Data Sheet

TEA1751T
HV start-up DCM/QR flyback controller with integrated
DCM/QR PFC controller
Rev. 3 — 10 January 2013
Product data sheet
1. General description
The TEA1751T is the third generation of green Switched Mode Power Supply (SMPS)
controller ICs. The TEA1751T combines a controller for Power Factor Correction (PFC)
and a flyback controller. Its high level of integration allows the design of a cost-effective
power supply with a very low number of external components.
The special built-in green functions provide high efficiency at all power levels. This
efficiency applies to quasi-resonant operation at high-power levels, quasi-resonant
operation with valley skipping, as well as reduced frequency operation at lower power
levels. At low-power levels, the PFC switches off to maintain high efficiency.
During low-power conditions, the flyback controller switches to frequency reduction mode
and limits the peak current to 25 % of its maximum value. This mode ensures high
efficiency at low-power and good standby power performance while minimizing audible
noise from the transformer.
The TEA1751T is a Multi-Chip Module, (MCM), containing two chips. The proprietary
high-voltage BCD800 process which makes direct start-up possible from the rectified
universal mains voltage in an effective and green way. The second low voltage
Silicon On Insulator (SOI) is used for accurate, high speed protection functions and
control.
The TEA1751T enables the design of highly efficient and reliable supplies with power
requirements of up to 250 W using the minimum number of external components.
Remark: All values provided throughout this data sheet are typical values unless
otherwise stated.
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
2. Features and benefits
2.1 Distinctive features




Integrated PFC and flyback controller
Universal mains supply operation (70 V (AC) to 276 V (AC))
Dual-boost PFC with accurate maximum output voltage (NXP patented)
High level of integration, resulting in a very low external component count and a
cost-effective design
2.2 Green features
 On-chip start-up current source
2.3 PFC green features
 Valley/Zero Voltage Switching (ZVS) for minimum switching losses (NXP patented)
 Frequency limitation to reduce switching losses
 PFC is switched off when a low load is detected at the flyback output
2.4 Flyback green features
 Valley switching for minimum switching losses (NXP patented)
 Frequency reduction with fixed minimum peak current at low-power operation to
maintain high efficiency at low output power levels
2.5 Protection features
 Safe restart mode for system fault conditions
 Continuous mode protection with demagnetization detection for both converters (NXP
patented)
 UnderVoltage Protection (UVP) (foldback during overload)
 Accurate OverVoltage Protection (OVP) for both converters (adjustable for flyback
converter)
 Mains voltage independent OverPower Protection (OPP)
 Open control loop protection for both converters. The open-loop protection on the
flyback converter is safe restart
 OverTemperature Protection (OTP)
 Low and adjustable OverCurrent Protection (OCP) trip level for both converters
 General-purpose input for latched protection to provide system OverTemperature
Protection (OTP) for example
3. Applications
 The device is used in all applications requiring an efficient and cost-effective power
supply solutions up to 250 W. Notebook adapters in particular can benefit from the
high level of integration
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
4. Ordering information
Table 1.
Ordering information
Type number
TEA1751T
TEA1751T
Product data sheet
Package
Name
Description
Version
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
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Rev. 3 — 10 January 2013
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
5. Block diagram
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TEA1751T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
4 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
6. Pinning information
6.1 Pinning
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Pin configuration: TEA1751T (SOT109-1)
6.2 Pin description
Table 2.
Pin description
Symbol
TEA1751T
Product data sheet
Pin
Description
VCC
1
supply voltage
GND
2
ground
FBCTRL
3
flyback control input
FBAUX
4
auxiliary winding input for demagnetization timing and flyback OVP
LATCH
5
general-purpose protection input
PFCCOMP
6
frequency compensation pin for PFC
VINSENSE
7
mains voltage sense input
PFCAUX
8
auxiliary winding input for demagnetization timing for PFC
VOSENSE
9
sense input for PFC output voltage
FBSENSE
10
flyback current sense input
PFCSENSE
11
PFC current sense input
PFCDRIVER
12
PFC gate-driver output
FBDRIVER
13
flyback gate-driver output
HVS
14 and15
high-voltage safety spacer, not connected
HV
16
high-voltage start-up / flyback valley sensing
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Rev. 3 — 10 January 2013
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
7. Functional description
7.1 General control
The TEA1751T contains a controller for a power factor correction circuit as well as a
controller for a flyback circuit. The typical configuration is shown in Figure 3.
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Fig 3.
TEA1751T typical configuration
7.1.1 Start-up and UnderVoltage LockOut (UVLO)
Initially, the capacitor on the VCC pin is charged from the high-voltage mains using the HV
pin.
When VCC is less than Vtrip, the charge current is low. This low current protects the IC if
the VCC pin is shorted to ground. To ensure a short start-up time, the charge current above
Vtrip is increased until VCC reaches Vth(UVLO). When VCC is between Vth(UVLO) and Vstartup,
the charge current goes low again to ensure a low, safe restart duty cycle during fault
conditions.
The control logic activates the internal circuitry and switches off the HV charge current
when the voltage on pin VCC passes the Vstartup level. First, the LATCH pin current source
is activated and the soft-start capacitors on the PFCSENSE and FBSENSE pins are
charged.
When the LATCH pin voltage exceeds the Ven(LATCH) voltage, and the soft start capacitor
on the PFCSENSE pin is charged, the PFC circuit is activated.
If the soft-start capacitor on the FBSENSE pin is charged, the flyback converter is also
activated. The flyback converter output voltage is then regulated to its nominal output
voltage. The auxiliary winding of the flyback converter takes over the IC supply. See
Figure 4.
TEA1751T
Product data sheet
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
If during start-up the LATCH pin does not reach the Ven(LATCH) level before VCC reaches
Vth(UVLO), it is deactivated. The charge current is then switched on again.
When the flyback converter starts, VFBCTRL is monitored. If this output voltage does not
reach its intended regulation level within a specified time, the voltage on the FBCTRL pin
reaches the Vto(FBCTRL) level. An error is then assumed and a safe restart is initiated.
When one of the protection functions is activated, both converters stop switching and the
VCC voltage drops to Vth(UVLO). A latched protection recharges capacitor CVCC using the
HV pin, but does not restart the converters. To provide safe restart protection, the
capacitor is recharged using the HV pin and the device restarts (see block diagram,
Figure 1).
If OVP of the PFC circuit (VVOSENSE > VOVP(VOSENSE)) occurs, the PFC controller stops
switching until the VOSENSE pin voltage drops to less than VOVP(VOSENSE). If a mains
undervoltage is detected, VVINSENSE < Vstop(VINSENSE), the PFC controller stops switching
until VVINSENSE > Vstart(VINSENSE) again.
When the voltage on pin VCC drops below the undervoltage lockout level, both controllers
stop switching and re-enter the safe restart mode. In the safe restart mode, the driver
outputs are disabled and the VCC pin voltage is recharged using the HV pin.
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
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Start-up sequence, normal operation and restart sequence
7.1.2 Supply management
All internal reference voltages are derived from a temperature compensated and trimmed
on-chip band gap circuit. Internal reference currents are derived from a temperature
compensated and trimmed on-chip current reference circuit.
7.1.3 Latch input
The LATCH pin is a general-purpose input pin, which is used to switch off both converters.
The pin sources a current IO(LATCH) of 80 A. Switching off is stopped as soon as the
voltage on the latch drops below 1.25 V.
At initial start-up, switching is inhibited until the capacitor on the LATCH pin is charged
above 1.35 V. No internal filtering is done on this pin. An internal Zener clamp of 2.9 V
protects this pin from excessive voltages.
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
7.1.4 Fast latch reset
In a typical application, the mains can be interrupted briefly to reset the latched protection.
The PFC bus capacitor, Cbus, does not have to discharge for this latched protection to
reset.
When the VINSENSE voltage drops below 750 mV and is then raised to 870 mV, the
latched protection is reset.
The latched protection is also reset by removing the voltage from the VCC and HV pins.
7.1.5 Overtemperature protection
An accurate internal temperature protection is provided in the circuit. When the junction
temperature exceeds the thermal shut-down temperature, the IC stops switching. As long
as OTP is active, the capacitor CVCC is not recharged from the HV mains. If the VCC
supply voltage is not sufficient, the OTP circuit is supplied from the HV pin.
OTP is a latched protection. It is reset by removing the voltage from the VCC and HV pins
or by the fast latch reset function (see Section 7.1.4).
7.2 Power factor correction circuit
The power factor correction circuit operates in quasi-resonant or Discontinuous
Conduction Mode (DCM) with valley switching. The next primary stroke is only started
when the previous secondary stroke has ended and the voltage across the PFC MOSFET
has reached a minimum value. VPFCAUX is used to detect transformer demagnetization
and the minimum voltage across the external PFC MOSFET switch.
7.2.1 ton control
The power factor correction circuit is operated in ton control. The resulting mains harmonic
reduction is well within the class-D requirements.
7.2.2 Valley switching and demagnetization (PFCAUX pin)
The PFC MOSFET is switched on after the transformer is demagnetized. Internal circuitry
connected to the PFCAUX pin detects the end of the secondary stroke. It also detects the
voltage across the PFC MOSFET. To reduce switching losses and electromagnetic
Interference (EMI) (valley switching), the next stroke is started if the voltage across the
PFC MOSFET is at its minimum.
If a demagnetization signal is not detected on the PFCAUX pin, the controller generates a
Zero-current Signal (ZCS), 50 s after the last PFCGATE signal.
If a valley signal is not detected on the PFCAUX pin, the controller generates a valley
signal 4 s after demagnetization is detected.
To protect the internal circuitry during lightning events, for example, add a 5 k series
resistor to PFCAUX. To prevent incorrect switching due to external disturbance, place the
resistor close to the IC on the printed-circuit board.
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
7.2.3 Frequency limitation
To optimize the transformer and minimize switching losses, the switching frequency is
limited to fsw(PFC)max. If the frequency for quasi-resonant operation is above the fsw(PFC)max
limit, the system switches over to DCM. The PFC MOSFET is only switched on at a
minimum voltage across the switch (valley switching).
7.2.4 Mains voltage compensation (VINSENSE pin)
The equation for the transfer function of a power factor corrector contains the square of
the mains input voltage. In a typical application, this results in a low bandwidth for low
mains input voltages and a high bandwidth for high mains input voltages.
To compensate for the mains input voltage influence, the TEA1751T contains a correction
circuit. The average input voltage is measured using the VINSENSE pin and the
information is fed to an internal compensation circuit. Using this compensation, it is
possible to keep the regulation loop bandwidth constant over the mains input range. This
feature yields a fast transient response on load steps, while still complying with class-D
MHR requirements.
In a typical application, a resistor and two capacitors connected to the PFCCOMP pin set
the bandwidth of the regulation loop.
7.2.5 Soft-start-up (pin PFCSENSE)
To prevent audible transformer noise at start-up or during hiccup, the soft-start function
slowly increases the transformer peak current. This increase is achieved by inserting RSS1
and CSS1 between the PFCSENSE pin and the current sense resistor RSENSE1.
An internal current source charges the capacitor to:
V PFCSENSE = I start  soft PFC  R SS1
(1)
The voltage is limited to Vstart(soft)PFC.
The start level and the time constant of the increasing primary current level are adjusted
externally by changing the values of RSS1 and CSS1.
soft – s tart = 3  R SS1  C SS1
(2)
The charging current Istart(soft)PFC flows as long as VPFCSENSE is below 0.5 V. If VPFCSENSE
exceeds 0.5 V, the soft-start current source starts limiting current Istart(soft)PFC. When the
PFC starts switching, the Istart(soft)PFC current source is switched off; see Figure 5.
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
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10 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
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Soft-start-up of PFC
7.2.6 Low-power mode
When the output power of the flyback converter (see Section 7.3) is low, the flyback
converter switches over to frequency reduction mode. The power factor correction circuit
is then switched off to maintain high efficiency.
During low-power mode operation, the PFCCOMP pin is clamped to a minimum voltage of
2.7 V and a maximum voltage of 3.9 V. The lower clamp voltage limits the maximum
power that is delivered when the PFC is switched on again. The upper clamp voltage
ensures that the PFC returns to its normal regulation point in a limited time when returning
from low-power mode.
When the flyback converter leaves the frequency reduction mode, the power factor
correction circuit restores normal operation. To prevent continuous switching of the PFC
circuit, a small hysteresis is built in (75 mV on the FBCTRL pin).
7.2.7 Dual-boost PFC
The mains input voltage modulates the PFC output voltage. The mains input voltage is
measured using the VINSENSE pin. If the voltage on the VINSENSE pin drops below
2.2 V, the current is sourced from the VOSENSE pin. To ensure the stable switch-over, a
200 mV transition region is inserted around the 2.2 V, see Figure 6.
At low VINSENSE input voltages, the output current is 15 A. This output current, in
combination with the resistors on the VOSENSE pin, sets the lower PFC output voltage
level at low mains voltages. At high mains input voltages, the current is switched to zero.
The PFC output voltage is then at its maximum. As this current is zero in this situation, it
does not affect the accuracy of the PFC output voltage.
To ensure proper switch-off, the VOSENSE current switches to its maximum value of
15 A when the voltage on pin VOSENSE drops below 2.1 V.
TEA1751T
Product data sheet
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
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Voltage to current transfer function for dual boost PFC
7.2.8 Overcurrent protection (PFCSENSE pin)
The maximum peak current is limited cycle-by-cycle by sensing the voltage across an
external sense resistor, RSENSE1, on the source of the external MOSFET. The voltage is
measured via the PFCSENSE pin.
7.2.9 Mains undervoltage lockout/brownout protection (VINSENSE pin)
To prevent the PFC from operating at very low mains input voltages, the voltage on the
VINSENSE pin is continuously sensed. When the voltage on this pin drops below the
Vstop(VINSENSE) level, switching of the PFC is stopped.
The voltage on the VINSENSE pin is clamped to a minimum value, Vstart(VINSENSE) 
Vpu(VINSENSE). This voltage clamping provides for a fast restart when the mains input
voltage is restored after a mains dropout.
7.2.10 Overvoltage protection (VOSENSE pin)
To prevent output overvoltage during load steps and mains transients, an overvoltage
protection circuit is built in.
When the voltage on the VOSENSE pin exceeds the VOVP(VOSENSE) level, switching of the
power factor correction circuit is stopped. Switching of the PFC recommences when the
VOSENSE pin voltage drops to less than VOVP(VOSENSE) again.
When the resistor between the VOSENSE pin and ground is open, the overvoltage
protection is also triggered.
7.2.11 PFC open-loop protection (VOSENSE pin)
The power factor correction circuit does not start switching until the voltage on the
VOSENSE pin exceeds the Vth(ol)(VOSENSE) level. This feature protects the circuit from
open-loop and VOSENSE short-circuit.
7.2.12 Driver (PFCDRIVER pin)
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
500 mA and a current sink capability of 1.2 A. These capabilities permit fast turn-on and
turn-off of the power MOSFET for efficient operation.
TEA1751T
Product data sheet
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TEA1751T
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HV start-up flyback controller with integrated PFC controller
7.3 Flyback controller
The TEA1751T includes a controller for a flyback converter. The flyback converter
operates in quasi-resonant or DCM with valley switching. The auxiliary winding of the
flyback transformer provides demagnetization detection and powers the IC after start-up.
7.3.1 Multimode operation
The TEA1751T flyback controller operates in several modes; see Figure 7.
fsw(fb)max
PFC off
PFC on
frequency
reduction
switching frequency
discontinuous
with valley
switching
quasi resonant
output power
014aaa158
Fig 7.
Multimode operation flyback
At high output power, the converter switches to quasi-resonant mode. The next converter
stroke starts after demagnetization of the transformer and detection of the valley. In
quasi-resonant mode switching losses are minimized. This minimization is achieved by
the converter only switching on when the voltage across the external MOSFET is at its
minimum (see also Section 7.3.2).
To prevent high frequency operation at low loads, the maximum switching frequency is
limited to 125 kHz. When the frequency limit is reached, the quasi-resonant operation
changes to DCM with valley skipping. The frequency limit reduces the MOSFET switch-on
losses and conducted EMI.
A Voltage Controlled Oscillator (VCO) controls the frequency at very low power and
standby levels. The minimum frequency is reduced to zero. During frequency reduction
mode, the primary peak current is kept at 25 % of its maximum level to maintain a high
efficiency. As the primary peak current is low in frequency reduction operation, no audible
noise is noticeable at switching frequencies in the audible range. Valley switching is also
active in this mode.
In frequency reduction mode, the PFC controller is switched off. The flyback maximum
frequency changes linearly with the control voltage on the FBCTRL pin (see Figure 8).
Hysteresis has been added for stable on and off switching of the PFC. At no-load
operation, the switching frequency can be reduced to (almost) zero.
TEA1751T
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TEA1751T
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HV start-up flyback controller with integrated PFC controller
PFC off
fsw(fb)max
PFC on
frequency
reduction
switching frequency
discontinuous
with valley
switching
1.5 V
Fig 8.
VFBCTRL
quasi resonant
014aaa159
Frequency control of flyback
7.3.2 Valley switching (HV pin)
A new cycle starts when the external MOSFET is switched on. VFBSENSE and VFBCTRL
determine the on-time. The MOSFET is then switched off and the secondary stroke starts.
After the secondary stroke, the drain voltage shows an oscillation with a frequency of
approximately:
1
f = -------------------------------------------------- 2     Lp  Cd  
(3)
where Lp is the primary self-inductance of the flyback transformer and Cd is the
capacitance on the drain node.
When the internal oscillator voltage is high and the secondary stroke ended, the circuit
waits for the lowest drain voltage before starting a new primary stroke.
Figure 9 shows the drain voltage, valley signal, secondary stroke signal and the internal
oscillator signal.
Valley switching allows high frequency operation as capacitive switching losses are
reduced, see Equation 4. High frequency operation makes small and cost-effective
magnetic components possible.
2
1
P = ---  C d  V  f
2
TEA1751T
Product data sheet
(4)
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TEA1751T
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HV start-up flyback controller with integrated PFC controller
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
(2)
(1)
oscillator
014aaa027
(1) Start of new cycle at lowest drain voltage.
(2) Start of new cycle in a classical Pulse Width Modulation (PWM) system without valley detection.
Fig 9.
Signals for valley switching
7.3.3 Current mode control (FBSENSE pin)
Current mode control is used for the flyback converter because of its good line regulation.
The FBSENSE pin senses the primary current across an external resistor and compares it
with an internal control voltage. The internal control voltage is proportional to the FBCTRL
pin voltage, see Figure 10.
TEA1751T
Product data sheet
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HV start-up flyback controller with integrated PFC controller
Vsense(fb)max
(V)
PFC off
0.52 V
PFC on
flyback
frequency
reduction
flyback
discontinuous
or QR
FBSENSE peak voltage
flyback
cycle skip
mode
0.13 V
1.4 V 1.5 V
2.0 V VFBCTRL (V)
014aaa160
Fig 10. Peak current control of flyback
7.3.4 Demagnetization (FBAUX pin)
The system is always in QR or DCM mode. The internal oscillator does not start a new
primary stroke until the previous secondary stroke has ended.
Demagnetization features a cycle-by-cycle output short-circuit protection by immediately
lowering the frequency (longer off-time), thus reducing the power level.
Demagnetization recognition is suppressed during the first tsup(xfmr_ring) time of 2 s. This
suppression can be necessary at low output voltages and at start-up. It can also be
required in applications where the transformer has a large leakage inductance.
If the FBAUX pin is open-circuit or not connected, a fault condition is assumed and the
converter immediately stops. Operation restarts as soon as the fault condition is removed.
7.3.5 Flyback control/time-out (FBCTRL pin)
The FBCTRL pin is connected to an internal voltage source of 3.5 V using an internal
resistor of 3 k. When the voltage on this pin exceeds 2.5 V, the connection is disabled
and the pin is biased with a small current. If the voltage on this pin exceeds 4.5 V, a fault is
assumed, switching is inhibited and a restart is made.
If a capacitor and a resistor are connected in series to this pin, a time-out function is
created to protect against an open control loop. See Figure 11 and Figure 12. The
time-out function is disabled by connecting a resistor (100 k) to ground on the FBCTRL
pin.
If the pin is short-circuited to ground, switching of the flyback controller is prevented.
Under normal operating conditions, the converter regulates the output voltage. The
voltage on the FBCTRL pin then varies between 1.4 V for the minimum output power and
2 V for the maximum output power.
TEA1751T
Product data sheet
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
2.5 V
3.5 V
30 μA
4.5 V
3 kΩ
FBCTRL
time-out
014aaa049
Fig 11. Time-out protection circuit
4.5 V
2.5 V
VFBCTRL
output
voltage
intended output
voltage not
reached within
time-out time.
restart
intended output voltage
reached within time-out
time.
014aaa050
Fig 12. Time-out protection (signals), safe restart
7.3.6 Soft-start (FBSENSE pin)
To prevent audible transformer noise during start-up, the soft start function slowly
increases the transformer peak current. This increase can be achieved by inserting a
resistor and a capacitor between the FBSENSE pin and the current sense resistor.
An internal current source charges the capacitor to:
V = I start  soft fb  R SS2
(5)
with a maximum of approximately 0.5 V.
The start level and the time constant of the increasing primary current level are adjusted
externally by changing the values of RSS2 and CSS2.
soft – s tart = 3  R SS2  C SS2
(6)
The soft-start current Istart(soft)fb is switched on as soon as VCC reaches Vstartup. When
VFBSENSE reaches 0.5 V, the flyback converter starts switching.
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HV start-up flyback controller with integrated PFC controller
The charging current Istart(soft)(FB) flows as long as VFBSENSE is less than approximately
0.5 V. If VFBSENSE exceeds 0.5 V, the soft-start current source starts limiting the current.
After the flyback converter has started, the soft-start current source is switched off.
6
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Fig 13. Soft-start up of flyback.
7.3.7 Maximum on-time
The flyback controller limits the on-time of the external MOSFET to 40 s. When the
on-time is longer than 40 s, the IC stops switching and enters the safe restart mode.
7.3.8 Overvoltage protection (FBAUX pin)
An output overvoltage protection is implemented in the GreenChip III series. In the
TEA1751T, the auxiliary voltage is sensed using the current flowing into the FBAUX pin
during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the
output voltage. An internal filter averages voltage spikes.
An internal up-down counter prevents false OVP detection which can occur during ESD or
lightning events. The internal counter counts up by one when the output voltage exceeds
the OVP trip level within one switching cycle. The internal counter counts down by two
when the output voltage has not exceeded the OVP trip level within one switching cycle.
When the counter has reached eight, the IC assumes a true OVP, sets the latched
protection and switches off both converters.
The converter only restarts after the OVP latch is reset. In a typical application, the
internal latch is reset when the VINSENSE voltage drops below 750 mV and is then raised
to 870 mV.
The latched protection is also reset by removing both the voltage on the VCC and HV pins.
The demagnetization resistor, RFBAUX sets the output voltage Vo(OVP) at which the OVP
function trips:
Ns
V o  OVP  = -----------  I ovp  FBAUX   R FBAUX + V clamp  FBAUX  
N aux
(7)
where Ns is the number of secondary turns and Naux is the number of auxiliary turns of the
transformer. Current Iovp(FBAUX) is internally trimmed.
TEA1751T
Product data sheet
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
Accurate OVP detection is made possible by adjusting the value of RFBAUX to the turns
ratio of the transformer.
7.3.9 Overcurrent protection (FBSENSE pin)
The primary peak current in the transformer is measured accurately cycle-by-cycle using
the external sense resistor Rsense2. VFBCTRLsets the level to which the OCP circuit limits
VFBSENSE (see Section 7.3.3). The OCP detection is suppressed during the leading-edge
blanking period, tleb, to prevent false triggering due to switch-on spikes.
tleb
OCP level
VFBSENSE
t
014aaa022
Fig 14. OCP leading-edge blanking
7.3.10 Overpower protection
During the primary stroke of the flyback converter, the input voltage is measured by
sensing the current drawn from the FBAUX pin.
The current information is used to adjust the peak drain current of the flyback converter,
measured from the FBSENSE pin. The internal compensation is such, that a maximum
output power is realized which is almost independent of the input voltage.
The OPP curve is given in Figure 15.
9)%6(16(
9
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Fig 15. Overpower protection curve
7.3.11 Driver (FBDRIVER pin)
The driver circuit to the power MOSFET gate has a current sourcing capability of 500 mA
and a current sink capability of 1.2 A. These capabilities permit fast turn-on and turn-off of
the power MOSFET, thus ensuring efficient operation.
TEA1751T
Product data sheet
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HV start-up flyback controller with integrated PFC controller
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
0.4
+38
V
0.4
+5
V
Voltages
VCC
supply voltage
VLATCH
voltage on the LATCH pin
VFBCTRL
voltage on the FBCTRL pin
0.4
+5
V
VPFCCOMP
voltage on the PFCCOMP
pin
0.4
+5
V
VVINSENSE
voltage on the VINSENSE
pin
0.4
+5
V
VVOSENSE
voltage on the VOSENSE
pin
0.4
+5
V
VPFCAUX
voltage on the PFCAUX pin
25
+25
V
VFBSENSE
voltage on the FBSENSE pin current limited
0.4
+5
V
0.4
+5
V
voltage on the HV pin
0.4
+650
V
IFBCTRL
current on the FBCTRL pin
3
0
mA
IFBAUX
current on the FBAUX pin
1
+1
mA
IPFCSENSE
current on the PFCSENSE
pin
1
+10
mA
IFBSENSE
current on the FBSENSE pin
1
+10
mA
IFBDRIVER
current on the FBDRIVER
pin
duty cycle < 10 %
0.8
+2
A
duty cycle < 10 %
0.8
+2
A
-
8
mA
-
0.6
W
VPFCSENSE voltage on the PFCSENSE
pin
VHV
current limited
current limited
Currents
IPFCDRIVER current on the PFCDRIVER
pin
current on the HV pin
IHV
General
Tamb < 75 C
Ptot
total power dissipation
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+150
C
ESD
VESD
electrostatic discharge
voltage
class 1
human body
model
pins 1 to 13
[1]
-
2000
V
pin 16 (HV)
[1]
-
1500
V
machine model
[2]
-
200
V
-
500
V
charged device
model
[1]
TEA1751T
Product data sheet
Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
[2]
Equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10  resistor.
9. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air; JEDEC test board
124
K/W
Rth(j-c)
thermal resistance from
junction to case
in free air; JEDEC test board
37
K/W
10. Characteristics
Table 5.
Characteristics
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC < Vtrip;
Vth(UVLO) < VCC < Vstartup
-
1.0
-
mA
Vtrip < VCC < Vth(UVLO)
-
5.4
-
mA
Start-up current source (HV pin)
IHV
current on the HV pin
VHV > 80 V
with auxiliary supply
VBR
breakdown voltage
8
20
40
A
650
-
-
V
Supply voltage management (VCC pin)
Vtrip
trip voltage
0.55
0.65
0.75
V
Vstartup
start-up voltage
21
22
23
V
Vth(UVLO)
undervoltage lockout threshold
voltage
14
15
16
V
Vstart(hys)
hysteresis of start voltage
during start-up phase
-
300
-
mV
Vhys
hysteresis voltage
Vstartup  Vth(UVLO)
6.3
7
7.7
V
Ich(low)
low charging current
VHV > 80 V; VCC < Vtrip or
Vth(UVLO) < VCC < Vstartup
1.2
1.0
0.8
mA
Ich(high)
high charging current
VHV > 80 V; Vtrip < VCC < Vth(UVLO)
4.6
5.4
6.3
mA
ICC(oper)
operating supply current
no-load on the FBDRIVER and
PFCDRIVER pins
2.25
3
3.75
mA
Input Voltage Sensing PFC (VINSENSE pin)
Vstop(VINSENSE)
stop voltage on the VINSENSE
pin
0.86
0.89
0.92
V
Vstart(VINSENSE)
start voltage on the VINSENSE
pin
1.11
1.15
1.19
V
Vpu(VINSENSE)
pull-up voltage difference on
the VINSENSE pin
active after Vstop(VINSENSE) is
detected
-
100
-
mV
Ipu(VINSENSE)
pull-up current on the
VINSENSE pin
active after Vstop(VINSENSE) is
detected
55
47
40
A
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NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Vmvc(VINSENSE)max maximum mains voltage
compensation voltage on the
VINSENSE pin
Min
Typ
Max
Unit
4
-
-
V
-
0.75
-
V
Vflr
fast latch reset voltage
Vflr(hys)
hysteresis of fast latch reset
voltage
-
0.12
-
V
II(VINSENSE)
input current on the VINSENSE VVINSENSE > Vstop(VINSENSE) after
pin
Vstart(VINSENSE) is detected
5
33
100
nA
Vbst(dual)
dual boost voltage
current switch-over point
-
2.2
-
V
switch-over region
-
200
-
mV
active after Vth(UVLO) is detected
Loop compensation PFC (PFCCOMP pin)
gm
transconductance
VVOSENSE to IO(PFCCOMP)
60
80
100
A/V
IO(PFCCOMP)
output current on the
PFCCOMP pin
VVOSENSE = 3.3 V
33
39
45
A
45
39
33
A
Vclamp(PFCCOMP)
clamp voltage on the
PFCCOMP pin
Low-power mode; PFC off; lower
clamp voltage.
[1]
2.5
2.7
2.9
V
Upper clamp voltage
[1]
-
3.9
-
V
VVOSENSE = 2 V
Vton(PFCCOMP)zero
zero on-time voltage on the
PFCCOMP pin
3.4
3.5
3.6
V
Vton(PFCCOMP)max
maximum on-time voltage on
the PFCCOMP pin
1.20
1.25
1.30
V
VVINSENSE = 3.3 V;
VPFCCOMP = Vton(PFCCOMP)max
3.6
4.5
5
s
VVINSENSE = 0.9 V;
VPFCCOMP = Vton(PFCCOMP)max
30
40
53
s
-
1.15
-
V
Pulse-width modulator PFC
ton(PFC)
PFC on-time
Output voltage sensing PFC (VOSENSE pin)
Vth(ol)(VOSENSE)
open-loop threshold voltage on
the VOSENSE pin
Vreg(VOSENSE)
regulation voltage on the
VOSENSE pin
Vovp(VOSENSE)
overvoltage protection voltage
on the VOSENSE pin
Ibst(dual)
dual boost current
for IO(PFCCOMP) = 0
2.475 2.500 2.525 V
2.60
2.63
2.67
V
VVINSENSE < Vbst(dual) or
VVOSENSE < 2.1 V
-
15

A
VVINSENSE > Vbst(dual)
-
30
-
nA
Over current protection PFC (PFCSENSE pin)
Vsense(PFC)max
maximum PFC sense voltage
V/t = 50 mV/s
0.49
0.52
0.55
V
V/t = 200 mV/s
0.51
0.54
0.57
V
tleb(PFC)
PFC leading edge blanking
time
250
310
370
ns
Iprot(PFCSENSE)
protection current on the
PFCSENSE pin
50
-
5
nA
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NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Soft-start PFC (PFCSENSE pin)
Istart(soft)PFC
PFC soft-start current
75
60
45
A
Vstart(soft)PFC
PFC soft-start voltage
enabling voltage
0.46
0.50
0.54
V
Vstop(soft)PFC
PFC soft-stop voltage
disabling voltage
0.42
0.45
0.48
V
Oscillator PFC
fsw(PFC)max
maximum PFC switching
frequency
100
125
150
kHz
toff(PFC)min
minimum PFC off-time
1.1
1.4
1.7
s
-
-
1.7
V/s
Valley switching PFC (PFCAUX pin)
(V/t)vrec(PFC)
PFC valley recognition voltage
change with time
tvrec(PFC)
PFC valley recognition time
tto(vrec)PFC
VPFCAUX = 1 V peak-to-peak
[2]
-
-
300
ns
demagnetization to V/t = 0
[3]
-
-
50
ns
3
4
6
s
PFC valley recognition time-out
time
Demagnetization management PFC (PFCAUX pin)
Vth(comp)PFCAUX
comparator threshold voltage
on the PFCAUX pin
150
100
50
mV
tto(demag)PFC
PFC demagnetization time-out
time
40
50
60
s
Iprot(PFCAUX)
protection current on the
PFCAUX pin
VPFCAUX = 50 mV
75
-
5
nA
-
A
Driver (PFCDRIVER pin)
Isrc(PFCDRIVER)
source current on the
PFCDRIVER pin
VPFCDRIVER = 2 V
-
0.5
Isink(PFCDRIVER)
sink current on the
PFCDRIVER pin
VPFCDRIVER = 2 V
-
0.7
-
A
VPFCDRIVER = 10 V
-
1.2
-
A
9.5
10.8
12
V
A
VO(PFCDRIVER)max
maximum output voltage on the
PFCDRIVER pin
OverVoltage Protection flyback (FBAUX pin)
Iovp(FBAUX)
overvoltage protection current
on the FBAUX pin
279
300
321
Ncy(ovp)
number of overvoltage
protection cycles
6
8
12
60
80
110
mV
-
5
nA
Demagnetization management flyback (FBAUX pin)
Vth(comp)FBAUX
comparator threshold voltage
on the FBAUX pin
Iprot(FBAUX)
protection current on the
FBAUX pin
VFBAUX = 50 mV
75
Vclamp(FBAUX)
clamp voltage on the FBAUX
pin
IFBAUX = 100 A
0.85 0.7
0.55 V
IFBAUX = 300 A
0.79
0.94
1.09
V
1.5
2
2.5
s
tsup(xfmr_ring)
TEA1751T
Product data sheet
transformer ringing
suppression time
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HV start-up flyback controller with integrated PFC controller
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pulse-width modulator flyback
ton(fb)min
minimum flyback on-time
-
tleb
-
ns
ton(fb)max
maximum flyback on-time
32
40
48
s
fsw(fb)max
maximum flyback switching
frequency
100
125
150
kHz
Vstart(VCO)FBCTRL
VCO start voltage on the
FBCTRL pin
1.3
1.5
1.7
V
Vhys(FBCTRL)
hysteresis voltage on pin
FBCTRL
-
75
-
mV
VVCO(FBCTRL)
VCO voltage difference on the
FBCTRL pin
-
0.12 -
V
Oscillator flyback
[4]
Peak current control flyback (FBCTRL pin)
VFBCTRL
voltage on the FBCTRL pin
for maximum flyback peak current
1.85
2
2.15
V
Vto(FBCTRL)
time-out voltage on the
FBCTRL pin
enable voltage
-
2.5
-
V
trip voltage
4.2
4.5
4.8
V
-
3
-
k
Rint(FBCTRL)
internal resistance on the
FBCTRL pin
IO(FBCTRL)
output current on the FBCTRL
pin
VFBCTRL = 0 V
1.4
1.19 0.93 mA
VFBCTRL = 2 V
0.6
0.5
0.4
mA
time-out current on the
FBCTRL pin
VFBCTRL = 2.6 V
36
30
24
A
VFBCTRL = 4.1 V
34.5 28.5 22.5 A
Ito(FBCTRL)
Valley switching flyback (HV pin)
(V/t)vrec(fb)
flyback valley recognition
voltage change with time
td(vrec-swon)
valley recognition to switch on
delay time
75
-
+75
V/s
-
150
-
ns
75
60
45
A
enable voltage
0.43
0.49
0.54
V
V/t = 50 mV/s
0.49
0.52
0.55
V
V/t = 200 mV/s
0.52
0.55
0.58
V
255
305
355
ns
IFBAUX = 80 A
0.49
0.52
0.55
V
IFBAUX = 120 A
0.46
0.50
0.54
V
IFBAUX = 240 A
0.38
0.42
0.46
V
[5]
Soft-start flyback (FBSENSE pin)
Istart(soft)fb
flyback soft-start current
Vstart(soft)fb
flyback soft-start voltage
Overcurrent protection flyback (FBSENSE pin)
Vsense(fb)max
maximum flyback sense
voltage
tleb(fb)
flyback leading edge blanking
time
Overpower protection flyback (FBSENSE pin)
Vsense(fb)max
TEA1751T
Product data sheet
maximum flyback sense
voltage
V/t = 50 mV/s
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HV start-up flyback controller with integrated PFC controller
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IFBAUX = 360 A
0.34
0.38
0.42
V
VFBDRIVER = 2 V
-
0.5
-
A
0.7
-
A
Driver (FBDRIVER pin)
Isrc(FBDRIVER)
source current on the
FBDRIVER pin
Isink(FBDRIVER)
sink current on the FBDRIVER VFBDRIVER = 2 V
pin
VFBDRIVER = 10 V
-
1.2
-
A
VO(FBDRIVER)(max)
maximum output voltage on the
FBDRIVER pin
9.5
10.8
12
V
1.23
1.25
1.27
V
LATCH input (LATCH pin)
Vprot(LATCH)
protection voltage on the
LATCH pin
IO(LATCH)
output current on the LATCH
pin
Vprot(LATCH) < VLATCH < Voc(LATCH)
85
80
75
A
Ven(LATCH)
enable voltage on the LATCH
pin
at start-up
1.30
1.35
1.40
V
Vhys(LATCH)
hysteresis voltage on the
LATCH pin
Ven(LATCH)  Vprot(LATCH)
80
100
140
mV
Voc(LATCH)
open-circuit voltage on the
LATCH pin
2.65
2.9
3.15
V
Temperature protection
Tpl(IC)
IC protection level temperature
130
140
150
C
Tpl(IC)hys
hysteresis of IC protection level
temperature
-
10
-
C
[1]
Applies to a typical application with a compensation network on the PFCCOMP pin, like the example in Figure 3.
[2]
Minimum required voltage change time for valley recognition on the PFCAUX pin.
[3]
Minimum time required between demagnetization detection and V/t = 0 on the PFCAUX pin.
[4]
Hysteresis for PFC on/off control.
[5]
Guaranteed by design.
TEA1751T
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TEA1751T
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HV start-up flyback controller with integrated PFC controller
11. Application information
A power supply with the TEA1751T consists of a power factor correction circuit and a
flyback converter. See Figure 16.
Capacitor CVCC buffers the IC supply voltage. The IC is powered from the high voltage
rectified mains during start-up and the auxiliary winding of the flyback converter during
operation. Sense resistors RSENSE1 and RSENSE2 convert the current through the
MOSFETs S1 and S2 into a voltage at pins PFCSENSE and FBSENSE. The values of
RSENSE1 and RSENSE2 define the maximum primary peak current in MOSFETs S1 and S2.
In the example given, the LATCH pin is connected to a Negative Temperature Coefficient
(NTC) resistor. The protection is activated when the resistance drops below a value
calculated as follows:
V prot  LATCH 
------------------------------- = 15.6 k
I O  LATCH 
(8)
A capacitor CTIMEOUT is connected to the FBCTRL pin. RLOOP is added so that the
time-out capacitor does not interfere with the normal regulation loop.
RS1 and RS2 are added to prevent the soft-start capacitors from being charged during
normal operation due to negative voltage spikes across the sense resistors.
Resistor RAUX1 is added to protect the IC from damage during lightning events.
56(16(
5$8;
56
56
56(16(
,&
&9&&
&7,0(287
DDD
Fig 16. Typical application diagram for the TEA1751T
TEA1751T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
26 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
12. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 17. Package outline SOT109-1 (SO16)
TEA1751T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
27 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
TEA1751T v.3
20130110
Product data sheet
Modifications:
•
•
•
Change notice
Supersedes
TEA1751T v.2
Multiple text changes
Multiple graphic updates
Updates to several characteristics
TEA1751T v.2
20110408
Product data sheet
-
TEA1751T v.1
TEA1751T v.1
20110304
Objective data sheet
-
-
TEA1751T
Product data sheet
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Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
28 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1751T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
29 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1751T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 January 2013
© NXP B.V. 2013. All rights reserved.
30 of 31
TEA1751T
NXP Semiconductors
HV start-up flyback controller with integrated PFC controller
16. Contents
1
2
2.1
2.2
2.3
2.4
2.5
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.2
7.2.1
7.2.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Distinctive features . . . . . . . . . . . . . . . . . . . . . . 2
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2
PFC green features . . . . . . . . . . . . . . . . . . . . . 2
Flyback green features . . . . . . . . . . . . . . . . . . . 2
Protection features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
General control . . . . . . . . . . . . . . . . . . . . . . . . . 6
Start-up and UnderVoltage LockOut (UVLO) . . 6
Supply management. . . . . . . . . . . . . . . . . . . . . 8
Latch input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Fast latch reset . . . . . . . . . . . . . . . . . . . . . . . . . 9
Overtemperature protection . . . . . . . . . . . . . . . 9
Power factor correction circuit . . . . . . . . . . . . . 9
ton control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Valley switching and demagnetization
(PFCAUX pin) . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2.3
Frequency limitation . . . . . . . . . . . . . . . . . . . . 10
7.2.4
Mains voltage compensation (VINSENSE pin) 10
7.2.5
Soft-start-up (pin PFCSENSE) . . . . . . . . . . . . 10
7.2.6
Low-power mode . . . . . . . . . . . . . . . . . . . . . . 11
7.2.7
Dual-boost PFC . . . . . . . . . . . . . . . . . . . . . . . 11
7.2.8
Overcurrent protection (PFCSENSE pin) . . . . 12
7.2.9
Mains undervoltage lockout/brownout
protection (VINSENSE pin) . . . . . . . . . . . . . . 12
7.2.10
Overvoltage protection (VOSENSE pin) . . . . . 12
7.2.11
PFC open-loop protection (VOSENSE pin) . . 12
7.2.12
Driver (PFCDRIVER pin) . . . . . . . . . . . . . . . . 12
7.3
Flyback controller . . . . . . . . . . . . . . . . . . . . . . 13
7.3.1
Multimode operation . . . . . . . . . . . . . . . . . . . . 13
7.3.2
Valley switching (HV pin) . . . . . . . . . . . . . . . . 14
7.3.3
Current mode control (FBSENSE pin) . . . . . . 15
7.3.4
Demagnetization (FBAUX pin) . . . . . . . . . . . . 16
7.3.5
Flyback control/time-out (FBCTRL pin) . . . . . 16
7.3.6
Soft-start (FBSENSE pin) . . . . . . . . . . . . . . . . 17
7.3.7
Maximum on-time . . . . . . . . . . . . . . . . . . . . . . 18
7.3.8
Overvoltage protection (FBAUX pin) . . . . . . . 18
7.3.9
Overcurrent protection (FBSENSE pin) . . . . . 19
7.3.10
Overpower protection . . . . . . . . . . . . . . . . . . . 19
7.3.11
Driver (FBDRIVER pin). . . . . . . . . . . . . . . . . . 19
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
21
21
26
27
28
29
29
29
29
30
30
31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 January 2013
Document identifier: TEA1751T