MCP9800/1/2/3 Rev. A Silicon/Data Sheet Errata

MCP9800/1/2/3
MCP9800/1/2/3 Rev. A Silicon/Data Sheet Errata
The MCP9800/1/2/3 parts you have received conform
functionally to the MCP9800/1/2/3 Data Sheet
(DS21909B), except for the anomalies described
below.
All of the issues listed here will be addressed in future
revisions of the MCP9800/1/2/3 silicon.
Contact Microchip for the latest Silicon fix.
Clarification/Corrections to the Data
Sheet:
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS21909B):
None at this time.
1. Module: Device Internal Latch-up at
Higher Temperatures
The MCP9800/1/2/3 devices may latch-up during
I2C™ communication at high temperatures. This is
caused by the internal I2C interface slew control
circuit.
At temperatures >80°C (typically), High-to-Low
transition <500 ns on the SDA or SCL lines causes
the slew control circuit to latch-up.
Work around
Connect a capacitor across the SDA and SCL
pull-up resistors so that the SDA and SCL fall
time is >500 ns. For example, use 5 k/0.01 µf.
Date Codes that pertain to this issue:
This issue concerns the devices produced on or
before 718. This issue is fixed in devices with a
date code of 721.
2. Module: POR Active During Oneshot
Mode
At high temperatures the MCP9800/1/2/3 may
reset while waking up from the Oneshot mode.
All registers may be set at the power-up default
states.
Work around
Shutdown and wake the device using the Shutdown bit in the Configuration register.
Date Codes that pertain to this issue:
This issue concerns the devices produced on or
before 718. This issue is fixed in devices with a
date code of 721.
 2007-2011 Microchip Technology Inc.
DS80331B-page 1
MCP9800/1/2/3
APPENDIX A:
REVISION HISTORY
Revision B (8/2011)
Specifies the device date codes that pertain to the
issues described in this errata.
Revision A (7/2007)
• Device Internal latch-up at higher temperature.
• POR active during Oneshot mode.
DS80331B-page 2
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DS80331B-page 3
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