Data Sheet

TEA1732CTS
GreenChip SMPS control IC
Rev. 1 — 18 March 2014
Product data sheet
1. General description
The TEA1732CTS is a low cost Switched Mode Power Supply (SMPS) controller IC
intended for flyback topologies. The TEA1732CTS operates in peak current and
frequency control mode. Frequency jitter has been implemented to reduce
ElectroMagnetic Interference (EMI). Slope compensation is integrated for Continuous
Conduction Mode (CCM) operation.
The TEA1732CTS IC features OverPower Protection (OPP). The controller accepts an
overpower situation for a limited amount of time.
Mains undervoltage protection (brownout), output OverVoltage Protection (OVP), and
OverTemperature Protection (OTP) can be implemented using a minimal number of
external components.
At low-power levels, the primary peak current is set to 25 % of the maximum peak current.
The switching frequency is reduced to limit the switching losses. The combination of fixed
frequency operation at high output power and frequency reduction at low output power
provides high efficiency over the total load range.
The TEA1732CTS makes the design of low-cost, highly efficient and reliable supplies for
power requirements up to 75 W easier by requiring a minimum number of external
components.
2. Features and benefits










SMPS controller IC enabling low-cost applications
Large input voltage range (12 V to 30 V)
Integrated OverVoltage Protection (OVP) on the VCC pin
Accurate OverVoltage Protection (OVP) via the ISENSE pin
Very low supply current during start-up and restart (10 A typical)
Low supply current during normal operation (0.58 mA typical without load)
Internal overpower time-out
Overpower protection or high/low line compensation
Fixed switching frequency with frequency jitter to reduce EMI
Frequency reduction with fixed minimum peak current to maintain high efficiency at
low output power levels
 Frequency increase at peak power operation
 Slope compensation for CCM operation
 Integrated soft-start
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC




Low and adjustable OverCurrent Protection (OCP) trip level
Mains undervoltage protection (brownout)
External OverTemperature Protection (OTP)
IC overtemperature protection
3. Applications
 All applications that require an efficient and cost-effective power supply solution up to
75 W.
4. Ordering information
Table 1.
Ordering information
Type number
Package
TEA1732CTS/1
Name
Description
Version
TSOP6
plastic surface-mounted package; 6 leads
SOT457
5. Block diagram
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Fig 1.
TEA1732CTS block diagram
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
6. Pinning information
6.1 Pinning
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TEA1732CTS pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
VCC
1
supply voltage
GND
2
ground
PROTECT
3
protection and mains detect input
CTRL
4
control input
ISENSE
5
current sense and accurate OVP input
DRIVER
6
gate driver output
7. Functional description
7.1 General control
The TEA1732CTS contains a controller for a flyback circuit. A typical configuration is
shown in Figure 3.
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
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Fig 3.
TEA1732CTS typical configuration
7.2 Start-up and UnderVoltage LockOut (UVLO)
Initially, the capacitor on the VCC pin, C3, is charged from the high-voltage mains via
resistor R1.
As long as VCC is below Vstartup, the IC current consumption is low (10 A typical). When
VCC reaches Vstartup, the IC first waits for the mains voltage to exceed the brownin level,
and the PROTECT pin to reach the Vdet(PROTECT)(L) voltage. When both conditions are
met, the IC starts switching. An internal soft-start time of 3.5 ms allows the ISENSE peak
voltage to increase gradually to prevent audible noise. In a typical application, the
auxiliary winding of the transformer takes over the supply voltage.
If a protection is triggered, the controller stops switching. Depending on the protection
triggered, it either causes a restart or latches the converter to an off-state.
The OPP, UVLO, brownout, maximum duty cycle, OVP, and external OTP protections
cause a save restart. The internal OTP protection latches the converter to an off-state.
A restart protection disables the switching of the IC. The supply voltage of the IC drops to
the UVLO level. When the UVLO level is reached, the IC switches to Power-down mode,
where it consumes a low supply current (10 A typical). The VCC capacitor is recharged
via R1 until the VCC start-up level is reached. A delayed restart is performed to lower the
average input power during a fault condition. Depending on the cause of the restart
protection, the restart sequence that discharges and recharges the VCC capacitor is
performed once or repeated three times, before switching recommences (See Figure 4).
When a latched protection is triggered, the TEA1732CTS immediately enters Power-down
mode. The VCC pin is clamped to a voltage just above the latch protection reset voltage
(Vrst(latch) + 0.9 V).
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
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Start-up sequence, normal operation and restart sequence
When the voltage on pin VCC drops below the Vth(UVLO) level during normal operation, the
controller stops switching. The TEA1732CTS waits for the rectified mains to charge the
VCC pin using resistor R1.
7.3 Supply management
All internal reference voltages are derived from a temperature compensated on-chip band
gap circuit. Internal reference currents are derived from a trimmed and temperature
compensated current reference circuit.
7.4 External overtemperature protection and mains detect input
(pin PROTECT)
The PROTECT input combines the functions of the external OverTemperature Protection
(OTP) and the mains voltage detection. An internal clock separates the period of
measuring the mains voltage and the period of detecting external OverTemperature
Protection (OTP). In a typical application, the PROTECT pin is connected to the mains via
a resistor. It is connected to ground via a negative temperature coefficient (NTC)
thermistor and a diode.
When measuring the mains voltage, the PROTECT pin is regulated to 0.25 V so that the
external diode does not conduct any current. The current into the PROTECT pin is
measured and stored. Once the measured current is above the brownin level, the system
is allowed to start switching. If the mains voltage is continuously below the brownout level
for at least 32 ms, a brownout is detected. The system immediately stops switching and
performs a restart. The VCC capacitor is discharged to the UVLO level and then charged
to Vstartup once before switching recommences (See Figure 5).
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
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Fig 5.
Mains detection
When detecting the external temperature, a current of 84 A (typical) out of the
PROTECT pin flows through the external capacitor and the NTC thermistor. If the
PROTECT voltage at the end of the measuring period is below Vdet(PROTECT) for four
consecutive measuring cycles, the IC detects overtemperature and activates a latched
protection.
The offset due to the current from the mains is canceled internally by remembering the
sinking current Iin when measuring the mains voltage (See Figure 6). The remembered
current is also used as the input of high/low line compensation.
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External overtemperature protection
An internal clamp of 4.1 V (typical) protects this pin from excessive voltages.
7.5 Duty cycle control (pin CTRL)
Pin CTRL regulates the output power of the converter. This pin is connected to an internal
voltage source of 5.4 V via an internal resistor (typical resistance: 7 k).
The CTRL pin voltage sets the peak current which is measured using the ISENSE pin
(see Section 7.8). At low output power, the switching frequency is reduced
(see Section 7.11). The maximum duty cycle is limited to 80 % (typical).
After eight consecutive converter strokes at maximum duty cycle the restart protection is
activated. In a restart, the VCC capacitor is quickly discharged to the Vth(UVLO) level and
recharged to the start-up level from the high-voltage mains, before switching
recommences. This occurs when the mains input voltage is removed.
7.6 Slope compensation (pin CTRL)
A slope compensation circuit is integrated for CCM. The slope compensation guarantees
stable operation for duty cycles exceeding 50 %.
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
7.7 Overpower timer
A temporary overload situation is allowed. If Vctrl(Ipeak) (see Figure 1) set by pin CTRL
exceeds 400 mV, an internal timer is started. If the overload situation continues to exist for
more than 60 ms (typical), an OverPower Protection (OPP) is triggered (see Figure 7).
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Fig 7.
Overpower delay
The TEA1732CTS enters the overpower restart mode when the overload time-out is
reached. In overpower restart mode, the VCC capacitor is discharged to UVLO level and
then charged to the start-up level three times before the converter switches again.
7.8 Current mode control (pin ISENSE)
Current mode control is used because it ensures a good line regulation.
Pin ISENSE senses the primary current across external resistor R6 and compares it with
an internal control voltage. The internal control voltage is proportional to the CTRL pin
voltage (see Figure 8).
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
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Fig 8.
Peak current control
Leading edge blanking prevents false triggering due to capacitive discharge when
switching on the external power switch (see Figure 9).
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Leading edge blanking
7.9 Overvoltage protection (pin ISENSE)
Accurate overvoltage protection can be realized at the ISENSE pin by sensing the
auxiliary voltage. During the primary stroke, diode D4 (see Figure 3) is blocked so that the
converter still works under current mode control. During the secondary stroke, the
ISENSE voltage represents the output voltage via the resistor divider R5 and R3
(see Figure 3). The ISENSE voltage is sampled 2 s after the gate signal drops to avoid
the ringing of the transformer. If the sampled voltage exceeds Vovp(ISENSE) for four
consecutive switching cycles, the IC triggers the latched protection.
7.10 Overvoltage protection (pin VCC)
An OverVoltage Protection (OVP) circuit is connected to the VCC pin. When the VCC
exceeds Vth(OVP) (30 V typical) for four consecutive switching cycles, the IC triggers the
latched protection. When VCC drops below Vth(OVP) before count = 4 is reached, the
counter is reset to zero.
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
7.11 Peak power, high-power and low-power operation
During high-power operation, with the converter running at a 65 kHz (typical) fixed
frequency, the power is controlled by varying the peak current. A peak power mode is
implemented to supply a short overload situation. In peak power mode, both frequency
and peak current are increased.
In low-power operation switching losses are reduced by lowering the switching frequency.
The switching frequency of the converter is reduced while the peak current is set to 25 %
of the maximum peak current (see Figure 8 and Figure 10).
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Fig 10. Frequency control
7.12 Overpower or high/low line compensation
The overpower compensation function can be used to realize a maximum output power
which is nearly constant over the full input mains. The overpower compensation circuit
measures the input current on the PROTECT pin and outputs a proportionally dependent
current on the ISENSE pin. The DC voltage across resistor R3 (see Figure 3) limits the
maximum peak current on the current sense resistor (see Figure 11).
At low output power levels, the overpower compensation circuit is switched off.
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
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Fig 11. Overpower compensation
7.13 Driver (pin DRIVER)
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically 300 mA and a current sink capability of typically 750 mA. This enables a fast
turn-on and turn-off of the power MOSFET for efficient operation.
7.14 OverTemperature Protection (OTP)
If the junction temperature exceeds the thermal shutdown limit, integrated
overtemperature protection ensures that the IC stops switching.
OTP is a latched protection. It can be reset by removing the voltage on pin VCC.
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
supply voltage
continuous
0.4
+30
V
t < 100 ms
-
35
V
current limited
0.4
+5
V
0.4
+5.5
V
Voltages
VCC
VPROTECT
voltage on pin PROTECT
VCTRL
voltage on pin CTRL
VISENSE
voltage on pin ISENSE
current limited to
2 mA
0.7
+5
V
current on pin VCC
 < 10 %
-
0.4
A
1
+1
mA
Currents
IVCC
II(PROTECT) input current on pin
PROTECT
ICTRL
current on pin CTRL
3
0
mA
IISENSE
current on pin ISENSE
10
+0.5
mA
IDRIVER
current on pin DRIVER
 < 10 %
0.4
+1
A
Ptot
total power dissipation
Tamb < 75 C
-
0.29
W
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+150
C
-
4000
V
-
750
V
General
ESD
VESD
electrostatic discharge
voltage
class 1
human body
model
changed device
model
[1]
[1]
Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
9. Thermal characteristics
Table 4.
TEA1732CTS
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air; single layer
JEDEC test board
259
K/W
Rth(j-c)
thermal resistance from junction
to case
in free air; JEDEC test
board
152
K/W
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Rev. 1 — 18 March 2014
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TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
10. Characteristics
Table 5.
Characteristics
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage management (pin VCC)
Vstartup
start-up voltage
19.3
21.5
23.8
V
Vth(UVLO)
undervoltage lockout
threshold voltage
11.2
12.5
13.8
V
Vclamp(VCC)
clamp voltage on pin
VCC
activated during latched
protection; ICC = 100 A
-
Vrst(latch) + 0.9
-
V
activated during latched
protection, ICC = 1 mA
-
-
Vrst(latch) + 3.5
V
ICC(restart)
restart supply current
1
2.5
-
mA
Vhys
hysteresis voltage
Vstartup - Vth(UVLO)
6.6
9.1
11.6
V
ICC(startup)
start-up supply
current
VCC < Vstartup
5
10
15
A
ICC(oper)
operating supply
current
no-load on pin DRIVER;
 = 2 %; excluding
optocurrent
-
0.58
-
mA
no-load on pin DRIVER;
 = 25 %, excluding
optocurrent
-
0.62
-
mA
3.5
4.5
5.5
V
1.95
2
2.05
V
VPROTECT = Vdet(PROTECT)
89
84
79
A
II(PROTECT) = 6 A;
mains detect period;
Cmax(PROTECT) = 10 pF
205
260
315
mV
3.5
4.1
4.7
V
Vrst(latch)
latched reset voltage
Protection input (pin PROTECT)
Vdet(PROTECT)
detection voltage on
pin PROTECT
IO(PROTECT)
output current on pin
PROTECT
Vclamp(PROTECT) clamp voltage on pin
PROTECT
II(PROTECT) = 200 A
[1]
Mains detect (pin PROTECT)
Imains(bi)
mains brownin
current
5.58
6
6.42
A
Imains(bo)
mains brownout
current
4.93
5.3
5.67
A
for minimum flyback peak
current
1.5
1.8
2.1
V
for maximum flyback peak
current
3.4
3.9
4.3
V
5
7
9
k
VCTRL = 1.4 V
0.7
0.5
0.3
mA
VCTRL = 3.7 V
0.28
0.2
0.12
mA
Peak current control (pin CTRL)
VCTRL
voltage on pin CTRL
Rint(CTRL)
internal resistance on
pin CTRL
IO(CTRL)
output current on pin
CTRL
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
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TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pulse width modulator
fosc
oscillator frequency
peak power
73
80
87
kHz
high power
60.5
65
69.5
kHz
fmod
modulation frequency
195
260
325
Hz
fmod
modulation frequency high power
variation
3
4
5
kHz
max
maximum duty cycle
77
80
83
%
Ncy(dmax)
number of switching
cycles with maximum
duty cycle
7
-
8
Vstart(red)f
frequency reduction
start voltage
pin CTRL dropping to low
power
1.5
1.8
2.1
V
Vstart(incr)f
frequency increase
start voltage
pin CTRL
2.8
3.1
3.4
V
VM(f)max
maximum frequency
peak voltage
pin CTRL
3.6
3.9
4.2
V
V(zero)
zero duty cycle
voltage
pin CTRL
1.15
1.45
1.75
V
45
60
75
ms
0.47
0.50
0.53
V
Overpower protection
tto(opp)
overpower protection
time-out time
Current sense and overpower compensation (pin ISENSE)
V/t = 0 V/s
Vsense(max)
maximum sense
voltage
tPD(sense)
sense propagation
delay
130
155
180
ns
Vth(sense)opp
overpower protection
sense threshold
voltage
370
400
430
mV
VISENSE/t
slope compensation
voltage on pin
ISENSE
-
20
-
mV/s
tleb
leading edge
blanking time
275
325
375
ns
Iopc(ISENSE)
overpower
IPROTECT = 10 A;
compensation current Vsense(max) > 400 mV
on pin ISENSE
IPROTECT = 18 A;
Vsense(max) > 400 mV
1
1.88
3
A
5
5.88
7
A
2.7
3.5
4.2
ms
-
0.3
0.25
A
high-power mode
Soft start (pin ISENSE)
tstart(soft)
soft start time
Driver (pin DRIVER)
Isource(DRIVER)
source current on pin VDRIVER = 2 V
DRIVER
TEA1732CTS
Product data sheet
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Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Isink(DRIVER)
sink current on pin
DRIVER
VDRIVER = 2 V
0.25
0.3
-
A
VDRIVER = 10 V
0.6
0.75
-
A
VO(DRIVER)max
maximum output
voltage on pin
DRIVER
9
10.5
12
V
Overvoltage protection (pins VCC and ISENSE)
Vovp(VCC)
overvoltage
protection voltage on
pin VCC
29
30
31
V
Vovp(ISENSE)
overvoltage
protection voltage on
pin ISENSE
2.4
2.5
2.6
V
tblank(ovp)ISENSE
overvoltage
protection blanking
time on pin ISENSE
1.7
2.1
2.5
s
Ncy(ovp)
number of
overvoltage
protection cycles
4
4
4
130
140
150
Temperature protection
Tpl(IC)
[1]
IC protection level
temperature
C
The clamp voltage on the PROTECT pin is lowered when the IC is in Power-down mode. (latched or restart protection)
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
11. Application information
A power supply with the TEA1732CTS is a flyback converter operating in continuous
conduction mode (see Figure 12).
Capacitor C3 buffers the IC supply voltage, which is powered via resistor R1 for start-up
and via the auxiliary winding during normal operation. Sense resistor R6 converts the
current through MOSFET S1 into a voltage on pin ISENSE. The value of resistor R6
defines the maximum primary peak current through MOSFET S1.
Capacitor C2 is added to reduce noise on the CTRL pin.
Resistor R4 is required to limit the current spikes to pin DRIVER because of parasitic
inductance of current sense resistor R6. Resistor R4 also dampens possible oscillations
of MOSFET S1. Adding a bead on the gate pin of MOSFET S1 can be required to prevent
local oscillations of the MOSFET.
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Fig 12. TEA1732CTS application diagram
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
15 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
12. Package outline
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Fig 13. Package outline SOT457 (TSOP6)
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
16 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1732CTS v.1
20140318
Product data sheet
-
-
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1732CTS
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
18 of 20
TEA1732CTS
NXP Semiconductors
GreenChip SMPS control IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1732CTS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 20
NXP Semiconductors
TEA1732CTS
GreenChip SMPS control IC
16. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
General control . . . . . . . . . . . . . . . . . . . . . . . . . 3
Start-up and UnderVoltage LockOut (UVLO) . . 4
Supply management. . . . . . . . . . . . . . . . . . . . . 5
External overtemperature protection and
mains detect input (pin PROTECT) . . . . . . . . . 5
Duty cycle control (pin CTRL). . . . . . . . . . . . . . 6
Slope compensation (pin CTRL). . . . . . . . . . . . 6
Overpower timer . . . . . . . . . . . . . . . . . . . . . . . . 7
Current mode control (pin ISENSE) . . . . . . . . . 7
Overvoltage protection (pin ISENSE) . . . . . . . . 8
Overvoltage protection (pin VCC). . . . . . . . . . . 8
Peak power, high-power and low-power
operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Overpower or high/low line compensation . . . . 9
Driver (pin DRIVER) . . . . . . . . . . . . . . . . . . . . 10
OverTemperature Protection (OTP) . . . . . . . . 10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics . . . . . . . . . . . . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 March 2014
Document identifier: TEA1732CTS