PDF

PACKAGE OUTLINES
LS6 – LEADLESS CERAMIC
POWER AMPLIFIER SMT PACKAGE
Suggested LS6 PCB Land Pattern
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR
SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating [2]
Package Marking [1]
HMC7229LS6
ALUMINA WHITE
Gold over Nickel
N/A [3]
H7229
XXXX
[1] 4-Digit lot number XXXX.
[2] Max peak reflow temperature of 260 °C.
[3] Not Applicable to air cavity packages.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
LS6 – LEADLESS CERAMIC
POWER AMPLIFIER SMT PACKAGE
2X.0325"
[0.82]
PAD SIZE
2X .0 1 0" X .04
5"
SOLDERMASK
.276"
PACKAGE OUTLINES
Suggested LS6 PCB Land Pattern
4X.0354"
[0.90]
.266"
GROUND PAD
.221"
.217"
PAD SIZE
14X .020"X.041"
.191"
2X.014"
PIN1
4X.0394"
[1.00]
.071"
2X.014"
.059"
.055"
.010"
TYPICAL VIA
.010"
.276"
.146" SQUARE MASK OPENING
.02X45° CHAMFER FOR PIN1
.266"
2X.010"
.047"
.010"
.000"
2X.010"
.220"
.000"
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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