PACKAGE OUTLINES LS6 – LEADLESS CERAMIC POWER AMPLIFIER SMT PACKAGE Suggested LS6 PCB Land Pattern NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Package Information Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1] HMC7229LS6 ALUMINA WHITE Gold over Nickel N/A [3] H7229 XXXX [1] 4-Digit lot number XXXX. [2] Max peak reflow temperature of 260 °C. [3] Not Applicable to air cavity packages. 2 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com LS6 – LEADLESS CERAMIC POWER AMPLIFIER SMT PACKAGE 2X.0325" [0.82] PAD SIZE 2X .0 1 0" X .04 5" SOLDERMASK .276" PACKAGE OUTLINES Suggested LS6 PCB Land Pattern 4X.0354" [0.90] .266" GROUND PAD .221" .217" PAD SIZE 14X .020"X.041" .191" 2X.014" PIN1 4X.0394" [1.00] .071" 2X.014" .059" .055" .010" TYPICAL VIA .010" .276" .146" SQUARE MASK OPENING .02X45° CHAMFER FOR PIN1 .266" 2X.010" .047" .010" .000" 2X.010" .220" .000" For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3