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28-Lead Power Small Outline Package, Thermally Enhanced [PSOP/2]
(RP-28)
Dimensions shown in millimeters
a
17.90
BSC
28
15
7.50
BSC
HEAT SLUG
ON BOTTOM
4.80
4.55
PIN 1
10.30
BSC
14
1
13.70
13.45
2.65
2.35
0.30
0.10
1.27
BSC
0.51
0.31
SEATING
PLANE
0.75
´ 45°
0.25
8°
0°
0.33
0.20
COMPLIANT TO JEDEC STANDARDS MS-013-AE
1.27
0.40