Materials Declaration Package Body Size Lead Count Option Substance Ceramics Aluminum Oxide Manganese Dioxide Silicon Dioxide Titanium Dioxide Chromium Oxide Iron Oxide Magnesium Oxide Cobalt Oxide Calcium Oxide Subtotal Sealing Glass Lead Oxide Tin Oxide Silicon Dioxide Boron Trioxide Aluminum Oxide Titanium Dioxide Magnesium Oxide Zinc Oxide Calcium Oxide Chromium Oxide Iron Oxide Manganese Dioxide Sodium Oxide Subtotal Total Substance Ceramics Aluminum Oxide Manganese Dioxide Silicon Dioxide Titanium Dioxide Chromium Oxide Iron Oxide Magnesium Oxide Cobalt Oxide Calcium Oxide Subtotal Sealing glass Lead Oxide Tin Oxide Silicon Dioxide Boron Trioxide Aluminum Oxide Magnesium Oxide Titanium Dioxide Zinc Oxide Calcium Oxide Chromium Oxide Iron Oxide Manganese Dioxide Sodium Oxide Subtotal Total CerDIP 600 mils 40 SnPb Base % of Base Weight (g) PPM 67.500 2.470 2.200 1.390 1.100 0.890 0.360 0.200 0.030 76.140 4.60E+00 1.68E-01 1.50E-01 9.48E-02 7.50E-02 6.07E-02 2.46E-02 1.36E-02 2.05E-03 5.19E+00 363942 13318 11862 7495 5931 4799 1941 1078 162 410526 14.480 3.780 1.680 1.374 1.000 0.748 0.490 0.200 0.040 0.028 0.028 0.010 0.002 23.860 100.00 9.88E-01 2.58E-01 1.15E-01 9.37E-02 6.82E-02 5.10E-02 3.34E-02 1.36E-02 2.73E-03 1.91E-03 1.91E-03 6.82E-04 1.36E-04 1.63 E+00 6.82 E+00 78072 20381 9058 7408 5392 4033 2642 1078 216 151 151 54 11 128647 539173 Caps % of Caps Weight (g) PPM 62.60 2.40 2.00 1.30 1.00 0.79 0.40 0.20 0.03 70.72 2.87E+00 1.10E-01 9.18E-02 5.97E-02 4.59E-02 3.63E-02 1.84E-02 9.18E-03 1.38E-03 3.25E+00 227159 8709 7257 4717 3629 2867 1451 726 109 256625 17.85 4.57 2.20 1.70 1.20 0.70 0.70 0.20 0.07 0.04 0.04 0.01 0.003 29.28 100.00 8.19E-01 2.10E-01 1.01E-01 7.80E-02 5.51E-02 3.21E-02 3.21E-02 9.18E-03 3.21E-03 1.84E-03 1.84E-03 4.59E-04 1.38E-04 1.34E+00 4.59 E+00 64773 16583 7983 6169 4354 2540 2540 726 254 145 145 36 11 106250 362875 Leadframe % of Leadframe 58.450 40.840 0.520 0.130 0.030 0.010 0.010 0.005 0.003 0.002 100.00 Weight (g) 6.72E-01 4.70E-01 5.98E-03 1.50E-03 3.45E-04 1.15E-04 1.15E-04 5.75E-05 3.45E-05 2.30E-05 1.15 E+00 PPM 53141 37130 473 118 27 9 9 5 3 2 90916 Substance Silver Lead Borate glass Subtotal Paste % of Paste 80 20 100 Weight (g) 2.40E-03 6.00E-04 3.00 E-03 PPM Substance Doped Silicon Chip % of Wire 100 Weight (g) 6.30E-02 PPM Substance Aluminum Bonding Wires Weight (g) % of Wire 100 3.00E-03 Substance Iron Nickel Manganese Silicon Cobalt Chromium Aluminum Sulfur Carbon Phosphorus Subtotal Substance Tin Lead Subtotal External Leadframe Plating % of Plating Weight (g) 63 1.26E-02 37 7.40E-03 100 2.00 E-02 190 47 237 4981 PPM 237 PPM 996 585 1581 Package Totals Weight (g) PPM 1.26 E+01 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information.