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SKD
1
08-08-2007 CLG
© by SEMIKRON
SKD 35
Fig. 3L Power dissipation vs. output current
Fig. 3R Power dissipation vs. case temperature
Fig. 9 Forward characteristics of a diode arm (typical)
Fig. 12 Transient thermal impedance vs. time
2
08-08-2007 CLG
© by SEMIKRON
SKD 35
Dimensions in mm
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I This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
3
08-08-2007 CLG
© by SEMIKRON