93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8K Microwire Compatible Serial EEPROM Device Selection Table Part Number VCC Range ORG Pin PE Pin Word Size Temp Ranges Packages 93AA76A 1.8-5.5 No No 8-bit I P, SN, ST, MS, OT 93AA76B 1.8-5-5 No No 16-bit I P, SN, ST, MS, OT 93LC76A 2.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT 93LC76B 2.5-5.5 No No 16-bit I, E P, SN, ST, MS, OT 93C76A 4.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT 93C76B 4.5-5.5 No No 16-bit I, E P, SN, ST, MS, OT 93AA76C 1.8-5.5 Yes Yes 8- or 16-bit I P, SN, ST, MS, MC, MN 93LC76C 2.5-5.5 Yes Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN 93C76C 4.5-5.5 Yes Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN Features: Description: • • • • • The Microchip Technology Inc. 93XX76A/B/C devices are 8Kbit, low-voltage, serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93XX76C are dependent upon external logic levels driving the ORG pin to set word size. The 93XX76A devices provide dedicated 8-bit memory organization, while the 93XX76B devices provide dedicated 16-bit memory organization. A Program Enable (PE) pin allows the user to write-protect the entire memory array. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/ TDFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish. • • • • • • • • • • Low-Power CMOS Technology ORG Pin to Select Word Size for ‘76C’ Version 1024 x 8-bit Organization ‘A’ Devices (no ORG) 512 x 16-bit Organization ‘B’ Devices (no ORG) Program Enable Pin to Write-Protect the Entire Array (‘76C’ version only) Self-Timed Erase/Write Cycles (including Auto-Erase) Automatic ERAL Before WRAL Power-On/Off Data Protection Circuitry Industry Standard 3-Wire Serial I/O Device Status Signal (Ready/Busy) Sequential Read Function 1,000,000 Erase/Write Cycles Data Retention > 200 Years Pb-free and RoHS Compliant Temperature Ranges Supported: - Industrial (I) Package Types (not to scale) -40°C to +85°C - Automotive (E) -40°C to +125°C Pin Function Table Name Function CS Chip Select CLK Serial Data Clock DI Serial Data Input DO Serial Data Output VSS Ground PE Program Enable – 93XX76C only ORG Memory Configuration – 93XX76C only VCC Power Supply 2003-2012 Microchip Technology Inc. SOT-23 (OT) PDIP/SOIC (P, SN) CS CLK DI DO 1 2 3 4 8 7 6 5 VCC PE(1) ORG(1) VSS 1 2 3 4 8 7 6 5 1 6 2 5 VCC CS DI 3 4 CLK DFN/TDFN (MC, MN) TSSOP/MSOP (ST, MS) CS CLK DI DO DO VSS VCC PE(1) ORG(1) VSS CS 1 CLK 2 DI 3 DO 4 8 7 6 5 VCC PE ORG VSS Note 1: 93XX76C only. DS21796M-page 1 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. Parameter Industrial (I): TA = -40°C to +85°C, VCC = +1.8V to 5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V Min Typ Max Units Conditions D1 VIH1 VIH2 High-level input voltage 2.0 0.7 VCC — — VCC +1 VCC +1 V V VCC 2.7V VCC < 2.7V D2 VIL1 VIL2 Low-level input voltage -0.3 -0.3 — — 0.8 0.2 VCC V V VCC 2.7V VCC < 2.7V D3 VOL1 VOL2 Low-level output voltage — — — — 0.4 0.2 V V IOL = 2.1 mA, VCC = 4.5V IOL = 100 A, VCC = 2.5V D4 VOH1 VOH2 High-level output voltage 2.4 VCC - 0.2 — — — — V V IOH = -400 A, VCC = 4.5V IOH = -100 A, VCC = 2.5V D5 ILI Input leakage current — — ±1 A VIN = VSS or VCC D6 ILO Output leakage current — — ±1 A VOUT = VSS or VCC D7 CIN, COUT Pin capacitance (all inputs/ outputs) — — 7 pF VIN/VOUT = 0V (Note 1) TA = 25°C, FCLK = 1 MHz D8 ICC write Write current — — — 500 3 — mA A FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 2.5V D9 ICC read Read current — — — — — 100 1 500 — mA A A FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 3.0V FCLK = 2 MHz, VCC = 2.5V D10 ICCS Standby current — — — — 1 5 A A I – Temp E – Temp CLK = CS = 0V ORG = DI = PE = VSS or VCC (Note 2) (Note 3) D11 VPOR VCC voltage detect — — 1.5 3.8 — — V V Note 1: 2: 3: (Note 1) 93AA76A/B/C, 93LC76A/B/C 93C76A/B/C This parameter is periodically sampled and not 100% tested. ORG and PE pins not available on ‘A’ or ‘B’ versions. Ready/Busy status must be cleared from DO; see Section 3.4 “Data Out (DO)”. DS21796M-page 2 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. Parameter Industrial (I): TA = -40°C to +85°C, VCC = +1.8V to 5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V Min Max Units Conditions A1 FCLK Clock frequency — 3 2 1 MHz MHz MHz 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A2 TCKH Clock high time 200 250 450 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A3 TCKL Clock low time 100 200 450 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A4 TCSS Chip Select setup time 50 100 250 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A5 TCSH Chip Select hold time 0 — ns 1.8V VCC < 5.5V A6 TCSL Chip Select low time 250 — ns 1.8V VCC < 5.5V A7 TDIS Data input setup time 50 100 250 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A8 TDIH Data input hold time 50 100 250 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A9 TPD Data output delay time — 100 250 400 ns ns ns 4.5V VCC < 5.5V, CL = 100 pF 2.5V VCC < 4.5V, CL = 100 pF 1.8V VCC < 2.5V, CL = 100 pF A10 TCZ Data output disable time — 100 200 ns ns 4.5V VCC < 5.5V, (Note 1) 1.8V VCC < 4.5V, (Note 1) A11 TSV Status valid time — 200 300 500 ns ns ns 4.5V VCC < 5.5V, CL = 100 pF 2.5V VCC < 4.5V, CL = 100 pF 1.8V VCC < 2.5V, CL = 100 pF A12 TWC Program cycle time — 5 ms Erase/Write mode (AA and LC versions) A13 TWC — 2 ms Erase/Write mode (93C versions) A14 TEC — 6 ms ERAL mode, 4.5V VCC 5.5V A15 TWL — 15 ms WRAL mode, 4.5V VCC 5.5V A16 — 1M — Note 1: 2: Endurance cycles 25°C, VCC = 5.0V, (Note 2) This parameter is periodically sampled and not 100% tested. This application is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which may be obtained from Microchip’s web site at www.microchip.com. 2003-2012 Microchip Technology Inc. DS21796M-page 3 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C FIGURE 1-1: CS SYNCHRONOUS DATA TIMING VIH TCSS VIL TCKH TCKL TCSH VIH CLK VIL TDIS TDIH VIH DI VIL DO (Read) DO (Program) Note: TCZ TPD TPD VOH VOL TCZ TSV VOH Status Valid VOL TSV is relative to CS. TABLE 1-3: INSTRUCTION SET FOR X16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1) Instruction SB Opcode Address READ 1 10 X EWEN 1 00 1 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 x x x x x x x x A8 A7 A6 A5 A4 A3 A2 A1 A0 Data In Data Out Req. CLK Cycles — D15-D0 29 — High-Z 13 — (RDY/BSY) 13 — (RDY/BSY) 13 D15-D0 (RDY/BSY) 29 ERASE 1 11 X ERAL 1 00 1 WRITE 1 01 X WRAL 1 00 0 1 x x x x x x x x D15-D0 (RDY/BSY) 29 EWDS 1 00 0 0 x x x x x x x x — High-Z 13 0 X X X X X X X X A8 A7 A6 A5 A4 A3 A2 A1 A0 TABLE 1-4: INSTRUCTION SET FOR X8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0) Instruction SB Opcode READ 1 10 X EWEN 1 00 1 ERASE 1 11 X ERAL 1 00 1 WRITE 1 01 X WRAL 1 00 0 1 x x x x x x x x EWDS 1 00 0 0 x x x x x x x x DS21796M-page 4 Data In Data Out Req. CLK Cycles — D7-D0 22 — High-Z 14 — (RDY/BSY) 14 — (RDY/BSY) 14 D7-D0 (RDY/BSY) 22 x D7-D0 (RDY/BSY) 22 x — High-Z 14 Address A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 x x x x x x x x x A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 0 x x x x x x x x x A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.0 FUNCTIONAL DESCRIPTION When the ORG pin (93XX76C) is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a High-Z state except when reading data from the device, or when checking the Ready/ Busy status during a programming operation. The Ready/Busy status can be verified during an Erase/ Write operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. DO will enter the High-Z state on the falling edge of CS. 2.1 Start Condition The Start bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time. Before a Start condition is detected, CS, CLK and DI may change in any combination (except to that of a Start condition), without resulting in any device operation (Read, Write, Erase, EWEN, EWDS, ERAL or WRAL). As soon as CS is high, the device is no longer in Standby mode. 2.3 All modes of operation are inhibited when VCC is below a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices or 3.8V for ‘93C’ devices. The EWEN and EWDS commands give additional protection against accidentally programming during normal operation. Note: 2.2 Note: It is possible to connect the Data In and Data Out pins together. However, with this configuration it is possible for a “bus conflict” to occur during the “dummy zero” that precedes the read operation if A0 is a logic highlevel. Under such a condition the voltage level seen at Data Out is undefined and will depend upon the relative impedances of Data Out and the signal source driving A0. The higher the current sourcing capability of the driver, the higher the voltage at the Data Out pin. In order to limit this current, a resistor should be connected between DI and DO. 2003-2012 Microchip Technology Inc. To prevent accidental writes to the array in the 93XX76C devices, set the PE pin to a logic low. Block Diagram VCC VSS Memory Array Address Decoder Address Counter When preparing to transmit an instruction, either the CLK or DI signal levels must be at a logic low as CS is toggled active high. Data In/Data Out (DI/DO) For added protection, an EWDS command should be performed after every write operation and an external 10 k pulldown protection resistor should be added to the CS pin. After power-up the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. An instruction following a Start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. Note: Data Protection Data Register Output Buffer DO DI ORG* CS Mode Decode Logic PE* CLK Clock Register *ORG and PE inputs are not available on A/B devices. DS21796M-page 5 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.4 Erase The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction. The ERASE instruction forces all data bits of the specified address to the logical ‘1’ state. The rising edge of CLK before the last address bit initiates the write cycle. Note: FIGURE 2-1: After the Erase cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. ERASE TIMING TCSL CS Check Status CLK 1 DI 1 1 AN AN-1 AN-2 ••• A0 TCZ TSV DO High-Z Busy Ready High-Z TWC 2.5 Erase All (ERAL) The DO pin indicates the Ready/Busy status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the erase cycle, except for the different opcode. The ERAL cycle is completely self-timed. The rising edge of CLK before the last data bit initiates the write cycle. Clocking of the CLK pin is not necessary after the device has entered the ERAL cycle. FIGURE 2-2: Note: After the ERAL command is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. VCC must be 4.5V for proper operation of ERAL. ERAL TIMING TCSL CS Check Status CLK DI 1 0 0 1 0 x ••• x TCZ TSV DO High-Z Busy Ready High-Z TEC DS21796M-page 6 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.6 Erase/Write Disable and Enable (EWDS/EWEN) Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or VCC is removed from the device. The 93XX76A/B/C powers up in the Erase/Write Disable (EWDS) state. All programming modes must be preceded by an Erase/Write Enable (EWEN) instruction. FIGURE 2-3: To protect against accidental data disturbance, the EWDS instruction can be used to disable all erase/write functions and should follow all programming operations. Execution of a READ instruction is independent of both the EWEN and EWDS instructions. EWDS TIMING TCSL CS CLK 1 DI FIGURE 2-4: 0 0 0 0 ••• x x EWEN TIMING TCSL CS CLK 1 DI 2.7 0 0 1 1 ••• x Read The output data bits will toggle on the rising edge of the CLK and are stable after the specified time delay (TPD). Sequential read is possible when CS is held high. The memory data will automatically cycle to the next register and output sequentially. The READ instruction outputs the serial data of the addressed memory location on the DO pin. A dummy zero bit precedes the 8-bit (If ORG pin is low or A-version devices) or 16-bit (If ORG pin is high or B-version devices) output string. FIGURE 2-5: x READ TIMING CS CLK DI DO 1 1 0 High-Z 2003-2012 Microchip Technology Inc. AN ••• A0 0 Dx ••• D0 Dx ••• D0 Dx ••• D0 DS21796M-page 7 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.8 Write The DO pin indicates the Ready/Busy status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction. The WRITE instruction is followed by 8 bits (if ORG is low or A-version devices) or 16 bits (if ORG pin is high or B-version devices) of data which are written into the specified address. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. FIGURE 2-6: Note: The write sequence requires a logic high signal on the PE pin prior to the rising edge of the last data bit. Note: After the Write cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. WRITE TIMING TCSL CS CLK DI 1 0 1 AN ••• A0 Dx ••• D0 TSV DO High-Z Busy TCZ Ready High-Z TWC DS21796M-page 8 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.9 Write All (WRAL) The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle. The WRAL command includes an automatic ERAL cycle for the device, so the WRAL instruction does not require an ERAL instruction. However, the chip must be in the EWEN status. Note: The write sequence requires a logic high signal on the PE pin prior to the rising edge of the last data bit. Note: After the Write All cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. VCC must be 4.5V for proper operation of WRAL. FIGURE 2-7: WRAL TIMING TCSL CS CLK DI 1 0 0 0 1 x ••• x Dx ••• D0 TSV DO High-Z Busy TCZ Ready HIGH-Z TWL 2003-2012 Microchip Technology Inc. DS21796M-page 9 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.0 PIN DESCRIPTIONS TABLE 3-1: PIN DESCRIPTIONS PDIP SOIC TSSOP MSOP DFN(1) TDFN(1) SOT-23 CS 1 1 1 1 1 1 5 Chip Select CLK 2 2 2 2 2 2 4 Serial Clock Name Function DI 3 3 3 3 3 3 3 Data In DO 4 4 4 4 4 4 1 Data Out VSS 5 5 5 5 5 5 2 Ground ORG 6 6 6 6 6 6 — Organization/93XX76C only PE 7 7 7 7 7 7 — Program Enable/ 93XX76C only 8 8 8 8 8 8 6 Power Supply VCC Note 1: 3.1 The exposed pad on the DFN/TDFN package may be connected to VSS or left floating. Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle that is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into Standby mode as soon as the programming cycle is completed. CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a Reset status. 3.2 Serial Clock (CLK) The Serial Clock is used to synchronize the communication between a master device and the 93XX series device. Opcodes, address and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK. CLK can be stopped anywhere in the transmission sequence (at high or low-level) and can be continued anytime with respect to Clock High Time (TCKH) and Clock Low Time (TCKL). This gives the controlling master freedom in preparing opcode, address and data. CLK is a “don’t care” if CS is low (device deselected). If CS is high, but the Start condition has not been detected (DI = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a Start condition). CLK cycles are not required during the self-timed write (i.e., auto erase/write) cycle. After detection of a Start condition the specified number of clock cycles (respectively, low-to-high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcode, address and DS21796M-page 10 data bits before an instruction is executed. CLK and DI then become “don’t care” inputs waiting for a new Start condition to be detected. 3.3 Data In (DI) Data In (DI) is used to clock in a Start bit, opcode, address and data synchronously with the CLK input. 3.4 Data Out (DO) Data Out (DO) is used in the Read mode to output data synchronously with the CLK input (TPD after the positive edge of CLK). This pin also provides Ready/Busy status information during erase and write cycles. Ready/Busy status information is available on the DO pin if CS is brought high after being low for minimum Chip Select Low Time (TCSL) and an erase or write operation has been initiated. The Status signal is not available on DO, if CS is held low during the entire erase or write cycle. In this case, DO is in the High-Z mode. If status is checked after the erase/write cycle, the data line will be high to indicate the device is ready. Note: 3.5 After a programming cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. Organization (ORG) When the ORG pin is connected to VCC or logic high, the (x16) memory organization is selected. When the ORG pin is tied to VSS or logic low, the (x8) memory organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX76A devices are always (x8) organization and 93XX76B devices are always (x16) organization. 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.6 Program Enable (PE) This pin allows the user to enable or disable the ability to write data to the memory array. If the PE pin is tied to VCC, the device can be programmed. If the PE pin is tied to VSS, programming will be inhibited. This pin cannot be floated – it must be tied to VCC or VSS. PE is not available on 93XX76A or 93XX76B. On those devices, programming is always enabled. 2003-2012 Microchip Technology Inc. DS21796M-page 11 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN 6-Lead SOT-23 XXNN Example: 3L76CI 5281L7 Example: 4EL7 8-Lead PDIP Example: XXXXXXXX T/XXXNNN YYWW 93LC76C I/P e3 1L7 0528 8-Lead SOIC Example: XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN 8-Lead 2x3 TDFN XXX YWW NN DS21796M-page 12 93LC76CI SN e3 0528 1L7 Example: L76C I528 1L7 Example: 3B4 528 L7 Example: EB4 528 L7 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 1st Line Marking Codes Part Number SOT-23 TSSOP 93AA76A DFN TDFN MSOP A76A I Temp. E Temp. I Temp. E Temp. I Temp. E Temp. 3A76AT 4BNN — — — — — 93AA76B A76B 3A76BT 4LNN — — — — — 93AA76C A76C 3A76CT — — 3B1 — EB1 — 93LC76A L76A 3L76AT 4ENN 4FNN — — — — 93LC76B L76B 3L76BT 4PNN 4RNN — — — — 93LC76C L76C 3L76CT — — 3B4 3B5 EB4 EB5 93C76A C76A 3C76AT 4HNN 4JNN — — — — 93C76B C76B 3C76BT 4TNN 4UNN — — — — 93C76C C76C 3C76CT — — 3B7 3B8 EB7 EB8 Note: T = Temperature grade (I, E) NN = Alphanumeric traceability code Legend: XX...X T Y YY WW NNN e3 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2003-2012 Microchip Technology Inc. DS21796M-page 13 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796M-page 14 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2003-2012 Microchip Technology Inc. DS21796M-page 15 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 16 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 3# 4# 5$8 %1 44"" 5 5 56 7 9 1# ()* 6$# !4!1# )* 6,:# ; !!1// < ; ( #! %% ; ( 6,=!# " ; !!1/=!# " ; < 6,4# ; . #4# 4 ; 9 . ## 4 ( ; < . # > ; > 4!/ < ; 9 4!=!# 8 ; ( !"! #$! !% #$ !% #$ #&! ! !# "'( )*+ ) #&#,$ --# $## - *<) 2003-2012 Microchip Technology Inc. DS21796M-page 17 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 18 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C !"## $% ! . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 3# 4# 5$8 %1 5*:" 5 5 56 7 < 1# # #1 ; ; !!1// ( ( ) # #1 ( ; ; $!# $!=!# " ( !!1/=!# " ( < 6,4# < 9( # #1 4 ( ( 4!/ < ( 8 9 8 < ) ; ; 34!=!# 4 -4!=!# 6, -? )* 1, $!&%#$,08$#$ #8 #!-###! ?%#*# # !"! #$! !% #$ !% #$ #&!@ ! !# "'( )*+) #&#,$ --# $## - *<) 2003-2012 Microchip Technology Inc. DS21796M-page 19 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 20 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2003-2012 Microchip Technology Inc. DS21796M-page 21 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C "&'()#$%!* . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ DS21796M-page 22 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C ++, "-(-$% . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 3# 4# 5$8 %1 44"" 5 5 56 7 < 1# 6,:# ; 9()* ; !!1// < ( #! %% ( ; ( 6,=!# " !!1/=!# " 9)* !!1/4# . #4# 4 ( 9 ( . ## 4 ( ". . # > ; <> 4!/ ; 4!=!# 8 ; 1, $!&%#$,08$#$ #8 #!-###! !"! #$! !% #$ !% #$ #&!( ! !# "'( )*+ ) #&#,$ --# $## ".+ % 0$ $-# $## 0% % # $ - *<9) 2003-2012 Microchip Technology Inc. DS21796M-page 23 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 24 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C . ',/0*"11#()$% . . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 3# 4# 5$8 %1 44"" 5 5 56 7 < 1# 6,:# < #! %% ( * ##/ ". 6,4# )* 6,=!# " "& !1!4# ; "& !1!=!# " ( ; ( 8 ( * ##4# 4 ( * ### "& !1! U ; ; * ##=!# ()* )* (( 1, $!&%#$,08$#$ #8 #!-###! 1/, & !#8 #! 1/ - $#! !# "'( )*+ ) #&#,$ --# $## ".+ % 0$ $-# $## 0% % # $ - ** 2003-2012 Microchip Technology Inc. DS21796M-page 25 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 26 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2003-2012 Microchip Technology Inc. DS21796M-page 27 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 28 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C . ',/0"11#(23$% . . # #$#/!- 0 # 1/%# #!# ##+22--- 2/ 2003-2012 Microchip Technology Inc. DS21796M-page 29 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C APPENDIX A: REVISION HISTORY Revision A (05/2003) Initial Release. Revision B (07/2003) Revision C (12/2003) Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision D (02/2004) Corrections to Device Selection Table, Table 1-1, Table 1-2, Section 2.4, Section 2.5, Section 2.8 and Section 2.9. Added note to Figure 2-7. Revision E (03/2005) Added DFN package. Revision F (04/2005) Added notes throughout. Revision G (09/2006) Revised note in Sections 2.8 and 2.9. Replaced DFN package drawing. Revision H (11/2006) Updated Package Drawings. Revision J (10/2007) Revised Device Selection Table; Revised Pin Function Table; Revised Package Types; Revised Table 3-1; Replaced Package Drawings; Revised Product ID System. Revision K (5/2008) Revised Figures 2-1, 2-2, 2-6 and 2-7; Revised Package Marking Information; Replaced Package Drawings. Revision L (01/2012) Added TDFN package. Revision M (04/2012) Revised Device Selection Table; Added Note to Package Types Diagram; Revised Marking Codes Table; Revised Product ID System. DS21796M-page 30 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2003-2012 Microchip Technology Inc. DS21796M-page 31 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Literature Number: DS21796M Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21796M-page 32 2003-2012 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.. X PART NO. Device Tape & Reel Temperature Range Device: Tape & Reel: /XX X Package Examples: a) b) 93AA76A: 8K 1.8V Microwire Serial EEPROM (x8) 93AA76B: 8K 1.8V Microwire Serial EEPROM (x16) 93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG c) 93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, tape and reel, 1.8V 93LC76A: 8K 2.5V Microwire Serial EEPROM (x8) 93LC76B: 8K 2.5V Microwire Serial EEPROM (x16) 93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG a) 93C76A: 93C76B: 93C76C: c) 93LC76C-I/ST: 8K, 1024x8 or 512x16 Serial EEPROM, TSSOP package, 2.5V 93LC76BT-I/OT: 8K, 512x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93LC76CT-E/MNY: 8K, 1024x8 or 512x16 Serial EEPROM, Automotive Temp, TDFN package, tape and reel Blank = T = 8K 5.0V Microwire Serial EEPROM (x8) 8K 5.0V Microwire Serial EEPROM (x16) 8K 5.0V Microwire Serial EEPROM w/ORG Standard pinout Tape & Reel b) a) b) Temperature Range: I E Package: MS = OT = P = SN = ST = MC = MNY(1) = Note 1: 93AA76C-I/P: 8K, 1024x8 or 512x16 Serial EEPROM, PDIP package, 1.8V 93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM, SOT-23 package, tape and reel, 1.8V = = 93C76C-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, 5.0V 93C76AT-I/OT: 8K, 1024x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V -40°C to +85°C -40°C to +125°C Plastic MSOP (Micro Small outline), 8-lead Plastic SOT-23, 6-lead (Tape & Reel only) Plastic DIP (300 mil body), 8-lead Plastic SOIC (3.90 mm body), 8-lead Plastic TSSOP (4.4 mm body), 8-lead Plastic DFN (2x3x0.90 mm body), 8-lead Plastic TDFN (2x3x0.75 mm body), 8-lead (Tape & Reel only) “Y” indicates a Nickel Palladium Gold (NiPdAu) finish. 2003-2012 Microchip Technology Inc. DS21796M-page 33 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796M-page 34 2003-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620762158 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2003-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21796M-page 35 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-66-152-7160 Fax: 81-66-152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS21796M-page 36 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 11/29/11 2003-2012 Microchip Technology Inc.