25AA1024 DATA SHEET (04/15/2015) DOWNLOAD

25AA1024
1 Mbit SPI Bus Serial EEPROM
Device Selection Table
Part Number
25AA1024
VCC Range
Page Size
Temp. Ranges
Packages
1.8-5.5V
256 Byte
I
P, SM, MF
Features
Description
• 20 MHz Maximum Clock Speed
• Byte and Page-level Write Operations:
- 256 byte page
- 6 ms maximum write cycle time
- No page or sector erase required
• Low-Power CMOS Technology:
- Maximum Write current: 7 mA at 5.5V
- Maximum Read current: 10 mA at 5.5V,
20 MHz
- Standby current: 1 µA at 2.5V, 85°C
(Deep Power-down)
• Electronic Signature for Device ID
• Self-Timed Erase and Write Cycles:
- Page Erase (6 ms maximum)
- Sector Erase (10 ms maximum)
- Chip Erase (10 ms maximum)
• Sector Write Protection (32K byte/sector):
- Protect none, 1/4, 1/2 or all of array
• Built-in Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• High Reliability:
- Endurance: 1M erase/write cycles
- Data Retention: >200 years
- ESD Protection: 4000V
• Temperature Ranges Supported:
- Industrial (I):-40°C to +85°C
• RoHS Compliant
The Microchip Technology Inc. 25AA1024 is a
1024 Kbit serial EEPROM memory with byte-level and
page-level serial EEPROM functions. It also features
Page, Sector and Chip erase functions typically
associated with Flash-based products. These functions
are not required for byte or page write operations. The
memory is accessed via a simple Serial Peripheral
Interface (SPI) compatible serial bus. The bus signals
required are a clock input (SCK) plus separate data in
(SI) and data out (SO) lines. Access to the device is
controlled by a Chip Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
The 25AA1024 is available in standard packages
including 8-lead PDIP and SOIJ, and advanced 8-lead
DFN package. All devices are RoHS compliant.
Package Types (not to scale)
DFN
PDIP/SOIJ
SO 2
WP 3
VSS 4
(P, SM)
8
VCC
7
HOLD
CS 1
SO 2
6
SCK
WP 3
5
SI
VSS 4
25AA1024
CS 1
25AA1024
(MF)
8
7
VCC
6
SCK
5
SI
HOLD
Pin Function Table
Name
Function
CS
Chip Select Input
SO
Serial Data Output
WP
Write-Protect
VSS
Ground
SI
Serial Data Input
SCK
Serial Clock Input
HOLD
Hold Input
VCC
Supply Voltage
 2007-2015 Microchip Technology Inc.
DS20001836J-page 1
25AA1024
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
D001
VIH1
D002
VIL1
D003
VIL2
D004
VOL
D005
VOL
D006
VOH
D007
ILI
D008
ILO
D009
CINT
D010
ICCREAD
Characteristic
Max.
Units
High-level Input
Voltage
0.7 VCC
VCC +1
V
Low-level Input
Voltage
-0.3
0.3 VCC
V
-0.3
0.2 VCC
V
VCC < 2.7V
Low-level Output
Voltage
—
0.4
V
IOL = 2.1 mA
—
0.2
V
IOL = 1.0 mA, VCC < 2.5V
High-level Output
Voltage
VCC -0.2
—
V
IOH = -400 µA
Input Leakage
Current
—
±1
µA
CS = VCC, VIN = VSS or VCC
Output Leakage
Current
—
±1
µA
CS = VCC, VOUT = VSS or VCC
Internal Capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note)
—
10
mA
VCC = 5.5V; FCLK = 20.0 MHz;
SO = Open
—
5
mA
VCC = 2.5V; FCLK = 10.0 MHz;
SO = Open
—
7
mA
VCC = 5.5V
—
5
mA
VCC = 2.5V
Standby Current
—
12
A
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, 85°C
Deep Power-down
Current
—
1
µA
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, 85°C
ICCWRITE
D012
ICCS
D013
ICCSPD
Note:
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
Min.
Operating Current
D011
Industrial (I)*:
TA = 0°C to +85°C
Industrial (I):
TA = -40°C to +85°C
* Limited industrial temperature range.
Test Conditions
VCC≥ 2.7V
This parameter is periodically sampled and not 100% tested.
DS20001836J-page 2
 2007-2015 Microchip Technology Inc.
25AA1024
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
No.
Sym.
1
FCLK
2
TCSS
3
TCSH
Characteristic
Clock Frequency
CS Setup Time
CS Hold Time
Industrial (I)*:
TA = 0°C to +85°C
Industrial (I):
TA = -40°C to +85°C
*Limited industrial temperature range.
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
Min.
Max.
Units
Conditions
—
20
MHz
4.5 ≤ VCC ≤ 5.5
—
10
MHz
2.5 ≤ VCC < 4.5
—
2
MHz
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
25
—
ns
4.5 ≤ VCC ≤ 5.5
50
—
ns
2.5 ≤ VCC < 4.5
250
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
50
—
ns
4.5 ≤ VCC ≤ 5.5
100
—
ns
2.5 ≤ VCC < 4.5
500
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
(Note 3)
4
TCSD
CS Disable Time
50
—
ns
5
TSU
Data Setup Time
5
—
ns
4.5 ≤ VCC ≤ 5.5
10
—
ns
2.5 ≤ VCC < 4.5
50
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
6
THD
Data Hold Time
10
—
ns
4.5 ≤ VCC ≤ 5.5
20
—
ns
2.5 ≤ VCC < 4.5
100
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
7
TR
CLK Rise Time
—
20
ns
(Note 1)
8
TF
CLK Fall Time
—
20
ns
(Note 1)
9
THI
Clock High Time
25
—
10
TLO
Clock Low Time
4.5 ≤ VCC ≤ 5.5
50
—
ns
2.5 ≤ VCC < 4.5
250
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
25
—
ns
4.5 ≤ VCC ≤ 5.5
50
—
ns
2.5 ≤ VCC < 4.5
250
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
11
TCLD
Clock Delay Time
50
—
ns
12
TCLE
Clock Enable Time
50
—
ns
13
TV
Output Valid from Clock
Low
—
25
ns
4.5 ≤ VCC ≤ 5.5
—
50
ns
2.5 ≤ VCC < 4.5
—
250
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from Microchip’s web site at www.microchip.com.
3: Includes THI time.
 2007-2015 Microchip Technology Inc.
DS20001836J-page 3
25AA1024
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
AC CHARACTERISTICS
Param.
No.
Sym.
14
THO
15
TDIS
16
17
18
19
THS
THH
THZ
THV
Characteristic
Industrial (I)*:
TA = 0°C to +85°C
Industrial (I):
TA = -40°C to +85°C
*Limited industrial temperature range.
VCC = 1.8V to 5.5V
VCC = 2.0V to 5.5V
Min.
Max.
Units
Output Hold Time
0
—
ns
(Note 1)
Output Disable Time
—
25
ns
4.5 ≤ VCC ≤ 5.5
—
50
ns
2.5 ≤ VCC < 4.5
—
250
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
(Note 1)
10
—
ns
4.5 ≤ VCC ≤ 5.5
20
—
ns
2.5 ≤ VCC < 4.5
100
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
10
—
ns
4.5 ≤ VCC ≤ 5.5
20
—
ns
2.5 ≤ VCC < 4.5
100
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
15
—
ns
4.5 ≤ VCC ≤ 5.5
30
—
ns
2.5 ≤ VCC < 4.5
150
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
(Note 1)
15
—
ns
4.5 ≤ VCC ≤ 5.5
HOLD Setup Time
HOLD Hold Time
HOLD Low to Output
High Z
HOLD High to Output
Valid
Conditions
30
—
ns
2.5 ≤ VCC < 4.5
150
—
ns
2.0 ≤ VCC < 2.5
1.8 ≤ VCC < 2.0, 0°C to +85°C
20
TREL
CS High to Standby mode
—
100
µs
VCC = 1.8V to 5.5V
21
TPD
CS High to Deep
Power-down
—
100
µs
VCC = 1.8V to 5.5V
22
TCE
Chip Erase Cycle Time
—
10
ms
VCC = 1.8V to 5.5V
23
TSE
Sector Erase Cycle Time
—
10
ms
VCC = 1.8V to 5.5V
24
TWC
Internal Write Cycle Time
—
6
ms
Byte or Page mode and Page
Erase
25
—
Endurance
1M
—
E/W Page mode, 25°C, 5.5V (Note 2)
cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from Microchip’s web site at www.microchip.com.
3: Includes THI time.
DS20001836J-page 4
 2007-2015 Microchip Technology Inc.
25AA1024
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform
VLO = 0.2V
—
VHI = VCC - 0.2V
(Note 1)
VHI = 4.0V
(Note 2)
CL = 30 pF
—
Timing Measurement Reference Level
Input
0.5 VCC
Output
0.5 VCC
Note 1: For VCC  4.0V
2: For VCC > 4.0V
FIGURE 1-1:
HOLD TIMING
CS
17
16
17
16
SCK
18
SO
n+2
n+1
n
19
High-Impedance
n
5
Don’t Care
n+2
SI
n+1
n-1
n
n
n-1
HOLD
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
7
Mode 1,1
8
3
12
11
SCK Mode 0,0
5
SI
6
MSB in
SO
 2007-2015 Microchip Technology Inc.
LSB in
High-Impedance
DS20001836J-page 5
25AA1024
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
3
10
Mode 0,0
SCK
13
SO
SI
DS20001836J-page 6
Mode 1,1
14
MSB out
15
LSB out
Don’t Care
 2007-2015 Microchip Technology Inc.
25AA1024
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
BLOCK DIAGRAM
STATUS
Register
The 25AA1024 is a 131,072 byte Serial EEPROM
designed to interface directly with the Serial Peripheral
Interface (SPI) port of many of today’s popular
microcontroller families, including Microchip’s PIC®
microcontrollers. It may also interface with
microcontrollers that do not have a built-in SPI port by
using discrete I/O lines programmed properly in
firmware to match the SPI protocol.
The 25AA1024 contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
I/O Control
Logic
Memory
Control
Logic
EEPROM
Array
X
Dec
Page Latches
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25AA1024 in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
TABLE 2-1:
HV Generator
VCC
VSS
INSTRUCTION SET
Instruction Name
Instruction Format
READ
0000 0011
Read data from memory array beginning at selected address
WRITE
0000 0010
Write data to memory array beginning at selected address
WREN
0000 0110
Set the write enable latch (enable write operations)
WRDI
0000 0100
Reset the write enable latch (disable write operations)
RDSR
0000 0101
Read STATUS register
WRSR
0000 0001
Write STATUS register
PE
0100 0010
Page Erase – erase one page in memory array
SE
1101 1000
Sector Erase – erase one sector in memory array
CE
1100 0111
Chip Erase – erase all sectors in memory array
RDID
1010 1011
Release from Deep Power-down and Read Electronic Signature
DPD
1011 1001
Deep Power-Down mode
 2007-2015 Microchip Technology Inc.
Description
DS20001836J-page 7
25AA1024
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 25AA1024
followed by the 24-bit address, with seven MSBs of the
address being “don’t care” bits. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin.
FIGURE 2-1:
The data stored in the memory at the next address can
be read sequentially by continuing to provide clock
pulses. The internal Address Pointer is automatically
incremented to the next higher address after each byte
of data is shifted out. When the highest address is
reached (1FFFFh), the address counter rolls over to
address, 00000h, allowing the read cycle to be
continued indefinitely. The read operation is terminated
by raising the CS pin (Figure 2-1).
READ SEQUENCE
CS
0
1
0
0
2
3
4
5
6
0
1
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
0
24-bit Address
1 23 22 21 20
2
1
0
Data Out
High-Impedance
SO
DS20001836J-page 8
7
6
5
4
3
2
1
0
 2007-2015 Microchip Technology Inc.
25AA1024
2.2
Write Sequence
Page write operations are limited to
writing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’), and end at addresses that
are integer multiples of page size – 1. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
Note:
Prior to any attempt to write data to the 25AA1024, the
write enable latch must be set by issuing the WREN
instruction (Figure 2-4). This is done by setting CS low
and then clocking out the proper instruction into the
25AA1024. After all eight bits of the instruction are
transmitted, the CS must be brought high to set the
write enable latch. If the write operation is initiated
immediately after the WREN instruction without CS
being brought high, the data will not be written to the
array because the write enable latch will not have been
properly set.
A write sequence includes an automatic, self-timed
erase cycle. It is not required to erase any portion of the
memory prior to issuing a Write command.
Once the write enable latch is set, the user may
proceed by setting the CS low, issuing a WRITE
instruction, followed by the 24-bit address, with seven
MSBs of the address being “don’t care” bits, and then
the data to be written. Up to 256 bytes of data can be
sent to the device before a write cycle is necessary.
The only restriction is that all of the bytes must reside
in the same page.
When doing a write of less than 256 bytes
the data in the rest of the page is
refreshed along with the data bytes being
written. This will force the entire page to
endure a write cycle, for this reason
endurance is specified per page.
Note:
FIGURE 2-2:
For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the nth data byte has been clocked in. If CS is
brought high at any other time, the write operation will
not be completed. Refer to Figure 2-2 and Figure 2-3
for more detailed illustrations on the byte write
sequence and the page write sequence, respectively.
While the write is in progress, the STATUS register may
be read to check the status of the WPEN, WIP, WEL,
BP1 and BP0 bits (Figure 2-6). A read attempt of a
memory array location will not be possible during a
write cycle. When the write cycle is completed, the
write enable latch is reset.
BYTE WRITE SEQUENCE
CS
TWC
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
0
0
0
24-bit Address
0
1
0 23 22 21 20
Data Byte
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 9
25AA1024
FIGURE 2-3:
PAGE WRITE SEQUENCE
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
24-bit Address
0 1
0 23 22 21 20
Data Byte 1
2
1
0
7
6
5
4
3
2
1
0
CS
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
SCK
Data Byte 2
SI
7
6
DS20001836J-page 10
5
4
3
2
Data Byte n (256 max.)
Data Byte 3
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
 2007-2015 Microchip Technology Inc.
25AA1024
2.3
The following is a list of conditions under which the
write enable latch will be reset:
Write Enable (WREN) and Write
Disable (WRDI)
•
•
•
•
•
•
•
The 25AA1024 contains a write enable latch. See
Table 2-4 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WREN instruction will set the
latch, and the WRDI will reset the latch.
FIGURE 2-4:
Power-up
WRDI instruction successfully executed
WRSR instruction successfully executed
WRITE instruction successfully executed
PE instruction successfully executed
SE instruction successfully executed
CE instruction successfully executed
WRITE ENABLE SEQUENCE (WREN)
CS
0
1
2
3
4
5
6
7
SCK
0
SI
0
0
0
1
1
0
High-Impedance
SO
FIGURE 2-5:
0
WRITE DISABLE SEQUENCE (WRDI)
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
1
10
0
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 11
25AA1024
2.4
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch and is read-only. When set to
a ‘1’, the latch allows writes to the array, when set to a
‘0’, the latch prohibits writes to the array. The state of
this bit can always be updated via the WREN or WRDI
commands regardless of the state of write protection
on the STATUS register. These commands are shown
in Figure 2-4 and Figure 2-5.
Read Status Register Instruction
(RDSR)
The Read Status Register instruction (RDSR) provides
access to the STATUS register. The STATUS register
may be read at any time, even during a write cycle. The
STATUS register is formatted as follows:
TABLE 2-2:
STATUS REGISTER
7
6 5 4
3
2
1
W/R
– – – W/R W/R
R
WPEN X X X BP1 BP0 WEL
W/R = writable/readable. R = read-only.
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSR instruction. These
bits are nonvolatile and are shown in Table 2-3.
0
R
WIP
See Figure 2-6 for the RDSR timing sequence.
The Write-In-Process (WIP) bit indicates whether the
25AA1024 is busy with a write operation. When set to
a ‘1’, a write is in progress, when set to a ‘0’, no write
is in progress. This bit is read-only.
FIGURE 2-6:
READ STATUS REGISTER TIMING SEQUENCE (RDSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
0
High-Impedance
SO
DS20001836J-page 12
1
0
1
Data from STATUS register
7
6
5
4
3
2
 2007-2015 Microchip Technology Inc.
25AA1024
2.5
The Write-Protect Enable (WPEN) bit is a nonvolatile
bit that is available as an enable bit for the WP pin. The
Write-Protect (WP) pin and the Write-Protect Enable
(WPEN) bit in the STATUS register control the
programmable
hardware
write-protect
feature.
Hardware write protection is enabled when the WP pin
is low and the WPEN bit is high. Hardware write
protection is disabled when either the WP pin is high or
the WPEN bit is low. When the chip is hardware
write-protected, only writes to nonvolatile bits in the
STATUS register are disabled. See Table 2-4 for a
matrix of functionality on the WPEN bit.
Write Status Register Instruction
(WRSR)
The Write Status Register instruction (WRSR) allows the
user to write to the nonvolatile bits in the STATUS
register, as shown in Table 2-2. The user is able to
select one of four levels of protection for the array by
writing to the appropriate bits in the STATUS register.
The array is divided up into four segments. The user
has the ability to write-protect none, one, two, or all four
of the segments of the array. The partitioning is
controlled, as shown in Table 2-3.
See Figure 2-7 for the WRSR timing sequence.
TABLE 2-3:
ARRAY PROTECTION
BP1
BP0
Array Addresses
Write-Protected
Array Addresses
Unprotected
0
0
none
All (Sectors 0, 1, 2 & 3)
(00000h-1FFFFh)
0
1
Upper 1/4 (Sector 3)
(18000h-1FFFFh)
Lower 3/4 (Sectors 0, 1 & 2)
(00000h-17FFFh)
1
0
Upper 1/2 (Sectors 2 & 3)
(10000h-1FFFFh)
Lower 1/2 (Sectors 0 & 1)
(00000h-0FFFFh)
1
1
All (Sectors 0, 1, 2 & 3)
(00000h-1FFFFh)
none
FIGURE 2-7:
WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
Data to STATUS register
0
0
0
1
7
6
5
4
3
2
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 13
25AA1024
2.6
Data Protection
2.7
The following protection has been implemented to
prevent inadvertent writes to the array:
• The write enable latch is reset on power-up
• A write enable instruction must be issued to set
the write enable latch
• After a byte write, page write or STATUS register
write, the write enable latch is reset
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
TABLE 2-4:
Power-On State
The 25AA1024 powers on in the following state:
• The device is in low-power Standby mode
(CS = 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low-level transition on CS is required to
enter active state
WRITE-PROTECT FUNCTIONALITY MATRIX
WEL
(SR bit 1)
WPEN
(SR bit 7)
WP
(pin 3)
Protected Blocks
Unprotected Blocks
STATUS Register
0
x
x
Protected
Protected
Protected
1
0
x
Protected
Writable
Writable
1
1
0 (low)
Protected
Writable
Protected
1
1
1 (high)
Protected
Writable
Writable
x = don’t care
DS20001836J-page 14
 2007-2015 Microchip Technology Inc.
25AA1024
2.8
PAGE ERASE
The Page Erase function will erase all bits (FFh) inside
the given page. A Write Enable (WREN) instruction
must be given prior to attempting a Page Erase. This
is done by setting CS low and then clocking out the
proper instruction into the 25AA1024. After all eight
bits of the instruction are transmitted, the CS must be
brought high to set the write enable latch.
CS must then be driven high after the last bit if the
address or the Page Erase will not execute. Once the
CS is driven high, the self-timed Page Erase cycle is
started. The WIP bit in the STATUS register can be
read to determine when the Page Erase cycle is
complete.
If a Page Erase function is given to an address that
has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The Page Erase function is entered by driving CS low,
followed by the instruction code (Figure 2-8), and
three address bytes. Any address inside the page to
be erased is a valid address.
FIGURE 2-8:
PAGE ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31
SCK
Instruction
SI
0
1
0
0
0
24-bit Address
0
1
0 23 22 21 20
2
1
0
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 15
25AA1024
2.9
SECTOR ERASE
CS must then be driven high after the last bit if the
address or the Sector Erase will not execute. Once the
CS is driven high, the self-timed Sector Erase cycle is
started. The WIP bit in the STATUS register can be
read to determine when the Sector Erase cycle is
complete.
The Sector Erase function will erase all bits (FFh)
inside the given sector. A Write Enable (WREN)
instruction must be given prior to executing a Sector
Erase. This is done by setting CS low and then
clocking out the proper instruction into the 25AA1024.
After all eight bits of the instruction are transmitted, the
CS must be brought high to set the write enable latch.
If a SECTOR ERASE instruction is given to an address
that has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The Sector Erase function is entered by driving CS
low, followed by the instruction code (Figure 2-9), and
three address bytes. Any address inside the sector to
be erased is a valid address.
FIGURE 2-9:
See Table 2-3 for Sector Addressing.
SECTOR ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31
SCK
Instruction
SI
1
1
0
1
1
24-bit Address
0
0
0 23 22 21 20
2
1
0
High-Impedance
SO
DS20001836J-page 16
 2007-2015 Microchip Technology Inc.
25AA1024
2.10
CHIP ERASE
The Chip Erase function will erase all bits (FFh) in the
array. A Write Enable (WREN) instruction must be given
prior to executing a Chip Erase. This is done by setting
CS low and then clocking out the proper instruction
into the 25AA1024. After all eight bits of the instruction
are transmitted, the CS must be brought high to set
the write enable latch.
The CS pin must be driven high after the eighth bit of
the instruction code has been given or the Chip Erase
function will not be executed. Once the CS pin is
driven high, the self-timed Chip Erase function begins.
While the device is executing the Chip Erase function
the WIP bit in the STATUS register can be read to
determine when the Chip Erase function is complete.
The Chip Erase function is entered by driving the CS
low, followed by the instruction code (Figure 2-10)
onto the SI line.
The Chip Erase function is ignored if either of the
Block Protect bits (BP0, BP1) are not 0, meaning ¼,
½, or all of the array is protected.
FIGURE 2-10:
CHIP ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
1
0
0
0
1
1
1
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 17
25AA1024
2.11
DEEP POWER-DOWN MODE
Deep Power-Down mode of the 25AA1024 is its
lowest power consumption state. The device will not
respond to any of the Read or Write commands while
in Deep Power-Down mode, and therefore it can be
used as an additional software write protection feature.
All instructions given during Deep Power-Down mode
are ignored except the Read Electronic Signature
Command (RDID). The RDID command will release
the device from Deep Power-down and outputs the
electronic signature on the SO pin, and then returns
the device to Standby mode after delay (TREL).
The Deep Power-Down mode is entered by driving CS
low, followed by the instruction code (Figure 2-11) onto
the SI line, followed by driving CS high.
Deep Power-Down mode automatically releases at
device power-down. Once power is restored to the
device, it will power-up in the Standby mode.
If the CS pin is not driven high after the eighth bit of the
instruction code has been given, the device will not
execute Deep Power-down. Once the CS line is driven
high, there is a delay (TDP) before the current settles
to its lowest consumption.
FIGURE 2-11:
DEEP POWER-DOWN SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
0
1
1
1
0
0
1
High-Impedance
SO
DS20001836J-page 18
 2007-2015 Microchip Technology Inc.
25AA1024
2.12
RELEASE FROM DEEP
POWER-DOWN AND READ
ELECTRONIC SIGNATURE
Once the device has entered Deep Power-Down
mode, all instructions are ignored except the release
from Deep Power-down and Read Electronic
Signature command. This command can also be used
when the device is not in Deep Power-down, to read
the electronic signature out on the SO pin unless
another command is being executed such as Erase,
Program or Write STATUS register.
FIGURE 2-12:
Release from Deep Power-Down mode and Read
Electronic Signature is entered by driving CS low,
followed by the RDID instruction code (Figure 2-12)
and then a dummy address of 24 bits (A23-A0). After
the last bit of the dummy address is clocked in, the
8-bit electronic signature is clocked out on the SO
pin.
After the signature has been read out at least once,
the sequence can be terminated by driving CS high.
After a delay of TREL, the device will then return to
Standby mode and will wait to be selected so it can be
given new instructions. If additional clock cycles are
sent after the electronic signature has been read once,
it will continue to output the signature on the SO line
until the sequence is terminated.
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
TREL
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
1
0
1
0
24-bit Address
1
0
1
1 23 22 21 20
2
1
0
Electronic Signature Out
High-Impedance
SO
7
6
0
0
5
4
3
2
1
0
1
0
1
0
0
1
Manufacturers ID 0x29
Driving CS high after the 8-bit RDID command, but before the electronic signature has been transmitted, will still
ensure the device will be taken out of Deep Power-Down mode, as shown in Figure 2-13.
FIGURE 2-13:
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
0
1
2
3
4
5
6
0
1
7
TREL
SCK
Instruction
SI
1
0
1
0
1
1
High-Impedance
SO
 2007-2015 Microchip Technology Inc.
DS20001836J-page 19
25AA1024
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Name
Pin Number
CS
1
Chip Select Input
SO
2
Serial Data Output
WP
3
Write-Protect Pin
VSS
4
Ground
SI
5
Serial Data Input
SCK
6
Serial Clock Input
HOLD
7
Hold Input
VCC
8
Supply Voltage
3.1
Function
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After
power-up, a low level on CS is required prior to any
sequence being initiated.
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the
25AA1024. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.
3.3
The WP pin function is blocked when the WPEN bit in
the STATUS register is low. This allows the user to
install the 25AA1024 in a system with WP pin grounded
and still be able to write to the STATUS register. The
WP pin functions will be enabled when the WPEN bit is
set high.
3.4
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
3.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25AA1024. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
3.6
Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25AA1024 while in the middle of a serial sequence
without having to retransmit the entire sequence again.
It must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK
high-to-low transition. The 25AA1024 must remain
selected during this sequence. The SI, SCK and SO
pins are in a high-impedance state during the time the
device is paused and transitions on these pins will be
ignored. To resume serial communication, HOLD must
be brought high while the SCK pin is low, otherwise
serial communication will not resume. Pulling the
HOLD line low at any time will tri-state the SO line.
Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
STATUS register to prohibit writes to the nonvolatile
bits in the STATUS register. When WP is low and
WPEN is high, writing to the nonvolatile bits in the
STATUS register is disabled. All other operations
function normally. When WP is high, all functions,
including writes to the nonvolatile bits in the STATUS
register, operate normally. If the WPEN bit is set, WP
low during a STATUS register write sequence will
disable writing to the STATUS register. If an internal
write cycle has already begun, WP going low will have
no effect on the write.
DS20001836J-page 20
 2007-2015 Microchip Technology Inc.
25AA1024
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
Legend: XX...X
T
Y
YY
WW
NNN
e3
8-Lead DFN
Example:
XXXXXXX
T/XXXXX
YYWW
NNN
5AA1024
I/MF e3
1509
1L7
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
25AA1024
I/P e3 1L7
1509
8-Lead SOIJ
Example:
XXXXXXXX
T/XXXXXX
YYWWNNN
25AA1024
I/SM e3
15091L7
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
JEDEC® designator for Matte Tin (Sn)
Note:
For very small packages with no room for the JEDEC® designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2007-2015 Microchip Technology Inc.
DS20001836J-page 21
25AA1024
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EXPOSED
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DS20001836J-page 22
 2007-2015 Microchip Technology Inc.
25AA1024
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L
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K
E2
E
EXPOSED PAD
NOTE 1
1
2
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NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
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 2007-2015 Microchip Technology Inc.
DS20001836J-page 23
25AA1024
1RWH
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KWWSZZZPLFURFKLSFRPSDFNDJLQJ
DS20001836J-page 24
 2007-2015 Microchip Technology Inc.
25AA1024
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
PLANE
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
 2007-2015 Microchip Technology Inc.
DS20001836J-page 25
25AA1024
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
DS20001836J-page 26
 2007-2015 Microchip Technology Inc.
25AA1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2015 Microchip Technology Inc.
DS20001836J-page 27
25AA1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001836J-page 28
 2007-2015 Microchip Technology Inc.
25AA1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2015 Microchip Technology Inc.
DS20001836J-page 29
25AA1024
APPENDIX A:
REVISION HISTORY
Revision C (02/2007)
Revised Features Section (Self-timed Erase and Write
Cycles); Revised Table 1-1 (parameters D012 and
D13); Table 1-2 (parameters 20-24); Revised Package
Marking Information; Replaced Package Drawings;
Revised Product ID System Section (SM package);
Changed PICmicro to PIC.
Revision D (07/2007)
Revised Features; Revised Tables 1-1 and 1-2 (added
Industrial temp. and revised parameters 22-23);
Replaced Package Drawings (Rev. AP); Revised
Product ID System; Changed Flash to EEPROM.
Revision E (10/2007)
Removed 25LC1024 part number; New data sheet
created for 25LC1024 (DS22064); Revised Tables;
Updates throughout.
Revision F (05/2008)
Modified parameter D006 in Table 1-1; Revised
Package Marking Information; Replaced Package
Drawings.
Revision G (01/2010)
Added 8-Lead (MF) DFN-S Land Pattern; Replaced
8-Lead (SM) SOIJ Land Pattern.
Revision H (05/2010)
Revised Table 1-2, Param. No 25 Conditions; Revised
Section 2.2; Added note.
Revision J (04/2015)
Corrected Features section; Revised Table 1-2,
updated ‘Conditions’; Revised Figure 2-12, added
parameter TREL; Revised Section 2-12, clarified
condition for existing Deep Power-Down mode.
DS20001836J-page 30
 2007-2015 Microchip Technology Inc.
25AA1024
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our web site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://www.microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2007-2015 Microchip Technology Inc.
DS20001836J-page 31
25AA1024
NOTES:
DS20001836J-page 32
 2007-2015 Microchip Technology Inc.
25AA1024
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
[X](1)
X
/XX
Device
Tape and Reel
Option
Temperature
Range
Package
Examples:
a)
b)
25AA1024
Device:
Tape &
Option:
Reel Blank
T
1 Mbit, 1.8V, 256-Byte Page SPI Serial EEPROM
=
=
Standard packaging (tube)
Tape & Reel
Temperature
Range:
I
=
-40C to+85C
Package:
MF
P
SM
=
=
=
Micro Lead Frame (6 x 5 mm body), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIJ (5.28 mm), 8-lead
 2007-2015 Microchip Technology Inc.
25AA1024T-I/SM = 1 Mbit, 1.8V Serial
EEPROM, Industrial temp., Tape & Reel, SOIJ
package
25AA1024T-I/MF = 1 Mbit, 1.8V Serial
EEPROM, Industrial temp., Tape & Reel, DFN
package
Note 1: Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes
and is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
DS20001836J-page 33
25AA1024
NOTES:
DS20001836J-page 34
 2007-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2007-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-265-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2007-2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001836J-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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Corporate Office
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Technical Support:
http://www.microchip.com/
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Web Address:
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01/27/15
DS20001836J-page 36
 2007-2015 Microchip Technology Inc.