ECLIPTEK PART NUMBER DATA SHEET CORPORATION ECX-6363-20.250M REGULATORY COMPLIANCE R (Data Sheet downloaded on Jun 28, 2016) 2011/65 + 2015/863 163 SVHC PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters are intentionally excluded from this specification sheet. ELECTRICAL SPECIFICATIONS Nominal Frequency 20.250MHz ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 1 of 4 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 ECLIPTEK PART NUMBER DATA SHEET R CORPORATION ECX-6363-20.250M MECHANICAL DIMENSIONS (all dimensions in millimeters) LINE MARKING 1 ECX6363 4.50 MAX 13.30 MAX 0.50 MIN (x2) 4.88 ±0.20 4.85 MAX 0.80 ±0.30 (x2) 11.60 MAX NOTE: Coplanarity 0.360 MAX Suggested Solder Pad Layout All Dimensions in Millimeters 5.5 (X2) 2.0 (X2) 4.0 Solder Land (X2) All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 2 of 4 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 ECLIPTEK PART NUMBER DATA SHEET R CORPORATION ECX-6363-20.250M Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 3 of 4 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 ECLIPTEK PART NUMBER DATA SHEET R CORPORATION ECX-6363-20.250M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 245°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level 5°C/Second Maximum N/A 150°C N/A 30 - 60 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/16/2006 | Page 4 of 4 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200