View the Part Number Specific Data Sheet for full specifications

ECLIPTEK
PART NUMBER DATA SHEET
CORPORATION
EH2625TS-4.096M
REGULATORY COMPLIANCE
R
(Data Sheet downloaded on Jun 28, 2016)
2011/65 +
2015/863
168 SVHC
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
4.096MHz ±25ppm 0°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
4.096MHz
Frequency Tolerance/Stability
±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating
Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
0°C to +70°C
Supply Voltage
3.3Vdc ±10%
Input Current
35mA Maximum (No Load)
Output Voltage Logic High (Voh)
2.7Vdc Minimum (IOH= -8mA)
Output Voltage Logic Low (Vol)
0.5Vdc Maximum (IOL= +8mA)
Rise/Fall Time
6nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle
50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability
30pF Maximum
Output Logic Type
CMOS
Pin 1 Connection
Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil)
70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable output.
Absolute Clock Jitter
±250pSec Maximum, ±100pSec Typical
One Sigma Clock Period Jitter
±50pSec Maximum, ±40pSec Typical
Start Up Time
10mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 1 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EH2625TS-4.096M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
7.00
±0.15
5.08
±0.15
4
3
MARKING
ORIENTATION
5.00
±0.15
2.20
±0.15
2
1
1.4 ±0.2
1.4 ±0.1
3.68
±0.15
PIN
CONNECTION
1
Tri-State (High
Impedance)
2
Ground
3
Output
4
Supply Voltage
LINE MARKING
1
ECLIPTEK
2
4.0960M
3
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
Solder Land
(X4)
2.88
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 2 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EH2625TS-4.096M
CLOCK OUTPUT
TRI-STATE INPUT
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
Fall
Time
Rise
Time
tPZL
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 3 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EH2625TS-4.096M
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
+
+
Power
Supply
_
Current
Meter
_
Supply
Voltage
(VDD)
Probe
(Note 2)
Output
+
Voltage
Meter
_
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
CL
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 4 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EH2625TS-4.096M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 5 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EH2625TS-4.096M
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 6 of 6
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200