RClamp0582BQ Low Capacitance TVS for Automotive Applications PROTECTION PRODUCTS - RailClamp® Description Features Transient protection for high-speed data lines to The RClamp®0582BQ transient voltage suppressor is specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (cable discharge events), and EFT (electrical fast transients). It is rated to Grade 2 of AEC-Q100 for use in automotive applications. The RClamp®0582BQ features high peak pulse current capability (Ipp=15A, tp=8/20us) for use in applications that require high surge immunity testing. It has a maximum capacitance of only 1.2pF (pin 1 or 2 to pin3). They may be used to meet the ESD immunity requirements of IEC 61000-4-2 (±30kV air, ±25kV contact discharge). Each device can be configured to protect 1 bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-523) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. The combination of small size, low capacitance, and high level of surge protection makes them a flexible solution for protection of USB 2.0, LVDS, and video interfaces. IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Qualified to AEC-Q100, Grade 2 Protects up to two I/O lines Low capacitance (<1.2pF) High surge capability: 15A (tp=8/20us) Low leakage current and clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-523) package Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Packaging: Tape and Reel Applications USB 2.0 Video Lines LVDS Lines Dimensions Schematic & PIN Configuration 1.60 0.50 BSC 3 0.80 1 1.60 2 1.00 BSC 0.75 Nominal Dimensions (mm) Revision 7/28/11 SC-75 3L (Top View) 1 www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts Peak Pulse Current (tp = 8/20µs) IP P 15 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD 30 25 kV TJ -40 to +105 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 or Pin 2 to Pin 3 Reverse Breakdown Voltage V BR It = 1mA Pin 1 or Pin 2 to Pin 3 Reverse Leakage Current IR Reverse Leakage Current Maximum Units 5 V 11 V VRWM = 5V, T=25°C Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 0.100 µA IR VRWM = 5V, T=105°C Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 0.300 µA Clamping Voltage VC IPP = 5A, tp = 8/20µs Pin 1 or Pin 2 to Pin 3 15 V Clamping Voltage VC IPP = 15A, tp = 8/20µs Pin 1 or Pin 2 to Pin 3 20 V Junction Capacitance Cj VR = 0V, f = 1MHz Pi n 1 to Pi n 2 0.8 pF Junction Capacitance Cj VR = 0V, f = 1MHz Pin 1 or Pin 2 to Pin 3 1.2 pF © 2011 Semtech Corp. 2 Minimum Typical 6 0.50 www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 100 1 0.1 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 20 2 18 1.8 16 1.6 14 12 10 8 6 4 2 150 15 1.4 1.2 1 0.8 0.6 0.2 f = 1 MHz 0 0 10 125 0.4 Waveform Parameters: tr = 8μs td = 20μs 5 100 Normalized Capacitance vs. Reverse Voltage Pin 1 or Pin 2 to Pin 3 Cj(VR)/Cj(VR=0V) Clamping Voltage - VC (V) Clamping Voltage vs. Peak Pulse Current Pin 1 or Pin 2 to Pin 3 0 75 Ambient Temperature - TA (oC) Pulse Duration - tp (us) 0 20 1 2 Peak Pulse Current - IPP (A) 3 4 5 Reverse Voltage - VR (V) Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3) ESD Clamping - Pin 1 or Pin 2 to Pin 3 (8kV Contact per IEC 61000-4-2) CH1 S21 LOG 6 dB / REF 0 dB 1: - 0.1601 dB 800 MHz 0 dB 5 12 2: - 0.1777 dB 900 MHz 3 4 3: - 0.5615 dB 1.8 GHz -6 dB -12 dB 4: - 1.5365 dB 2.5 GHz -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB START . 030 MHz Note: Data is taken with a 10x attenuator © 2011 Semtech Corp. 1 MHz 3 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Forward Voltage vs. Forward Current (Pin 3 to Pin 1 or Pin 2) Normalized Capacitance vs. Temperature (Pin 1 or Pin 2 to Pin 3) 5 20 O 15 10 5 5 10 Forward Current - IF (A) 4 3 2 1 0 -100 0 0 VR=0V Line to Line O Capacitance Normalized to 25 C Forward Voltage - V F (V) TA=25 C 8/20μs pulse 15 -50 0 50 100 O Temperature ( C) 150 200 Reverse Leakage Current vs. Temperature (Pin 1 or Pin 2 to Pin 3) 60 Leakage (nA) VR=5V Pin1 or 2 to 3 40 20 0 -75 -25 25 75 125 175 O Temperature ( C) © 2011 Semtech Corp. 4 www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Applications Information Figure 1. Pin Configuration Device Connection Options This device is optimized for protection of two high speed dta lines. The device is connected as follows: Protection of two lines is achieved by connecting data lines at pins 1 & 2. Pin 3 is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. © 2011 Semtech Corp. 5 www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Outline Drawing -SC-75 (SOT-523) A D DIM e1 B A A1 A2 b c D E E1 e e1 L N 0 aaa bbb 3 E E1 1 2 bxN bbb e A C A B A2 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .023 .035 .000 .004 .023 .030 .031 .005 .012 .003 .008 .059 .063 .067 .057 .063 .069 .029 .031 .033 .039 BSC .020 BSC (.009) 3 0° 8° .004 .008 0.60 0.00 0.60 0.15 0.10 1.50 1.45 0.75 0.75 - 0.90 0.10 0.80 0.30 0.20 1.60 1.70 1.60 1.75 0.80 0.85 1.00 BSC 0.50 BSC (0.22) 3 0° 8° 0.10 0.20 aaa C SEATING PLANE A1 C H SEE DETAIL A 0 SEATING PLANE C SIDE VIEW c L DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SC-75 (SOT-523) X Y Z C DIM C P p1 G X Y Z G Y DIMENSIONS INCHES MILLIMETERS (.055) .039 .020 .024 .016 .031 .087 (1.40) 1.00 0.50 0.60 0.40 0.80 2.20 p1 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2011 Semtech Corp. 6 www.semtech.com RClamp0582BQ PROTECTION PRODUCTS Marking YW P8 Ordering Information Part Number Lead Finish Qty per Reel Reel Size RClamp 0582BQ.TCT Pb Free 3,000 7 Inch RailClamp and RClamp are registered trademarks of Semtech Corporation YW = Date Code Tape and Reel Specification Device Orientation in Tape A0 B0 K0 1.85 +/-0.15 mm 1.85 +/-0.15 mm 0.87 +/-0.15 mm Tape B, (Max) Width 8 mm D D1 ( M IN ) E K (MAX) F P P0 P2 T(MAX) 4.2 mm 1.5 + 0.1 mm - 0.0 mm 1.0 mm 1.750±.10 mm 3.5±0.05 mm 2.4 mm 4.0±0.1 mm 4.0±0.1 mm 2.0±0.05mm 0.4 mm (.165) (0.59 +.005 - .000) (.039) (.016) (.069±.004) (.138±.002) (.094) (.157±.004) (.157±.004) (.079±.002) W 8.3 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2011 Semtech Corp. 7 www.semtech.com