MLOTM RF-RF SMT Crossover GENERAL DESCRIPTION The MLOTM SMT RF-RF Crossover is a very low profile crossover that intersects an RF and RF circuit trace in an SMT package. The RF-RF Crossover is a low cost solution for applications where a critical RF circuit trace intersects a RF circuit precluding the need for an expensive multilayer printed circuit board. The SMT package can support frequencies up to 6 GHz. MLOTM crossovers have been subjected to JEDEC reliability standards and 100% electrically tested. The RF-RF crossovers are available in NiSn. FEATURES APPLICATIONS • • • • • • • • • • • DC – 6.0 GHz RF – RF Crossover Low Loss High Isolation Surface Mountable Tape and Reel 100% Tested Mobile communications GPS Vehicle location systems Wireless LAN’s TOP VIEW LAND GRID ARRAY ADVANTAGES • • • • Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER X2B 2020 RFRF T Series Size Type Packaging T = 1000pcs T&R T/250 = 250pcs T&R B = Bulk Frequency (GHz) DC -2.5 2.5 – 4.0 4.0 – 6.0 Port Impedance (ohms) 50 50 50 Ins. Loss (dB max) 0.05 0.10 0.15 Return Loss (dB min) Isolation (dB min) Power (Watts) θJC (ºC /Watts) 20 18 10 50 30 20 30 19 9 150 150 150 Operating Temperature (ºC) -55 to +85 -55 to +85 -55 to +85 * Specification based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance. QUALITY INSPECTION TERMINATION Finished parts are 100% tested for electrical parameters and visual characteristics. NiSn compatible with automatic soldering technologies: Pb free reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE - 55ºC to +85ºC 1 MLOTM RF-RF SMT Crossover MECHANICAL OUTLINE TOP BOTTOM RF IN/OUT RF IN/OUT 4.98 ±0.25 (0.196 ±0.010) 0.40 ± (0.016 ± 0.38 ±0.10 (0.015 ±0.004) GND GND GND GND RF IN/OUT 4.98 ±0.25 (0.196 ±0.010) RF IN/OUT 0.74 ±0.10 X4 (0.029 ±0.004 X4) RF IN/OUT RF IN/OUT GND GND GND 0.76 ±0.10 X4 (0.030 ±0.004 X4) GND 1.73 ±0.20 X4 SQ (0.068 ±0.008 X4 SQ) RF IN/OUT RF IN/OUT SIDE 0.40 ±0.04 (0.016 ±0.002) D 4 X4) N/OUT D 2 MLOTM RF-RF SMT Crossover RF-RF SMT CROSSOVER PERFORMANCE: 0.3 GHZ TO 6 GHZ RF/RF Crossover – Return Loss 0.02 -10 -0.02 -20 Return Loss 2 (dB) Return Loss 1 (dB) Insertion Loss 2 (dB) Insertion Loss 1 (dB) RF/RF Crossover – Insertion Loss -0.07 -0.12 -30 -40 -50 -0.17 -60 -0.22 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -70 6.0 0.5 1.0 1.5 2.0 Frequency (GHz) 3.5 4.0 4.5 5.0 5.5 6.0 5.5 6.0 RF/RF Crossover – Phase Balance -20 6 -30 4 -40 2 Phase Balance (ºC) Isolation (dB) 3.0 Frequency (GHz) RF/RF Crossover – Isolation -50 -60 -70 0 -2 -4 -80 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -6 0.5 1.0 1.5 Frequency (GHz) MOUNTING PROCEDURE TM 2.5 MLO SMT crossovers require 50Ω transmission lines leading to and from all of the RF ports. Proper grounding is required in order to ensure optimal device performance. If these conditions are not met then performance parameters including insertion loss, return loss and any isolation may not meet published values. All of the MLOTM components utilize castellated interconnects which allow for high yield assembly, expansion matched and halogen free dielectric. When mounting the user must be mindful of the following: a) ensure the RF pads of the device are in contact with the circuit trace of the printed circuit board and b) the ground plane of neither the component nor the PCB is in contact with the RF signal. Parts are specifically oriented in the tape and reel. 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency (GHz) MOUNTING FOOTPRINT To ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part. 0.89 (0.035) SQ X 4 0.18 (0.007) X 8 Multiple plate thru hole to ground 3.61 (0.142) 50 ohm Tranmission Line Dimensions are in mm (inches) 3 MLOTM RF-RF SMT Crossover AUTOMATED SMT ASSEMBLY surface mount assembly of MLO TM RF devices onto the PCB. Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLOTM devices onto the PCB. The following section describes the guidelines for automated SMT assembly of MLOTM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for SMT REFLOW PROFILE and slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below: Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time tp Tp Critical Zone TL to Tp Ramp-up Temperature TL tL Ts max Ts min Ramp-down ts Preheat 25 t 25ºC to Peak Time Profile Parameter Ramp-up rate (Tsmax to Tp) Preheat temperature (Ts min to Ts max) Preheat time (ts) Time above TL, 217ºC (tL) Peak temperature (Tp) Time within 5ºC of peak temperature (tp) Ramp-down rate Time 25ºC to peak temperature 4 Pb free, Convection, IR/Convection 3ºC/second max. 150ºC to 200ºC 60 – 180 seconds 60 – 120 seconds 260°C 10 – 20 seconds 4ºC/second max. 6 minutes max.