700 MHz to 1000 MHz GaAs Matched RF PA Predriver ADL5322 Data Sheet FUNCTIONAL BLOCK DIAGRAM BIAS CONTROL VCC 5 OUTPUT MATCH GND 6 GND 7 4 RFOUT INPUT MATCH Internally matched to 50 Ω input and output Internally biased Operating frequency: 700 MHz to 1000 MHz Gain: 20 dB OIP3: 45 dBm P1 dB: 27 dBm Noise figure: 5 dB 3 mm × 3 mm LFCSP Power supply: 5 V 2 VCC RFIN 8 1 VCC ADL5322 APPLICATIONS CDMA2000, WCDMA, and GSM base station transceivers and high power amplifiers 3 GND 06057-001 FEATURES Figure 1. GENERAL DESCRIPTION The ADL5322 is a high linearity GaAs driver amplifier that is internally matched to 50 Ω for operation in the 700 MHz to 1000 MHz frequency range. The amplifier, which has a gain of 20 dB, is specially designed for use in the output stage of a cellular base station radio or as an input preamplifier in a multicarrier base station power amplifier. Matching and biasing are all on-chip. The ADL5322 is available in a Pb-free, 3 mm × 3 mm, 8-lead LFCSP package with an operating temperature from −40°C to +85°C. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2006–2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADL5322 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Typical Performance Characteristics ..............................................6 Functional Block Diagram .............................................................. 1 Basic Connections .............................................................................8 General Description ......................................................................... 1 CDMA2000 Driving Application ................................................8 Revision History ............................................................................... 2 Evaluation Board ............................................................................ 10 Specifications..................................................................................... 3 Outline Dimensions ....................................................................... 11 Absolute Maximum Ratings ............................................................ 4 Ordering Guide .......................................................................... 11 ESD Caution .................................................................................. 4 REVISION HISTORY 1/14—Rev. 0 to Rev. A: Changes to Figure 2 .......................................................................... 5 Added Figure 12, Renumbered Sequentially ................................ 7 Added Exposed Pad Notation to Outline Dimensions ............. 11 Changes to Ordering Guide .......................................................... 11 7/06—Revision 0: Initial Version Rev. A | Page 2 of 12 Data Sheet ADL5322 SPECIFICATIONS VCC = 5 V, TA = 25°C. Table 1. Parameter FREQUENCY RANGE GAIN vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage P1 dB vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage NOISE FIGURE INPUT RETURN LOSS OUTPUT RETURN LOSS OIP3 vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage vs. Frequency vs. Temperature vs. Voltage POWER SUPPLY Supply Voltage Supply Current Operating Temperature Test Conditions/Comments Frequency = 850 MHz 832 MHz to 870 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 900 MHz 869 MHz to 894 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 950 MHz 925 MHz to 960 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 850 MHz 832 MHz to 870 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 900 MHz 869 MHz to 894 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 950 MHz 925 MHz to 960 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 830 MHz to 960 MHz Min 700 19 18.6 18.3 27.0 27.3 26.7 Frequency = 830 MHz to 960 MHz Frequency = 830 MHz to 960 MHz Carrier spacing = 1 MHz, POUT = 5 dBm per carrier Frequency = 850 MHz 832 MHz to 870 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 900 MHz 869 MHz to 894 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) Frequency = 950 MHz 925 MHz to 960 MHz −40°C to +85°C 5 V, @ 5% (4.75 V to 5.25 V) 4.75 POUT = 5 dBm −40 Rev. A | Page 3 of 12 Typ 20.3 ±0.125 ±1 ±0.1 19.9 ±0.125 ±1 ±0.1 19.6 ±0.125 ±1.1 ±0.1 27.7 ±0.1 ±1 ±0.3 27.9 ±0.1 ±1 ±0.4 27.5 ±0.2 ±1 ±0.4 5 Max 1000 21.4 Unit MHz dB dB dB dB 21.1 dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dB 20.8 −10 −10 dB dB 44.8 ±0.25 ±3.0 ±0.5 45.3 ±0.25 ±2.7 ±0.8 44.4 ±0.25 ±2.2 ±0.8 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm 5 320 5.25 +85 V mA °C ADL5322 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage, VPOS Input Power (re: 50 Ω) Equivalent Voltage θJC (Soldered) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Rating 6V 18 dBm 1.8 V rms 28.5°C/W 150°C −40°C to +85°C −65°C to +150°C 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION Rev. A | Page 4 of 12 Data Sheet ADL5322 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VCC 1 8 RFIN VCC 2 ADL5322 7 GND GND 3 TOP VIEW (Not to Scale) 6 GND RFOUT 4 NOTES 1. CONNECT THE EXPOSED PADDLE TO THE GROUND PLANE VIA A LOW IMPEDANCE PADDLE. 06057-002 5 VCC Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1, 2, 5 Mnemonic VCC 3, 6, 7 4 8 N/A GND RFOUT RFIN EP Description Positive 5 V Supply Voltage. Bypass these three pins with independent power supply decoupling networks (100 pF, 10 nF, and 10 µF). Device Ground. RF Output. Internally matched to 50 Ω. RF Input. Internally matched to 50 Ω. Exposed Paddle. Connect to the ground plane via a low impedance path. Table 4. S-Parameters Frequency 700.0 MHz 720.0 MHz 740.0 MHz 760.0 MHz 780.0 MHz 800.0 MHz 820.0 MHz 840.0 MHz 860.0 MHz 880.0 MHz 900.0 MHz 920.0 MHz 940.0 MHz 960.0 MHz 980.0 MHz 1.000 GHz ADL5322 (1, 1) 0.210/109.457 0.195/104.437 0.179/99.101 0.165/93.363 0.151/86.953 0.138/79.928 0.125/71.950 0.114/62.829 0.103/52.162 0.095/39.531 0.090/24.952 0.088/9.188 +0.090/−7.350 +0.095/−23.642 +0.104/−39.131 +0.115/−53.477 ADL5322 (1, 2) 0.002/97.018 0.002/93.284 0.002/87.856 0.002/86.137 0.002/78.668 0.002/74.072 0.002/68.940 0.002/62.269 0.002/56.742 0.002/56.696 0.003/43.549 0.003/37.254 0.003/29.904 0.003/24.334 0.003/16.521 0.003/8.139 Rev. A | Page 5 of 12 ADL5322 (2, 1) +11.221/−158.622 +11.108/−166.579 +11.013/−174.596 10.931/177.282 10.856/169.006 10.781/160.613 10.698/152.065 10.605/143.342 10.493/134.489 10.361/125.433 10.210/116.239 10.033/106.889 9.837/97.326 9.614/87.600 9.364/77.609 9.081/67.342 ADL5322 (2, 2) 0.436/150.470 0.392/145.211 0.345/137.443 0.295/133.051 0.242/125.612 0.187/116.434 0.130/102.897 0.079/76.154 0.061/18.090 +0.098/−26.962 +0.153/−46.741 +0.211/−58.300 +0.269/−66.606 +0.324/−73.265 +0.376/−78.914 +0.424/−83.911 ADL5322 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 22.0 5.6 21.5 5.4 TEMP = –40°C 21.0 5.2 20.5 5.0 NF (dB) GAIN (dB) TEMP = +25°C 20.0 19.5 TEMP = +85°C 4.8 4.6 19.0 4.4 18.5 850 900 950 1000 FREQUENCY (MHz) 4.0 700 06057-003 17.5 800 Figure 3. Gain vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C 900 1000 FREQUENCY (MHz) Figure 6. Noise Figure vs. Frequency, Multiple Devices, VS = 5 V, TA = 25°C 29.0 28.4 TEMP = –40°C 28.2 28.5 28.0 27.8 28.0 TEMP = +25°C P1dB (dBm) P1dB (dBm) 800 06057-006 4.2 18.0 27.5 VCC = 5.25V VCC = 5V 27.6 VCC = 4.75V 27.4 27.2 27.0 27.0 TEMP = +85°C 26.8 26.5 900 950 1000 FREQUENCY (MHz) Figure 4. P1 dB vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C 47 26.4 800 06057-004 850 850 900 950 1000 FREQUENCY (MHz) 06057-007 26.6 26.0 800 Figure 7. P1 dB vs. Frequency, VCC = 4.75 V, 5 V, and 5.25 V, TA = 25°C 46.5 TEMP = –40°C 46.0 46 VCC = 5.25V 45.5 TEMP = +25°C OIP3 (dBm) OIP3 (dBm) 45 44 45.0 VCC = 5V 44.5 43 VCC = 4.75V 44.0 42 43.5 850 900 FREQUENCY (MHz) 950 1000 43.0 800 850 900 FREQUENCY (MHz) 950 1000 06057-008 41 800 06057-005 TEMP = +85°C Figure 8. OIP3 vs. Frequency, VCC = 4. 75 V, 5 V, and 5.25 V, TA = 25°C Figure 5. OIP3 vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C Rev. A | Page 6 of 12 Data Sheet ADL5322 6 7 6 5 5 FREQUENCY FREQUENCY 4 3 4 3 2 2 1 1 44.5 44.7 44.9 45.1 45.3 45.5 45.7 0 OIP3 (dBm) 43.6 –6 650 600 –10 SUPPLY CURRENT (mA) –14 –16 S11 –20 45.2 350 250 0.95 45.0 400 –24 0.90 44.8 450 300 0.85 44.6 500 –22 1.00 FREQUENCY (GHz) Figure 10. Input S11 and Output S22 Return Loss vs. Frequency 200 06057-010 ADL5322 [1, 1] (dB) ADL5322 [2, 2] (dB) –12 0.80 44.4 TA = –40°C TA = +25C TA = +85C 550 S22 0.75 44.2 Figure 11. Distribution of OIP3 at 950 MHz –8 –26 0.70 44.0 OIP3 (dBm) Figure 9. Distribution of OIP3 at 850 MHz –18 43.8 06057-011 44.3 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 06057-112 44.1 06057-009 0 Figure 12. Supply Current vs. POUT and Temperature VCC = 5 V, TA = −40°C, +25°C, and +85°C Rev. A | Page 7 of 12 ADL5322 Data Sheet BASIC CONNECTIONS CDMA2000 DRIVING APPLICATION Figure 15 shows the basic connections for operating the ADL5322. Each of the three power supply lines should be decoupled with 10 µF, 10 nF, and 100 pF capacitors. Pin 3, Pin 6, Pin 7, and the exposed paddle under the device should all be connected to a low impedance ground plane. If multiple ground planes are being used, these should be stitched together with vias under the device to optimize thermal conduction. See recommended land pattern in Figure 13. Figure 14 shows a plot of the spectrum of an ADL5323 driving at 4-carrier CDMA2000 signal at 0 dBm per carrier (total carrier power = 6 dBm), centered at 880 MHz. At 750 kHz and 1.98 MHz offset, adjacent channel power ratios of −59 dBc and −84 dBc (measured in 30 kHz with respect to the 1.22 MHz carrier) are observed. At 4 MHz carrier offset, −73 dBc is measured in a 1 MHz bandwidth (−133 dBm/Hz). Note that the spectrum of the four carriers is slightly rounded due the frequency response of the cavity-tuned filter that was used to filter out the noise and distortion of the source signal. –10 RBW = 30kHz VBW = 300kHz SWT = 2s RF ATT = 20dB MIXER = –10dBm –20 –30 CH PWR = 0.26dBm ACP UP = –59.33dB ALT1 UP = –84.35dB ALT2 UP = –72.74dB –40 (dBm) –50 –60 06057-013 –70 –80 –90 Figure 13. Recommended Land Pattern –110 CENTER 881.875MHz 1MHz/ SPAN 10MHz 06057-014 –100 Figure 14. Spectrum of 4 Adjacent CDMA2000 Carriers Centered at 880 MHz; Total Carrier Power = 6 dBm (0 dBm per Carrier) C5 100pF RFOUT VCC C3 10nF C2 100pF AGND AGND AGND ADL5322 AGND 5 VCC 6 GND 7 GND 8 RFIN RFOUT GND VCC VCC 4 3 2 1 EP C4 100pF AGND VCC C6 100pF C7 10nF C8 10µF AGND AGND AGND C9 100pF C10 10nF C11 10µF AGND AGND AGND VCC RFIN Figure 15. Basic Connections Rev. A | Page 8 of 12 06057-012 C1 10µF –30 –30 –40 –40 –50 –50 ACP1 (dBc) – 750kHz OFFSET – 30kHz RBW –60 –70 –60 ACP3 (dBm) – 4MHz OFFSET – 1MHz RBW –70 –80 –90 –100 –10 –80 ACP2 (dBc) – 1.98MHz OFFSET – 30kHz RBW –8 –6 –4 –2 0 2 OUTPUT POWER (dBm) 4 6 –90 8 –100 10 06057-015 Figure 16 shows how ACP varies with output power level. The close-in ACP is a function of the signal coding and is unaffected by output headroom at these power levels. The ACP measured at 1.98 MHz carrier offset is −72 dBc at 10 dBm output power (12 dB below the required 60 dBc). At 4 MHz carrier offset, the noise and distortion measured in a 1 MHz bandwidth is −75 dBm at 6 dBm (total) output power (0 dBm per carrier). In a 50 dBm transmitter, this corresponds to an antenna-referred output power of −31 dBm (1 MHz), which is 18 dB below what is required by the CDMA2000 standard. ACP3 – 1MHz RBW (dBm) ADL5322 ACP1 AND ACP2 – 30kHz RBW (dBc) Data Sheet Figure 16. CDMA2000 ACP vs. Output Power per Carrier; 4 Adjacent Carriers Rev. A | Page 9 of 12 ADL5322 Data Sheet EVALUATION BOARD 06057-016 Figure 18 shows the schematic of the ADL5322 evaluation board. The board is powered by a single supply in the 4.75 V to 5.25 V range. The power supply is decoupled on each of the three power supply pins by 10 µF, 10 nF, and 100 pF capacitors. See Table 5 for exact evaluation board component values. Note that all three VCC pins (Pin 1, Pin 2, and Pin 5) should be independently bypassed as shown in Figure 18 for proper operation. Figure 17. Evaluation Board Component Side View Table 5. Evaluation Board Components Component DUT1 C1, C12, C16 C3, C11, C17 C2, C10, C18 C8, C9, C13, C14, R3 R2, R4 Function Driver amplifier Low frequency bypass capacitors Low frequency bypass capacitors High frequency bypass capacitors Open AC coupling capacitors Default Value ADL5322 10 µF, 0603 10 nF, 0402 100 pF, 0402 Open, 0402 100 pF, 0402 R4 100pF RFOUT VCC C3 10nF C2 100pF AGND AGND AGND ADL5322/ ADL5323 AGND 5 VCC 6 GND 7 GND 8 RFIN R2 100pF RFOUT GND VCC VCC AGND AGND AGND TP2 VCC C10 100pF C11 10nF C12 10µF AGND AGND AGND R3 OPEN RFIN C9 OPEN AGND AGND 4 3 2 1 DUT1 C8 OPEN C14 OPEN TP1 SNS1 GND VCC AGND VCC W1 VCC AGND Figure 18. Evaluation Board Schematic Rev. A | Page 10 of 12 C18 100pF C17 10nF C16 10µF AGND AGND AGND VCC 06057-017 C1 10µF C13 OPEN Data Sheet ADL5322 OUTLINE DIMENSIONS 0.60 MAX 5 TOP VIEW PIN 1 INDICATOR 2.95 2.75 SQ 2.55 8 12° MAX 0.50 0.40 0.30 0.70 MAX 0.65 TYP 0.05 MAX 0.01 NOM 0.30 0.23 0.18 SEATING PLANE 0.20 REF 1.60 1.45 1.30 EXPOSED PAD (BOTTOM VIEW) 4 0.90 MAX 0.85 NOM 0.50 BSC 0.60 MAX 1 1.89 1.74 1.59 PIN 1 INDICATOR FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 04-04-2012-A 3.25 3.00 SQ 2.75 Figure 19. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-2) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5322ACPZ-R7 ADL5322ACPZ-WP ADL5322-EVALZ 1 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 8-Lead LFCSP_VD, 7" Tape and Reel 8-Lead LFCSP_VD, Waffle Pack Evaluation Board Z = RoHS Compliant Part. Rev. A | Page 11 of 12 Package Option CP-8-2 CP-8-2 Branding OP OP Ordering Quantity 1500 50 1 ADL5322 Data Sheet NOTES ©2006–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06057-0-1/14(A) Rev. A | Page 12 of 12