View the Part Number Specific Data Sheet for full specifications

ECLIPTEK
PART NUMBER DATA SHEET
CORPORATION
ECX-6046-25.000M
REGULATORY COMPLIANCE
R
(Data Sheet downloaded on Jun 28, 2016)
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers,
certain parameters are intentionally excluded from this specification sheet.
ELECTRICAL SPECIFICATIONS
Nominal Frequency
25.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Lead Integrity
MIL-STD-883, Method 2004
Mechanical Shock
MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | HC-49/U Revision A 03/28/2005 | HC-49/U Revision A
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6046-25.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
12.70
MIN
DIA 0.457
±0.051(X2)
11.18
MAX
1
ECX6046
2
25.000M
3
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
4.88 ±0.20
13.58
MAX
4.70
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | HC-49/U Revision A 03/28/2005 | HC-49/U Revision A
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6046-25.000M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | HC-49/U Revision A 03/28/2005 | HC-49/U Revision A
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
ECX-6046-25.000M
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
5°C/Second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | HC-49/U Revision A 03/28/2005 | HC-49/U Revision A
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200