Material Content Data Sheet Sales Product Name SAF-XE164K-96F66L AC MA# MA000749486 Package PG-LQFP-100-3 Issued 29. August 2013 Weight* 752.56 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 40.856 5.43 0.068 0.01 0.272 0.04 361 5.439 0.72 7228 220.854 29.35 30.12 293472 301151 4.149 0.55 0.55 5514 5514 2.299 0.31 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 5.43 54289 54289 90 3055 62.082 8.25 395.485 52.54 61.10 525522 611072 8.316 1.11 1.11 11051 11051 2.259 0.30 0.30 3002 3002 2.619 0.35 7.858 1.04 82495 3480 1.39 10441 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13921 1000000