HFM101
MCC
THRU
HFM108
ES2A-L
1.0A
Surface
Mount High Effciency Rectifiers -50V- 1000V
omponents
SMA THRU
PACKAGE
20736 Marilla Street Chatsworth
Micro Commercial Components
TM
FEATURES
* Glass passivated device
!"#
$
% !"#
ES2J-L
SMA
.181(4.60)
* Ideal for surface mounted applications
Features
.160(4.06)
• * Lead
Compliant(Note 1) ("P" Suffix designates
Low
leakage
Free
Finish/RoHS
current
See ordering information)
* RoHS
Metallurgically
Compliant.
bonded
constructionrating
meets
UL
94 V-0 flammability
• Epoxy
• * Moisture Sensitivity Level 1
Pb-Free
is speed
available
x * Super
fastpackage
switching
under 35ns
x
RoHS product
for packing
"G"
Marking
: Cathode
bandcode
and suffix
type number
(No '-L' Suffix)
Maximum
Ratings
MECHANICAL
DATA
2 Amp Super Fast
Recovery Rectifier
50 to 600 Volts
* Epoxy: Device has Ulflammability classification 94V-O
* Lead:
method 208C guaranteed
Maximum DC
Maximum
MCCMIL-STD-202E
*Part
Mounting
Any
Maximum
Blocking
Recurrent
Numberposition:
RMS Voltage
Voltage
* Weight: 0.064Peak
gramReverse
( Approximated)
.086(2.18)
.006(.152)
.091(2.31)
.067(1.70)
DO-214AC
(SMA) (LEAD FRAME)
.059(1.50)
.008 Max.
(.203)
.035(0.89)
H
.208(5.28)
.188(4.80)
Voltage
ES2A-L
50V
35V
50V
RATINGS AND
ES2B-LMAXIMUM
100V
70V ELECTRICAL
100V CHARACTERISTICS
ES2D-L
200Vtemperature 140V
200V
Ratings
at 25℃ ambient
unless otherwise specified.
ES2G-L
400V
Single
phase half wave,
60Hz, resistive280V
of inductive load.400V
ES2J-L
600V
420V
600V
For capacitive load, derate current by 20%
Electrical Characteristics @ 25°C Unless Otherwise Specified
.110(2.79)
.051(1.29)
.012(.305)
Halohen free product for packing code suffix "H"
• * Case:
Operating
Temperature:
-65к to +175
к
Molded
plastic, DO-214AC
(SMA)
• Storage Temperature: -65к to +175к
.067(1.70)
Dimensions in inches and (millimeters)
J
A
E
C
D
B
F
Average Forward
I
2.0A
TL= 110кSYMBOL HFM101 HFM102
HFM103 HFM104 HFM105 HFM106 HFM107 HFM108
RATINGS F(AV)
Current
G
H1
H2
H3
H4
H5
H6
H7
H8
Marking
Code
Peak Forward Surge
IFSM
50A
8.3ms, half sine
DIMENSIONS
Maximum Recurrent Peak Reverse Voltage
50
100
200
300
400
600
800
1000
VRRM
Current
INCHES
MM
MIN
MAX
MIN
MAX
NOTE
Maximum
Maximum RMS Voltage
35 DIM
70
140
210
280
420
560
700
VRMS
A
.079
.096
2.00
2.44
B
.050
.064
1.27
1.63
Instantaneous
Maximum DC Blocking Voltage
50 C 100
200
300
400
600
800
1000
VDC
.002
.008
.05
.20
Forward Voltage
D
--.02
--.51
Maximum Average Forward Current
o
E
.030
.060
.76
1.52
VF
.95V
ES2A-L-ES2D-L
IFM = 2.0A;TJ=25
IO C
F
.065
.091
1.65 1.0 2.32
at TA = 50℃ES2G-L
G
.189
.220
4.80
5.59
1.25V
H
.157
.181
4.00
4.60
1.70V
ES2J-L
Peak Forward
Surge Current 8.3 ms single
half sine-waYH
J
.090
.115
2.25
2.92
o
I
FSM
30
ES2J-L
.975V(Typ)
superimposed
on rated load (JEDEC
method) IFM = 2.0A;TJ=150 C
1.25V(Max)
Maximum
DC Resistance (Note 1)
Typical Thermal
IR
Reverse Current At
5µA
Rated
Blocking
TypicalDC
Junction
Capacitance (Note 2)1mA
Voltage
Operating Temperature Range
Maximum Reverse
Trr
35ns
Storage Temperature
Range
Recovery
Time
RΘJA
TA = 25к RΘJC
TA = 100к CJ
TJ
IF=0.5A, IR=1.0A,
T
S
TG
Irr=0.25A
SUGGESTED SOLDER
PAD LAYOUT 75
0.090”
12
-55 to +150
-55 to +150
Measured at
1.0MHz, VSYMBOL
HFM101 HFM102 HFM103 HFM104 HFM105 HFM106 HFM107 HFM108
R=4.0V
0.070”
Notes:
1. High Temperature
Solder Exemption
1.00
1.70
Maximum
Forward Voltage
at 1.0AApplied,
DC see EU Directive Annex Notes
1.30
VF 7.
Maximum Full load Reverse Current, Full
50.00
cycle Average TA=55℃
IR
5.0
Maximum DC Reverse Current
@ TA = 25℃
www.mccsemi.com
2012.11
Amps
PF
UNIT
Volts
μAmps
100.0
@ TA = 125℃
Maximum Reverse Recovery Time (Note 3)
Trr
NOTES :1.Thermal Resistance: Mounted on PCB.
2. Measured at 1 MHz and applied reverse voltage of 4.0 volts.
Revision: D
of 3
3.Test Conditions: IF = 0.5A, IR = 1.0A, IRR =1 0.25A
Amps
℃
℃
Typical Junction
CJ
15pF
Capacitance
CHARACTERISTICS
at Rated DC Blocking Voltage
Volts
Volts
Volts
℃/W
25
15
0.085”
UNIT
50
75
nSec
2012/05/25
WILLAS ELECTRONIC CORP.
HFM101
THRU
1.0A Surface Mount High Effciency Rectifiers -50V- 1000V
SMA PACKAGE
2012.11
HFM108
WILLAS ELECTRONIC CORP.