PART NUMBER DATA SHEET EA3250FA12-8.000M TR REGULATORY COMPLIANCE ECLIPTEK R CORPORATION (Data Sheet downloaded on Jun 28, 2016) 2011/65 + 2015/863 168 SVHC ITEM DESCRIPTION Quartz Crystal Resonator 3.2mm x 5.0mm x 1.0mm 4 Pad Ceramic Surface Mount (SMD) 8.000MHz ±30ppm at 25°C, ±50ppm over -40°C to +85°C 12pF Parallel Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency 8.000MHz Frequency Tolerance/Stability ±30ppm at 25°C, ±50ppm over -40°C to +85°C Aging at 25°C ±3ppm/Year Maximum Load Capacitance 12pF Parallel Resonant Shunt Capacitance 5pF Maximum Equivalent Series Resistance 120 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 100µWatts Maximum Spurious Response -3dB Minimum (Measured from Fo to Fo+5000ppm) Storage Temperature Range -40°C to +125°C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 1 of 5 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 ECLIPTEK PART NUMBER DATA SHEET R CORPORATION EA3250FA12-8.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 3.2 ±0.2 1.4 ±0.1 MARKING ORIENTATION 2 5.0 ±0.2 3 1.2 ±0.1 (X4) PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground LINE MARKING 2.6 ±0.1 1 1.0 MAX 4 1 E8.000 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 0.9 ±0.1 (X4) Suggested Solder Pad Layout All Dimensions in Millimeters 1.20 (X4) 1.50 (X4) Solder Land (X4) 2.30 1.00 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 2 of 5 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EA3250FA12-8.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 ±0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 ±0.10 1.75 ±0.10 7.50 ±0.10 MARKING ORIENTATION 16.00 ±0.30 DIA 1.50 MIN 8.00 ±0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.40 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 ±0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.40 +2.00/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 3 of 5 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EA3250FA12-8.000M TR ECLIPTEK R CORPORATION Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 4 of 5 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EA3250FA12-8.000M TR ECLIPTEK R CORPORATION Recommended Solder Reflow Methods Low Temperature Infrared/Convection 245°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 30 - 60 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device. ) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device. ) www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 5 of 5 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200