SML

MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
Available
Surface Mount 3000 Watt
Transient Voltage Suppressor
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The MSMLG(J)5.0A through MXLSMLG(J)170A series of high-reliability Transient Voltage
Suppressors (TVSs) protect circuits from voltage spikes containing up to 3000 W (10/1000 µs
model pulse. The SMLG gull-wing design in the DO-215AB package allows for visible solder
connections. The SMLJ J-bend design in the DO-214AB package allows for greater PC board
mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant
versions. These are available with a variety of upscreening options for enhanced reliability. They
protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses
from inductive switching environments and induced by RF radiation. Since their response time is
virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2
and IEC61000-4-4.
DO-215AB
Package
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
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High reliability devices with fabrication and assembly lot traceability for all M prefix devices
All devices are 100% surge tested
3σ lot norm screening performed on standby current (I D ) for all M prefix devices
Available in both unidirectional and bidirectional versions
Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B for all M
prefix devices.
Enhanced reliability screening options with M prefix are available in reference to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all available options.)
RoHS compliant versions available
Axial-lead equivalent packages for thru-hole mounting are available as M5KP5.0A to M5KP110CA
with 5000 W rating (contact Microsemi for other surface mount options).
DO-214AB
Package
APPLICATIONS / BENEFITS
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Suppresses transients up to 3000 watts (10/1000 us test pulse - see Figure 2)
Selections for 5.0 to 170 volts standoff voltages (V WM )
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance:
Class 1 & 2: SML 5.0A to SML 170A or CA
Class 3: SML 5.0A to SML 150A or CA
Class 4: SML 5.0A to SML 75A or CA
Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance:
Class 1: SML 5.0A to SML 170A or CA
Class 2: SML 5.0A to SML 90A or CA
Class 3: SML 5.0A to SML 48A or CA
Class 4: SML 5.0A to SML 24A or CA
Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance:
Class 2: SML 5.0A to SML 43A or CA
Class 3: SML 5.0A to SML 22A or CA
Class 4: SML 5.0A to SML10A or CA
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Page 1 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
(1)
Thermal Resistance Junction-to-Ambient
Peak Pulse Power Dissipation @ 25 ºC
(at 10/1000 µs, see Figures 1, 2, and 3)
Impulse Repetition Rate (duty factor)
t clamping (0 volts to V (BR) min.)
Unidirectional
Bidirectional
Rated Average Power Dissipation
T L = +45 ºC
T A = +25 ºC
(2)
Maximum Forward Surge Current
Solder Temperature @ 10 s
Symbol
T J and T STG
R ӨJL
R ӨJA
P PP
Value
-65 to +150
17.5
77.5
3000
Unit
ºC
ºC/W
ºC/W
W
df
0.01 or less
<100
<5
6
(1)
1.61
200
260
%
ps
ns
W
t clamping
P M(AV)
I FSM
T SP
A (pk)
o
C
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page)
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only)
MECHANICAL and PACKAGING
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CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
MARKING: Part number marked on package
POLARITY: Cathode indicated by band. No cathode band on bi-directional devices
TAPE & REEL option: Standard per EIA-481-B with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 0.25 grams
See Package Dimensions on last page.
PART NOMENCLATURE
MX
SM
L
G
5.0
C
A
e3
Reliability Level*
M (controlled product)
MA (Avionics grade)
MX (reference JANTX)
MXL (MX Lite)
Blank = commercial
*(see High Reliability
Up-Screened Plastic
Products Portfolio)
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
Surface Mount
Package
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
3000 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 2 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
SYMBOLS & DEFINITIONS
Definition
Symbol
I (BR)
ID
IF
Breakdown Current: The current used for measuring breakdown voltage V (BR) .
Standby Current: The current at the rated standoff voltage (V WM ).
Forward Current: The forward current dc value, no alternating component.
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle.
Peak Impulse Current: The peak current during the impulse.
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current I PP .
Clamping Voltage: Maximum clamping voltage at specified I PP (Peak Pulse Current) at the specified pulse conditions.
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is
also referred to as standoff voltage.
IO
I PP
P PP
VC
V (BR)
V WM
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
PART NUMBER
Gull-Wing
SMLG5.0A
SMLG6.0A
SMLG6.5A
SMLG7.0A
SMLG7.5A
SMLG8.0A
SMLG8.5A
SMLG9.0A
SMLG10A
SMLG11A
SMLG12A
SMLG13A
SMLG14A
SMLG15A
SMLG16A
SMLG17A
SMLG18A
SMLG20A
SMLG22A
SMLG24A
SMLG26A
SMLG28A
SMLG30A
SMLG33A
SMLG36A
SMLG40A
SMLG43A
SMLG45A
SMLG48A
SMLG51A
SMLG54A
SMLG58A
SMLG60A
SMLG64A
SMLG70A
SMLG75A
J-Bend
SMLJ5.0A
SMLJ6.0A
SMLJ6.5A
SMLJ7.0A
SMLJ7.5A
SMLJ8.0A
SMLJ8.5A
SMLJ9.0A
SMLJ10A
SMLJ11A
SMLJ12A
SMLJ13A
SMLJ14A
SMLJ15A
SMLJ16A
SMLJ17A
SMLJ18A
SMLJ20A
SMLJ22A
SMLJ24A
SMLJ26A
SMLJ28A
SMLJ30A
SMLJ33A
SMLJ36A
SMLJ40A
SMLJ43A
SMLJ45A
SMLJ48A
SMLJ51A
SMLJ54A
SMLJ58A
SMLJ60A
SMLJ64A
SMLJ70A
SMLJ75A
REVERSE
STAND-OFF
VOLTAGE
V WM
Volts
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
BREAKDOWN
VOLTAGE
V (BR) @ I (BR)
Volts
I (BR)
MIN. MAX.
mA
6.40 – 7.00
10
6.67 – 7.37
10
7.22 – 7.98
10
7.78 – 8.60
10
8.33 – 9.21
1
8.89 – 9.83
1
9.44 – 10.4
1
10.0 – 11.1
1
11.1 – 12.3
1
12.2 – 13.5
1
13.3 – 14.7
1
14.4 – 15.9
1
15.6 – 17.2
1
16.7 – 18.5
1
17.8 – 19.7
1
18.9 – 20.9
1
20.0 – 22.1
1
22.2 – 24.5
1
24.4 – 26.9
1
26.7 – 29.5
1
28.9 – 31.9
1
31.1 – 34.4
1
33.3 – 36.8
1
36.7 – 40.6
1
40.0 – 44.2
1
44.4 – 49.1
1
47.8 – 52.8
1
50.0 – 55.3
1
53.3 – 58.9
1
56.7 – 62.7
1
60.0 – 66.3
1
64.4 – 71.2
1
66.7 – 73.7
1
71.1 – 78.6
1
77.8 – 86.0
1
83.3 – 92.1
1
MAXIMUM
CLAMPING
VOLTAGE
@ I PP
PEAK PULSE
CURRENT
(See Fig. 2)
I PP
Volts
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
121
Amps
326.0
291.3
267.9
250.0
232.6
220.6
208.4
194.8
176.4
164.8
150.6
139.4
129.4
123.0
115.4
106.6
102.8
92.6
84.4
77.2
71.2
66.0
62.0
56.2
51.6
46.4
43.2
41.2
38.8
36.4
34.4
32.0
31.0
29.2
26.6
24.8
MAXIMUM
STANDBY
CURRENT
@ V WM
ID
µA
1000
1000
500
200
100
50
25
10
5
5
5
5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Continued.
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 3 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated (continued)
MICROSEMI PART NUMBER
Gull-Wing
SMLG78A
SMLG85A
SMLG90A
SMLG100A
SMLG110A
SMLG120A
SMLG130A
SMLG150A
SMLG160A
SMLG170A
NOTE 1:
J-Bend
SMLJ78A
SMLJ85A
SMLJ90A
SMLJ100A
SMLJ110A
SMLJ120A
SMLJ130A
SMLJ150A
SMLJ160A
SMLJ170A
REVERSE
STAND-OFF
VOLTAGE
V WM
Volts
78
85
90
100
110
120
130
150
160
170
BREAKDOWN
VOLTAGE
V (BR) @ I (BR)
Volts
I (BR)
MIN. MAX.
mA
86.7 – 95.8
1
94.4 – 104.0
1
100 – 111
1
111 – 123
1
122 – 135
1
133 – 147
1
144 – 159
1
167 – 185
1
178 – 197
1
189 – 209
1
MAXIMUM
CLAMPING
VOLTAGE
@ I PP
PEAK PULSE
CURRENT
(See Fig. 2)
I PP
Volts
126
137
146
162
177
193
209
243
259
275
Amps
22.8
20.8
20.6
18.6
16.8
15.6
14.4
12.4
11.6
11.0
MAXIMUM
STANDBY
CURRENT
@ V WM
ID
µA
2
2
2
2
2
2
2
2
2
2
Bidirectional capacitance is half that shown in figure 4 at zero volts.
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 4 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
PPP – Peak Pulse Power - kW
GRAPHS
tp – Pulse Time – sec
FIGURE 1
Peak Pulse Power vs. Pulse Time
IPP – Peak Pulse Current - % IPP
Test wave form
parameters
tr = 10 µsec.
tp = 1000 µsec.
t – Time (msec)
FIGURE 2
Pulse Waveform
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 5 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
Peak Pulse Power (PPP) or continuous
o
Power in Percent of 25 C Rating
GRAPHS (continued)
o
T L Lead Temperature C
C – Capacitance (pF)
FIGURE 3
Derating Curve
B V – Breakdown Voltage (V)
FIGURE 4
Typical Capacitance vs.
Breakdown Voltage (unidirectional configuration)
NOTE: Bidirectional capacitance is half that shown at zero volts.
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 6 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
PACKAGE DIMENSIONS
SMLG (DO-215AB)
Ltr
A
B
C
E
F
K
Dimensions
Inch
Millimeters
Min
Max
Min
Max
0.115 0.121
2.92
3.07
0.260 0.280
6.60
7.11
0.220 0.245
5.59
6.22
0.077 0.110
1.95
2.80
0.380 0.400
9.65
10.16
0.025 0.040 0.635 1.016
NOTES: Dimension “E” exceeds the JEDEC outline as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
SMLJ (DO-214AB)
Ltr
A
B
C
D
E
L
Dimensions
Inch
Millimeters
Min
Max
Min
Max
0.115 0.121
2.92
3.07
0.260 0.280
6.60
7.11
0.220 0.245
5.59
6.22
0.305 0.320
7.75
8.13
0.077 0.110
1.95
2.80
0.030 0.060 0.760
1.52
NOTES: Dimension “E” exceeds the JEDEC outline in height as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
RF01003, Rev. C (7/30/13)
©2013 Microsemi Corporation
Page 7 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
PAD LAYOUT
RF01003, Rev. C (7/30/13)
Ltr
A
B
C
SMLG (DO-215AB)
Inch
Millimeters
0.510
12.95
0.110
2.79
0.150
3.81
Ltr
A
B
C
SMLJ (DO-214AB)
Inch
Millimeters
0.390
9.90
0.110
2.79
0.150
3.81
©2013 Microsemi Corporation
Page 8 of 8