GL100MN1MP

GL100MN1MPx
GL100MN1MPx
Surface Mount Type, High Power
Output Infrared Emitting Diode
■ Features
■ Agency Approvals/Compliance
1.
2.
3.
4.
5.
6.
7.
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS)
(Chinese:
);
refer to page 7.
Compact and thin SMD package
Top view and side view mountable
Plastic mold with resin lens
Peak emission wavelength: 940 nm TYP.
Narrow directivity angle (Δθ ±10° TYP.)
High power output (φ e: 6.0 mW MAX.)
Lead free and RoHS directive compliant
■ Applications
■ Model Line-up
Model No.
Packaging
Mount Direction
GL100MN1MP
2000 pcs/reel
Side view
GL100MN1MP1
1500 pcs/reel
Top view
1.
2.
3.
4.
5.
6.
7.
Office automation equipment
Audio visual equipment
Home appliances
Telecommunication equipment
Measuring equipment
Tooling machines
Computers
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D1-A00701EN
Date: November 30, 2007
©SHARP Corporation
GL100MN1MPx
■ External Dimensions
3.0
(0.4)
1.5
0.95
0.65
0.75
(0.2)
(0.35)
2.2
1.5
0.4
1.0
2.2
R0.8
(0.57)
(0.57)
Pin Arrangement
(0.65)
1
1
2
(1.0)
(1.0)
No.
2
Viewed from PCB
(Side view Mounting)
Viewed from PCB
(Top view Mounting)
3.0
3.0
1.5
NOTES:
1. Unit: mm
2. Unspecified tolerance : ±0.2 mm
3. ( ) : Reference dimensions
4.
Au-plated area
5. Do not allow circuit runs in
area
1.1
1
Anode
2
Cathode
1.1
1.7
1.4
0.85
1.5
Name
1.1
1.1
(Lens center)
Sheet No.: D1-A00701EN
2
GL100MN1MPx
■ Absolute Maximum Ratings
Parameter
Symbol
(Ta = 25°C)
Rating
Unit
IF
50
mA
Peak pulsed forward current *1
IFM
0.5
A
Reverse voltage
VR
6
V
Power dissipation
P
75
mW
Operating temperature
Topr
-30 to +85
°C
Storage temperature
Tstg
-40 to +95
°C
Soldering temperature *2
Tsol
240
°C
Forward current
width: 100 µs, Duty ratio: 0.01
*12 Pulse
* 10 s (MAX.) see reflow profile on page 6.
■ Electro-optical Charactertistics
Parameter
(Ta = 25°C)
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VF
IF = 20 mA
–
1.2
1.5
V
VFM
IFM = 0.5 A
–
3.0
4.0
V
Reverse current
IR
VR = 3 V
–
–
10
µA
Radiant flux
φe
IF = 20 mA
2.0
–
6.0
mW
Peak emission wavelength
λp
IF = 5 mA
–
940
–
nm
Half intensity wavelength
Δλ
IF = 5 mA
–
45
–
nm
Terminal capacitance
Ct
VR = 0, f = 1 MHz
–
50
–
pF
Response frequency
fC
–
–
300
–
kHz
Half intensity angle
Δθ
–
–
±10
–
degrees
Forward voltage
Peak forward voltage
Fig. 1 Forward Current vs.
Ambient Temperature
Fig. 2 Peak Forward Current vs. Duty Ratio
10000
Peak forward current IFM (mA)
60
Forward current IF (mA)
50
40
30
20
Pulse width ≤ 100 µs
Ta = 25°C
1000
100
10
10
10-4
0
-50
-30
-25
25
50
75
10-2
10-1
100
Duty ratio
85
0
10-3
100
Ambient temperature Ta (°C)
Sheet No.: D1-A00701EN
3
GL100MN1MPx
Fig. 3 Spectral Distribution
Fig. 5 Forward Current vs. Forward Voltage
1,000
100
Ta = 85°C
80
Forward current IF (mA)
Relative radiant intensity (%)
IF = 5 mA
Ta = 25°C
60
40
100
50°C
10
25°C
0°C
-30°C
1
20
0
860 880 900 920 940 960 980 1000 1020 1040
0.1
0
0.5
Wavelength λ (nm)
1
1.5
2
3
Forward voltage VF (V)
Fig. 4 Peak Emission Wavelength vs.
Ambient Temperature
Fig. 6 Relative Radiant Flux vs.
Ambient Temperature
980
10
IF = constant
IF = constant
970
Relative radiant flux (%)
Peak emission wavelength λp (nm)
2.5
960
950
940
1
930
920
-50 -30 -25
0
25
50
0.1
-50
75 85 100
Ambient temperature Ta (°C)
-30 -25
0
25
50
75 85 100
Ambient temperature Ta (°C)
Sheet No.: D1-A00701EN
4
GL100MN1MPx
Fig. 7 Radiant Flux vs. Forward Current
100
Fig. 9 Radiation Diagram (Typical Value)
-20°
Ta = 25°C
-10°
0°
+10°
100
-30°
+20°
Ta = 25°C
+30°
10
-40°
Pulse
(Pulse width ≤ 100 μs)
-50°
1
-60°
0.1
1
10
100
1000
Relative radiant intensity (%)
Radiant flux Φe (mW)
80
60
+40°
40
+50°
+60°
20
-70°
+70°
-80°
+80°
-90°
0
+90°
Angular displacement θ
Forward current IF (mA)
Fig. 8 Relative Output vs.
Distance to Detector
(Detector: PT100MF0MP)
100
IF = constant
Ta = 25°C
Relative output (%)
10
1
0.1
0.01
0.1
1
10
100
1000
Distance to detector d (mm)
Sheet No.: D1-A00701EN
5
GL100MN1MPx
■ Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% degradation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 10. Sharp recommends checking the process to make sure these parameters are not exceeded; exceeding these parameters
can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or
other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures ≤ 260° for ≤ 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
1 ~ 4°C/s
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
25°C
10s MAX.
60s MAX.
120s MAX.
90s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A00701EN
6
GL100MN1MPx
Storage and Handling
1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%.
2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than
60%, and mount the parts within two days. If unable to do so, bake before mounting.
3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry
box or by resealing the parts in a moisture-proof bag with a desiccant. If unable to do so, bake before mounting.
4. When baking the parts before mounting, Sharp recommends baking the parts only once and only if in a metal
tray or mounted on a PCB. Recommended conditions are for 16 to 24 hours, at a temperature of 125°C.
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
• Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese:
)
Toxic and Hazdardous Substances
Category
Infrared Emitting Diode
Lead (Pb) mercury (Hg) Cadmium (Cd)
✓
✓
✓
Hexavalent
chromiun (Cr6+)
Polybrominated
biphenyls (PBB)
Polybrominated
diphenyl ethers
(PBDE)
✓
✓
✓
NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
■ Taping Specifications
1.
2.
3.
4.
5.
6.
Tape structure and dimensions conforms to those shown in Fig. 11 to Fig. 16.
Product insertion will have the cathode to the hole side of the tape.
Cover tape peel-separation force: F = 0.2 to 1.0 N (where θ 160° to 180°)
Quantity per reel = 2000 pcs. (GL100MN1MP) or 1500 pcs. (GL100MN1MP1)
Product mass: 0.01 g (approx.)
Packaging:
a. Reels are sealed inside an aluminum bag, along with a humidity indicator card.
b. Bags are labeled and securely packed.
Sheet No.: D1-A00701EN
7
GL100MN1MPx
■ Packing Specifications
● GL100MN1MP (Side view mount, 2000 pcs/reel)
Fig. 11 Tape Shape and Dimension
1.75 ±0.1
4.0 ±0.1
0.3 ±0.05
5°
8.0 ±0.3
3.3 ±0.1
5.5 ±0.1
1.7 ±0.1
3.5 ±0.05
1.75 ±0.1
2.0 ±0.05
φ1.5 +0.1
-0
4.0 ±0.1
1.6 ±0.1
2.5 ±0.1
Fig. 12 Reel Shape and Dimension
+0.3
9.0 -0
2.0 ±0.5
60.0 -0
+1
φ13.0 ±0.2
180.0
11.4 ±1
NOTE: Unit: mm
Sheet No.: D1-A00701EN
8
GL100MN1MPx
Fig. 13 Product Insertion Direction
Pull-out direction
● GL100MN1MP1 (Top view mount, 1500 pcs/reel)
Fig. 14 Tape Shape and Dimension
2.45 ±0.1
4.0 ±0.1
0.3 ±0.05
8.0 ±0.3
5°
5.5 ±0.1
3.3 ±0.1
3.5 ±0.05
1.75 ±0.1
2.0 ±0.05
φ1.5 +0.1
-0
4.0 ±0.1
1.8 ±0.1
Sheet No.: D1-A00701EN
9
GL100MN1MPx
Fig. 15 Reel Shape and Dimension
+0.3
9.0 -0
2.0 ±0.5
60.0 -0
+1
φ13.0 ±0.2
180.0
11.4 ±1
NOTE: Unit: mm
Fig. 16 Product Insertion Direction
Pull-out direction
Sheet No.: D1-A00701EN
10
GL100MN1MPx
■ Important Notices
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, structure, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: D1-A00701EN
11