PC4SD11NTZCF

PC4SD11NTZ Series
VDRM : 800V
Non-zero cross type
DIP 6pin
Phototriac Coupler for triggering
PC4SD11NTZ
Series
∗
Zero cross type is also available.
(PC4SD21NTZ Series)
■ Description
■ Agency approvals/Compliance
PC4SD11NTZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 4SD11)
2. Approved by CSA, file No. CA95323 (as model No.
4SD11)
3. Optionary available VDE Approved (∗)(DIN EN 607475-2), file No. 40008189 (as model No. 4SD11)
4. Package resin : UL flammability grade (94V-0)
(∗)
DIN EN60747-5-2 : succesor standard of DIN VDE0884.
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
(∗∗)
Reinforced insulation type is also available.
(PC4SF11YVZ Series)
■ Features
1. High repetitive peak off-state voltage (VDRM : 800V)
2. Non-zero crossing functionality
3. IFT ranks available (see Model Line-up section in this
datasheet)
4. 6 pin DIP package
5. Double transfer mold construction (Ideal for Flow
Soldering)
6. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
■ Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. Triggering for Triacs used for implementing phase
control in applications such as lighting control and
temperature control (HVAC).
3. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A07801FEN
Date Mar. 31. 2004
© SHARP Corporation
PC4SD11NTZ Series
■ Internal Connection Diagram
1
6
2
5
1
2
3
4
3
5
4
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC4SD11NTZ]
2. Wide Through-Hole Lead-Form [ex. PC4SD11NVZ]
±0.3
1.2
6
Model No.
4
SHARP
mark
"S"
6.5±0.5
Date code (2 digit)
3
Date code (2 digit)
Factory identification mark
7.12±0.5
0.5±0.1
3.25±0.5
Epoxy resin
2.54±0.25
θ
±0.25
2.54
θ : 0 to 13˚
0.5±0.1
Model No.
Rank mark
4SD11
Anode
mark
1.2±0.3
6
SHARP
mark
"S"
6.5±0.5
5
Rank mark
4SD11
Anode
mark
Date code (2 digit)
1
2
Date code (2 digit)
3
1
Factory identification mark
7.12±0.5
3
Factory identification mark
7.62±0.3
0.35±0.25
0.26±0.1
1.0+0.4
−0
2
7.12±0.5
7.62±0.3
3.5±0.5
2.54±0.25
Model No.
4
0.25±0.25
SHARP
mark
"S"
0.6±0.2
4
±0.1
0.26
4. Wide SMT Gullwing Lead-Form [ex. PC4SD11NWP]
1.2±0.3
5
±0.5
10.16
Product mass : approx. 0.35g
3. SMT Gullwing Lead-Form [ex. PC4SD11NXP]
6
±0.3
7.62
Epoxy resin
θ
Product mass : approx. 0.35g
0.6±0.2
Factory identification mark
2.9±0.5
3.5±0.5
2.9±0.5
±0.3
0.5TYP.
7.62
2
0.5
7.12
3
TYP.
±0.5
1
3.5±0.5
2
Anode
mark
3.5±0.5
1
Rank mark
4SD11
2.7MIN.
Anode
mark
Model No.
6.5±0.5
Rank mark
4SD11
4
5
6.5±0.5
5
Epoxy resin
2.54±0.25
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
6
3.25±0.5
0.6
SHARP
mark
"S"
1.2±0.3
0.6±0.2
±0.2
0.75±0.25
Epoxy resin
10.16±0.5
0.75±0.25
MAX.
12.0
Product mass : approx. 0.33g
Product mass : approx. 0.34g
Sheet No.: D2-A07801FEN
2
PC4SD11NTZ Series
■ Outline Dimensions
(Unit : mm)
5. Through-Hole VDE option [ex. PC4SD11YTZ]
6. Wide Through-Hole Lead-Form VDE option
[ex. PC4SD11YVZ]
1.2±0.3
6
Model No.
SHARP
mark
"S"
Rank mark
2
Anode
mark
4
Date code (2 digit)
3
Date code (2 digit)
Factory identification mark
7.12±0.5
1
0.5TYP.
3.25±0.5
Factory identification mark
7.12±0.5
θ
θ
Epoxy resin
θ : 0 to 13˚
±0.25
2.54
0.5±0.1
Product mass : approx. 0.35g
0.6±0.2
Model No.
SHARP
mark
"S"
Rank mark
4SD11
4
5
4
Rank mark
4SD11
Anode
mark
4
Date code (2 digit)
2
Date code (2 digit)
3
1
Factory identification mark
7.12±0.5
7.12±0.5
7.62±0.3
0.26±0.1
3.5±0.5
2.54±0.25
1.0+0.4
−0
2
VDE
identification mark
3
Factory identification mark
7.62±0.3
0.35±0.25
VDE
identification mark
0.25±0.25
1
Model No.
3.5±0.5
Anode
mark
1.2±0.3
6
6.5±0.5
4
6.5±0.5
SHARP
mark
"S"
5
±0.1
0.26
8. Wide SMT Gullwing Lead-Form VDE option
[ex. PC4SD11YWP]
1.2±0.3
6
±0.5
10.16
Product mass : approx. 0.35g
7. SMT Gullwing Lead-Form VDE option
[ex. PC4SD11YXP]
0.6±0.2
±0.3
7.62
0.5
2.9±0.5
3.5±0.5
7.62±0.3
0.5±0.1
2
VDE
identification mark
Epoxy resin
2.54±0.25
3
TYP.
1
VDE
identification mark
Rank mark
4SD11
2.7MIN.
4
Model No.
2.9±0.5
Anode
mark
6.5±0.5
4SD11
4
5
6.5±0.5
4
3.5±0.5
5
Epoxy resin
2.54±0.25
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
6
3.25±0.5
0.6
SHARP
mark
"S"
1.2±0.3
0.6±0.2
±0.2
0.75±0.25
Epoxy resin
10.16±0.5
0.75±0.25
MAX.
12.0
Product mass : approx. 0.33g
∗Pin
5
Product mass : approx. 0.34g
is not allowed external connection
Sheet No.: D2-A07801FEN
3
PC4SD11NTZ Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A07801FEN
4
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
IF
50
Forward current
Input
VR
6
Reverse voltage
I
(rms)
0.1
RMS ON-state current
T
*3
Output Peak one cycle surge current
Isurge
1.2
800
Repetitive peak OFF-state voltage VDRM
*1
Viso (rms)
5.0
Isolation voltage
Topr
−30 to +100
Operating temperature
Tstg
−55 to +125
Storage temperature
*2
Tsol
270 *4
Soldering temperature
(Ta=25˚C)
Unit
mA
V
A
A
V
kV
˚C
˚C
˚C
1mm
PC4SD11NTZ Series
Soldering area
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Output
Holding current
Critical rate of rise of OFF-state voltage
Rank B
Transfer Minimum trigger current
Rank C
characIsolation
resistance
teristics
Turn-on time
(Ta=25˚C)
Symbol
VF
IR
IDRM
VT
IH
dV/dt
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=6V
−
VD=1/√2 ·VDRM
IFT
VD=6V, RL=100Ω
RISO
ton
DC500V,40 to 60%RH
VD=6V, RL=100Ω, IF=20mA
MIN. TYP.
1.2
−
−
−
−
−
−
−
−
0.1
−
50
−
−
−
−
10
1011
5×10
−
−
MAX.
1.4
10
3
2.5
3.5
−
7
5
−
100
Unit
V
µA
µA
V
mA
V/µs
mA
Ω
µs
Sheet No.: D2-A07801FEN
5
PC4SD11NTZ Series
Model Line-up
Lead Form
Through-Hole
Shipping Package
DIN
EN60747-5-2
Model No.
PC4SD11NTZBF
PC4SD11NTZCF
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
Approved
PC4SD11YTZBF
PC4SD11YTZCF
Wide SMT Gullwing
Sleeve
50pcs/sleeve
-
PC4SD11NWZBF
PC4SD11NWZCF
Approved
PC4SD11YWZBF
PC4SD11YWZCF
SMT Gullwing
Sleeve
50pcs/sleeve
PC4SD11NXZBF
PC4SD11NXZCF
Approved
PC4SD11YXZBF
PC4SD11YXZCF
SMT Gullwing
PC4SD11NXPBF
PC4SD11NXPCF
Wide Through-Hole
PC4SD11NVZBF
PC4SD11NVZCF
PC4SD11YXPBF
PC4SD11YXPCF
PC4SD11NWPBF
PC4SD11NWPCF
IFT [mA]
(V D =6V,
R L =100Ω )
B
C
MAX.7
MAX.5
Rank mark
IFT [mA]
(V D =6V,
R L =100Ω )
B
C
MAX.7
MAX.5
Approved
PC4SD11YVZBF
PC4SD11YVZCF
Wide SMT Gullwing
Taping
1 000pcs/reel
Approved
Rank mark
Approved
PC4SD11YWPBF
PC4SD11YWPCF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A07801F EN
6
PC4SD11NTZ Series
Fig.2 RMS ON-state Current vs.
Ambient Temperature
70
175
60
150
RMS ON-state current Ir (rms) (mA)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
50
40
30
20
10
125
100
75
50
25
0
0
−30
0
50
−30
100
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
10
Minimum trigger current IFT (mA)
Ta=75˚C
Forward current IF (mA)
VD=6V
RL=100Ω
9
100
50
50˚C
25˚C
0˚C
10
5
−25˚C
8
7
6
5
4
3
2
1
1
0.9
1
1.1
1.2
1.3
1.4
0
−40
1.5
−20
Forward voltage VF (V)
20
40
60
80
100
Ambient temperature T (˚C)
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Fig.6 ON-state Voltage vs.
Ambient Temperature
2
1.3
IT=100mA
1.9
1.2
1.8
ON-state voltage VT (V)
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta)/VDRM (Tj=25˚C)
0
1.1
1
0.9
1.7
1.6
1.5
1.4
1.3
1.2
0.8
1.1
0.7
−40
−20
0
20
40
60
80
1
−40
100
Ambient Temperature Ta (˚C)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A07801FEN
7
PC4SD11NTZ Series
Fig.7 Holding Current vs.
Ambient Temperature
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
10−5
10
Repetitive peak OFF-state current IDRM (A)
Holding Current IH (mA)
VD=6V
1
0.1
−40
−20
0
20
40
60
80
VD=800V
10−6
10−7
10−8
10−9
−40
100
Ambient temperature Ta (˚C)
−20
0
20
40
60
80
100
120
Ambient Temperature Ta (˚C)
Fig.9 Turn-on Time vs. Forward Current
Turn-on time tON (µs)
1 000
VD=6V
RL=100Ω
100
10
1
10
100
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A07801FEN
8
PC4SD11NTZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration.
These Phototriac Coupler are intended to be used as triggering device for main Triacs.
Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of
your choice. Failure to do may result in malfunctions.
In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that
the pulse width is a minimum of 1ms.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit.
Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often
eliminate the need for a snubber circuit.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
1.7
1.7
2.54
2.54
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
Sheet No.: D2-A07801FEN
9
PC4SD11NTZ Series
● Standard Circuit (Medium/High Power Triac Drive Circuit)
PC4SD11NTZ
1
6
Load
5
Triac
2
3
AC Line
4
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A07801FEN
10
PC4SD11NTZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07801FEN
11
PC4SD11NTZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A07801FEN
12
PC4SD11NTZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A07801FEN
13
PC4SD11NTZ Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
I
5˚
X.
MA
H
H
A
B
C
E
K
Dimensions List
A
B
±0.3
16.0
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
7.8±0.1
E
2.0±0.1
F
4.0±0.1
(Unit:mm)
G
+0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07801FEN
14
PC4SD11NTZ Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
MA
X.
H
H
A
B
C
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
±0.1
12.2
0.4±0.05
5˚
K
C
1.75±0.1
J
4.15±0.1
D
12.0±0.1
K
7.6±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
a
Dimensions List
a
b
330
25.5±1.5
e
f
±1.0
23
2.0±0.5
f
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07801FEN
15
PC4SD11NTZ Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A07801FEN
16