Fair-Rite P/N 2508051527Y0 Y Chip Bead Material Grade Nominal Chemical Composition Wt of core (g)= Ferrite -Compound Fe2O3 ZnO NiO CuO MnO CAS Number wt % 1309-37-1 1314-13-2 1313-99-1 1317-38-0 1344-43-0 65 17 9 6 3 0.008 0.0052 0.0014 0.0007 0.0005 0.0002 Compound Weight (g) Breakdown of Y Chip Bead Material Grade Wt of termination (g)= Termination Plating Elements Sn Ni Ag CAS Number wt % 7440-31-5 7440-02-0 7440-22-4 14.3 6.9 78.8 0.002 0.00029 0.00014 0.00158 Supporting notes: 1. P/N 2508051527Y0 consists of: a core Y Chip Bead Material Grade b Termination Plating SnNiAg 2. 3. 4. 5. Moisture Sensitivity Level (MSL)= 1 Max Reflow Temp= 260 degC Max Time at Max Reflow Temp= 40 sec RoHS 6/6 Compliant Terminations/ Wire are backwards compatible with standard Soldering Processes 6. RoHS Conversion Date= 1/1/2005 7. RoHS Compliance Marking is Contained on Shipping Labels Element Weight (g) Breakdown of Pb- Free Termination Plating Calculated Maximum Levels of RoHS Restricted Substances Present in Y Chip Bead Material Grade Wt of core (g)= Impurity Substance Cr+6 Cd Hg Pb PBB PBDE 2508051527Y0 RoHS.xls RoHS Threshold (ppm): 1000 100 1000 1000 1000 1000 ppm ND ND ND ND ND ND 0.008 NOT DETECTED NOT DETECTED NOT DETECTED NOT DETECTED NOT DETECTED NOT DETECTED RoHS Impurity Substance Weight (g) Breakdown of Y Chip Bead Material Grade Fair-Rite Products Corp. Compiled by Rich Eckmann