Fair-Rite P/N 2512063017Y3 Y Chip Bead Material Grade Nominal Chemical Composition Supporting notes: 1. P/N Wt of core (g)= Ferrite -Compound Fe2O3 ZnO NiO CuO MnO CAS Number wt % 1309-37-1 1314-13-2 1313-99-1 1317-38-0 1344-43-0 65 17 9 6 3 0.024 0.0156 0.0041 0.0022 0.0014 0.0007 Compound Weight (g) Breakdown of Y Chip Bead Material Grade Wt of termination (g)= Termination Plating Elements Sn Ni Ag CAS Number wt % 7440-31-5 7440-02-0 7440-22-4 14.3 6.9 78.8 0.006 0.00086 0.00041 0.00473 2512063017Y3 consists of: a core Y Chip Bead Material Grade b Termination Plating SnNiAg 2. 3. 4. 5. Moisture Sensitivity Level (MSL)= 1 Max Reflow Temp= 260 degC Max Time at Max Reflow Temp= 40 sec RoHS 6/6 Compliant Terminations/ Wire are backwards compatible with standard Soldering Processes 6. RoHS Conversion Date= 1/1/2005 7. RoHS Compliance Marking is Contained on Shipping Labels Element Weight (g) Breakdown of Pb- Free Termination Plating Calculated Maximum Levels of RoHS Restricted Substances Present in Y Chip Bead Material Grade Wt of core (g)= Impurity Substance Cr+6 Cd Hg Pb PBB PBDE 2512063017Y3 RoHS RoHS Threshold (ppm): 1000 100 1000 1000 1000 1000 ppm 0.00 0.00 0.00 0.00 0.00 0.00 0.024 0 0 0 0 0 0 RoHS Impurity Substance Weight (g) Breakdown of Y Chip Bead Material Grade Fair-Rite Products Corp. Compiled by Rich Eckmann