AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL DMSMS NOTICE DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES 1. TITLE 2. DOCUMENT NUMBER MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX INVERTER, MONOLITHIC SILICON – FAB MIGRATION SPO-2014-D-0004 3. DATE (Year, Month, Date) 2014 February 14 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT (NAME) AEROFLEX COLORADO SPRINGS, INC. 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 MR. TIM MEADE 6. MANUFACTURER POINT OF CONTACT TELEPHONE (719) 594-8048 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. MANUFACTURER FINAL ORDER DATE 10. PRODUCT IDENTIFICATION CODE 11. BASE PART 65342 SEE COMMENTS BELOW C004A UT54ACS04 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR 96516 01 15. RHA LEVELS 16. QML LEVEL NON, R, F, G, AND H Q AND V 17. NON QML LEVEL 18. BLANK 12. BLANK N/A 19. COMMENTS AEROFLEX COLORADO SPRINGS INC. IS ISSUING THIS DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES NOTICE AND PRODUCT CHANGE NOTIFICATION TO ANNOUNCE THE FOUNDRY MIGRATION OF DEVICE TYPE 01 FROM 1.2UM RADIATION-HARDENED CMOS TO ON-SEMICONDUCTOR’S 0.6UM C5U COMMERCIAL RADIATIONHARDENED CMOS PROCESS. BECAUSE THE MIGRATED DEVICE IS FORM, FIT, AND FUNCTIONAL TO THE LEGACY DEVICE, IT WILL CONTINUE TO SHIP AS DEVICE TYPE 01. AS PART OF THIS PROCESS MIGRATION, THE RADIATION HARDNESS ASSURANCE LEVEL “H” AND CASE OUTLINE “C” WILL NO LONGER BE AVAILABLE FROM AN APPROVED SOURCE OF SUPPLY. AEROFLEX WILL ACCEPT ORDERS FOR RHA LEVEL “H” AND PACKAGE OUTLINE “C” ON A “FIRST COME, FIRST SERVED” BASIS, THROUGH JUNE 2014 OR UNTIL INVENTORY EXHAUSTS. ADDITIONALLY, DIE SALES AGAINST DIE DETAIL “A” WILL NO LONGER BE AVAILABLE. FUTURE DIE SALES MAY BE ISSUED AGAINST DIE DETAIL “B” OF THE AFFECTED SMD. NOTE: THE NEW DIE SUPPLIED AGAINST DIE DETAIL “B” REQUIRE A SUBSTRATE BIAS TO VSS. THE MIGRATED DEVICE OFFERING WILL BE AVAILABLE WITH THE FOLLOWING OPTIONS: SMD #: 5962-96516 DEVICE TYPE: 01 AVAILABLE RHA DESIGNATORS: R (100Krads (Si)), F (300Krads (Si)), G (500Krads (Si)) DEVICE CLASS: Q, V CASE OUTLINE DESIGNATOR: X (14 LEAD FLAT PACK) OR DIE CODE: 9 LEAD FINISH: A, C, X OR DIE DETAIL: B SHIPMENTS OF THE MIGRATED DEVICE ARE EXPECTED TO BEGIN IN JUNE 2014. See Continuation on page 2. 20. ADEPT REPRESENTATIVE Timothy L. Meade ADEPT FORM F##### REV - 21. SIGNATURE 22. DATE 28 February, 2014 RELEASE DATE: 11/11/11 Continuation Page 2 Obsolete SMD PINs 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 5962 H 96516 Replace SMD PINs 5962 G 96516 5962 G 96516 5962 G 96516 5962 G 96516 5962 G 96516 5962 G 96516 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 V Q Q Q Q Q V V V V Q Q Q V V V 9 9 C X C X C X C X 9 X X 9 X X ADEPT FORM F##### REV - A A A A C C A A C C Vendor Similar PINs UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04- VDIE QDIE PQAH UQAH PQCH UQCH PVAH UVAH PVCH UVCH B A C B A C Vendor Similar PINs UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04UT54ACS04- QDIE UQAG UQCG VDIE UVAG UVCG RELEASE DATE: 11/11/11