AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL PRODUCT CHANGE NOTICE 1. TITLE 2. DOCUMENT NUMBER MICROCIRCUIT, DIGITAL-LINEAR, OCTAL 400 MBPS BUS LVDS REPEATER, MONOLITHIC SILICON THETA-JC AND POWER DISSIPATION UPDATE SPO-2014-PCN-0001 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT NAME AEROFLEX COLORADO SPRINGS, INC. Jennifer Larsen 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 6. MANUFACTURER POINT OF CONTACT TELEPHONE 3. DATE (Year, Month, Date) 2014, February, 28 719-594-8000 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. EFFECTIVE DATE 10. PRODUCT IDENTIFICATION CODE 11. BASE PART 65342 2014, February, 28 WD17 & WD18 UT54LVDM328 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR 5962-01536 01 15. RHA LEVELS 16. QML LEVEL NON, R, F, G, and H Q and V 17. NON QML LEVEL 18. BLANK 12. BLANK PROTO and HIREL 19. PRODUCT CHANGE This notification serves to inform our customers of the update to the power dissipation (PD) and thermal resistance junction-to-case (ϴJC). Aeroflex Colorado Springs has performed analysis that more accurately represent the PD and ϴJC parameters. Per MIL-STD-883, Method 1012.1, Section 3.4.1, PD = (TJ(max) – TC(max) ) / ϴJC. The SMD will update to reflect the following changes: Parameter ϴJC PD OLD 22°C/W 800mW NEW 15°C/W 1.667W The effective result of this change is the device has better thermal impedance than previously reported. The lower ϴJC permits the user application to reliably dissipate more power. 20. DISPOSITIONARY RECOMMENDATION: 21. ADEPT REPRESENTATIVE CHECK & ☒ USE AS IS 22. SIGNATURE CONTACT MANUFACTURER Timothy L. Meade ADEPT PA FORM ☐ REMOVE & REPLACE ☐ CORRECT & ☐ USE AS SPECIFIED 23. DATE 28 February, 2014 REVISON DATE: 2/27/2013 REVISION: A