AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL PRODUCT INFORMATION NOTICE 1. TITLE 2. DOCUMENT NUMBER MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16-MEG X 40-BIT X 4-BANK (2.5-GIG), RADIATION-HARDENED, SYNCHRONOUS DRAM (SDRAM), MULTIPCHIP MODULE – HOLD TID RHA LEVEL R SPO-2014-PIN-0001 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT NAME AEROFLEX COLORADO SPRINGS, INC. TIMOTHY MEADE 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 6. MANUFACTURER POINT OF CONTACT TELEPHONE 3. DATE (Year, Month, Date) 2014, February, 27 (719) 594-8000 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. BLANK 10. PRODUCT IDENTIFICATION CODE 11. BASE PART 65342 QS18 UT8SDMQ64M40 12. BLANK 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR 5962-10229 01,02 15. RHA LEVELS 16. QML LEVEL R Q 17. NON QML LEVEL 18. BLANK N/A 19. DESCRIPTION (FOR NEW PRODUCTS, PROVIDE AVAILABILITY DATE AND LEAD TIME) THIS NOTIFICATION SERVES TO INFORM OUR CUSTOMERS OF THE CURRENT UNAVAILABILITY OF RHA LEVEL R. ALTHOUGH THE 100K RAD(SI) OFFERING IS CURRENTLY NOT AVAILABLE, THE UT8SDMQ64M40 2.5G SDRAM DEVICE WILL CONTINUE TO SHIP WITH RHA LEVELS L, P, AND D. AEROFLEX IS RECEIVING AND TESTING NEW WAFER LOTS TO DETERMINE IF ANY OF THE NEW MATERIAL IS CAPABLE OF ACHIEVING 100K RAD(SI). IF ANY MATERIAL QUALIFIES FOR 100K RAD(SI), AEROFLEX WILL RESUME BOOKING & SHIPPING 100K RAD(SI) PRODUCT WHILE MATERIALS LAST. THE TARGET COMPLETION DATE FOR EVALUATION OF NEW MATERIAL IS DECEMBER 2014. AFFECTED DEVICES ON HOLD ACTIVE DEVICES 5962R1022901QXC 5962R1022901QYC 5962R1022902QXC 5962R1022902QYC 5962L1022901QXC 5962L1022901QYC 5962L1022902QXC 5962L1022902QYC 5962P1022901QXC 5962P1022901QYC 5962P1022902QXC 5962P1022902QYC 5962D1022901QXC 5962D1022901QYC 5962D1022902QXC 5962D1022902QYC NOTE: THIS DOCUMENT IS PUBLISHED FOR INFORMATION PURPOSES AND MAY PROVIDE FORWARD LOOKING STATEMENTS THAT ARE SUBJECT TO CHANGE. THE USERS SHOULD CONTACT THEIR LOCAL AEROFLEX SALES OFFICE FOR ANY ACTIONABLE CONTENT DESCRIBED HEREIN. 20. ADEPT REPRESENTATIVE Timothy L. Meade ADEPT PIN FORM 21. SIGNATURE 22. DATE 28 February 2014