AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL PRODUCT INFORMATION NOTICE 1. TITLE 2. DOCUMENT NUMBER SPO-2015-PIN-0002 Supply Chain Notification Subcontractor Ownership Change 3. DATE (Year, Month, Date) 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT NAME AEROFLEX COLORADO SPRINGS, INC. Paul Coe 4350 CENTENNIAL BOULEVARD 6. MANUFACTURER POINT OF CONTACT TELEPHONE 719/594-8085 2015, June 17 COLORADO SPRINGS, COLORADO 80907-3486 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. BLANK 10. PRODUCT IDENTIFICATION CODE 11. BASE PART 65342 NA NA 12. BLANK 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR NA NA 15. RHA LEVELS 16. QML LEVEL NA NA 17. NON QML LEVEL 18. BLANK NA 19. DESCRIPTION (FOR NEW PRODUCTS, PROVIDE AVAILABILITY DATE AND LEAD TIME) The following correspondence is written notification of a supply chain change as a result of a recent business acquisition. Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 30th, 2015. Located in Tianshui, China TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components, and trades on the Shenzhen Stock Exchange under the symbol TSHT. Please find a copy of the announcement for TSHT on page 2. FlipChip International LLC, located in Phoenix, AZ, provides wafer bumping services, as a subcontractor, to Aeroflex Colorado Springs (dba, Cobham Semiconductor Solutions (Cobham)). Wafer bumping is integral to flip chip packaging. Flip chip technology is used in Cobham’s advanced digital, power, and serial communication products to deliver the high performance interconnect demanded by these solutions. Cobham sends passivated wafers to FCI for bumping; FCI returns completed wafers and reject wafers to Cobham for post-bump electrical probe testing prior to packaging. After the completion of packaging, Cobham performs additional electrical testing prior to product shipment. FCI is bumping EAR controlled wafers for Cobham (i.e., non-ITAR, non-Classified, non-Trusted wafers). Other than wafers and wafer level X-Y coordinates for I/O positions, Cobham does not share any confidential or controlled information with our wafer bumping subcontractors, FCI or otherwise. For the bumping of ITAR, Classified, and Trusted wafers, Cobhman is assessing second sources that can handle controlled wafers and technical information. Please contact me via telephone (719)594-8085 or e-mail [email protected] if you have any questions or concerns. NOTE: THIS DOCUMENT IS PUBLISHED FOR INFORMATION PURPOSES AND MAY PROVIDE FORWARD LOOKING STATEMENTS THAT ARE SUBJECT TO CHANGE. THE USERS SHOULD CONTACT THEIR LOCAL AEROFLEX SALES OFFICE FOR ANY ACTIONABLE CONTENT DESCRIBED HEREIN. 20. ADEPT REPRESENTATIVE 21. SIGNATURE Lin-Chi Huang ADEPT PIN FORM 22. DATE 2015, June 17 REVISON DATE: 05/28/2014 SHEET 1 REVISION: B SPO-2015-PIN-0002 Page 2 ADEPT PIN FORM REVISON DATE: 05/28/2014 SHEET 2 REVISION: B