PDF Data Sheet Rev. A

FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
Low jitter, low phase noise clock distribution
Clock generation and translation for SONET, 10Ge, 10G FC,
and other 10 Gbps protocols
Forward error correction (G.710)
Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs
High performance wireless transceivers
ATE and high performance instrumentation
Broadband infrastructures
GENERAL DESCRIPTION
The AD9522-31 provides a multioutput clock distribution
function with subpicosecond jitter performance, along with an
on-chip PLL and VCO. The on-chip VCO tunes from 1.72 GHz
to 2.25 GHz. An external 3.3 V/5 V VCO/VCXO of up to 2.4 GHz
can also be used.
1
CP
OPTIONAL
REF1
REFIN
REFIN
CLK
REF2
LF
STATUS
MONITOR
PLL
Low phase noise, phase-locked loop (PLL)
On-chip voltage controlled oscillator (VCO) tunes from
1.72 GHz to 2.25 GHz
Supports external 3.3 V/5 V VCO/VCXO to 2.4 GHz
1 differential or 2 single-ended reference inputs
Accepts CMOS, LVPECL, or LVDS references to 250 MHz
Accepts 16.62 MHz to 33.3 MHz crystal for reference input
Optional reference clock doubler
Reference monitoring capability
Revertive automatic and manual reference switchover/
holdover modes
Glitch-free switchover between references
Automatic recovery from holdover
Digital or analog lock detect, selectable
Optional zero delay operation
Twelve 800 MHz LVDS outputs divided into 4 groups
Each group of 3 has a 1-to-32 divider with phase delay
Additive output jitter as low as 242 fs rms
Channel-to-channel skew grouped outputs <60 ps
Each LVDS output can be configured as 2 CMOS outputs
(for fOUT ≤ 250 MHz)
Automatic synchronization of all outputs on power-up
Manual synchronization of outputs as needed
SPI- and I²C-compatible serial control port
64-lead LFCSP
Nonvolatile EEPROM stores configuration settings
VCO
ZERO
DELAY
DIVIDER
AND MUXES
LVDS/
CMOS
DIV/Φ
OUT0
OUT1
OUT2
DIV/Φ
OUT3
OUT4
OUT5
DIV/Φ
OUT6
OUT7
OUT8
DIV/Φ
OUT9
OUT10
OUT11
SPI/I2C CONTROL
PORT AND
DIGITAL LOGIC
EEPROM
AD9522
07224-001
FEATURES
SWITCHOVER
AND MONITOR
Data Sheet
12 LVDS/24 CMOS Output Clock Generator
with Integrated 2 GHz VCO
AD9522-3
Figure 1.
The AD9522 serial interface supports both SPI and I²C® ports.
An in-package EEPROM can be programmed through the
serial interface and store user-defined register settings for
power-up and chip reset.
The AD9522 features 12 LVDS outputs in four groups. Any of
the 800 MHz LVDS outputs can be reconfigured as two
250 MHz CMOS outputs.
Each group of outputs has a divider that allows both the divide
ratio (from 1 to 32) and the phase (coarse delay) to be set.
The AD9522 is available in a 64-lead LFCSP and can be operated
from a single 3.3 V supply. The external VCO can have an
operating voltage up to 5.5 V.
The AD9522 is specified for operation over the standard industrial
range of −40°C to +85°C.
The AD9520-3 is an equivalent part to the AD9522-3 featuring
LVPECL/CMOS drivers instead of LVDS/CMOS drivers.
The AD9522 is used throughout this data sheet to refer to all the members of the AD9522 family. However, when AD9522-3 is used, it is referring to that specific
member of the AD9522 family.
Rev. A
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AD9522-3
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Mode 1: Clock Distribution or External VCO < 1600 MHz
.................................................................................................. 31
Applications ....................................................................................... 1
Mode 2: High Frequency Clock Distribution—CLK or
External VCO > 1600 MHz .................................................. 33
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Phase-Locked Loop (PLL) .................................................... 35
Revision History ............................................................................... 4
Configuration of the PLL ...................................................... 35
Specifications..................................................................................... 5
Phase Frequency Detector (PFD) ........................................ 35
Power Supply Requirements ....................................................... 5
Charge Pump (CP) ................................................................. 35
PLL Characteristics ...................................................................... 5
On-Chip VCO ........................................................................ 36
Clock Inputs .................................................................................. 8
PLL External Loop Filter ....................................................... 36
Clock Outputs ............................................................................... 8
PLL Reference Inputs ............................................................. 36
Timing Characteristics ................................................................ 9
Reference Switchover ............................................................. 37
Timing Diagrams ..................................................................... 9
Reference Divider R ............................................................... 37
Clock Output Additive Phase Noise (Distribution Only; VCO
Divider Not Used) ...................................................................... 10
VCO/VCXO Feedback Divider N: P, A, B .......................... 37
Clock Output Absolute Phase Noise (Internal VCO Used) .. 11
Digital Lock Detect (DLD) ................................................... 39
Clock Output Absolute Time Jitter (Clock Generation Using
Internal VCO) ............................................................................. 11
Analog Lock Detect (ALD)................................................... 39
Clock Output Absolute Time Jitter (Clock Cleanup Using
Internal VCO) ............................................................................. 11
External VCXO/VCO Clock Input (CLK/CLK) ................ 40
Current Source Digital Lock Detect (CSDLD) .................. 39
Holdover .................................................................................. 40
Clock Output Absolute Time Jitter (Clock Generation Using
External VCXO) ......................................................................... 12
External/Manual Holdover Mode ........................................ 40
Automatic/Internal Holdover Mode.................................... 40
Clock Output Additive Time Jitter (VCO Divider Not Used)
....................................................................................................... 12
Frequency Status Monitors ................................................... 42
Clock Output Additive Time Jitter (VCO Divider Used) ..... 13
VCO Calibration .................................................................... 42
Serial Control Port—SPI Mode ................................................ 13
Zero Delay Operation ................................................................ 45
Serial Control Port—I²C Mode ................................................ 14
Internal Zero Delay Mode..................................................... 45
PD, SYNC, and RESET Pins ..................................................... 15
External Zero Delay Mode .................................................... 45
Serial Port Setup Pins: SP1, SP0 ............................................... 15
Clock Distribution ..................................................................... 46
Operation Modes ................................................................... 46
LD, STATUS, and REFMON Pins ............................................ 15
Clock Frequency Division..................................................... 47
Power Dissipation ....................................................................... 16
VCO Divider ........................................................................... 47
Absolute Maximum Ratings .......................................................... 17
Thermal Resistance .................................................................... 17
Channel Dividers ................................................................... 47
ESD Caution ................................................................................ 17
Synchronizing the Outputs—SYNC Function ................... 49
Pin Configuration and Function Descriptions ........................... 18
LVDS Output Drivers ............................................................ 50
Typical Performance Characteristics ........................................... 21
CMOS Output Drivers .......................................................... 51
Test Circuits ..................................................................................... 26
Reset Modes ................................................................................ 51
Terminology .................................................................................... 27
Power-On Reset ...................................................................... 51
Detailed Block Diagram ................................................................ 28
Hardware Reset via the RESET Pin ..................................... 51
Theory of Operation ...................................................................... 29
Soft Reset via the Serial Port ................................................. 51
Operational Configurations ...................................................... 29
Soft Reset to Settings in EEPROM when EEPROM Pin = 0 via
the Serial Port ......................................................................... 51
Mode 0: Internal VCO and Clock Distribution ................. 29
Rev. A | Page 2 of 84
Data Sheet
AD9522-3
Power-Down Modes ...................................................................51
SPI MSB/LSB First Transfers ..................................................... 57
Chip Power-Down via PD .....................................................51
EEPROM Operations ..................................................................... 60
PLL Power-Down ....................................................................52
Writing to the EEPROM ............................................................ 60
Distribution Power-Down .....................................................52
Reading from the EEPROM ...................................................... 60
Individual Clock Output Power-Down................................52
Programming the EEPROM Buffer Segment.......................... 61
Individual Clock Channel Power-Down .............................52
Register Section Definition Group ....................................... 61
Serial Control Port ..........................................................................53
IO_UPDATE (Operational Code 0x80) .............................. 61
SPI/I²C Port Selection ................................................................53
End-of-Data (Operational Code 0xFF) ............................... 61
I²C Serial Port Operation ...........................................................53
Pseudo-End-of-Data (Operational Code 0xFE) ................. 61
I C Bus Characteristics ...........................................................53
Thermal Performance..................................................................... 63
Data Transfer Process .............................................................54
Register Map .................................................................................... 64
Data Transfer Format .............................................................55
Register Map Descriptions ............................................................. 68
I²C Serial Port Timing ............................................................55
Applications Information ............................................................... 82
SPI Serial Port Operation ...........................................................56
Frequency Planning Using the AD9522 .................................. 82
Pin Descriptions ......................................................................56
Using the AD9522 Outputs for ADC Clock Applications..... 82
SPI Mode Operation ...............................................................56
LVDS Clock Distribution ........................................................... 82
Communication Cycle—Instruction Plus Data ..................56
CMOS Clock Distribution ......................................................... 83
Write .........................................................................................56
Outline Dimensions ........................................................................ 84
Read ..........................................................................................56
Ordering Guide ........................................................................... 84
2
SPI Instruction Word (16 Bits) ..................................................57
Rev. A | Page 3 of 84
AD9522-3
Data Sheet
REVISION HISTORY
3/15—Rev. 0 to Rev. A
Changes to Features Section............................................................ 1
Changes to Table 1 and Table 2 ....................................................... 5
Change to Input Frequency Parameter, Table 3 ........................... 8
Changes to Table 4 ............................................................................ 8
Changes to SDIO, SDO (Outputs) Parameter, Test
Conditions/Comments Column, Table 13 .................................. 13
Changes to Table 17 ........................................................................ 15
Change to VCP Supply Parameter, Table 18 ............................... 16
Change to Junction Temperature Parameter, Table 19 .............. 17
Changes to Pin 4 Description Column, Table 21 and Pin 22
Description Column, Table 21 ...................................................... 18
Deleted Figure 13; Renumbered Sequentially............................. 21
Added Test Circuits Section .......................................................... 26
Moved Figure 33 and Figure 34 .................................................... 26
Changes to Figure 33 and Figure 34............................................. 26
Changes to Mode 0: Internal VCO and Clock Distribution
Section .............................................................................................. 29
Deleted Configuration and Register Settings Section ............... 29
Changes to Figure 36 ...................................................................... 30
Changes to Figure 37 ...................................................................... 32
Changes to Figure 38 ...................................................................... 34
Changes to Configuration of the PLL Section and Charge Pump
(CP) Section .................................................................................... 35
Changes to On-Chip VCO Section, Figure 40, and PLL
Reference Inputs Section ............................................................... 36
Added Figure 42 and Figure 43; Renumbered Sequentially ..... 36
Changes to Reference Switchover Section ................................... 37
Changes to Prescaler Section, A and B Counters Section, R and
N Divider Delays, and Table 29 .................................................... 38
Changes to Current Source Digital Lock Detect (CSDLD)
Section .............................................................................................. 39
Changes to External VCXO/VCO Clock Input (CLK/CLK)
Section and Holdover Section....................................................... 40
Changes to Frequency Status Monitors Section and VCO
Calibration Section ......................................................................... 42
Changes to Figure 49 Caption ...................................................... 43
Added Table 31; Renumbered Sequentially ................................ 44
Changes to Zero Delay Operation Section and Internal Zero
Delay Mode Section ....................................................................... 45
Changes to Clock Distribution Section ....................................... 46
Added Channel Divider Maximum Frequency Section............ 47
Changes to Channel Frequency Division (0, 1, 2, and 3)
Section .............................................................................................. 47
Changes to Duty Cycle and Duty-Cycle Correction Section and
Table 37 ............................................................................................ 48
Changes to Synchronizing the Outputs—SYNC Function
Section .............................................................................................. 49
Changes to Power-On Reset Section, Hardware Reset Value via
the RESET Pin Section, and Soft Reset via the Serial Port
Section .............................................................................................. 51
Changes to Pin Descriptions Section and SPI Mode Operation
Section .............................................................................................. 56
Changes to SPI Instruction Word (16 Bits) Section .................. 57
Changes to Figure 66, Figure 67 Caption, and Figure 68 .......... 58
Changes to EEPROM Operation Section .................................... 60
Changes to Table 49 ....................................................................... 64
Changes to Table 50 and Table 51 ................................................ 68
Changes to Table 53 ....................................................................... 69
Changes to Table 55 ....................................................................... 77
Changes to Table 58 ....................................................................... 81
Change to Frequency Planning Using the AD9522 Section ..... 82
Updated Outline Dimensions ....................................................... 84
10/08—Revision 0: Initial Version
Rev. A | Page 4 of 84
Data Sheet
AD9522-3
SPECIFICATIONS
Typical (typ) is given for VS = 3.3 V ± 5%; VS ≤ VCP ≤ 5.25 V; TA = 25°C; RSET = 4.12 kΩ; CPRSET = 5.1 kΩ, unless otherwise noted. Minimum
(min) and maximum (max) values are given over full VS and TA (−40°C to +85°C) variation.
POWER SUPPLY REQUIREMENTS
Table 1.
Parameter
VS
VCP
Min
3.135
VS
Typ
3.3
Max
3.465
5.25
Unit
V
V
RSET Pin Resistor
CPRSET Pin Resistor
4.12
5.1
kΩ
kΩ
BYPASS Pin Capacitor
220
nF
Test Conditions/Comments
3.3 V ± 5%
This supply is usually at the same voltage as VS; set VCP = 5.0 V ± 5% only if
connecting a 5 V external VCO/VCXO
Sets internal biasing currents; connect to ground
Sets internal CP current range, nominally 4.8 mA (CP_lsb = 600 µA);
actual current can be calculated by CP_lsb = 3.06/CPRSET; connect to ground
Bypass for internal LDO regulator; necessary for LDO stability; connect to ground
PLL CHARACTERISTICS
Table 2.
Parameter
VCO (ON-CHIP)
Frequency Range
VCO Gain (KVCO)
Tuning Voltage (VT)
Min
1720
0.5
Unit
Test Conditions/Comments
2250
MHz
MHz/V
V
See Figure 8
VCP ≤ VS when using internal VCO
MHz/V
dBc/Hz
dBc/Hz
dBc/Hz
LVDS output; fVCO = 1985 MHz; fOUT = 662MHz
LVDS output; fVCO = 1985 MHz; fOUT = 662MHz
LVDS output; fVCO = 1985 MHz; fOUT = 662MHz
VCP −
0.5
1
−62
−118
−135
0
Input Sensitivity
Self-Bias Voltage, REFIN
Self-Bias Voltage, REFIN
Input Resistance, REFIN
Input Resistance, REFIN
Dual Single-Ended Mode (REF1, REF2)
Input Frequency (AC-Coupled)
with DC Offset Off )
Input Frequency (AC-Coupled
with DC Offset On)
Input Frequency (DC-Coupled)
Input Sensitivity (AC-Coupled
with DC Offset Off )
Input Sensitivity (AC-Coupled
with DC Offset On)
Input Logic High, DC Offset Off
Input Logic Low, DC Offset Off
Input Current
Input Capacitance
Max
47
Frequency Pushing (Open-Loop)
Phase Noise at 1 kHz Offset
Phase Noise at 100 kHz Offset
Phase Noise at 1 MHz Offset
REFERENCE INPUTS
Differential Mode (REFIN, REFIN)
Input Frequency
Typ
250
280
1.35
1.30
4.0
4.4
1.60
1.50
4.8
5.3
MHz
mV p-p
Differential mode (can accommodate single-ended
input by ac grounding the unused complementary input)
Frequencies below about 1 MHz must be dc-coupled;
be careful to match VCM (self-bias voltage)
PLL figure of merit (FOM) increases with increasing
slew rate (see Figure 12); the input sensitivity is
sufficient for ac-coupled LVDS and LVPECL signals
Self-bias voltage of REFIN 1
Self-bias voltage of REFIN1
Self-biased1
Self-biased1
Two single-ended CMOS-compatible inputs
Slew rate must be > 50 V/µs
1.75
1.60
5.9
6.4
V
V
kΩ
kΩ
250
MHz
250
MHz
0
0.55
250
3.28
MHz
V p-p
Slew rate must be > 50 V/µs, and input amplitude
sensitivity specification must be met; see input sensitivity
Slew rate > 50 V/µs; CMOS levels
VIH must not exceed VS
1.5
2.78
V p-p
VIH must not exceed VS
0.8
+100
V
V
µA
pF
Each pin, REFIN (REF1)/REFIN (REF2)
10
2.0
−100
2
Rev. A | Page 5 of 84
AD9522-3
Parameter
Pulse Width High/Low
Data Sheet
Max
Unit
ns
33.33
30
MHz
Ω
100
45
50
1.3
2.9
6.0
MHz
MHz
MHz
ns
ns
ns
CHARGE PUMP (CP)
ICP Sink/Source
High Value
4.8
mA
Low Value
0.60
mA
Crystal Oscillator
Crystal Resonator Frequency Range
Maximum Crystal Motional Resistance
PHASE/FREQUENCY DETECTOR (PFD)
PFD Input Frequency
Reference Input Clock Doubler Frequency
Antibacklash Pulse Width
Absolute Accuracy
CPRSET Range
ICP High Impedance Mode Leakage
Sink-and-Source Current Matching
ICP vs. VCP
ICP vs. Temperature
PRESCALER (PART OF N DIVIDER)
Prescaler Input Frequency
P = 1 FD
P = 2 FD
P = 3 FD
P = 2 DM (2/3)
P = 4 DM (4/5)
P = 8 DM (8/9)
P = 16 DM (16/17)
P = 32 DM (32/33)
Prescaler Output Frequency
PLL N DIVIDER DELAY
000
001
010
011
100
101
110
111
Min
1.8
Typ
16.62
0.004
2.5
1
1
%
kΩ
nA
%
1.5
2
%
%
2.7
10
300
600
900
200
1000
2400
3000
3000
300
Off
385
504
623
743
866
989
1112
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
ps
ps
ps
ps
ps
ps
ps
Rev. A | Page 6 of 84
Test Conditions/Comments
Amount of time a square wave is high/low
determines the allowable input duty cycle
Antibacklash pulse width = 1.3 ns, 2.9 ns
Antibacklash pulse width = 6.0 ns
Antibacklash pulse width = 1.3 ns, 2.9 ns
Register 0x017[1:0] = 01b
Register 0x017[1:0] = 00b; Register 0x017[1:0] = 11b
Register 0x017[1:0] = 10b
Programmable
With CPRSET = 5.1 kΩ; higher ICP is possible by changing
CPRSET
With CPRSET = 5.1 kΩ; lower ICP is possible by changing
CPRSET
Charge pump voltage set to VCP/2
0.5 V < VCP < VCP − 0.5 V; VCP is the voltage on the CP (charge
pump) pin; VCP is the voltage on the VCP power supply pin
0.5 V < VCP < VCP − 0.5 V
VCP = VCP/2 V
A, B counter input frequency (prescaler input frequency
divided by P)
Register 0x019[2:0]; see Table 53
Data Sheet
Parameter
PLL R DIVIDER DELAY
000
001
010
011
100
101
110
111
PHASE OFFSET IN ZERO DELAY
Phase Offset (REF-to-LVDS Clock Output
Pins) in Internal Zero Delay Mode
Phase Offset (REF-to-LVDS Clock Output
Pins) in Internal Zero Delay Mode
Phase Offset (REF-to-CLK Input Pins) in
External Zero Delay Mode
Phase Offset (REF-to-CLK Input Pins) in
External Zero Delay Mode
NOISE CHARACTERISTICS
In-Band Phase Noise of the Charge Pump/
Phase Frequency Detector (In-Band
Means Within the LBW of the PLL)
At 500 kHz PFD Frequency
At 1 MHz PFD Frequency
At 10 MHz PFD Frequency
At 50 MHz PFD Frequency
PLL Figure of Merit (FOM)
AD9522-3
Min
Typ
Max
Off
365
486
608
730
852
976
1101
Unit
ps
ps
ps
ps
ps
ps
ps
1890
2348
3026
ps
REF refers to REFIN (REF1)/REFIN (REF2)
When N delay and R delay are bypassed
900
1217
1695
ps
When N delay = Setting 111 and R delay is bypassed
318
677
1085
ps
When N delay and R delay are bypassed
−329
+33
+360
ps
When N delay = Setting 011 and R delay is bypassed
The PLL in-band phase noise floor is estimated by
measuring the in-band phase noise at the output of
the VCO and subtracting 20 log(N) (where N is the value
of the N divider)
−165
−162
−152
−144
−222
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Low Range (ABP 1.3 ns, 2.9 ns)
High Range (ABP 1.3 ns, 2.9 ns)
High Range (ABP 6.0 ns)
Unlock Threshold (Hysteresis)2
3.5
7.5
3.5
ns
ns
ns
Low Range (ABP 1.3 ns, 2.9 ns)
High Range (ABP 1.3 ns, 2.9 ns)
High Range (ABP 6.0 ns)
7
15
11
ns
ns
ns
PLL DIGITAL LOCK DETECT WINDOW 2
Lock Threshold (Coincidence of Edges)
1
2
Test Conditions/Comments
Register 0x019[5:3]; see Table 53
Reference slew rate > 0.5 V/ns; FOM + 10 log(fPFD) is an
approximation of the PFD/CP in-band phase noise (in
the flat region) inside the PLL loop bandwidth; when
running closed-loop, the phase noise, as observed at
the VCO output, is increased by 20 log(N); PLL figure of
merit decreases with decreasing slew rate; see Figure 12
Signal available at the LD, STATUS, and REFMON pins
when selected by appropriate register settings; lock
detect window settings can be varied by changing the
CPRSET resistor
Selected by Register 0x017[1:0] and Register 0x018[4]
(this is the threshold to go from unlock to lock)
Register 0x017[1:0] = 00b, 01b, 11b; Register 0x018[4] = 1b
Register 0x017[1:0] = 00b, 01b, 11b; Register 0x018[4] = 0b
Register 0x017[1:0] = 10b; Register 0x018[4] = 0b
Selected by Register 0x017[1:0] and Register 0x018[4]
(this is the threshold to go from lock to unlock)
Register 0x017[1:0] = 00b, 01b, 11b; Register 0x018[4] = 1b
Register 0x017[1:0] = 00b, 01b, 11b; Register 0x018[4] = 0b
Register 0x017[1:0] = 10b; Register 0x018[4] = 0b
The REFIN and REFIN self-bias points are offset slightly to avoid chatter on an open input condition.
For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
Rev. A | Page 7 of 84
AD9522-3
Data Sheet
CLOCK INPUTS
Table 3.
Parameter
CLOCK INPUTS (CLK, CLK)
Input Frequency
Min
Typ
01
01
Input Sensitivity, Differential
1
Unit
2.4
2
GHz
GHz
150
Input Level, Differential
Input Common-Mode Voltage, VCM
Input Common-Mode Range, VCMR
Input Sensitivity, Single-Ended
Input Resistance
Input Capacitance
Max
1.3
1.3
3.9
1.57
150
4.7
2
mV p-p
2
V p-p
1.8
1.8
V
V
mV p-p
kΩ
pF
5.7
Test Conditions/Comments
Differential input
High frequency distribution (VCO divider)
Distribution only (VCO divider bypassed); this is the
frequency range supported by the channel divider, see the
Channel Divider Maximum Frequency section
Measured at 2.4 GHz; jitter performance is improved with
slew rates > 1 V/ns
Larger voltage swings can turn on the protection diodes
and can degrade jitter performance
Self-biased; enables ac coupling
With 200 mV p-p signal applied; dc-coupled
CLK ac-coupled; CLK ac-bypassed to RF ground
Self-biased
Below about 1 MHz, the input must be dc-coupled. Take care to match VCM.
CLOCK OUTPUTS
Table 4.
Parameter
LVDS CLOCK OUTPUTS
OUT0, OUT1, OUT2, OUT3, OUT4, OUT5,
OUT6, OUT7, OUT8, OUT9, OUT10, OUT11
Output Frequency
Output Differential Voltage, VOD
Min
247
Typ
Max
Unit
Test Conditions/Comments
Termination = 100 Ω across differential pair
Differential (OUT, OUT)
800
MHz
454
mV
25
mV
1.25
1.375
25
V
mV
14
<1
24
mA
nA
The AD9522 outputs toggle at higher frequencies,
but the output amplitude may not meet the VOD
specification
VOH − VOL for each leg of a differential pair for default
amplitude setting with the driver not toggling; the
peak-to-peak amplitude measured using a
differential probe across the differential pair with
the driver toggling is roughly 2× these values (see
Figure 20)
Absolute difference between voltage swing of
normal pin and inverted pin, output driver static
(VOH + VOL)/2 across a differential pair
This is the absolute value of the difference between
VOS when the normal output is high vs. when the
complementary output is high
Output shorted to GND
Output in tristate with 100 Ω across differential pair
360
Delta VOD
Output Offset Voltage, VOS
Delta VOS
Short-Circuit Current, ISA, ISB
Tristate Leakage Current per Output
CMOS CLOCK OUTPUTS
OUT0A, OUT0B, OUT1A, OUT1B, OUT2A,
OUT2B, OUT3A, OUT3B, OUT4A, OUT4B,
OUT5A, OUT5B, OUT6A, OUT6B, OUT7A,
OUT7B, OUT8A, OUT8B, OUT9A, OUT9B,
OUT10A, OUT10B, OUT11A, OUT11B
Output Frequency
Output Voltage High, VOH
Output Voltage Low, VOL
Output Voltage High, VOH
Output Voltage Low, VOL
1.125
Single-ended; termination = 10 pF
250
VS − 0.1
0.1
2.7
0.5
Rev. A | Page 8 of 84
MHz
V
V
V
V
See Figure 21
At 1 mA load
At 1 mA load
At 10 mA load
At 10 mA load
Data Sheet
AD9522-3
TIMING CHARACTERISTICS
Table 5.
Parameter
LVDS OUTPUT RISE/FALL TIMES
Output Rise Time, tRP
Output Fall Time, tFP
PROPAGATION DELAY, tLVDS, CLK-TO-LVDS OUTPUT
For All Divide Values
Variation with Temperature
OUTPUT SKEW, LVDS OUTPUTS1
LVDS Outputs That Share the Same Divider
LVDS Outputs on Different Dividers
All LVDS Outputs Across Multiple Parts
CMOS OUTPUT RISE/FALL TIMES
Output Rise Time, tRC
Output Fall Time, tFC
PROPAGATION DELAY, tCMOS, CLK-TO-CMOS OUTPUT
For All Divide Values
Variation with Temperature
OUTPUT SKEW, CMOS OUTPUTS1
CMOS Outputs That Share the Same Divider
All CMOS Outputs on Different Dividers
All CMOS Outputs Across Multiple Parts
OUTPUT SKEW, LVDS-TO-CMOS OUTPUT1
Outputs That Share the Same Divider
Outputs That Are on Different Dividers
1
Min
1866
1808
Typ
Max
Unit
Test Conditions/Comments
Termination = 100 Ω across differential pair
20% to 80%, measured differentially
80% to 20%, measured differentially
150
150
350
350
ps
ps
2313
2245
1
2812
2740
ps
ps
ps/°C
7
19
60
162
432
ps
ps
ps
625
625
835
800
ps
ps
2400
2
2950
ps
ps/°C
10
27
55
230
500
ps
ps
ps
+152
+160
+495
+495
ps
ps
High frequency clock distribution configuration
Clock distribution configuration
Termination = 100 Ω across differential pair
1913
−31
−193
Termination = open
20% to 80%; CLOAD = 10 pF
80% to 20%; CLOAD = 10 pF
Clock distribution configuration
All settings identical; different logic type
LVDS to CMOS on the same part
LVDS to CMOS on the same part
The output skew is the difference between any two similar delay paths while operating at the same voltage and temperature.
Timing Diagrams
tCLK
CLK
SINGLE-ENDED
tLVDS
80%
CMOS
10pF LOAD
tCMOS
tRC
Figure 4. CMOS Timing, Single-Ended, 10 pF Load
Figure 2. CLK/CLK to Clock Output Timing, DIV = 1
DIFFERENTIAL
80%
LVDS
tFP
07224-061
20%
tRP
tFC
Figure 3. LVDS Timing, Differential
Rev. A | Page 9 of 84
07224-063
07224-060
20%
AD9522-3
Data Sheet
CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)
Table 6.
Parameter
CLK-TO-LVDS ADDITIVE PHASE NOISE
CLK = 1.6 GHz, Output = 800 MHz
Divider = 2
At 10 Hz Offset
At 100 Hz Offset
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
At 10 MHz Offset
At 100 MHz Offset
CLK = 1 GHz, Output = 200 MHz
Divider = 5
At 10 Hz Offset
At 100 Hz Offset
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
>10 MHz Offset
CLK-TO-CMOS ADDITIVE PHASE NOISE
CLK = 1 GHz, Output = 500 MHz
Divider = 2
At 10 Hz Offset
At 100 Hz Offset
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
>10 MHz Offset
CLK = 1 GHz, Output = 50 MHz
Divider = 20
At 10 Hz Offset
At 100 Hz Offset
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
>10 MHz Offset
Min
Typ
−100
−110
−117
−126
−134
−137
−147
−148
Max
Unit
Test Conditions/Comments
Distribution section only; does not include PLL and VCO
Input slew rate > 1 V/ns
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Input slew rate > 1 V/ns
−111
−123
−132
−141
−146
−150
−156
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Distribution section only; does not include PLL and VCO
Input slew rate > 1 V/ns
−102
−114
−122
−129
−135
−140
−150
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Input slew rate > 1 V/ns
−125
−136
−144
−152
−157
−160
−164
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Rev. A | Page 10 of 84
Data Sheet
AD9522-3
CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)
Table 7.
Parameter
LVDS ABSOLUTE PHASE NOISE
VCO = 2250 MHz; Output = 750 MHz
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
At 10 MHz Offset
At 40 MHz Offset
VCO = 1985 MHz; Output = 662 MHz
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
At 10 MHz Offset
At 40 MHz Offset
VCO = 1720 MHz; Output = 573 MHz
At 1 kHz Offset
At 10 kHz Offset
At 100 kHz Offset
At 1 MHz Offset
At 10 MHz Offset
At 40 MHz Offset
Min
Typ
Max
Unit
−58
−90
−116
−133
−147
−150
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−62
−94
−118
−135
−148
−151
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−70
−99
−123
−138
−149
−151
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Test Conditions/Comments
Internal VCO; VCO divider = 3; LVDS output and for
loop bandwidths < 1 kHz
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)
Table 8.
Parameter
LVDS OUTPUT ABSOLUTE TIME JITTER
Min
VCO = 1966 MHz; LVDS = 245.76 MHz; PLL LBW = 55 kHz
Typ
Max
141
312
136
285
187
340
VCO = 1720 MHz; LVDS = 122.88 MHz; PLL LBW = 55 kHz
VCO = 1720 MHz; LVDS = 61.44 MHz; PLL LBW = 55 kHz
Unit
fs rms
fs rms
fs rms
fs rms
fs rms
fs rms
Test Conditions/Comments
Application example based on a typical
setup where the reference source is clean,
so a wider PLL loop bandwidth is used;
reference = 15.36 MHz; R DIV = 1
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)
Table 9.
Parameter
LVDS OUTPUT ABSOLUTE TIME JITTER
VCO = 1866 MHz; LVDS = 155.52 MHz; PLL LBW = 1.8 kHz
VCO = 1720 MHz; LVDS = 122.88 MHz; PLL LBW = 1.8 kHz
Min
Typ
Max
440
362
Rev. A | Page 11 of 84
Unit
fs rms
fs rms
Test Conditions/Comments
Application example based on a typical
setup where the reference source is jittery,
so a narrower PLL loop bandwidth is used;
reference = 19.44 MHz; R DIV = 162
Integration bandwidth = 12 kHz to 20 MHz
Integration bandwidth = 12 kHz to 20 MHz
AD9522-3
Data Sheet
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)
Table 10.
Parameter
LVDS OUTPUT ABSOLUTE TIME JITTER
Min
Typ
LVDS = 245.76 MHz; PLL LBW = 125 Hz
Max
87
108
146
120
151
207
157
210
295
LVDS = 122.88 MHz; PLL LBW = 125 Hz
LVDS = 61.44 MHz; PLL LBW = 125 Hz
Unit
Test Conditions/Comments
Application example based on a typical setup using an
external 245.76 MHz VCXO (Toyocom TCO-2112);
reference = 15.36 MHz; R DIV = 1
Integration bandwidth = 200 kHz to 5 MHz
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
Integration bandwidth = 200 kHz to 5 MHz
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
Integration bandwidth = 200 kHz to 5 MHz
Integration bandwidth = 200 kHz to 10 MHz
Integration bandwidth = 12 kHz to 20 MHz
fs rms
fs rms
fs rms
fs rms
fs rms
fs rms
fs rms
fs rms
fs rms
CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)
Table 11.
Parameter
LVDS OUTPUT ADDITIVE TIME JITTER
CLK = 622.08 MHz
Any LVDS Output = 622.08 MHz
Divide Ratio = 1
CLK = 622.08 MHz
Any LVDS Output = 155.52 MHz
Divide Ratio = 4
CLK = 100 MHz
Any LVDS Output = 100 MHz
Divide Ratio = 1
CLK = 500 MHz
Any LVDS Output = 100 MHz
Divide Ratio = 5
CMOS OUTPUT ADDITIVE TIME JITTER
CLK = 200 MHz
Any CMOS Output Pair = 100 MHz
Divide Ratio = 2
Min
Typ
Max
Unit
69
fs rms
Test Conditions/Comments
Distribution section only; does not include PLL and
VCO; measured at rising edge of clock signal
Integration bandwidth = 12 kHz to 20 MHz
116
fs rms
Integration bandwidth = 12 kHz to 20 MHz
263
fs rms
Calculated from SNR of ADC method
Broadband jitter
242
fs rms
Calculated from SNR of ADC method
Broadband jitter
289
fs rms
Distribution section only; does not include PLL and VCO
Calculated from SNR of ADC method
Broadband jitter
Rev. A | Page 12 of 84
Data Sheet
AD9522-3
CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)
Table 12.
Parameter
LVDS OUTPUT ADDITIVE TIME JITTER
Min
Typ
Max
Unit
CLK = 500 MHz; VCO DIV = 5; LVDS = 100 MHz;
Bypass Channel Divider; Duty-Cycle Correction = On
CMOS OUTPUT ADDITIVE TIME JITTER
248
fs rms
CLK = 200 MHz; VCO DIV = 2; CMOS = 100 MHz;
Bypass Channel Divider; Duty-Cycle Correction = Off
CLK = 200 MHz; VCO DIV = 1; CMOS = 100 MHz;
Bypass Channel Divider; Duty-Cycle Correction = Off
290
fs rms
288
fs rms
Test Conditions/Comments
Distribution section only; does not include
PLL and VCO; uses rising edge of clock signal
Calculated from SNR of ADC method
(broadband jitter)
Distribution section only; does not include
PLL and VCO; uses rising edge of clock signal
Calculated from SNR of ADC method
(broadband jitter)
Calculated from SNR of ADC method
(broadband jitter)
SERIAL CONTROL PORT—SPI MODE
Table 13.
Parameter
CS (INPUT)
Input Logic 1 Voltage
Input Logic 0 Voltage
Input Logic 1 Current
Input Logic 0 Current
Min
Max
Unit
0.8
3
−110
V
V
µA
µA
2
pF
2.0
Input Capacitance
SCLK (INPUT) IN SPI MODE
Input Logic 1 Voltage
Input Logic 0 Voltage
Input Logic 1 Current
Input Logic 0 Current
Input Capacitance
SDIO (WHEN AN INPUT IN BIDIRECTIONAL MODE)
Input Logic 1 Voltage
Input Logic 0 Voltage
Input Logic 1 Current
Input Logic 0 Current
Input Capacitance
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage
Output Logic 0 Voltage
TIMING
Clock Rate (SCLK, 1/tSCLK)
Pulse Width High, tHIGH
Pulse Width Low, tLOW
SDIO to SCLK Setup, tDS
SCLK to SDIO Hold, tDH
SCLK to Valid SDIO and SDO, tDV
CS to SCLK Setup and Hold, tS, tC
CS Minimum Pulse Width High, tPWH
Typ
Test Conditions/Comments
CS has an internal 30 kΩ pull-up resistor
The minus sign indicates that current is flowing out of
the AD9522, which is due to the internal pull-up resistor
SCLK has an internal 30 kΩ pull-down resistor in SPI
mode, but not in I2C mode
2.0
0.8
110
1
2
2.0
0.8
1
1
2
2.7
0.4
25
16
16
4
0
11
2
3
V
V
µA
µA
pF
V
V
µA
µA
pF
V
V
MHz
ns
ns
ns
ns
ns
ns
ns
Rev. A | Page 13 of 84
At 1 mA current; maximum recommended current: 5 mA
At 1 mA current
AD9522-3
Data Sheet
SERIAL CONTROL PORT—I²C MODE
Table 14.
Parameter
SDA, SCL (WHEN INPUTTING DATA)
Input Logic 1 Voltage
Input Logic 0 Voltage
Input Current with an Input Voltage Between
0.1 × VS and 0.9 × VS
Hysteresis of Schmitt Trigger Inputs
Pulse Width of Spikes That Must Be Suppressed by
the Input Filter, tSPIKE
SDA (WHEN OUTPUTTING DATA)
Output Logic 0 Voltage at 3 mA Sink Current
Output Fall Time from VIHMIN to VILMAX with a Bus
Capacitance from 10 pF to 400 pF
TIMING
Min
Typ
Unit
0.3 × VS
+10
V
V
µA
50
V
ns
0.4
250
V
ns
0.7 × VS
−10
0.015 × VS
20 + 0.1 Cb
Test Conditions/Comments
Cb = capacitance of one bus line in pF
Note that all I2C timing values refer
to VIHMIN (0.3 × VS) and VILMAX levels
(0.7 × VS)
Clock Rate (SCL, fI2C)
Bus Free Time Between a Stop and Start Condition, tIDLE
Setup Time for a Repeated Start Condition, tSET; STR
Hold Time (Repeated) Start Condition (After This Period,
the First Clock Pulse Is Generated), tHLD; STR
Setup Time for Stop Condition, tSET; STP
Low Period of the SCL Clock, tLOW
High Period of the SCL Clock, tHIGH
SCL, SDA Rise Time, tRISE
SCL, SDA Fall Time, tFALL
Data Setup Time, tSET; DAT
1.3
0.6
0.6
400
kHz
µs
µs
µs
0.6
1.3
0.6
20 + 0.1 Cb
20 + 0.1 Cb
120
µs
µs
µs
ns
ns
ns
Data Hold Time, tHLD; DAT
140
Capacitive Load for Each Bus Line, Cb
1
Max
300
300
880
ns
400
pF
Cb = capacitance of one bus line in pF
Cb = capacitance of one bus line in pF
This is a minor deviation from the
original I²C specification of 100 ns
minimum
This is a minor deviation from the
original I²C specification of 0 ns
minimum 1
According to the original I2C specification, an I2C master must also provide a minimum hold time of 300 ns for the SDA signal to bridge the undefined region of the SCL
falling edge.
Rev. A | Page 14 of 84
Data Sheet
AD9522-3
PD, SYNC, AND RESET PINS
Table 15.
Parameter
INPUT CHARACTERISTICS
Logic 1 Voltage
Logic 0 Voltage
Logic 1 Current
Logic 0 Current
Min
Typ
Max
Unit
0.8
1
−110
V
V
µA
µA
2
pF
2.0
Capacitance
RESET TIMING
Pulse Width Low
RESET Inactive to Start of Register Programming
50
100
ns
ns
SYNC TIMING
Pulse Width Low
1.3
ns
Test Conditions/Comments
Each of these pins has an 30 kΩ internal pull-up resistor
The minus sign indicates that current is flowing out of
the AD9522, which is due to the internal pull-up resistor
High speed clock is CLK input signal
SERIAL PORT SETUP PINS: SP1, SP0
Table 16.
Parameter
SP1, SP0
Logic Level 0
Logic Level ½
Logic Level 1
Min
0.4 × VS
Typ
Max
Unit
0.25 × VS
0.65 × VS
V
V
0.8 × VS
Test Conditions/Comments
These pins do not have internal pull-up/pull-down resistors
VS is the voltage on the VS pin
User can float these pins to obtain Logic Level ½; if floating this pin, connect a
capacitor to ground
V
LD, STATUS, AND REFMON PINS
Table 17.
Parameter
OUTPUT CHARACTERISTICS
Min
Output Voltage High, VOH
Output Voltage Low, VOL
MAXIMUM TOGGLE RATE
2.7
Max
Unit
0.4
100
V
V
MHz
3
pF
On-chip capacitance; used to calculate RC time constant
for analog lock detect read back; use a pull-up resistor
1.02
MHz
8
kHz
Frequency above which the monitor indicates the
presence of the reference
Frequency above which the monitor indicates the
presence of the reference
ANALOG LOCK DETECT
Capacitance
REF1, REF2, AND VCO FREQUENCY STATUS MONITOR
Normal Range
Extended Range
LD PIN COMPARATOR
Trip Point
Hysteresis
Typ
1.6
260
V
mV
Rev. A | Page 15 of 84
Test Conditions/Comments
When selected as a digital output (CMOS); there are other
modes in which these pins are not CMOS digital outputs;
see Table 53, Register 0x017, Register 0x01A, and
Register 0x01B
At 1 mA current; maximum recommended current: 5 mA
At 1 mA current.
Applies when mux is set to any divider or counter output,
or PFD up/down pulse; also applies in analog lock detect
mode; usually debug mode only; note that spurs can
couple to output when any of these pins are toggling
AD9522-3
Data Sheet
POWER DISSIPATION
Table 18.
Parameter
POWER DISSIPATION, CHIP
Typ
Max
Unit
Power-On Default
PLL Locked; One LVDS Output Enabled
0.88
0.54
1.0
0.63
W
W
PLL Locked; One CMOS Output Enabled
0.55
0.66
W
Distribution Only Mode; VCO Divider On;
One LVDS Output Enabled
Distribution Only Mode; VCO Divider Off;
One LVDS Output Enabled
Maximum Power, Full Operation
0.36
0.43
W
0.33
0.4
W
1.1
1.3
W
PD Power-Down
35
50
mW
PD Power-Down, Maximum Sleep
27
43
mW
2.3
8
mW
33
25
43
31
mW
mW
REF1, REF2 (Single-Ended) On/Off
16
22
mW
VCO On/Off
PLL Dividers and Phase Detector On/Off
LVDS Channel
LVDS Driver
CMOS Channel
60
54
118
11
120
95
67
146
15
154
mW
mW
mW
mW
mW
CMOS Driver On/Off
Channel Divider Enabled
16
33
30
40
mW
mW
Zero Delay Block On/Off
30
35
mW
VCP Supply
POWER DELTAS, INDIVIDUAL FUNCTIONS
VCO Divider On/Off
REFIN (Differential) Off
Min
Test Conditions/Comments
Does not include power dissipated in external resistors; all LVDS
outputs terminated with 100 Ω across differential pair; all CMOS
outputs have 10 pF capacitive loading
No clock; no programming; default register values
fREF = 25 MHz; fOUT = 250 MHz; VCO = 2000 MHz; VCO divider = 2;
one LVDS output and output divider enabled; zero delay off;
ICP = 4.8 mA
fREF = 25 MHz; fOUT = 62.5 MHz; VCO = 2000 MHz; VCO divider = 2;
one CMOS output and output divider enabled; zero delay off;
ICP = 4.8 mA
fCLK = 2.4 GHz; fOUT = 200 MHz; VCO divider = 2; one LVDS output
and output divider enabled; zero delay off
fCLK = 2.4 GHz; fOUT = 200 MHz; VCO divider bypassed; one LVDS
output and output divider enabled; zero delay off
PLL on; internal VCO = 2000 MHz; VCO divider = 2; all channel
dividers on; 12 LVDS outputs @ 125 MHz; zero delay on
PD pin pulled low; does not include power dissipated in
termination resistors
PD pin pulled low; PLL power-down, Register 0x010[1:0] = 01b;
power-down SYNC, Register 0x230[2] = 1b; power-down
distribution reference, Register 0x230[1] = 1b
PLL operating; typical closed-loop configuration
Power delta when a function is enabled/disabled
VCO divider not used
Delta between reference input off and differential reference
input mode
Delta between reference inputs off and one single-ended
reference enabled; double this number if both REF1 and REF2
are powered up
Internal VCO disabled; CLK input selected
PLL off to PLL on, normal operation; no reference enabled
No LVDS output on to one LVDS output on; channel divider set to 1
Second LVDS output turned on, same channel
No CMOS output on to one CMOS output on; channel divider
set to 1; fOUT = 62.5 MHz and 10 pF of capacitive loading
Additional CMOS outputs within the same channel turned on
Delta between divider bypassed (divide-by-1) and divide-by-2 to
divide-by-32
Rev. A | Page 16 of 84
Data Sheet
AD9522-3
ABSOLUTE MAXIMUM RATINGS
Table 19.
Parameter or Pin
VS
VCP, CP
REFIN, REFIN
RSET, LF, BYPASS
CPRSET
CLK, CLK
CLK
SCLK/SCL, SDIO/SDA, SDO, CS
OUT0, OUT0, OUT1, OUT1,
OUT2, OUT2, OUT3, OUT3,
OUT4, OUT4, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7,
OUT8, OUT8, OUT9, OUT9,
OUT10, OUT10, OUT11, OUT11
SYNC, RESET, PD
REFMON, STATUS, LD
SP0, SP1, EEPROM
Junction Temperature 1
Storage Temperature Range
Lead Temperature (10 sec)
1
With
Respect to
GND
GND
GND
GND
GND
GND
CLK
GND
GND
Rating
−0.3 V to +3.6 V
−0.3 V to +5.8 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−1.2 V to +1.2 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal impedance measurements were taken on a JEDEC
JESD51-5 2S2P test board in still air in accordance with JEDEC
JESD51-2. See the Thermal Performance section for more details.
Table 20.
Package Type
64-Lead LFCSP (CP-64-4)
GND
GND
GND
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
125°C
−65°C to +150°C
300°C
ESD CAUTION
See the Specifications section for operating temperature range (TA).
Rev. A | Page 17 of 84
θJA
22
Unit
°C/W
AD9522-3
Data Sheet
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
REFIN (REF1)
REFIN (REF2)
CPRSET
VS
VS
GND
RSET
VS
OUT0 (OUT0A)
OUT0 (OUT0B)
VS
OUT1 (OUT1A)
OUT1 (OUT1B)
OUT2 (OUT2A)
OUT2 (OUT2B)
VS
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
INDICATOR
AD9522
TOP VIEW
(Not to Scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
OUT3 (OUT3A)
OUT3 (OUT3B)
VS
OUT4 (OUT4A)
OUT4 (OUT4B)
OUT5 (OUT5A)
OUT5 (OUT5B)
VS
VS
OUT8 (OUT8B)
OUT8 (OUT8A)
OUT7 (OUT7B)
OUT7 (OUT7A)
VS
OUT6 (OUT6B)
OUT6 (OUT6A)
NOTES
1. EXPOSED DIE PAD MUST BE CONNECTED TO GND.
07224-003
SDIO/SDA
SDO
GND
SP1
SP0
EEPROM
RESET
PD
OUT9 (OUT9A)
OUT9 (OUT9B)
VS
OUT10 (OUT10A)
OUT10 (OUT10B)
OUT11 (OUT11A)
OUT11 (OUT11B)
VS
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VS
REFMON
LD
VCP
CP
STATUS
REF_SEL
SYNC
LF
BYPASS
VS
VS
CLK
CLK
CS
SCLK/SCL
Figure 5. Pin Configuration
Table 21. Pin Function Descriptions
Input/
Output
I
Pin
Type
Power
Mnemonic
VS
Description
3.3 V Power Pins.
O
O
I
3.3 V CMOS
3.3 V CMOS
Power
REFMON
LD
VCP
5
O
Loop filter
CP
6
7
O
I
3.3 V CMOS
3.3 V CMOS
STATUS
REF_SEL
8
I
3.3 V CMOS
SYNC
9
10
I
O
Loop filter
Loop filter
LF
BYPASS
13
I
CLK
14
I
Differential
clock input
Differential
clock input
Reference Monitor (Output). This pin has multiple selectable outputs.
Lock Detect (Output). This pin has multiple selectable outputs.
Power Supply for Charge Pump (CP); VS ≤ VCP ≤ 5.25 V. VCP must still be connected
to 3.3 V if the PLL is not used.
Charge Pump (Output). This pin connects to an external loop filter. This pin can
be left unconnected if the PLL is not used.
Programmable Status Output.
Reference Select. It selects REF1 (low) or REF2 (high). This pin has an internal
30 kΩ pull-down resistor.
Manual Synchronizations and Manual Holdover. This pin initiates a manual
synchronization and is used for manual holdover. Active low. This pin has an
internal 30 kΩ pull-up resistor.
Loop Filter (Input). It connects internally to the VCO control voltage node.
This pin is for bypassing the LDO to ground with a 220 nF capacitor.
This pin can be left unconnected if the PLL is not used.
Along with CLK, this pin is the differential input for the clock distribution section.
Pin No.
1, 11, 12, 27,
32, 35, 40,
41, 46, 49,
54, 57, 60, 61
2
3
4
CLK
Along with CLK, this pin is the differential input for the clock distribution section. If a
single-ended input is connected to the CLK pin, connect a 0.1 µF bypass capacitor
from this pin to ground.
Rev. A | Page 18 of 84
Data Sheet
AD9522-3
Pin No.
15
Input/
Output
I
Pin
Type
3.3 V CMOS
Mnemonic
CS
16
I
3.3 V CMOS
SCLK/SCL
17
18
19, 59
20
I/O
O
I
I
SDIO/SDA
SDO
GND
SP1
21
I
22
I
3.3 V CMOS
3.3 V CMOS
GND
Three-level
logic
Three-level
logic
3.3 V CMOS
23
24
25
I
I
O
RESET
PD
OUT9 (OUT9A)
26
O
28
O
29
O
30
O
31
O
33
O
34
O
36
O
37
O
38
O
39
O
42
O
43
O
44
O
45
O
3.3 V CMOS
3.3 V CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
SP0
EEPROM
OUT9 (OUT9B)
OUT10 (OUT10A)
OUT10 (OUT10B)
OUT11 (OUT11A)
OUT11 (OUT11B)
OUT6 (OUT6A)
OUT6 (OUT6B)
OUT7 (OUT7A)
OUT7 (OUT7B)
OUT8 (OUT8A)
OUT8 (OUT8B)
OUT5 (OUT5B)
OUT5 (OUT5A)
OUT4 (OUT4B)
OUT4 (OUT4A)
Description
Serial Control Port Chip Select; Active Low. This pin has an internal 30 kΩ
pull-up resistor.
Serial Control Port Clock Signal. This pin has an internal 30 kΩ pull-down resistor
in SPI mode but is high impedance in I²C mode.
Serial Control Port Bidirectional Serial Data In/Out.
Serial Control Port Unidirectional Serial Data Out.
Ground Pins.
Select SPI or I²C as the serial interface port and select the I²C slave address in I²C
mode. Three-level logic. This pin is internally biased for the open logic level.
Select SPI or I²C as the serial interface port and select the I²C slave address in I²C
mode. Three-level logic. This pin is internally biased for the open logic level.
Setting this pin high selects the register values stored in the internal EEPROM to
be loaded at reset and/or power-up. Setting this pin low causes the AD9522 to
load the hard-coded default register values at power-up/reset. This pin has an
internal 30 kΩ pull-down resistor. Note that to guarantee the proper loading of
EEPROM during startup, a high-low-high pulse on the RESET pin occurs after the
power supply stabilizes.
Chip Reset, Active Low. This pin has an internal 30 kΩ pull-up resistor.
Chip Power-Down, Active Low. This pin has an internal 30 kΩ pull-up resistor.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Rev. A | Page 19 of 84
AD9522-3
Pin No.
47
Input/
Output
O
48
O
50
O
51
O
52
O
53
O
55
O
56
O
58
O
62
O
63
I
64
I
EPAD
Data Sheet
Pin
Type
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
LVDS or
CMOS
Current set
resistor
Current set
resistor
Reference
input
Reference
input
GND
Mnemonic
OUT3 (OUT3B)
OUT3 (OUT3A)
OUT2 (OUT2B)
OUT2 (OUT2A)
OUT1 (OUT1B)
OUT1 (OUT1A)
OUT0 (OUT0B)
OUT0 (OUT0A)
RSET
CPRSET
REFIN (REF2)
REFIN (REF1)
GND
Description
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Output. This pin can be configured as one side of a differential LVDS output
or as a single-ended CMOS output.
Clock Distribution Current Set Resistor. Connect a 4.12 kΩ resistor from this pin
to GND.
Charge Pump Current Set Resistor. Connect a 5.1 kΩ resistor from this pin to GND.
This resistor can be omitted if the PLL is not used.
Along with REFIN, this is the differential input for the PLL reference. Alternatively,
this pin is a single-ended input for REF2.
Along with REFIN, this is the differential input for the PLL reference. Alternatively,
this pin is a single-ended input for REF1.
The exposed die pad must be connected to GND.
Rev. A | Page 20 of 84
Data Sheet
AD9522-3
TYPICAL PERFORMANCE CHARACTERISTICS
275
5
3 CHANNELS—6 LVDS
CURRENT FROM CP PIN (mA)
250
3 CHANNELS—3 LVDS
200
175
2 CHANNELS—2 LVDS
150
125
PUMP DOWN
2
1
1000
0
0
2.0
1.5
3.0
2.5
3.5
5.0
Figure 9. Charge Pump Characteristics @ VCP = 3.3 V
5
240
CURRENT FROM CP PIN (mA)
2 CHANNELS—8 CMOS
220
200
180
2 CHANNELS—2 CMOS
160
140
1 CHANNEL—2 CMOS
120
100
4
PUMP DOWN
PUMP UP
3
2
1
1 CHANNEL—1 CMOS
0
50
150
100
200
250
FREQUENCY (MHz)
0
07224-109
CURRENT (mA)
1.0
VOLTAGE ON CP PIN (V)
Figure 6. Total Current vs. Frequency, CLK-to-Output (PLL Off), Channel and
VCO Divider Bypassed, LVDS Outputs Terminated 100 Ω Across Differential Pair
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Figure 10. Charge Pump Characteristics at VCP = 5.0 V
–140
PFD PHASE NOISE REFERRED TO PFD INPUT
(dBc/Hz)
70
65
60
55
50
45
40
35
1.8
1.9
2.0
2.1
VCO FREQUENCY (GHz)
Figure 8. KVCO vs. VCO Frequency
2.2
2.3
–145
–150
–155
–160
–165
–170
0.1
07224-010
30
25
1.7
0
VOLTAGE ON CP PIN (V)
Figure 7. Total Current vs. Frequency, CLK-to-Output (PLL Off), Channel and
VCO Divider Bypassed, CMOS Outputs with 10 pF Load
KVCO (MHz/V)
0.5
07224-111
800
600
07224-112
400
200
07224-108
0
FREQUENCY (MHz)
80
PUMP UP
3
1 CHANNEL—1 LVDS
100
75
4
1
10
100
PFD FREQUENCY (MHz)
Figure 11. PFD Phase Noise Referred to PFD Input vs. PFD Frequency
Rev. A | Page 21 of 84
07224-013
CURRENT (mA)
225
AD9522-3
Data Sheet
–208
3.5
VS_DRV = 3.3V
3.0
–212
VS_DRV = 2.5V
2.5
–216
–218
DIFFERENTIAL INPUT
2.0
1.5
0.2
0.6
0.4
1.0
0.8
1.4
1.2
INPUT SLEW RATE (V/ns)
0
10k
Figure 12. PLL Figure of Merit (FOM) vs. Slew Rate at REFIN/REFIN
Figure 15. CMOS Output VOH (Static) vs. RLOAD (to Ground)
0
0.4
–10
0.3
DIFFERENTIAL OUTPUT (V)
–20
–30
–40
–50
–60
–70
–80
–90
0.2
0.1
0
–0.1
–0.2
110
115
120
125
130
135
140
145
FREQUENCY (MHz)
–0.4
07224-116
105
0
3
4
5
6
7
8
9
10 11 12 13 14 15
Figure 16. LVDS Output (Differential) at 100 MHz
Output Terminated 100 Ω Across Differential Pair
0
0.4
–10
0.3
DIFFERENTIAL SWING (V p-p)
–20
–30
–40
–50
–60
–70
–80
0.2
0.1
0
–0.1
–0.2
–0.3
–90
122.58
122.78
122.98
123.18
123.38
FREQUENCY (MHz)
07224-117
POWER (dBm)
2
TIME (ns)
Figure 13. PFD/CP Spurs; 122.88 MHz; PFD = 15.36 MHz;
LBW = 127 kHz; ICP = 3.0 mA; fVCO = 1720 MHz
–100
122.38
1
07224-014
–0.3
–100
–110
100
100
1k
RESISTIVE LOAD (Ω)
–0.4
0
0.5
1.0
1.5
2.0
2.5
TIME (ns)
Figure 17. LVDS Differential Voltage Swing at 800 MHz
Output Terminated 100 Ω Across Differential Pair
Figure 14. Output Spectrum, LVDS; 122.88 MHz; PFD = 15.36 MHz;
LBW = 127 kHz; ICP = 3.0 mA; fVCO = 1720 MHz
Rev. A | Page 22 of 84
3.0
07224-015
0
07224-118
0.5
SINGLE-ENDED INPUT
07224-114
–224
VS_DRV = 2.35V
1.0
–220
–222
POWER (dBm)
VS_DRV = 3.135V
–214
VOH (V)
PLL FIGURE OF MERIT (dBc/Hz)
–210
Data Sheet
AD9522-3
4.0
3.2
3.5
2.8
3.0
1.6
1.2
2.5
2.0
0.8
1.0
0.4
0.5
0
0
10
20
30
40
50
60
70
80
90
100
TIME (ns)
10pF
1.5
20pF
0
0
100
200
300
400
500
600
700
FREQUENCY (MHz)
07224-124
AMPLITUDE (V)
2pF
2.0
07224-018
AMPLITUDE (V)
2.4
Figure 21. CMOS Output Swing vs. Frequency and Capacitive Load
Figure 18. CMOS Output with 10 pF Load at 25 MHz
–50
2pF LOAD
3.2
–60
2.8
–70
AMPLITUDE (V)
2.4
PHASE NOISE (dBc/Hz)
10pF
LOAD
2.0
1.6
1.2
0.8
–80
–90
–100
–110
–120
–130
–140
0.4
1
2
3
4
5
6
7
8
9
10
TIME (ns)
–160
1k
07224-019
0
100k
1M
10M
100M
FREQUENCY (Hz)
Figure 22. Internal VCO Phase Noise (Absolute), LVDS Output at 573 MHz
Figure 19. CMOS Output with 2 pF and 10 pF Load at 250 MHz
–50
1600
–60
1400
7mA SETTING
–70
PHASE NOISE (dBc/Hz)
1200
1000
800
DEFAULT 3.5mA SETTING
600
400
–80
–90
–100
–110
–120
–130
–140
200
0
200
400
600
800
1000
FREQUENCY (GHz)
Figure 20. LVDS Differential Voltage Swing vs. Frequency
Output Terminated 100 Ω Across Differential Pair
–160
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
07224-024
–150
0
07224-123
DIFFERENTIAL SWING (mV p-p)
10k
07224-023
–150
0
Figure 23. Internal VCO Phase Noise (Absolute), LVDS Output at 662 MHz
Rev. A | Page 23 of 84
AD9522-3
Data Sheet
–50
–100
–60
–110
–80
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
–70
–90
–100
–110
–120
–130
–120
–130
–140
–140
1M
10M
100M
FREQUENCY (Hz)
–150
10
–110
–120
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
–110
–140
–150
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
10M
100M
100M
100M
–140
–150
–170
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 28. Additive (Residual) Phase Noise,
CLK-to-CMOS at 50 MHz, Divide-by-20
–100
–110
–110
PHASE NOISE (dBc/Hz)
–100
–120
–130
–140
–120
–130
–140
–150
–150
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
100M
07224-129
PHASE NOISE (dBc/Hz)
1M
–130
Figure 25. Additive (Residual) Phase Noise,
CLK-to-LVDS at 245.76 MHz, Divide-by-1
–160
10
100k
–160
07224-128
–160
10
10k
Figure 27. Additive (Residual) Phase Noise,
CLK-to-LVDS at 800 MHz, Divide-by-1
–100
–130
1k
FREQUENCY (Hz)
Figure 24. Internal VCO Phase Noise (Absolute), LVDS Output at 750 MHz
–120
100
07224-130
100k
07224-131
10k
07224-025
–160
1k
07224-132
–150
–160
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 29. Additive (Residual) Phase Noise,
CLK-to-CMOS at 250 MHz, Divide-by-4
Figure 26. Additive (Residual) Phase Noise,
CLK-to-LVDS at 200 MHz, Divide-by-5
Rev. A | Page 24 of 84
Data Sheet
AD9522-3
–100
–80
PHASE NOISE (dBc/Hz)
–120
–130
–140
–150
100k
1M
10M
100M
PHASE NOISE (dBc/Hz)
–130
–140
–110
–120
–130
–140
100k
1M
10M
100M
07224-034
–150
FREQUENCY (Hz)
100k
1M
10M
100M
Figure 32. Phase Noise (Absolute), External VCXO (Toyocom TCO-2112)
at 245.76 MHz; PFD = 15.36 MHz; LBW = 250 Hz; LVDS Output = 245.76 MHz
INTEGRATED RMS JITTER (12kHz TO 20MHz): 440fs
INTEGRATED RMS JITTER (20kHz TO 80MHz): 347fs (EXTRAPOLATED)
10k
10k
FREQUENCY (Hz)
–100
–160
1k
–120
–160
1k
07224-033
10k
Figure 30. Phase Noise (Absolute) Clock Generation; Internal VCO at
1720 MHz; PFD = 15.36 MHz; LBW = 40 kHz; LVDS Output = 122.88 MHz
–90
–110
–150
FREQUENCY (Hz)
–80
–100
07224-135
PHASE NOISE (dBc/Hz)
–110
–160
1k
INTEGRATED RMS JITTER (12kHz TO 20MHz): 146fs
–90
Figure 31. Phase Noise (Absolute) Clock Cleanup; Internal VCO at 1866 MHz;
PFD = 120 kHz; LBW = 1.92 kHz; LVDS Output = 155.52 MHz
Rev. A | Page 25 of 84
AD9522-3
Data Sheet
TEST CIRCUITS
C1
62pF
C2
240nF
R1
820Ω
R2
3kΩ
CP
LF
C3
33pF
C1
1.5nF
C2
4.7µF
R1
2.1kΩ
C3
2.2nF
BYPASS
C12
220nF
BYPASS
BYPASS
CAPACITOR
FOR LDO
07224-234
BYPASS
CAPACITOR
FOR LDO
LF
Figure 33. PLL Loop Filter Used for Clock Generation Plot (See Figure 30)
C12
220nF
07224-235
R2
390Ω
CP
Figure 34. PLL Loop Filter Used for Clock Cleanup Plot (See Figure 31)
Rev. A | Page 26 of 84
Data Sheet
AD9522-3
TERMINOLOGY
Phase Jitter and Phase Noise
An ideal sine wave can be thought of as having a continuous
and even progression of phase with time from 0° to 360° for
each cycle. Actual signals, however, display a certain amount
of variation from ideal phase progression over time. This
phenomenon is called phase jitter. Although many causes can
contribute to phase jitter, one major cause is random noise,
which is characterized statistically as Gaussian (normal) in
distribution.
Time Jitter
Phase noise is a frequency domain phenomenon. In the time
domain, the same effect is exhibited as time jitter. When observing
a sine wave, the time of successive zero crossings varies. In a square
wave, the time jitter is a displacement of the edges from their
ideal (regular) times of occurrence. In both cases, the variations in
timing from the ideal are the time jitter. Because these variations
are random in nature, the time jitter is specified in seconds root
mean square (rms) or 1 sigma of the Gaussian distribution.
This phase jitter leads to a spreading out of the energy of the
sine wave in the frequency domain, producing a continuous
power spectrum. This power spectrum is usually reported as a
series of values whose units are dBc/Hz at a given offset in
frequency from the sine wave (carrier). The value is a ratio
(expressed in decibels) of the power contained within a 1 Hz
bandwidth with respect to the power at the carrier frequency.
For each measurement, the offset from the carrier frequency is
also given.
Time jitter that occurs on a sampling clock for a DAC or an
ADC decreases the signal-to-noise ratio (SNR) and dynamic
range of the converter. A sampling clock with the lowest possible
jitter provides the highest performance from a given converter.
It is meaningful to integrate the total power contained within
some interval of offset frequencies (for example, 10 kHz to
10 MHz). This is called the integrated phase noise over that
frequency offset interval and can be readily related to the time
jitter due to the phase noise within that offset frequency interval.
Phase noise has a detrimental effect on the performance of ADCs,
DACs, and RF mixers. It lowers the achievable dynamic range of
the converters and mixers, although they are affected in somewhat
different ways.
Additive Phase Noise
Additive phase noise is the amount of phase noise that is
attributable to the device or subsystem being measured.
The phase noise of any external oscillators or clock sources is
subtracted. This makes it possible to predict the degree to which
the device impacts the total system phase noise when used in
conjunction with the various oscillators and clock sources, each
of which contributes its own phase noise to the total. In many
cases, the phase noise of one element dominates the system
phase noise. When there are multiple contributors to phase
noise, the total is the square root of the sum of squares of the
individual contributors.
Additive Time Jitter
Additive time jitter is the amount of time jitter that is attributable to
the device or subsystem being measured. The time jitter of any
external oscillators or clock sources is subtracted. This makes it
possible to predict the degree to which the device impacts the
total system time jitter when used in conjunction with the various
oscillators and clock sources, each of which contributes its own
time jitter to the total. In many cases, the time jitter of the external
oscillators and clock sources dominates the system time jitter.
Rev. A | Page 27 of 84
AD9522-3
Data Sheet
DETAILED BLOCK DIAGRAM
VS
GND
RSET
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
REFMON
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
REFIN
AMP
BYPASS
LOW DROPOUT
REGULATOR (LDO)
STATUS
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
LF
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
OUT0
CLK
1
PD
SYNC
DIGITAL
LOGIC
EEPROM
OUT0
0
DIVIDE BY
1 TO 32
RESET
OUT1
OUT1
OUT2
OUT2
EEPROM
OUT3
OUT3
DIVIDE BY
1 TO 32
SPI
INTERFACE
I2C
INTERFACE
OUT4
OUT4
OUT5
SCLK/SCL
SDIO/SDA
SDO
CS
OUT5
OUT6
OUT6
DIVIDE BY
1 TO 32
LVDS/LVCMOS OUTPUT
SP0
SERIAL
PORT
DECODE
OUT7
OUT7
OUT8
OUT8
OUT9
OUT9
DIVIDE BY
1 TO 32
AD9522
OUT10
OUT10
OUT11
OUT11
Figure 35.
Rev. A | Page 28 of 84
07224-028
SP1
Data Sheet
AD9522-3
THEORY OF OPERATION
OPERATIONAL CONFIGURATIONS
Table 22. Settings When Using Internal VCO
The AD9522 can be configured in several ways. These
configurations must be set up by loading the control registers
(see Table 49 to Table 60). Each section or function must be
individually programmed by setting the appropriate bits in the
corresponding control register or registers. After the desired
configuration is programmed, the user can store these values in
the on-board EEPROM to allow the part to power up in the
desired configuration without user intervention.
Register
0x010[1:0] = 00b
0x010 to 0x01E
Mode 0: Internal VCO and Clock Distribution
When using the internal VCO and PLL, the VCO divider must
be employed to ensure in most cases that the input frequency to the
channel dividers does not exceed its specified maximum
frequency (see Table 3). The exceptions to this are VCO direct
mode and cases where the VCO frequency is ≤2000 MHz. The
channel divider maximum input frequency is 2000 MHz
provided that the user does not choose a divide-by-17 or a
divide-by-3. If divide-by-3 or divide-by-17 is desired, the
maximum channel divider input frequency is 1600 MHz.
0x1E1[1] = 1b
0x01C[2:0]
0x1E0[2:0]
0x1E1[0] = 0b
0x018[0] = 0b
0x232[0] = 1b
0x018[0] = 1b
0x232[0] = 1b
The internal PLL uses an external loop filter to set the loop
bandwidth. The external loop filter is also crucial to the loop
stability. The internal PLL uses an external loop filter to set the
loop bandwidth. The external loop filter is also crucial to the
loop stability.
When using the internal VCO, it is necessary to calibrate the
VCO (Register 0x018[0] = 1b) to ensure optimal performance.
For internal VCO and clock distribution applications, use the
register settings shown in Table 22.
Rev. A | Page 29 of 84
Description
PLL normal operation (PLL on)
PLL settings; select and enable a reference
input; set R, N (P, A, B), PFD polarity, and ICP
according to the intended loop configuration
VCO selected as the source
Enable reference inputs
Set VCO divider
Use the VCO divider as the source for
the distribution section
Reset VCO calibration and issue IO_UPDATE
(not necessary for the first time after power-up,
but must be done subsequently)
Initiate VCO calibration, issue IO_UPDATE
AD9522-3
Data Sheet
VS
GND
RSET
REFMON
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
REFIN
AMP
BYPASS
LOW DROPOUT
REGULATOR (LDO)
STATUS
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
LF
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
OUT0
CLK
1
PD
SYNC
DIGITAL
LOGIC
EEPROM
OUT0
0
DIVIDE BY
1 TO 32
RESET
OUT1
OUT1
OUT2
OUT2
EEPROM
OUT3
SP0
OUT3
SERIAL
PORT
DECODE
DIVIDE BY
1 TO 32
SPI
INTERFACE
I2C
INTERFACE
OUT4
OUT4
OUT5
SCLK/SCL
SDIO/SDA
SDO
CS
OUT5
OUT6
OUT6
DIVIDE BY
1 TO 32
LVDS/CMOS OUTPUT
SP1
OUT7
OUT7
OUT8
OUT8
OUT9
OUT9
DIVIDE BY
1 TO 32
AD9522
OUT10
OUT10
OUT11
07224-030
OUT11
Figure 36. Internal VCO and Clock Distribution (Mode 0)
Rev. A | Page 30 of 84
Data Sheet
AD9522-3
Mode 1: Clock Distribution or External VCO < 1600 MHz
When the external clock source to be distributed or the external
VCO/VCXO is <1600 MHz, a configuration that bypasses the
VCO divider can be used. This is the only difference from Mode 2.
Bypassing the VCO divider limits the frequency of the clock
source to <1600 MHz (due to the maximum input frequency
allowed at the channel dividers).
For clock distribution applications where the external clock is
<1600 MHz, use the register settings shown in Table 23.
Table 23. Settings for Clock Distribution < 1600 MHz
Register
0x010[1:0] = 01b
0x1E1[0] = 1b
0x1E1[1] = 0b
Description
PLL asynchronous power-down (PLL off )
Bypass the VCO divider as the source for
the distribution section
CLK selected as the source
When using the internal PLL with an external VCO < 1600 MHz,
the PLL must be turned on.
Table 24. Settings for Using Internal PLL with External VCO
< 1600 MHz
Register
0x1E1[0] = 1b
0x010[1:0] = 00b
Description
Bypass the VCO divider as the source for
the distribution section
PLL normal operation (PLL on) along
with other appropriate PLL settings in
Register 0x010 to Register 0x01E
An external VCO/VCXO requires an external loop filter that
must be connected between CP and the tuning pin of the VCO/
VCXO. This loop filter determines the loop bandwidth and stability
of the PLL. Make sure to select the proper PFD polarity for the
VCO/VCXO being used.
Table 25. Setting the PFD Polarity
Register
0x010[7] = 0b
0x010[7] = 1b
Rev. A | Page 31 of 84
Description
PFD polarity positive (higher control voltage
produces higher frequency)
PFD polarity negative (higher control voltage
produces lower frequency)
AD9522-3
Data Sheet
VS
GND
RSET
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
REFMON
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
REFIN
AMP
BYPASS
LOW DROPOUT
REGULATOR (LDO)
STATUS
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
LF
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
OUT0
CLK
1
PD
SYNC
DIGITAL
LOGIC
EEPROM
OUT0
0
DIVIDE BY
1 TO 32
RESET
OUT1
OUT1
OUT2
OUT2
EEPROM
OUT3
OUT3
DIVIDE BY
1 TO 32
SPI
INTERFACE
I2C
INTERFACE
OUT4
OUT4
OUT5
SCLK/SCL
SDIO/SDA
SDO
CS
OUT5
OUT6
OUT6
DIVIDE BY
1 TO 32
LVDS/CMOS OUTPUT
SP0
SERIAL
PORT
DECODE
OUT7
OUT7
OUT8
OUT8
OUT9
OUT9
DIVIDE BY
1 TO 32
AD9522
OUT10
OUT10
OUT11
OUT11
Figure 37. Clock Distribution or External VCO < 1600 MHz (Mode 1)
Rev. A | Page 32 of 84
07224-031
SP1
Data Sheet
AD9522-3
Mode 2: High Frequency Clock Distribution—CLK or
External VCO > 1600 MHz
When using the internal PLL with an external VCO, the PLL
must be turned on.
The AD9522 power-up default configuration has the PLL
powered off and the routing of the input set so that the CLK/
CLK input is connected to the distribution section through the
VCO divider (divide-by-1/divide-by-2/divide-by-3/divide-by-4/
divide-by-5/divide-by-6). This is a distribution-only mode that
allows for an external input up to 2400 MHz (see Table 3). The
maximum frequency that can be applied to the channel dividers
is 1600 MHz; therefore, higher input frequencies must be divided
down before reaching the channel dividers.
Table 27. Settings When Using an External VCO
Register
0x010[1:0] = 00b
0x010 to 0x01E
0x1E1[1] = 0b
Description
PLL normal operation (PLL on)
PLL settings; select and enable a
reference input; set R, N (P, A, B), PFD
polarity, and ICP according to the intended
loop configuration
CLK selected as the source
When the PLL is enabled, this routing also allows the use of the
PLL with an external VCO or VCXO with a frequency <2400 MHz.
In this configuration, the internal VCO is not used and is powered
off. The external VCO/VCXO feeds directly into the prescaler.
An external VCO requires an external loop filter that must be
connected between CP and the tuning pin of the VCO. This
loop filter determines the loop bandwidth and stability of the
PLL. Make sure to select the proper PFD polarity for the VCO
being used.
The register settings shown in Table 26 are the default values of
these registers at power-up or after a reset operation.
Table 28. Setting the PFD Polarity
Table 26. Default Register Settings for Clock Distribution Mode
Register
0x010[1:0] = 01b
0x1E0[2:0] = 000b
0x1E1[0] = 0b
0x1E1[1] = 0b
Description
PLL asynchronous power-down (PLL off )
Set VCO divider = 2
Use the VCO divider
CLK selected as the source
Register
0x010[7] = 0b
0x010[7] = 1b
Rev. A | Page 33 of 84
Description
PFD polarity positive (higher control
voltage produces higher frequency)
PFD polarity negative (higher control
voltage produces lower frequency)
AD9522-3
Data Sheet
VS
GND
RSET
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
REFMON
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
REFIN
AMP
BYPASS
STATUS
LOW DROPOUT
REGULATOR (LDO)
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
LF
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
OUT0
CLK
1
PD
SYNC
DIGITAL
LOGIC
EEPROM
OUT0
0
DIVIDE BY
1 TO 32
RESET
OUT1
OUT1
OUT2
OUT2
EEPROM
OUT3
SP0
OUT3
SERIAL
PORT
DECODE
DIVIDE BY
1 TO 32
SPI
INTERFACE
I2C
INTERFACE
OUT4
OUT4
OUT5
SCLK/SCL
SDIO/SDA
SDO
CS
OUT5
OUT6
OUT6
DIVIDE BY
1 TO 32
LVDS/CMOS OUTPUT
SP1
OUT7
OUT7
OUT8
OUT8
OUT9
OUT9
DIVIDE BY
1 TO 32
AD9522
OUT10
OUT10
OUT11
07224-029
OUT11
Figure 38. High Frequency Clock Distribution or External VCO > 1600 MHz (Mode 2)
Rev. A | Page 34 of 84
Data Sheet
AD9522-3
Phase-Locked Loop (PLL)
VS
RSET
GND
REFMON
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
REFIN
BYPASS
LOW DROPOUT
REGULATOR (LDO)
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
STATUS
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
CLK
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
FROM CHANNEL
DIVIDER 0
CLK
1
0
07224-064
LF
Figure 39. PLL Functional Block Diagram
The AD9522 includes an on-chip PLL with an on-chip VCO.
The PLL blocks can be used either with the on-chip VCO to
create a complete phase-locked loop or with an external VCO
or VCXO. The PLL requires an external loop filter, which
usually consists of a small number of capacitors and resistors.
The configuration and components of the loop filter help to
establish the loop bandwidth and stability of the operating PLL.
The AD9522 PLL is useful for generating clock frequencies
from a supplied reference frequency. This includes conversion
of reference frequencies to much higher frequencies for subsequent
division and distribution. In addition, the PLL can be used to
clean up jitter and phase noise on a noisy reference. The exact
choice of PLL parameters and loop dynamics is application specific.
The flexibility and depth of the AD9522 PLL allow the part to
be tailored to function in many different applications and signal
environments.
Configuration of the PLL
The AD9522 allows flexible configuration of the PLL,
accommodating various reference frequencies, PFD comparison
frequencies, VCO frequencies, internal or external VCO/VCXO,
and loop dynamics. This is accomplished by the various settings
for the R divider, the N divider, the PFD polarity (only applicable to
external VCO/VCXO), the antibacklash pulse width, the charge
pump current, the selection of internal VCO or external VCO/
VCXO, and the loop bandwidth. These are managed through
programmable register settings (see Table 49 and Table 53) and
by the design of the external loop filter.
Successful PLL operation and satisfactory PLL loop performance
are highly dependent upon proper configuration of the PLL
settings, and the design of the external loop filter is crucial to
the proper operation of the PLL.
ADIsimCLK™ is a free program that can help with the design
and exploration of the capabilities and features of the AD9522,
including the design of the PLL loop filter. The UG-077 is the
AD9522 evaluation software user guide that allows users to easily
set the correct register values when the desired configuration is
determined. Both are available at www.analog.com/clocks.
Phase Frequency Detector (PFD)
The PFD takes inputs from the R divider and the N divider and
produces an output proportional to the phase and frequency
difference between them. The PFD includes a programmable
delay element that controls the width of the antibacklash pulse.
This pulse ensures that there is no dead zone in the PFD
transfer function and minimizes phase noise and reference
spurs. The antibacklash pulse width is set by Register 0x017[1:0].
An important limit to keep in mind is the maximum frequency
allowed into the PFD. The maximum input frequency into the
PFD is a function of the antibacklash pulse setting, as specified
in the phase/frequency detector (PFD) parameter in Table 2.
Charge Pump (CP)
The charge pump is controlled by the PFD. The PFD monitors
the phase and frequency relationship between its two inputs and
tells the CP to pump up or pump down to charge or discharge the
integrating node (part of the loop filter). The integrated and
filtered CP current is transformed into a voltage that drives the
tuning node of the internal VCO through the LF pin (or the tuning
pin of an external VCO) to move the VCO frequency up or
down. The CP can be set (Register 0x010[3:2]) for high impedance
(allows holdover operation), for normal operation (attempts to
lock the PLL loop), for pump-up, or for pump-down (test modes).
The CP current is programmable in eight steps from (nominally)
0.6 mA to 4.8 mA. The exact value of the CP current LSB is set by
the CPRSET resistor and is calculated using the following equation:
3.06
I CP =
CPRSET
Rev. A | Page 35 of 84
AD9522-3
Data Sheet
On-Chip VCO
AD9522
LF
31pF
R2
CP
R1
C1
CBP = 220nF
C2
C3
07224-065
BYPASS
Figure 40. Example of External Loop Filter for a PLL Using the Internal VCO
C3
07224-265
C2
Figure 42 and Figure 43 show the typical PLL loop filters used to
generate the plots in Figure 30 and Figure 31, respectively.
R2
390Ω
CP
C1
62pF
C2
240nF
R1
820Ω
LF
C3
33pF
BYPASS
BYPASS
CAPACITOR
FOR LDO
C12
220nF
Figure 42. Typical PLL Loop Filter Used for Clock Generation
R2
3kΩ
CP
C1
1.5nF
C2
4.7µF
R1
2.1kΩ
LF
C3
2.2nF
BYPASS
BYPASS
CAPACITOR
FOR LDO
AD9522
CHARGE
PUMP
C1
Figure 41. Example of External Loop Filter for a PLL Using an External VCO
PLL External Loop Filter
VCO
R1
CHARGE
PUMP
When using an external VCO/VCXO, leave the BYPASS and LF
pins floating. This configuration is shown in Figure 41.
When using an external VCO, the external loop filter must be
referenced to ground. An example of an external loop filter for a
PLL using an external VCO is shown in Figure 41.
R2
CP
The on-chip VCO is powered by an on-chip, low dropout (LDO),
linear voltage regulator. The LDO provides some isolation of
the VCO from variations in the power supply voltage level. The
BYPASS pin must be connected to ground by a 220 nF capacitor
to ensure stability. This LDO employs the same technology used
in the anyCAP® line of regulators from Analog Devices, Inc.,
making it insensitive to the type of capacitor used. Driving an
external load from the BYPASS pin is not supported.
When using the internal VCO, the external loop filter must be
referenced to the BYPASS pin for optimal noise and spurious
performance. An example of an external loop filter for a PLL
that uses the internal VCO is shown in Figure 40. A loop filter
must be calculated for each desired PLL configuration. The values
of the components depend upon the VCO frequency, the KVCO,
the PFD frequency, the CP current, the desired loop bandwidth,
and the desired phase margin. The loop filter affects the phase
noise, the loop settling time, and the loop stability. A basic
knowledge of PLL theory is helpful for understanding loop filter
design. ADIsimCLK can help with the calculation of a loop
filter according to the application requirements.
EXTERNAL
VCO/VCXO
07224-334
To tune over the wide range of frequencies covered by this
VCO, tuning ranges are used. The calibration procedure selects
the correct range for the desired VCO frequency. See the VCO
Calibration section for additional information.
CLK/CLK
C12
220nF
07224-335
The AD9522 includes an on-chip VCO covering the frequency
range shown in Table 2. The calibration procedure ensures that
the VCO operating voltage is centered for the desired VCO
frequency. The VCO must be calibrated when the VCO loop
is first set up, as well as any time the nominal VCO frequency
changes. However, once the VCO is calibrated, the VCO has
sufficient operating range to stay locked over temperature and
voltage extremes without needing additional calibration. See the
VCO Calibration section for additional information.
Figure 43. Typical PLL Loop Filter Used for Clock Cleanup
PLL Reference Inputs
The AD9522 features a flexible PLL reference input circuit that
allows a fully differential input, two separate single-ended inputs,
or a 16.62 MHz to 33.33 MHz crystal oscillator with an on-chip
maintaining amplifier. An optional reference clock doubler
can be used to double the PLL reference frequency. The input
frequency range for the reference inputs is specified in Table 2.
Both the differential and the single-ended inputs are self-biased,
allowing for easy ac coupling of input signals.
Either a differential or a single-ended reference must be specifically
enabled. All PLL reference inputs are off by default.
The differential input and the single-ended inputs share two pins,
REFIN (REF1) and REFIN (REF2). The desired reference input
type is selected and controlled by Register 0x01C (see Table 49 and
Table 53).
When the differential reference input is selected, the self-bias
level of the two sides is offset slightly (~100 mV, see Table 2) to
prevent chattering of the input buffer when the reference is slow
or missing. This increases the voltage swing that is required of
the driver and overcomes the offset. The differential reference
input can be driven by either ac-coupled LVDS or ac-coupled
LVPECL signals.
The single-ended inputs can be driven by either a dc-coupled
CMOS level signal or an ac-coupled sine wave or square wave.
Rev. A | Page 36 of 84
Data Sheet
AD9522-3
To avoid input buffer chatter when a single-ended, ac-coupled
input signal stops toggling, the user can set Register 0x018[7] to
1b. This setting shifts the dc offset bias point down 140 mV. To
increase isolation and reduce power, each single-ended input can
be independently powered down.
The differential reference input receiver is powered down when
it is not selected or when the PLL is powered down. The singleended buffers power down when the PLL is powered down or
when their respective individual power-down registers are set.
When the differential mode is selected, the single-ended inputs
are powered down.
VS
REF1
VS
Automatic revertive switchover relies on the REFMON pin to
indicate when REF1 disappears. By programming Register 0x01B =
0xF7 and Register 0x01C = 0x26, the REFMON pin is programmed
high when REF1 is invalid, which commands the switch to
REF2. When REF1 is valid again, the REFMON pin goes low, and
the device again locks to REF1. The STATUS pin can also be used
for this function, and REF2 can be used as the preferred reference.
12kΩ
REFIN
150Ω
REFIN
150Ω
10kΩ
The AD9522 features a dc offset option in single-ended mode.
This option is designed to eliminate the risk of the reference
inputs chattering when they are ac-coupled and the reference
clock disappears. When using the reference switchover, the singleended reference inputs must be dc-coupled CMOS levels (with
the AD9522 dc offset feature disabled). Alternatively, the inputs
can be ac-coupled and dc offset feature enabled. Keep in mind,
however, that the minimum input amplitude for the reference
inputs is greater when the dc offset is turned on.
Reference switchover can be performed manually or automatically.
Manual switchover is performed either through Register 0x01C
or by using the REF_SEL pin. Manual switchover requires the
presence of a clock on the reference input that is being switched
to; otherwise, the deglitching feature must be disabled in Bit 7
of Register 0x01C. The reference switching logic fails if this
condition is not met, and the PLL does not reacquire.
85kΩ
10kΩ
switchover with an output frequency disturbance as low as
10 ppm.
10kΩ
VS
REF2
07224-066
85kΩ
A switchover deglitch feature ensures that the PLL does not receive
rising edges that are far out of alignment with the newly selected
reference. For the switchover deglitch feature to work correctly,
the presence of a clock is required on the reference input that is
being switched to. The deglitching feature can also be disabled
(Register 0x01C[7]).
Automatic nonrevertive switching is not supported.
Figure 44. REFIN Equivalent Circuit for NonXTAL Mode
In differential mode, the reference input pins are internally selfbiased so that they can be ac-coupled via capacitors. It is possible to
dc couple to these inputs. If the differential REFIN is driven by
a single-ended signal, decouple the unused side (REFIN) via a
suitable capacitor to a quiet ground. Figure 44 shows the
equivalent circuit of REFIN.
Crystal mode is nearly identical to differential mode. The user
enables a maintaining amplifier by setting the enable XTAL
OSC bit, and putting a series resonant, AT fundamental cut
crystal across the REFIN/REFIN pins.
Reference Switchover
The AD9522 supports dual single-ended CMOS inputs, as well
as a single differential reference input. In the dual single-ended
reference mode, the AD9522 supports automatic revertive and
manual PLL reference clock switching between REF1 (on
Pin REFIN) and REF2 (on Pin REFIN). This feature supports
networking and other applications that require redundant
references. When used in conjunction with the automatic holdover
function, the AD9522 can achieve a worst-case reference input
Reference Divider R
The reference inputs are routed to the reference divider, R. R (a
14-bit counter) can be set to any value from 0 to 16,383 by writing
to Register 0x011 and Register 0x012. (Both R = 0 and R = 1 give
divide-by-1.) The output of the R divider goes to one of the PFD
inputs to be compared with the VCO frequency divided by the
N divider. The frequency applied to the PFD must not exceed
the maximum allowable frequency, which depends on the
antibacklash pulse setting (see Table 2).
The R divider has its own reset. The R divider can be reset using
the shared reset bit of the R, A, and B counters. It can also be
reset by a SYNC operation.
VCO/VCXO Feedback Divider N: P, A, B
The N divider is a combination of a prescaler (P) and two counters,
A and B. The total divider value is
N = (P × B) + A
where P can be 2, 4, 8, 16, or 32.
Rev. A | Page 37 of 84
AD9522-3
Data Sheet
Prescaler
The maximum input frequency to the A/B counter is reflected
in the maximum prescaler output frequency (~300 MHz) specified
in Table 2. This is the prescaler input frequency (VCO or CLK)
divided by P. For example, dual modulus P = 8/9 mode is not
allowed if the VCO frequency is greater than 2400 MHz
because the frequency going to the A/B counter is too high.
The prescaler of the AD9522 allows for two modes of operation:
a fixed divide (FD) mode of 1, 2, or 3, and a dual modulus (DM)
mode where the prescaler divides by P and (P + 1) {2 and 3, 4
and 5, 8 and 9, 16 and 17, or 32 and 33}. The prescaler modes of
operation are given in Table 53, Register 0x016[2:0]. Not all modes
are available at all frequencies (see Table 2). It is common to use
a prescaler of 8 for VC frequencies <2400 MHz, and P = 32 is
usually used for very large feedback divider values only.
When the AD9522 B counter is bypassed (B = 1), the A counter
must be set to zero, and the overall resulting divide is equal to
the prescaler setting, P. The possible divide ratios in this mode
are 1, 2, 3, 4, 8, 16, and 32.
When operating the AD9522 in dual modulus mode, P/(P + 1),
the equation used to relate the input reference frequency to the
VCO output frequency is
Although manual reset is not normally required, the A/B counters
have their own reset bit. Alternatively, the A and B counters can be
reset using the shared reset bit of the R, A, and B counters. Note
that these reset bits are not self-clearing.
fVCO = (fREF/R) × (P × B + A) = fREF × N/R
However, when operating the prescaler in FD Mode 1, FD Mode 2,
or FD Mode 3, the A counter is not used (A = 0; the divide is a
fixed divide of P = 2, 4, 8, 16, or 32) and the equation simplifies to
R, A, and B Counters: SYNC Pin Reset
The R, A, and B counters can be reset simultaneously through the
SYNC pin. This function is controlled by Register 0x019[7:6] (see
Table 53). The SYNC pin reset is disabled by default.
fVCO = (fREF/R) × (P × B) = fREF × N/R
By using combinations of DM and FD modes, the AD9522 can
achieve values of N from 1 to 262,175.
R and N Divider Delays
Both the R and N dividers feature a programmable delay cell.
These delays can be enabled to allow adjustment of the phase
relationship between the PLL reference clock and the VCO or CLK,
and are useful for controlling the input/output phase relationship in
zero delay mode. Each delay is controlled by three bits. The total
delay range is about 1 ns. See Register 0x019 in Table 2 and Table 53.
Table 29 shows how a 10 MHz reference input can be locked to
any integer multiple of N. Note that the same value of N can be
derived in different ways, as illustrated by the case of N = 12. The
user can choose a fixed divide mode of P = 2 with B = 6, use the
dual modulus mode of 2/3 with A = 0, B = 6, or use the dual
modulus mode of 4/5 with A = 0, B = 3.
A and B Counters
The B counter must be ≥3 or bypassed, and unlike the R
counter, A = 0 is actually zero. The B counter must always be
greater than or equal to the A counter.
Table 29. How a 10 MHz Reference Input Can Be Locked to Any Integer Multiple of N (X= Don’t Care)
fREF (MHz)
10
10
10
10
10
10
10
10
R
1
1
1
1
1
1
1
1
P
1
2
1
1
1
2
2
2
A
X
X
X
X
X
X
0
1
B
1
1
3
4
5
3
3
3
N
1
2
3
4
5
6
6
7
fVCO (MHz)
10
20
30
40
50
60
60
70
Mode
FD
FD
FD
FD
FD
FD
DM
DM
10
10
10
10
10
10
10
10
10
1
1
1
1
1
10
1
1
10
2
2
8
8
16
32
8
16
32
2
1
6
7
7
6
0
0
0
3
4
18
18
9
47
25
15
75
8
9
150
151
151
151
200
240
2400
80
90
1500
1510
1510
1510
2000
2400
2400
DM
DM
DM
DM
DM
DM
DM
DM
DM
Notes
P = 1, B = 1 (A and B counters are bypassed).
P = 2, B = 1 (A and B counters are bypassed).
A counter is bypassed.
A counter is bypassed.
A counter is bypassed.
A counter is bypassed.
Maximum frequency into prescaler in P 2/3 mode is 200 MHz.
If N = 7 or N = 11 is desired for prescaler input frequency of
200 MHz to 300 MHz, use P = 1 and N = 7, or 11, respectively.
Rev. A | Page 38 of 84
Data Sheet
AD9522-3
VS = 3.3V
Digital Lock Detect (DLD)
The lock detect window timing depends on the value of the
CPRSET resistor, as well as three settings: the digital lock detect
window bit (Register 0x018[4]), the antibacklash pulse width bit
(Register 0x017[1:0], see Table 2), and the lock detect counter
(Register 0x018[6:5]). The lock and unlock detection values in
Table 2 are for the nominal value of CPRSET = 5.11 kΩ.
Doubling the CPRSET value to 10 kΩ doubles the values in Table 2.
A lock is not indicated until there is a programmable number of
consecutive PFD cycles with a time difference less than the lock
detect threshold. The lock detect circuit continues to indicate a
lock until a time difference greater than the unlock threshold
occurs on a single subsequent cycle. For the lock detect to work
properly, the period of the PFD frequency must be greater than
the unlock threshold. The number of consecutive PFD cycles
required for lock is programmable (Register 0x018[6:5]).
Note that it is possible in certain low (<500 Hz) loop bandwidth,
high phase margin cases that the DLD can chatter during
acquisition, which can cause the AD9522 to automatically enter
and exit holdover. To avoid this problem, it is recommended
that the user make provisions for a capacitor to ground on the
LD pin so that current source digital lock detect (CSDLD) mode
can be used.
Analog Lock Detect (ALD)
The AD9522 provides an ALD function that can be selected for
use at the LD pin. There are two operating modes for ALD.


N-channel open-drain lock detect. This signal requires a
pull-up resistor to the positive supply, VS. The output is
normally high with short, low going pulses. Lock is
indicated by the minimum duty cycle of the low going pulses.
P-channel open-drain lock detect. This signal requires a
pull-down resistor to GND. The output is normally low with
short, high going pulses. Lock is indicated by the minimum
duty cycle of the high going pulses.
LD
R1
ALD
R2
VOUT
07224-067
C
Figure 45. Example of Analog Lock Detect Filter Using
N-Channel Open-Drain Driver
Current Source Digital Lock Detect (CSDLD)
During the PLL locking sequence, it is normal for the DLD
signal to toggle a number of times before remaining steady.
There may be applications where it is necessary to have DLD
asserted without chattering and only after the PLL is solidly
locked. This is possible by using the current source digital lock
detect function.
The current source lock detect provides a current of 110 μA when
DLD is true and shorts to ground when DLD is false. If a capacitor
is connected to the LD pin, it charges at a rate determined by the
current source during the DLD true time but is discharged nearly
instantly when DLD is false. By monitoring the voltage at the
LD pin (top of the capacitor), LD = high happens only after the
DLD is true for a sufficiently long time. Any momentary DLD
false resets the charging. By selecting a properly sized capacitor,
it is possible to delay a lock detect indication until the PLL is
stably locked and the lock detect does not chatter.
To use current source digital lock detect, do the following:



Place a capacitor to ground on the LD pin
Set Register 0x01A[5:0] = 0x04
Enable the LD pin comparator (Register 0x01D[3] = 1)
The LD pin comparator senses the voltage on the LD pin, and the
comparator output can be made available at the REFMON pin
control (Register 0x01B[4:0]) or the STATUS pin control (Register
0x017[7:2]). The internal LD pin comparator trip point and
hysteresis are given in Table 17. The voltage on the capacitor can
also be sensed by an external comparator connected to the LD
pin. In this case, enabling the on-board LD pin comparator is
not necessary.
The user can asynchronously enable individual clock outputs only
when CSDLD is high. To enable this feature, set the appropriate bits
in the enable output on the CSDLD registers (Register 0x0FC and
Register 0x0FD).
The analog lock detect function requires an RC filter to provide a
logic level indicating lock/unlock. The ADIsimCLK tool can be
used to help the user select the right passive component values
for ALD to ensure its correct operation.
AD9522
110µA
DLD
LD
VOUT
C
LD PIN
COMPARATOR
REFMON
OR
STATUS
07224-068
By selecting the proper output through the mux on each pin, the
DLD function is available at the LD, STATUS, and REFMON pins.
The digital lock detect circuit indicates a lock when the time
difference of the rising edges at the PFD inputs is less than a
specified value (the lock threshold). The loss of a lock is indicated
when the time difference exceeds a specified value (the unlock
threshold). Note that the unlock threshold is wider than the
lock threshold, which allows some phase error in excess of the
lock window to occur without chattering on the lock indicator.
AD9522
Figure 46. Current Source Digital Lock Detect
Rev. A | Page 39 of 84
AD9522-3
Data Sheet
External VCXO/VCO Clock Input (CLK/CLK)
External/Manual Holdover Mode
This differential input is used to drive the AD9522 clock
distribution section. This input can receive up to 2.4 GHz.
The pins are internally self-biased, and the input signal must be
ac-coupled via capacitors.
A manual holdover mode can be enabled that allows the user to
place the charge pump into a high impedance state when the
SYNC pin is asserted low. This operation is edge sensitive, not
level sensitive. The charge pump enters a high impedance state
immediately. To take the charge pump out of a high impedance
state, take the SYNC pin high. The charge pump then leaves the
high impedance state synchronously with the next PFD rising
edge from the reference clock. This prevents extraneous charge
pump events from occurring during the time between SYNC
going high and the next PFD event. This also means that the
charge pump stays in a high impedance state if there is no
reference clock present.
CLOCK INPUT
STAGE
VS
CLK
CLK
2.5kΩ
2.5kΩ
5kΩ
07224-032
5kΩ
Figure 47. CLK Equivalent Input Circuit
The self-biased CLK/CLK input can be used either as a
distribution only input (with the PLL off), or as a feedback
input for an external VCO/VCXO using the internal PLL when
the internal VCO is not used. These inputs are also used as a
feedback path for the external zero delay mode.
Holdover
The AD9522 PLL has a holdover function. Holdover mode
allows the VCO to maintain a relatively constant frequency even
though there is no reference clock. This function is useful when
the PLL reference clock is lost. Holdover is implemented by placing
the charge pump in a high impedance state. Without this function,
the charge pump is placed into a constant pump-up or pumpdown state, resulting in a significant VCO frequency shift. Because
the charge pump is placed in a high impedance state, any leakage
that occurs at the charge pump output or the VCO tuning node
causes a drift of the VCO frequency. This drift can be mitigated
by using a loop filter that contains a large capacitive component
because this drift is limited by the current leakage induced
slew rate (ILEAK/C) of the VCO control voltage.
Both a manual holdover mode, using the SYNC pin, and an
automatic holdover mode are provided. To use either function, the
holdover function must be enabled (Register 0x01D[0]).
The B counter (in the N divider) is reset synchronously with the
charge pump leaving the high impedance state on the reference
path PFD event. This helps align the edges out of the R and N
dividers for faster settling of the PLL. Because the prescaler is
not reset, this feature works best when the B and R numbers are
close because this results in a smaller phase difference for the
loop to settle out.
When using this mode, set the channel dividers to ignore the
SYNC pin (at least after an initial SYNC event). If the dividers are
not set to ignore the SYNC pin, any time SYNC is taken low to
put the part into holdover, the distribution outputs turn off. The
channel divider ignore SYNC function is found in
Register 0x191[6], Register 0x194[6], Register 0x197[6], and
Register 0x19A[6] for Channel Divider 0, Channel Divider 1,
Channel Divider 2, and Channel Divider 3, respectively.
Automatic/Internal Holdover Mode
When enabled, this function automatically puts the charge
pump into a high impedance state when the loop loses lock.
The assumption is that the only reason the loop loses lock is due
to the PLL losing the reference clock; therefore, the holdover
function puts the charge pump into a high impedance state to
maintain the VCO frequency as close as possible to the original
frequency before the reference clock disappeared.
A flowchart of the automatic/internal holdover function
operation is shown in Figure 48.
Rev. A | Page 40 of 84
Data Sheet
AD9522-3
PLL ENABLED
LOOP OUT OF LOCK. DIGITAL LOCK
DETECT SIGNAL GOES LOW WHEN THE
LOOP LEAVES LOCK AS DETERMINED
BY THE PHASE DIFFERENCE AT THE
INPUT OF THE PFD.
NO
DLD == LOW
YES
NO
ANALOG LOCK DETECT PIN INDICATES
LOCK WAS PREVIOUSLY ACHIEVED.
(0x01D[3] = 1; USE LD PIN VOLTAGE
WITH HOLDOVER.
0x01D[3] = 0; IGNORE LD PIN VOLTAGE,
TREAT LD PIN AS ALWAYS HIGH.)
WAS
LD PIN == HIGH
WHEN DLD WENT
LOW?
YES
CHARGE PUMP IS MADE
HIGH IMPEDANCE.
PLL COUNTERS CONTINUE
OPERATING NORMALLY.
HIGH IMPEDANCE
CHARGE PUMP
NO
CHARGE PUMP REMAINS HIGH
IMPEDANCE UNTIL THE REFERENCE
RETURNS.
REFERENCE
EDGE AT PFD?
YES
YES
RELEASE
CHARGE PUMP
HIGH IMPEDANCE
NO
DLD == HIGH
WAIT FOR DLD TO GO HIGH. THIS TAKES
5 TO 255 CYCLES (PROGRAMMING OF THE DLD
DELAY COUNTER) WITH THE REFERENCE AND
FEEDBACK CLOCKS INSIDE THE LOCK WINDOW AT
THE PFD. THIS ENSURES THAT THE HOLDOVER
FUNCTION WAITS FOR THE PLL TO SETTLE AND LOCK
BEFORE THE HOLDOVER FUNCTION CAN BE
RETRIGGERED.
07224-069
TAKE CHARGE PUMP OUT OF
HIGH IMPEDANCE. PLL CAN
NOW RESETTLE.
Figure 48. Flowchart of Automatic/Internal Holdover Mode
The holdover function senses the logic level of the LD pin as a
condition to enter holdover. The signal at LD can be from the
DLD, ALD, or current source LD (CSDLD) mode. It is possible
to disable the LD comparator (Register 0x01D[3]), which causes
the hold-over function to always sense LD as high. If DLD is
used, it is possible for the DLD signal to chatter while the PLL is
reacquiring lock. The holdover function may retrigger, thereby
preventing the holdover mode from terminating. Use of the
current source lock detect mode is recommended to avoid this
situation (see the Current Source Digital Lock Detect (CSDLD)
section).
When in holdover mode, the charge pump stays in a high
impedance state as long as there is no reference clock present.
As in the external holdover mode, the B counter (in the N divider)
is reset synchronously with the charge pump leaving the high
impedance state on the reference path PFD event. This helps
align the edges out of the R and N dividers for faster settling of
the PLL and reduces frequency errors during settling. Because
the prescaler is not reset, this feature works best when the B and
R numbers are close because this results in a smaller phase
difference for the loop to settle out.
Rev. A | Page 41 of 84
AD9522-3
Data Sheet
After leaving holdover, the loop then reacquires lock and the
LD pin must go high (if Register 0x01D[3] = 1) before it can
reenter holdover.
The holdover function always responds to the state of the currently
selected reference (Register 0x01C). If the loop loses lock
during a reference switchover (see the Reference Switchover
section), holdover is triggered briefly until the next reference
clock edge at the PFD.
The following registers affect the automatic/internal holdover
function:
•
•
•
•
•
•
Register 0x018[6:5]—lock detect counter. This changes
how many consecutive PFD cycles with edges inside the
lock detect window are required for the DLD indicator to
indicate lock. This impacts the time required before the LD
pin can begin to charge as well as the delay from the end of
a holdover event until the holdover function can be
reengaged.
Register 0x018[3]—disable digital lock detect. This bit
must be set to 0 to enable the DLD circuit.
Internal/automatic holdover does not operate correctly
without the DLD function enabled.
Register 0x01A[5:0]—lock detect pin control. Set this to
000100b to put it in the current source lock detect mode if
using the LD pin comparator. Load the LD pin with a
capacitor of an appropriate value.
Register 0x01D[3]—LD pin comparator enable. 1 = enable;
0 = disable. When disabled, the holdover function always
senses the LD pin as high.
Register 0x01D[1]—external holdover control.
Register 0x01D[0]—holdover enable. If holdover is
disabled, both external and automatic/internal holdover
are disabled.
In the following example, automatic holdover is configured with
•
•
•
Automatic reference switchover, prefer REF1.
Digital lock detect: five PFD cycles, high range window.
Automatic holdover using the LD pin comparator.
The following registers are set (in addition to the normal PLL
registers):
•
•
•
•
•
•
•
•
•
•
Register 0x018[6:5] = 00b; lock detect counter = five cycles.
Register 0x018[4] = 0b; digital lock detect window = high
range.
Register 0x018[3] = 1b; disable DLD normal operation.
Register 0x01A[5:0] = 000100b; program LD pin control to
current source lock detect mode.
Register 0x01C[4] = 1b; enable automatic switchover.
Register 0x01C[3] = 0b; prefer REF1.
Register 0x01C[2:1] = 11b; enable REF1 and REF2 input
buffers.
Register 0x01D[3] = 1b; enable LD pin comparator.
Register 0x01D[1] = 0b; disable external holdover mode and
use automatic/internal holdover mode.
Register 0x01D[0] = 1b; enable holdover.
Frequency Status Monitors
The AD9522 contains three frequency status monitors that are
used to indicate if the PLL reference (or references in the case of
single-ended mode) and the external VCO/CLK input fall below
a threshold frequency. Note that the VCO frequency monitor
becomes a CLK input frequency monitor if the CLK input is
selected instead of the internal VCO. A diagram showing their
location in the PLL is shown in Figure 49.
The PLL reference monitors have two threshold frequencies:
normal and extended (see Table 17). The reference frequency
monitor thresholds are selected in Register 0x01A[6].
VCO Calibration
The AD9522 on-chip VCO must be calibrated to ensure proper
operation over process and temperature. The VCO calibration
is controlled by a calibration controller running off a divided
REFIN clock. The calibration requires that the PLL be set up
properly to lock the PLL loop and that the REFIN clock be
present. The REFIN clock must come from a stable source
external to the AD9522.
VCO calibration can be performed two ways: automatically at
power-up and manually. Automatic VCO calibration occurs when
the EEPROM is set to automatically load the preprogrammed
values in the EEPROM and then automatically calibrate the
VCO. A valid reference must be provided at power-up in order
for the automatic calibration to complete. If this is not the case,
the user must calibrate the VCO manually.
Rev. A | Page 42 of 84
Data Sheet
AD9522-3
VS
GND
RSET
REFMON
DISTRIBUTION
REFERENCE
STATUS
REF2
STATUS
R
DIVIDER
CLOCK
DOUBLER
REF1
BUF
REFIN
BYPASS
LOW DROPOUT
REGULATOR (LDO)
LD
LOCK
DETECT
PLL
REFERENCE
REFERENCE
SWITCHOVER
OPTIONAL
REFIN
CPRSET VCP
PROGRAMMABLE
R DELAY
REF_SEL
HOLD
VCO STATUS
P, P + 1
PRESCALER
A/B
COUNTERS
PROGRAMMABLE
N DELAY
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
N DIVIDER
CLK
ZERO DELAY BLOCK
STATUS
DIVIDE BY 1,
2, 3, 4, 5, OR 6
FROM CHANNEL
DIVIDER 0
CLK
1
07224-070
LF
0
Figure 49. Reference and VCO/CLK Frequency Status Monitors
During the first initialization after a power-up or a reset of the
AD9522, a manual VCO calibration sequence is initiated by
setting Register 0x018[0] = 1b. This can be done as part of the
initial setup before executing update registers (Register 0x232[0] =
1b). Subsequent to the initial setup, a VCO calibration sequence
is initiated by resetting Register 0x018[0] = 0b, executing an update
registers operation, setting Register 0x018[0] = 1b, and
executing another update registers operation. A readback bit
(Register 0x01F[6]) indicates when a VCO calibration is finished
by returning a logic true (that is, 1b).
The sequence of operations for the VCO calibration follows:
1.
2.
3.
4.
5.
6.
7.
Program the PLL registers to the proper values for the PLL
loop. Note that the VCO divider (Register 0x1E0[2:0])
must not be set to static during VCO calibration.
For the initial setting of the registers after a power-up or
reset, initiate a VCO calibration by setting
Register 0x018[0] = 1b. Subsequently, whenever a
calibration is desired, set Register 0x018[0] = 0b, update
registers and set Register 0x018[0] = 1b, update registers.
A SYNC operation is initiated internally, causing the
outputs to go to a static state determined by normal SYNC
function operation.
VCO is calibrated to the desired setting for the requested
VCO frequency.
Internally, the SYNC signal is released, allowing outputs to
continue clocking.
The PLL loop is closed.
PLL locks.
A SYNC is executed during the VCO calibration; therefore, the
outputs of the AD9522 are held static during the calibration,
which prevents unwanted frequencies from being produced.
However, at the end of a VCO calibration, the outputs may
resume clocking before the PLL loop is completely settled.
The VCO calibration clock divider is set as shown in Table 53
(Register 0x018[2:1]).
The calibration divider divides the PFD frequency (reference
frequency divided by R) down to the calibration clock. The
calibration occurs at the PFD frequency divided by the calibration
divider setting. Lower VCO calibration clock frequencies result in
longer times for a calibration to be completed.
The VCO calibration clock frequency is given by
fCAL_CLOCK = fREFIN/(R × CAL_DIV)
where:
fREFIN is the frequency of the REFIN signal.
R is the value of the R counter.
CAL_DIV is the division set for the VCO calibration divider
(Register 0x018[2:1]).
Choose a calibration divider such that the calibration frequency
is less than 6.25 MHz. Table 30 shows the appropriate value for
the calibration divider.
Table 30. VCO Calibration Divider Values for Different
Phase Detector Frequencies
PFD Rate (MHz)
<12
12 to 25
25 to 50
50 to 100
Rev. A | Page 43 of 84
Recommended VCO Calibration Divider
Any
4, 8, 16
8, 16
16
AD9522-3
Data Sheet
The VCO calibration takes 4400 calibration clock cycles. Therefore,
the VCO calibration time in PLL reference clock cycles is given by
Time to Calibrate VCO =
4400 × R × CAL_DIV PLL Reference Clock Cycles
Initiate a VCO calibration in the following conditions:
Table 31. Example Time to Complete a VCO Calibration
with Different fREFIN Frequencies
fREFIN (MHz)
100
10
10
R Divider
1
10
100
PFD
100 MHz
1 MHz
100 kHz
In addition, because the calibration procedure results in rapid
changes in the VCO frequency, the distribution section is
automatically placed in SYNC until the calibration is finished.
Therefore, expect this temporary loss of outputs.
•
Time to Calibrate VCO
88 µs
8.8 ms
88 ms
•
The AD9522 does not automatically recalibrate its VCO when
the PLL settings change. This feature allows for flexibility in
deciding what order to program the registers and when to initiate a
calibration, instead of having it happen every time certain PLL
registers have their values change. For example, this feature
allows for the VCO frequency to be changed by small amounts
without having an automatic calibration occur each time;
however, do this with caution and only when the VCO control
voltage does not exceed the nominal best performance limits. For
example, a few 100 kHz steps are fine, but a few MHz may not be.
Rev. A | Page 44 of 84
After changing any of the PLL R, P, B, and A divider settings
or after a change in the PLL reference clock frequency. This, in
effect, means any time a PLL register or reference clock is
changed such that a different VCO frequency results.
When system calibration is desired. The VCO is designed to
operate properly over extremes of temperature even when
it is first calibrated at the opposite extreme. However, a
VCO calibration can be initiated at any time, if desired.
Data Sheet
AD9522-3
REFIN/
REFIN
R
DIVIDER
AD9522
R
DELAY
PFD
N
DIVIDER
LOOP
FILTER
CP
N
DELAY
REG 0x01E[1] = 1
MUX1
MUX3
INTERNAL FEEDBACK PATH
ZERO DELAY FEEDBACK CLOCK
LF
EXTERNAL FEEDBACK PATH
REG 0x01E[0]
DIVIDE BY 1,
2, 3, 4, 5, OR 6
ZERO DELAY
CLK/CLK
CHANNEL DIVIDER 0
OUT0 TO OUT2
CHANNEL DIVIDER 1
OUT3 TO OUT5
CHANNEL DIVIDER 2
OUT6 TO OUT8
CHANNEL DIVIDER 3
OUT9 TO OUT11
0
07224-053
1
Figure 50. Zero Delay Function
ZERO DELAY OPERATION
Zero delay operation aligns the phase of the output clocks with
the phase of the external PLL reference input. There are two
zero delay modes on the AD9522: internal and external.
Note that when the AD9522 is configured in zero delay mode
with output frequencies that are integer multiples of each other
(for example, 50 MHz, 100 MHz, 200 MHz), it is critical to use
the lowest output frequency in the feedback path of the PLL.
Otherwise, the input/output phase relationship of the lowest
frequency is not guaranteed.
Internal Zero Delay Mode
The internal zero delay function of the AD9522 is achieved by
feeding the output of Channel Divider 0 back to the PLL N
divider. In Figure 50, the change in signal routing for internal
zero delay mode is shown in blue.
Set Register 0x01E[2:1] = 01b to select internal zero delay mode.
In the default internal zero delay mode, the output of Channel
Divider 0 is routed back to the PLL (N divider) through MUX3
and MUX1 (feedback path shown in blue in Figure 50). The PLL
synchronizes the phase/edge of the output of Channel Divider 0
with the phase/edge of the reference input. External zero delay
mode must be used if Channel Divider 1, Channel Divider 2, or
Channel Divider 3 is used for zero delay feedback. This is
accomplished by changing the value in Register 0x01E[4:3].
Because the channel dividers are synchronized to each other,
the outputs of the channel divider are synchronous with the
reference input. Both the R delay and the N delay inside the
PLL can be programmed to compensate for the propagation
delay from the output drivers and PLL components to minimize
the phase offset between the clock output and the reference
input to achieve zero delay.
External Zero Delay Mode
The external zero delay function of the AD9522 is achieved by
feeding one clock output back to the CLK input and ultimately
back to the PLL N divider. In Figure 50, the change in signal
routing for external zero delay mode is shown in red.
Set Register 0x01E[2:1] = 11b to select the external zero delay
mode. In external zero delay mode, one of the twelve output
clocks (OUT0 to OUT11) can be routed back to the PLL (N
divider) through the CLK/CLK pins and through MUX3 and
MUX1. This feedback path is shown in red in Figure 50.
The user must specify which channel divider is used for
external zero delay mode in order for VCO calibration to work
correctly. Channel Divider 0 is the default. Channel Divider 1,
Channel Divider 2, or Channel Divider 3 can be selected for
zero delay feedback by changing the value in Register 0x01E[4:3].
The PLL synchronizes the phase/edge of the feedback output clock
with the phase/edge of the reference input. Because the channel
dividers are synchronized to each other, the clock outputs are
synchronous with the reference input. Both the R delay and the
N delay inside the PLL can be programmed to compensate for
the propagation delay from the PLL components to minimize the
phase offset between the feedback clock and the reference input.
Rev. A | Page 45 of 84
AD9522-3
Data Sheet
PLL
PLL
CLK
LF
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
LF
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
CLK
1
CLK
0
DISTRIBUTION
CLOCK
1
CLOCK
DISTRIBUTION
MODE 0 (INTERNAL VCO MODE)
DIVIDE BY 1,
2, 3, 4, 5, OR 6
CLK
0
DISTRIBUTION
CLOCK
1
CLOCK
DISTRIBUTION
MODE 1 (CLOCK DISTRIBUTION MODE)
0
DISTRIBUTION
CLOCK
CLOCK
DISTRIBUTION
MODE 2 (HF CLOCK DISTRIBUTION MODE)
07224-054
LF
PLL
Figure 51. Simplified Diagram of the Three Clock Distribution Operation Modes
CLOCK DISTRIBUTION
A clock channel consists of three LVDS clock outputs or six
CMOS clock outputs that share a common divider. A clock
output consists of the drivers that connect to the output pins.
The clock outputs have either LVDS or CMOS at the pins.
The AD9522 has four clock channels. Each channel has its own
programmable divider that divides the clock frequency applied
to its input. The channel dividers can divide by any integer
from 1 to 32. Divide by 1 is achieved by setting the Divider n
bypass bit (where n = 0 through 3) in the appropriate channel
divider register.
In addition, the channel dividers allow a coarse phase offset or
delay to be set. Depending on the division selected, the output
can be delayed by up to 15 input clock cycles. For example, if
the frequency at the input of the channel divider is 1 GHz, the
channel divider output can be delayed by up to 15 ns. The
divider outputs can also be set to start high or to start low.
Operation Modes
There are three clock distribution operating modes, and these
are shown in Figure 51. One of these modes uses the internal
VCO, whereas the other two modes bypass the internal VCO
and use the signal provided on the CLK/CLK pins.
The AD9522 features a VCO divider that divides the VCO output
by 1, 2, 3, 4, 5, or 6 before going to the individual channel dividers.
The VCO divider has two purposes. The first is to limit the maximum input frequency of the channel dividers to 1.6 GHz. See the
Channel Divider Maximum Frequency section for discussion of
special cases where the channel divider maximum input frequency
is >1.6 GHz. The other is to allow the AD9522 to generate
lower output frequencies than is normally possible with only a
simple post divider. External clock signals connected to the
CLK input can also use the VCO divider.
In Mode 0 (internal VCO mode), there are two signal paths
available. In the first path, the VCO signal is sent to the VCO
divider and then to the individual channel dividers. In the
second path, the user bypasses the VCO and channel dividers
and sends the VCO signal directly to the drivers.
The channel dividers allow for a selection of various duty cycles,
depending on the currently set division. That is, for any specific
division, D, the output of the divider can be set to high for N + 1
input clock cycles and low for M + 1 input clock cycles (where
D = N + M + 2). For example, a divide-by-5 can be high for one
divider input cycle and low for four cycles, or a divide-by-5 can
be high for three divider input cycles and low for two cycles.
Other combinations are also possible.
Table 32 shows how the VCO, CLK, and VCO divider are selected.
Register 0x1E1[1:0] selects the channel divider source and
determines whether the VCO divider is used. It is not possible
to select the VCO without using the VCO divider.
The channel dividers include a duty-cycle correction function
that can be disabled. In contrast to the selectable duty cycle
just described, this function can correct a non-50% duty cycle
caused by an odd division. However, this requires that the
division be set by M = N + 1. Note that the duty-cycle correction
feature is not available when the VCO divider is set to 1.
When CLK is selected as the source, it is not necessary to use the
VCO divider if the CLK frequency is less than the maximum
channel divider input frequency (1600 MHz); otherwise, the
VCO divider must be used to reduce the frequency going to
the channel dividers.
Table 32. Operation Modes
Mode
2
1
0
Rev. A | Page 46 of 84
0x1E1
[1]
[0]
0
0
0
1
1
0
1
1
Channel Divider Source
CLK
CLK
VCO
Not allowed
VCO Divider
Used
Not used
Used
Not allowed
Data Sheet
AD9522-3
Clock Frequency Division
Channel Dividers
The total frequency division is a combination of the VCO
divider (when used) and the channel divider. When the VCO
divider is used, the total division from the VCO or CLK to the
output is the product of the VCO divider (1, 2, 3, 4, 5, and 6)
and the division of the channel divider. Table 33 indicates how the
frequency division for a channel is set.
A channel divider drives each group of three LVDS outputs.
There are four channel dividers (0, 1, 2, and 3) driving 12 LVDS
outputs (OUT0 to OUT11). Table 34 gives the register locations
used for setting the division and other functions of these dividers.
The division is set by the values of M and N. The divider can be
bypassed (equivalent to divide-by-1, divider circuit is powered
down) by setting the bypass bit. The duty-cycle correction can
be enabled or disabled according to the setting of the disable
divider DCC bits.
Table 33. Frequency Division
CLK or VCO
Selected
CLK or VCO input
CLK or VCO input
CLK or VCO input
VCO Divider
Setting1
1 to 6
2 to 6
1
CLK(internal
VCO off)
CLK (internal
VCO off)
VCO divider
bypassed
VCO divider
bypassed
1
Channel
Divider
Setting
2 to 32
Bypass
Bypass
Bypass
Resulting
Frequency
Division
(1 to 6) × (2 to 32)
(2 to 6) × (1)
Output static
(illegal state)
1
2 to 32
2 to 32
Table 34. Setting DX for the Output Dividers
Divider
0
1
2
3
Low Cycles M
0x190[7:4]
0x193[7:4]
0x196[7:4]
0x199[7:4]
High Cycles N
0x190[3:0]
0x193[3:0]
0x196[3:0]
0x199[3:0]
Bypass
0x191[7]
0x194[7]
0x197[7]
0x19A[7]
Disable
Div DCC
0x192[0]
0x195[0]
0x198[0]
0x19B[0]
Channel Divider Maximum Frequency
The bypass VCO divider (Register 0x1E1[0] = 1) is not the same as VCO
divider = 1.
The channel dividers feeding the output drivers contain one
2-to-32 frequency divider. This divider provides for division-by-1
to division-by-32. Division-by-1 is accomplished by bypassing
the divider. The dividers also provide for a programmable duty
cycle, with optional duty-cycle correction when the divide ratio
is odd. A phase offset or delay in increments of the input clock
cycle is selectable. The channel dividers operate with a signal at
their inputs up to 1600 MHz. The features and settings of the
dividers are selected by programming the appropriate setup
and control registers (see Table 49 through Table 60).
The maximum frequency at which all features of the channel
divider are guaranteed to work is 1.6 GHz; this is the number that
appears elsewhere in the data sheet. However, if the divide-by-3
and divide-by-17 settings are avoided, the maximum channel
divider input frequency is 2 GHz.
Channel Frequency Division (0, 1, 2, and 3)
For each channel (where the channel number x is 0, 1, 2, or 3),
the frequency division, DX, is set by the values of M and N
(four bits each, representing Decimal 0 to Decimal 15), where
Number of Low Cycles = M + 1
Number of High Cycles = N + 1
VCO Divider
The VCO divider provides frequency division between the
internal VCO or the external CLK input and the clock
distribution channel dividers. The VCO divider can be set
to divide by 1, 2, 3, 4, 5, or 6 (see Table 56, Register 0x1E0[2:0]).
However, when the VCO divider is set to 1, none of the channel
output dividers can be bypassed.
The VCO divider can also be set to static, which is useful for
applications where the only desired output frequency is the
VCO frequency. Making the VCO divider static increases the
wide band spurious-free dynamic range (SFDR). If the VCO
divider is static during VCO calibration, there is no output
signal. Therefore, it is important to calibrate the VCO with the
VCO divider set to a nonstatic value during VCO calibration,
and then set the VCO divider to static when VCO calibration is
complete.
The recommended alternative to achieving the same SFDR
performance is to set the VCO divider to 1. This allows the user
to program the EEPROM with the desired values and does not
require further action after the VCO calibration is complete.
The high and low cycles are cycles of the clock signal currently routed
to the input of the channel dividers (VCO divider out or CLK).
When a divider is bypassed, DX = 1.
Otherwise, DX = (N + 1) + (M + 1) = N + M + 2. This allows
each channel divider to divide by any integer from 2 to 32.
Duty Cycle and Duty-Cycle Correction
The duty cycle of the clock signal at the output of a channel is a
result of some or all of the following conditions:
•
•
•
•
The M and N values for the channel
DCC enabled/disabled
VCO divider enabled/bypassed
The CLK input duty cycle (note that the internal VCO has
a 50% duty cycle)
The DCC function is enabled by default for each channel divider.
However, the DCC function can be disabled individually for
each channel divider by setting the disable divider DCC bit for
that channel.
Rev. A | Page 47 of 84
AD9522-3
Data Sheet
Certain M and N values for a channel divider result in a non50% duty cycle. A non-50% duty cycle can also result with an
even division, if M ≠ N. The duty-cycle correction function
automatically corrects non-50% duty cycles at the channel divider
output to 50% duty cycle. Note that the duty-cycle correction
feature is not available when the VCO divider is set to 1.
Duty-cycle correction requires the following channel divider
conditions:
• An even division must be set as M = N.
• An odd division must be set as M = N + 1.
• The VCO divider is not set to 1.
When not bypassed or corrected by the DCC function, the duty
cycle of each channel divider output is the numerical value of
(N + 1)/(N + M + 2) expressed as a percent.
The duty cycle at the output of the channel divider for various
configurations is shown in Table 35 to Table 38.
Table 35. Channel Divider Output Duty Cycle with VCO
Divider ≠ 1, Input Duty Cycle Is 50%
DX
VCO Divider
Even
Even, odd
N+M+2
Channel divider
bypassed
Channel divider
bypassed
Channel divider
bypassed
Even
Even, odd
Odd
Odd = 3
Odd = 5
Output Duty Cycle
Disable Div Disable Div
DCC = 1
DCC = 0
50%
50%
DX
Even
N+M+2
Channel
divider
bypassed
Channel
divider
bypassed
Channel
divider
bypassed
Even
Even
Odd
Odd = 3
Even
Odd = 3
Odd
Odd = 3
50%
40%
50%
(N + 1)/
(N + M + 2)
(N + 1)/
(N + M + 2)
50%, requires
M=N
50%, requires
M=N+1
Odd = 5
Output Duty Cycle
Disable Div
DCC = 1
Disable Div DCC = 0
50%
50%
33.3%
(2 + X%)/5
(N + 1)/
(N + M + 2)
(N + 1)/
(N + M + 2)
(N + 1)/
(N + M + 2)
(N + 1)/
(N + M + 2)
50%, requires M = N
(3N + 4 + X%)/(6N + 9),
requires M = N + 1
Odd
Table 37. Channel Divider Output Duty Cycle When the
VCO Divider Is Enabled and Set to 1
DX
Input
Clock
Duty Cycle
Any
N+M+2
Even
50%
Odd
X%
Odd
Output Duty Cycle
Disable Div
DCC = 1
Disable Div DCC = 0
(N + 1)/
50%, requires M = N
(M + N + 2)
(N + 1)/
(N + 1)/(M + N + 2)
(M + N + 2)
(N + 1)/
(N + 1 + X%)/(2 × N + 3),
(M + N + 2)
requires M = N + 1
Note that the channel divider must be enabled when the VCO
divider = 1.
Table 38. Channel Divider Output Duty Cycle When the
VCO Divider Is Bypassed
DX
Any
N+M+2
Channel
divider
bypassed
Even
50%
Odd
X%
Odd
Output Duty Cycle
Disable Div
DCC = 1
Disable Div DCC = 0
Same as input Same as input duty
duty cycle
cycle
(N + 1)/
(M + N + 2)
(N + 1)/
(M + N + 2)
(N + 1)/
(M + N + 2)
50%, requires M = N
50%, requires M = N + 1
(N + 1 + X%)/(2 × N + 3),
requires M = N + 1
Phase Offset or Coarse Time Delay
50%, requires M = N + 1
50%, requires M = N
Odd = 5
Output Duty Cycle
Disable Div
DCC = 1
Disable Div DCC = 0
(N + 1)/
50%, requires M = N
(N + M + 2)
(N + 1)/
(5N + 7 + X%)/(10N + 15),
(N + M + 2)
requires M = N + 1
The internal VCO has a duty cycle of 50%. Therefore, when the
VCO divider equals 1, the duty cycle is 50%. If the CLK input is
routed directly to the output, the duty cycle of the output is the
same as the CLK input.
(1 + X%)/3
40%
N+M+2
Even
Input
Clock
Duty Cycle
Any
33.3%
Table 36. Channel Divider Output Duty Cycle with VCO
Divider ≠ 1, Input Duty Cycle Is X%
VCO
Divider
Even
DX
VCO
Divider
Odd = 5
Each channel divider allows for a phase offset, or a coarse time
delay, to be programmed by setting register bits (see Table 39).
These settings determine the number of cycles (successive rising
edges) of the channel divider input frequency by which to offset, or
delay, the rising edge of the output of the divider. This delay is
with respect to a nondelayed output (that is, with a phase offset
of zero). The amount of the delay is set by five bits loaded into
the phase offset (PO) register plus the start high (SH) bit for
each channel divider. When the start high bit is set, the delay is
also affected by the number of low cycles (M) programmed for
the divider.
It is necessary to use the SYNC function to make phase offsets
effective (see the Synchronizing the Outputs— Function section).
Rev. A | Page 48 of 84
Data Sheet
AD9522-3
Synchronization of the outputs is executed in the following ways:
Table 39. Setting Phase Offset and Division
Divider
0
1
2
3
Start
High (SH)
0x191[4]
0x194[4]
0x197[4]
0x19A[4]
Phase
Offset (PO)
0x191[3:0]
0x194[3:0]
0x197[3:0]
0x19A[3:0]
Low Cycles
M
0x190[7:4]
0x193[7:4]
0x196[7:4]
0x199[7:4]
High Cycles
N
0x190[3:0]
0x193[3:0]
0x196[3:0]
0x199[3:0]
Let
Δt = delay (in seconds).
Δc = delay (in cycles of clock signal at input to DX).
TX = period of the clock signal at the input of the divider, DX (in
seconds).
Φ=
16 × SH[4] + 8 × PO[3] + 4 × PO[2] + 2 × PO[1] + 1 × PO[0]
The channel divide by is set as N = high cycles and M = low
cycles.
For Φ ≤ 15,
Δt = Φ × TX
Δc = Δt/TX = Φ
Case 2
For Φ ≥ 16,
Δt = (Φ − 16 + M + 1) × TX
Δc = Δt/TX
By giving each divider a different phase offset, output-to-output
delays can be set in increments of the channel divider input
clock cycle. Figure 52 shows the results of setting such a coarse
offset between outputs.
0
1
2
Tx
3
4
5
6
7
8
9
10 11 12 13 14 15
CHANNEL DIVIDER OUTPUTS
DIV = 4, DUTY = 50%
SH = 0
PO = 1
DIVIDER 2
SH = 0
PO = 2
07224-071
SH = 0
DIVIDER 0 PO = 0
DIVIDER 1




The SYNC pin is forced low and then released (manual sync).
By setting and then resetting any one of the following three
bits: the soft SYNC bit (Register 0x230[0]), the soft reset bit
(Register 0x000[5] [mirrored]), and the power-down
distribution reference bit (Register 0x230[1]).
Synchronization of the outputs can be executed as part of
the chip power-up sequence.
The RESET pin is forced low and then released (chip reset).
The PD pin is forced low and then released (chip powerdown).
Whenever a VCO calibration is completed, an internal
SYNC signal is automatically asserted at the beginning and
released upon the completion of a VCO calibration.
The most common way to execute the SYNC function is to use
the SYNC pin to perform a manual synchronization of the outputs.
This requires a low going signal on the SYNC pin, which is held
low and then released when synchronization is desired. The
timing of the SYNC operation is shown in Figure 54 (using the
VCO divider) and in Figure 55 (the VCO divider is not used).
There is an uncertainty of up to one cycle of the clock at the
input to the channel divider due to the asynchronous nature of
the SYNC signal with respect to the clock edges inside the
AD9522.
Case 1
CHANNEL
DIVIDER INPUT


1 × Tx
2 × Tx
Figure 52. Effect of Coarse Phase Offset (or Delay)
Synchronizing the Outputs—SYNC Function
The AD9522 clock outputs can be synchronized to each other.
Outputs can be individually excluded from synchronization.
Synchronization consists of setting the nonexcluded outputs to
a preset set of static conditions. These conditions include the
divider ratio and phase offsets for a given channel divider. This
allows the user to specify different divide ratios and phase offsets
for each of the four channel dividers. Releasing the SYNC pin
allows the outputs to continue clocking with the preset conditions
applied.
The pipeline delay from the SYNC rising edge to the beginning
of the synchronized output clocking is between 14 cycles and
15 cycles of clock at the channel divider input, plus one cycle of
the VCO divider input (see Figure 54) or one cycle of the channel
divider input (see Figure 55), depending on whether the VCO
divider is used. Cycles are counted from the rising edge of the
signal. In addition, there is an additional 1.2 ns (typical) delay from
the SYNC signal to the internal synchronization logic, as well as
the propagation delay of the output driver. The driver propagation
delay is approximately 100 ps for the LVDS driver and
approximately 1.5 ns for the CMOS driver.
Another common way to execute the SYNC function is by
setting and resetting the soft SYNC bit at Register 0x230[0]. Both
setting and resetting of the soft SYNC bit require an update all
registers (Register 0x232[0] = 1b) operation to take effect.
A SYNC operation brings all outputs that are not excluded (by the
ignore SYNC bit) to a preset condition before allowing the outputs
to begin clocking in synchronicity. The preset condition takes into
account the settings in each of the channel’s start high bit and its
phase offset. These settings govern both the static state of each
output when the SYNC operation is happening and the state
and relative phase of the outputs when they begin clocking
again upon completion of the SYNC operation. A SYNC operation
must take place for the phase offsets setting to take effect.
Rev. A | Page 49 of 84
AD9522-3
Data Sheet
The AD9522 differential LVDS outputs are four groups of three,
sharing a channel divider per triplet. In the case of CMOS, each
LVDS differential pair can be configured as two single-ended
CMOS outputs. The synchronization conditions apply to all of
the drivers that belong to that channel divider.
The LVDS output polarity can be set as noninverting or
inverting, which allows for the adjustment of the relative
polarity of outputs within an application without requiring a
board layout change. Each LVDS output can be individually
powered down to save power.
Each channel (a divider and its outputs) can be excluded from
any SYNC operation by setting the ignore SYNC bit of the channel.
Channels that are set to ignore SYNC (excluded channels) do
not set their outputs static during a SYNC operation, and their
outputs are not synchronized with those of the included channels.
3.5mA
OUT
OUT
The AD9522 output drivers can be configured as either an
LVDS differential output or as a pair of CMOS single-ended
outputs. The LVDS outputs allow for selectable output current
from ~1.75 mA to ~7 mA.
CHANNEL DIVIDER
OUTPUT CLOCKING
07224-134
LVDS Output Drivers
3.5mA
Figure 53. LVDS Output Simplified Equivalent Circuit with
3.5 mA Typical Current Source
CHANNEL DIVIDER
OUTPUT CLOCKING
CHANNEL DIVIDER OUTPUT STATIC
INPUT TO VCO DIVIDER
1
1
INPUT TO CHANNEL DIVIDER
2
3
4
5
6
7
9
8
11
10
12
13
14
SYNC PIN
OUTPUT OF
CHANNEL DIVIDER
07224-073
14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT VCO DIVIDER INPUT
Figure 54. SYNC Timing Pipeline Delay When the VCO Divider Is Used—CLK or VCO Is Input
CHANNEL DIVIDER
OUTPUT CLOCKING
CHANNEL DIVIDER
OUTPUT CLOCKING
CHANNEL DIVIDER OUTPUT STATIC
INPUT TO CLK
INPUT TO CHANNEL DIVIDER
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SYNC PIN
OUTPUT OF
CHANNEL DIVIDER
07224-074
14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT CLK INPUT
Figure 55. SYNC Timing Pipeline Delay When the VCO Divider Is Not Used—CLK Input Only
Rev. A | Page 50 of 84
Data Sheet
AD9522-3
CMOS Output Drivers
Soft Reset via the Serial Port
The user can also individually configure each LVDS output as a
pair of CMOS outputs, which provides up to 24 CMOS outputs.
When an output is configured as CMOS, CMOS Output A
and CMOS Output B are automatically turned on. For a given
differential pair, either CMOS Output A or Output B can be
turned on or off independently. The user can also select the
relative polarity of the CMOS outputs for any combination of
inverting and noninverting (see Register 0x0F0 to Register 0x0FB).
The serial port control register allows for a soft reset by setting
Bit 2 and Bit 5 in Register 0x000. The function of this register is
determined by the state of the EEPROM pin.
The user can power down each CMOS output as needed to save
power. The CMOS output power-down is individually controlled
by the enable CMOS output register (Registe r0x0F0[6:5] to
Register 0x0FB[6:5]). The CMOS driver is in tristate when it is
powered down.
VS_DRV
When Bit 2 and Bit 5 are set and the EEPROM pin is high, the
chip is restored to the settings saved in the EEPROM. When Bit 2
and Bit 5 are set and the EEPROM pin is low, the chip is restored to
the on-chip defaults.
Except for the self-clearing bits, Bit 2 and Bit 5, Register 0x000
retains its previous value prior to reset. During the internal reset,
the outputs hold static. However, the self-clearing operation
does not complete until an additional serial port SCLK cycle
occurs, and the AD9522 is held in reset until that happens.
Soft Reset to Settings in EEPROM when EEPROM Pin = 0 via
the Serial Port
The serial port control register allows the chip to be reset to settings
in EEPROM when the EEPROM pin = 1 via Register 0xB02[1].
This bit is self-clearing. This bit does not have any effect when
the EEPROM pin = 0. It takes ~20 ms for the outputs to begin
toggling after the SOFT_EEPROM register is cleared.
07224-035
OUT1/
OUT1
Figure 56. CMOS Equivalent Output Circuit
POWER-DOWN MODES
RESET MODES
Chip Power-Down via PD
The AD9522 has a power-on reset (POR) and several other
ways to apply a reset condition to the chip.
The AD9522 can be put into a power-down condition by pulling
the PD pin low. Power-down turns off most of the functions and
currents inside the AD9522. The chip remains in this power-down
state until PD is brought back to logic high. When taken out of
power-down mode, the AD9522 returns to the settings programmed
into its registers prior to the power-down, unless the registers
are changed by new programming while the PD pin is held low.
Power-On Reset
During chip power-up, a power-on reset pulse is issued when
VS reaches ~2.6 V (<2.8 V) and restores the chip either to the
setting stored in EEPROM (with the EEPROM pin = 1) or to
the on-chip setting (with the EEPROM pin = 0). At power-on,
the AD9522 also executes a SYNC operation, ~50 ms after the
supply reaches ~2.4 V, which brings the outputs into phase
alignment according to the default settings. It takes ~70 ms for
the outputs to begin toggling after the power-on reset pulse
signal is internally generated.
Hardware Reset via the RESET Pin
RESET, a hard reset (an asynchronous hard reset is executed by
briefly pulling RESET low), restores the chip either to the setting
stored in EEPROM (the EEPROM pin = 1b) or to the on-chip
setting (the EEPROM pin = 0b). A hard reset also executes a
SYNC operation, bringing the outputs into phase alignment
according to the default settings. When EEPROM is inactive
(the EEPROM pin = 0b), it takes ~2 µs for the outputs to begin
toggling after RESET is issued. When EEPROM is active (the
EEPROM pin = 1b), it takes ~20 ms for the outputs to toggle after
RESET is brought high.
Powering down the chip shuts down the currents on the chip.
Because this is not a complete power-down, it can be called sleep
mode. The AD9522 contains special circuitry to prevent runt
pulses on the outputs when the chip is entering or exiting sleep
mode.
When the AD9522 is in a PD power-down, the chip is in the
following state:
•
•
•
•
•
•
•
•
•
Rev. A | Page 51 of 84
The PLL is off (asynchronous power-down).
The VCO is off.
The CLK input buffer is off, but the CLK input dc bias
circuit is on.
In differential mode, the reference input buffer is off, but
the dc bias circuit is still on.
In singled-ended mode, the reference input buffer is off,
and the dc bias circuit is off.
All dividers are off.
All CMOS outputs are tristated.
All LVDS outputs are in power-down (high impedance)
mode.
The serial control port is active, and the chip responds to
commands.
AD9522-3
Data Sheet
PLL Power-Down
Individual Clock Output Power-Down
The PLL section of the AD9522 can be selectively powered
down. There are two PLL power-down modes set by
Register 0x010[1:0]: asynchronous and synchronous.
Any of the clock distribution outputs can be put
into power-down mode by individually writing to the
appropriate registers. The register map details the individual
power-down settings for each output. These settings are found
in Register 0x0F0[0] to Register 0x0FB[0].
In asynchronous power-down mode, the device powers down as
soon as the registers are updated. In synchronous power-down
mode, the PLL power-down is gated by the charge pump to
prevent unwanted frequency jumps. The device goes into powerdown on the occurrence of the next charge pump event after the
registers are updated.
Distribution Power-Down
The distribution section can be powered down by writing
Register 0x230[1] = 1b, which turns off the bias to the
distribution section. If the LVDS power-down mode is normal
operation (0b), it is possible for a low impedance load on that
LVDS output to draw significant current during this powerdown. If the LVDS power-down mode is set to 1b, the LVDS
output is not protected from reverse bias and can be damaged
under certain termination conditions.
Individual Clock Channel Power-Down
Any of the clock distribution channels can be powered down
individually by writing to the appropriate registers. Powering
down a clock channel is similar to powering down an individual
driver, but it saves more power because the dividers are also
powered down. Powering down a clock channel also automatically
powers down the drivers connected to it. The register map
details the individual power-down settings for each output
channel. These settings are found in Register 0x192[2],
Register 0x195[2], Register 0x198[2], and Register 0x19B[2].
Rev. A | Page 52 of 84
Data Sheet
AD9522-3
SERIAL CONTROL PORT
The AD9522 serial control port is a flexible, synchronous serial
communications port that allows an easy interface with many
industry-standard microcontrollers and microprocessors. The
AD9522 serial control port is compatible with most synchronous
transfer formats, including Philips I2C, Motorola® SPI®, and
Intel® SSR protocols. The AD9522 I2C implementation deviates
from the classic I2C specification on two specifications, and
these deviations are documented in Table 14 of this data sheet.
The serial control port allows read/write access to all registers
that configure the AD9522.
SPI/I²C PORT SELECTION
The AD9522 has two serial interfaces, SPI and I2C. Users can
select either SPI or I2C depending on the states of the three
logic level (high, open, low) input pins, SP1 and SP0. When
both SP1 and SP0 are high, the SPI interface is active. Otherwise,
I2C is active with eight different I2C slave address (seven bits
wide) settings, see Table 40. The four MSBs of the slave address
are hardware coded as 1011, and the three LSBs are programmed
by SP1 and SP0.
I2C Bus Characteristics
Table 41. I2C Bus Definitions
Abbreviation
S
Sr
P
A
A
W
R
Definition
Start
Repeated start
Stop
Acknowledge
No acknowledge
Write
Read
One pulse on the SCL clock line is generated for each data bit
transferred.
The data on the SDA line must not change during the high
period of the clock. The state of the data line can change only when
the clock on the SCL line is low.
DATA LINE
STABLE;
DATA VALID
CHANGE
OF DATA
ALLOWED
SDA
SP1
Low
Low
Low
Open
Open
Open
High
High
High
SP0
Low
Open
High
Low
Open
High
Low
Open
High
Address
I²C, 1011000
I²C, 1011001
I²C, 1011010
I²C, 1011011
I²C, 1011100
I²C, 1011101
I²C, 1011110
I²C, 1011111
SPI
07224-160
Table 40. Serial Port Mode Selection
SCL
Figure 57. Valid Bit Transfer
A start condition is a transition from high to low on the SDA
line while SCL is high. The start condition is always generated
by the master to initialize the data transfer.
A stop condition is a transition from low to high on the SDA
line while SCL is high. The stop condition is always generated
by the master to end the data transfer.
SDA
The AD9522 I2C port is based on the I2C fast mode standard.
The AD9522 supports both I2C protocols: standard mode
(100 kHz) and fast mode (400 kHz).
The AD9522 I2C port has a 2-wire interface consisting of a serial
data line (SDA) and a serial clock line (SCL). In an I2C bus system,
the AD9522 is connected to the serial bus (data bus SDA and
clock bus SCL) as a slave device, meaning that no clock is generated
by the AD9522. The AD9522 uses direct 16-bit (two bytes)
memory addressing instead of traditional 8-bit (one byte) memory
addressing.
SCL
S
P
START
CONDITION
STOP
CONDITION
07224-161
I²C SERIAL PORT OPERATION
Figure 58. Start and Stop Conditions
A byte on the SDA line is always eight bits long. An acknowledge
bit must follow every byte. Bytes are sent MSB first.
The acknowledge bit is the ninth bit attached to any 8-bit data
byte. An acknowledge bit is always generated by the receiving
device (receiver) to inform the transmitter that the byte has
been received. It is accomplished by pulling the SDA line low
during the ninth clock pulse after each 8-bit data byte.
Rev. A | Page 53 of 84
AD9522-3
MSB
ACKNOWLEDGE FROM
SLAVE-RECEIVER
1
SCL
2
3 TO 7
8
9
1
ACKNOWLEDGE FROM
SLAVE-RECEIVER
2
3 TO 7
8
9
S
10
P
07224-162
SDA
Data Sheet
Figure 59. Acknowledge Bit
MSB = 0
1
SCL
2
3 TO 7
8
9
1
ACKNOWLEDGE FROM
SLAVE-RECEIVER
2
3 TO 7
8
9
S
10
P
07224-163
ACKNOWLEDGE FROM
SLAVE-RECEIVER
10
P
07224-164
SDA
Figure 60. Data Transfer Process (Master Write Mode, 2-Byte Transfer Used for Illustration)
MSB = 1
SDA
ACKNOWLEDGE FROM
MASTER-RECEIVER
1
SCL
2
3 TO 7
8
9
1
NO ACKNOWLEDGE
FROM
SLAVE-RECEIVER
2
3 TO 7
8
S
9
Figure 61. Data Transfer Process (Master Read Mode, 2-Byte Transfer Used for Illustration)
The no acknowledge bit is the ninth bit attached to any 8-bit
data byte. A no acknowledge bit is always generated by the
receiving device (receiver) to inform the transmitter that the
byte has not been received. It is done by leaving the SDA line
high during the ninth clock pulse after each 8-bit data byte.
Data Transfer Process
The master initiates data transfer by asserting a start condition.
This indicates that a data stream follows. All I2C slave devices
connected to the serial bus respond to the start condition.
The master then sends an 8-bit address byte over the SDA line,
consisting of a 7-bit slave address (MSB first) plus an R/W bit.
This bit determines the direction of the data transfer, that is,
whether data is written to or read from the slave device
(0 = write, 1 = read).
The peripheral whose address corresponds to the transmitted
address responds by sending an acknowledge bit. All other
devices on the bus remain idle while the selected device waits
for data to be read from or written to it. If the R/W bit is 0, the
master (transmitter) writes to the slave device (receiver). If the
R/W bit is 1, the master (receiver) reads from the slave device
(transmitter).
The format for these commands is described in the Data
Transfer Format section.
Data is then sent over the serial bus in the format of nine clock
pulses, one data byte (8-bit) from either master (write mode) or
slave (read mode) followed by an acknowledge bit from the
receiving device. The number of bytes that can be transmitted per
transfer is unrestricted. In write mode, the first two data bytes
immediately after the slave address byte are the internal
memory (control registers) address bytes with the high address
byte first. This addressing scheme gives a memory address up to
216 − 1 = 65,535. The data bytes after these two memory address
bytes are register data written into the control registers. In read
mode, the data bytes after the slave address byte are register
data read from the control registers.
When all data bytes are read or written, stop conditions are
established. In write mode, the master (transmitter) asserts a
stop condition to end data transfer during the 10th clock pulse
following the acknowledge bit for the last data byte from the
slave device (receiver). In read mode, the master device (receiver)
receives the last data byte from the slave device (transmitter)
but does not pull it low during the ninth clock pulse. This is
known as a no acknowledge bit. By receiving the no acknowledge
bit, the slave device knows that the data transfer is finished and
releases the SDA line. The master then takes the data line low
during the low period before the 10th clock pulse and high
during the 10th clock pulse to assert a stop condition.
A repeated start (Sr) condition can be used in place of a stop
condition. Furthermore, a start or stop condition can occur at
any time, and partially transferred bytes are discarded.
Rev. A | Page 54 of 84
Data Sheet
AD9522-3
Data Transfer Format
Send byte format—the send byte protocol is used to set up the register address for subsequent commands.
S
Slave Address
W
A
RAM Address High Byte
A
RAM Address Low Byte
A
P
Write byte format—the write byte protocol is used to write a register address to the RAM starting from the specified RAM address.
S
Slave Address
W
A
RAM Address
High Byte
A
RAM Address
Low Byte
A
RAM Data 0
A
RAM Data 1
A
RAM Data 2
A
P
Receive byte format—the receive byte protocol is used to read the data byte(s) from RAM starting from the current address.
S
Slave Address
R
A
RAM Data 0
A
RAM Data 1
A
A
RAM Data 2
P
Read byte format—the combined format of the send byte and the receive byte.
S
Slave
Address
W
RAM Address
High Byte
A
A
RAM Address
Low Byte
A
Sr
Slave
Address
R
A
RAM
Data 0
A
RAM
Data 1
A
RAM
Data 2
A
I²C Serial Port Timing
SDA
tSET; DAT
tFALL
tLOW
tFALL
tHLD; STR
tRISE
tSPIKE
tRISE
tIDLE
tHLD; STR
tHLD; DAT
S
tHIGH
tSET; STP
tSET; STR
Sr
Figure 62. I²C Serial Port Timing
Table 42. I2C Timing Definitions
Parameter
fI2C
tIDLE
tHLD; STR
tSET; STR
tSET; STP
tHLD; DAT
tSET; DAT
tLOW
tHIGH
tRISE
tFALL
tSPIKE
Description
I²C clock frequency
Bus idle time between stop and start conditions
Hold time for repeated start condition
Setup time for repeated start condition
Setup time for stop condition
Hold time for data
Setup time for data
Duration of SCL clock low
Duration of SCL clock high
SCL/SDA rise time
SCL/SDA fall time
Voltage spike pulse width that must be suppressed by the input filter
Rev. A | Page 55 of 84
P
S
07224-165
SCL
P
AD9522-3
Data Sheet
SPI SERIAL PORT OPERATION
Pin Descriptions
SCLK (serial clock) is the serial shift clock. This pin is an input.
SCLK is used to synchronize serial control port reads and writes.
Write data bits are registered on the rising edge of this clock.
The read data bits transition on the falling edge of SCLK. This
pin is internally pulled down by a 30 kΩ resistor to ground.
SDIO (serial data input/output) is a dual-purpose pin and acts
either as an input only (unidirectional mode) or as an input/
output (bidirectional mode). The AD9522 defaults to the
bidirectional I/O mode (Register 0x000[7] = 0b).
SDO (serial data out) is used only in the unidirectional I/O mode
(Register 0x000[7] = 1b) as a separate output pin for reading back
data.
CS (chip select bar) is an active low control that gates the read
and write cycles. When CS is high, SDO and SDIO are in a high
impedance state. This pin is internally pulled up by a 30 kΩ
resistor to VS.
15
16
SDIO/SDA
17
SDO
18
AD9522
SERIAL
CONTROL
PORT
07224-036
CS
SCLK/SCL
Figure 63. Serial Control Port
SPI Mode Operation
In SPI mode, single or multiple byte transfers are supported, as
well as MSB first or LSB first transfer formats. The AD9522
serial control port can be configured for a single bidirectional
I/O pin (SDIO only) or for two unidirectional I/O pins (SDIO/
SDO). By default, the AD9522 is in bidirectional mode. Short
instruction mode (8-bit instructions) is not supported. Only
long (16-bit) instruction mode is supported. It is possible that
serial activity on the SDIO/SDO pins may induce jitter on the
PLL while data is transmitted.
A write or a read operation to the AD9522 is initiated by pulling
CS low.
The CS stalled high mode is supported in data transfers where
three or fewer bytes of data (plus instruction data) are transferred
(see Table 43). In this mode, the CS pin can temporarily return
high on any byte boundary, allowing time for the system controller
to process the next byte. CS can go high on byte boundaries only
and can go high during either part (instruction or data) of the
transfer.
During this period, the serial control port state machine enters
a wait state until all data is sent. If the system controller decides
to abort the transfer before all of the data is sent, the state machine
must be reset by either completing the remaining transfers or by
returning CS low for at least one complete SCLK cycle (but
fewer than eight SCLK cycles). Raising the CS pin on a nonbyte
boundary terminates the serial transfer and flushes the buffer.
In the streaming mode (see Table 43), any number of data bytes
can be transferred in a continuous stream. The register address
is automatically incremented or decremented (see the SPI
MSB/LSB First Transfers section). CS must be raised at the end
of the last byte to be transferred, thereby ending streaming mode.
Communication Cycle—Instruction Plus Data
There are two parts to a communication cycle with the AD9522.
The first part writes a 16-bit instruction word into the AD9522,
coincident with the first 16 SCLK rising edges. The instruction
word provides the AD9522 serial control port with information
regarding the data transfer, which is the second part of the
communication cycle. The instruction word defines whether
the upcoming data transfer is a read or a write, the number of
bytes in the data transfer, and the starting register address for
the first byte of the data transfer.
Write
If the instruction word is for a write operation, the second part
is the transfer of data into the serial control port buffer of the
AD9522. Data bits are registered on the rising edge of SCLK.
The length of the transfer (one, two, or three bytes, or streaming
mode) is indicated by two bits (W1:W0) in the instruction byte.
When the transfer is one, two, or three bytes, but not streaming,
CS can be raised after each sequence of eight bits to stall the bus
(except after the last byte, where it ends the cycle). When the bus
is stalled, the serial transfer resumes when CS is lowered. Raising
the CS pin on a nonbyte boundary resets the serial control port.
During a write, streaming mode does not skip over reserved or
blank registers, and the user can write 0x00 to the reserved
register addresses.
Because data is written into a serial control port buffer area, not
directly into the actual control registers of the AD9522, an
additional operation is needed to transfer the serial control port
buffer contents to the actual control registers of the AD9522,
thereby causing them to become active. The update registers
operation consists of setting Register 0x232[0] = 1b (this bit is
self-clearing). Any number of bytes of data can be changed
before executing an update registers operation. The update
registers operation simultaneously actuates all register changes
that have been written to the buffer since any previous update.
Read
The AD9522 supports only the long instruction mode. If the
instruction word is for a read operation, the next N × 8 SCLK
cycles clock out the data from the address specified in the
instruction word, where N is 1 to 3 as determined by W1:W0.
If N = 4, the read operation is in streaming mode, continuing
until CS is raised. Streaming mode does not skip over reserved
or blank registers. The readback data is valid on the falling
edge of SCLK.
Rev. A | Page 56 of 84
Data Sheet
AD9522-3
The default mode of the AD9522 serial control port is the
bidirectional mode. In bidirectional mode, both the sent data
and the readback data appear on the SDIO pin. It is also possible to
set the AD9522 to unidirectional mode (Register 0x000[7] = 1
and Register 0x000[0] = 1). In unidirectional mode, the
readback data appears on the SDO pin.
A readback request reads the data that is in the serial control
port buffer area or the data that is in the active registers (see
Figure 64). Readback of the buffer or active registers is controlled
by Register 0x004[0].
SDO
SERIAL
CONTROL
PORT
UPDATE
REGISTERS
WRITE REGISTER 0x232 = 0x001
TO UPDATE REGISTERS
07224-037
SDIO/SDA
Figure 64. Relationship Between Serial Control Port Buffer Registers and
Active Registers of the AD9522
SPI INSTRUCTION WORD (16 BITS)
The MSB of the instruction word is R/W, which indicates
whether the instruction is a read or a write. The next two bits
(W1:W0) indicate the length of the transfer in bytes. The final
13 bits are the address (A12:A0) at which to begin the read or
write operation.
For a write, the instruction word is followed by the number of
bytes of data indicated by Bits[W1:W0], see Table 43.
Table 43. Byte Transfer Count
W1
0
0
1
1
W0
0
1
0
1
The AD9522 instruction word and byte data can be MSB first
or LSB first. Any data written to Register 0x000 must be mirrored;
the upper four bits ([7:4]) must mirror the lower four bits ([3:0]).
This makes it irrelevant whether LSB first or MSB first is in
effect. As an example of this mirroring, see the default setting
for Register 0x000, which mirrors Bit 4 and Bit 3. This sets the
long instruction mode, which is the default and the only mode
supported.
The default for the AD9522 is MSB first.
When LSB first is set by Register 0x000[1] and Register 0x000[6], it
takes effect immediately because it only affects the operation of
the serial control port and does not require that an update be
executed.
ACTIVE REGISTERS
CS
SCLK/SCL
BUFFER REGISTERS
The AD9522 uses Register Address 0x000 to Register
Address 0xB03.
SPI MSB/LSB FIRST TRANSFERS
Bytes to Transfer
1
2
3
Streaming mode
When MSB first mode is active, the instruction and data bytes
must be written from MSB to LSB. Multibyte data transfers in
MSB first format start with an instruction byte that includes the
register address of the most significant data byte. Subsequent
data bytes must follow in order from the high address to the
low address. In MSB first mode, the serial control port internal
address generator decrements for each data byte of the multibyte
transfer cycle.
When LSB first is active, the instruction and data bytes must be
written from LSB to MSB. Multibyte data transfers in LSB first
format start with an instruction byte that includes the register
address of the least significant data byte followed by multiple
data bytes. In a multibyte transfer cycle, the internal byte
address generator of the serial port increments for each byte.
The AD9522 serial control port register address decrements
from the register address just written toward 0x000 for multibyte
I/O operations if the MSB first mode is active (default). If the
LSB first mode is active, the register address of the serial control
port increments from the address just written toward
Register 0x232 for multibyte I/O operations.
Streaming mode always terminates when it reaches Register 0x232.
Note that unused addresses are not skipped during multibyte
I/O operations.
Bits[A12:A0] select the address within the register map that is
written to or read from during the data transfer portion of the
communications cycle. For multibyte transfers, this address is
the starting byte address. In MSB first mode, subsequent bytes
decrement the address.
Table 44. Streaming Mode (No Addresses Are Skipped)
Write Mode
LSB first
MSB first
Rev. A | Page 57 of 84
Address Direction
Increment
Decrement
Stop Sequence
0x230, 0x231, 0x232, stop
0x001, 0x000, 0x232, stop
AD9522-3
Data Sheet
Table 45. Serial Control Port, 16-Bit Instruction Word, MSB First
MSB
I15
I14
I13
I12
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
LSB
R/W
W1
W0
A12 = 0
A11 = 0
A10 = 0
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
CS
SCLK DON'T CARE
R/W W1 W0 A12 A11 A10 A9
A8
A7
A6 A5
A4 A3 A2
A1 A0
D7 D6 D5
16-BIT INSTRUCTION HEADER
D4 D3
D2 D1
D0
D7
D6 D5
REGISTER (N) DATA
D4 D3 D2
D1 D0
DON'T CARE
REGISTER (N – 1) DATA
07224-038
SDIO DON'T CARE
DON'T CARE
Figure 65. Serial Control Port Write—MSB First, 16-Bit Instruction, Two Bytes of Data
tDH
tHIGH
SCLK
DON'T CARE
SDIO
DON'T CARE
R/W
W1
W0
A12
tC
tCLK
tLOW
CS
A11
A10
A9
A0
HIGH IMPEDANCE
SDO
DON’T CARE
D7
D6
16-BIT INSTRUCTION HEADER
D5
D4
D3
D2
D1
D0
HIGH IMPEDANCE
07224-039
tDS
tS
REGISTER (N) DATA
Figure 66. Serial Control Port Read—MSB First, 16-Bit Instruction, Four Bytes of Data
tHIGH
tDS
tS
DON'T CARE
SDIO
DON'T CARE
tLOW
DON'T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
A6
A5
D4
D3
D2
D1
D0
DON'T CARE
07224-040
SCLK
tC
tCLK
tDH
CS
Figure 67. Serial Control Port Read—MSB First, 16-Bit Instruction, Timing Measurements
CS
SCLK
DATA BIT N
DATA BIT N – 1
DATA
BIT 0
DATA BIT 1
HIGH IMPEDANCE
07224-041
tDV
SDIO (3-WIRE MODE)
SDO (4-WIRE MODE)
Figure 68. Timing Diagram for Serial Control Port Register Read
CS
SCLK DON'T CARE
A0 A1 A2 A3
A4
A5 A6 A7
A8
A9 A10 A11 A12 W0 W1 R/W D0 D1 D2 D3 D4
16-BIT INSTRUCTION HEADER
D5 D6
REGISTER (N) DATA
D7
D0
D1 D2
D6
REGISTER (N + 1) DATA
Figure 69. Serial Control Port Write—LSB First, 16-Bit Instruction, Two Bytes of Data
Rev. A | Page 58 of 84
D3 D4 D5
D7
DON'T CARE
07224-042
SDIO DON'T CARE
DON'T CARE
Data Sheet
AD9522-3
tS
tC
CS
tCLK
tHIGH
SCLK
tLOW
tDS
SDIO
BIT N
BIT N + 1
Figure 70. Serial Control Port Timing—Write
Table 46. Serial Control Port Timing
Parameter
tDS
tDH
tCLK
tS
tC
tHIGH
tLOW
tDV
Description
Setup time between data and rising edge of SCLK
Hold time between data and rising edge of SCLK
Period of the clock
Setup time between the CS falling edge and SCLK rising edge (start of communication cycle)
Setup time between SCLK rising edge and the CS rising edge (end of communication cycle)
Minimum period that SCLK must be in a logic high state
Minimum period that SCLK must be in a logic low state
SCLK to valid SDIO and SDO (see Figure 68)
Rev. A | Page 59 of 84
07224-043
tDH
AD9522-3
Data Sheet
EEPROM OPERATIONS
The AD9522 contains an internal EEPROM (nonvolatile memory).
The EEPROM can be programmed by users to create and store
a user-defined register setting file when the power is off. This
setting file can be used for power-up and chip reset as a default
setting. The EEPROM size is 512 bytes.
To guarantee proper loading of the EEPROM during startup, a
high-low-high pulse on the RESET pin must occur after the
power supply stabilizes.
During the data transfer process, the write and read registers via
the serial port are generally not available except for one readback
register, STATUS_EEPROM.
To determine the data transfer state through the serial port
in SPI mode, users can read the value of STATUS_EEPROM
(1 = in process and 0 = completed).
In I²C mode, the user can address the AD9522 slave port with
the external I²C master (send an address byte to the AD9522). If
the AD9522 responds with a no acknowledge bit, the data transfer
process is not done. If the AD9522 responds with an acknowledge
bit, the data transfer process is completed. The user can monitor
the STATUS_EEPROM register or program the STATUS pin to
monitor the status of the data transfer.
WRITING TO THE EEPROM
The EEPROM cannot be programmed directly through the serial
port interface. To program the EEPROM and store a register
setting file, do the following:
1.
2.
3.
4.
5.
Program the AD9522 registers to the desired circuit state. If
the user wants the PLL to lock automatically after power-up,
the VCO calibration now bit (Register 0x018[0]) must be
set to 1. This allows VCO calibration to start automatically
after register loading. Note that a valid input reference
signal must be present during VCO calibration.
Program the EEPROM buffer registers, if necessary (see
the Programming the EEPROM Buffer Segment section).
This is only necessary if users want to use the EEPROM to
control the default setting of some (but not all) of the
AD9522 registers, or if they want to control the register
setting update sequence during power-up or chip reset.
Set the enable EEPROM write bit (Register 0xB02[0]) to 1
to enable the EEPROM.
Set the REG2EEPROM bit (Register 0xB03[0]) to 1.
Set the IO_UPDATE bit (Register 0x232[0]) to 1, which
starts the process of writing data into the EEPROM to
create the EEPROM setting file. This enables the AD9522
EEPROM controller to transfer the current register values,
as well as the memory address and instruction bytes, from the
EEPROM buffer segment, into the EEPROM. After the
write process is completed, the internal controller sets
Register 0xB03[0] (REG2EEPROM) back to 0.
6.
The readback register, STATUS_EEPROM
(Register 0xB00[0]), is used to indicate the data transfer
status between the EEPROM and the control registers (0 =
done/inactive; 1 = in process/active). At the beginning of
the data transfer, STATUS_EEPROM is set to 1 by the
EEPROM controller and cleared to 0 at the end of the data
transfer. The user can access STATUS_EEPROM through
the STATUS pin when the STATUS pin is programmed to
monitor STATUS_EEPROM. Alternatively, the user can
monitor the STATUS_EEPROM bit.
After the data transfer process is done (Register 0xB00[0] = 0),
set the enable EEPROM write register (Register 0xB02[0])
to 0 to disable writing to the EEPROM.
To verify that the data transfer has completed correctly, the user
can verify that Register 0xB01[0] = 0. A value of 1 in this register
indicates a data transfer error.
READING FROM THE EEPROM
The following reset-related events can start the process of
restoring the settings stored in EEPROM to control registers.
When the EEPROM pin is set high, do any of the following:
1.
2.
3.
Power up the AD9522.
Perform a hardware chip reset by pulling the RESET pin
low and then releasing RESET.
Set the self-clearing soft reset bit (Register 0x000[5]) to 1.
When the EEPROM pin is set low, set the self-clearing
SOFT_EEPROM bit (Register 0xB02[1]) to 1. The AD9522
then starts to read the EEPROM and loads the values into the
AD9522.
If the EEPROM pin is low during reset or power-up, the
EEPROM is not active, and the AD9522 default values are
loaded instead.
When using the EEPROM to automatically load the AD9522
register values and lock the PLL, the VCO calibration now bit
(Register 0x018[0]) must be set to 1 when the register values are
written to the EEPROM. This allows VCO calibration to start
automatically after register loading. A valid input reference
signal must be present during VCO calibration.
To verify that the data transfer has completed correctly, the user
can verify that Register 0xB01[0] = 0. A value of 1 in this register
indicates a data transfer error.
Rev. A | Page 60 of 84
Data Sheet
AD9522-3
PROGRAMMING THE EEPROM BUFFER SEGMENT
IO_UPDATE (Operational Code 0x80)
The EEPROM buffer segment is a register space on the AD9522
that allows the user to specify which groups of registers are
stored to the EEPROM during EEPROM programming. Normally,
this segment does not need to be programmed by the user. Instead,
the default power-up values for the EEPROM buffer segment
allow the user to store all of the AD9522 register values from
Register 0x000 to Register 0x231 to the EEPROM.
The EEPROM controller uses Operational Code 0x80 to generate
an IO_UPDATE signal to update the active control register
bank from the buffer register bank during the download process.
For example, if users want to load only the output driver settings
from the EEPROM without disturbing the PLL register settings
currently stored in the AD9522, they can alter the EEPROM buffer
segment to include only the registers that apply to the output
drivers and exclude the registers that apply to the PLL configuration.
There are two parts to the EEPROM buffer segment: register
section definition groups and operational codes. Each register
section definition group contains the starting address and
number of bytes to be written to the EEPROM.
If the AD9522 register map were continuous from Address 0x000
to Address 0x232, only one register section definition group
would consist of a starting address of 0x000 and a length of
563 bytes. However, this is not the case. The AD9522 register
map is noncontiguous, and the EEPROM is only 512 bytes long.
Therefore, the register section definition group tells the EEPROM
controller how the AD9522 register map is segmented.
There are three operational codes: IO_UPDATE, end-of-data,
and pseudo-end-of-data. It is important that the EEPROM buffer
segment always have either an end-of-data or a pseudo-end-of-data
operational code and that an IO_UPDATE operation code appear
at least once before the end-of-data op code.
Register Section Definition Group
The register section definition group is used to define a continuous
register section for the EEPROM profile. It consists of three bytes.
The first byte defines how many continuous register bytes are in
this group. If the user puts 0x000 in the first byte, it means there
is only one byte in this group. If the user puts 0x001, it means
there are two bytes in this group. The maximum number of
registers in one group is 128.
At a minimum, there must be at least one IO_UPDATE
operational code after the end of the final register section definition
group. This is needed so that at least one IO_UPDATE occurs after
all of the AD9522 registers are loaded when the EEPROM is
read. If this operational code is absent during a write to the
EEPROM, the register values loaded from the EEPROM are not
transferred to the active register space, and these values do not
take effect after they are loaded from the EEPROM to the AD9522.
End-of-Data (Operational Code 0xFF)
The EEPROM controller uses Operational Code 0xFF to terminate
the data transfer process between EEPROM and the control
register during the upload and download process. The last item
appearing in the EEPROM buffer segment must be either this
operational code or the pseudo-end-of-data operational code.
Pseudo-End-of-Data (Operational Code 0xFE)
The AD9522 EEPROM buffer segment has 23 bytes that can
contain up to seven register section definition groups. If users
want to define more than seven register section definition
groups, the pseudo-end-of-data operational code (0xFE) can be
used. During the upload process, when the EEPROM controller
receives the pseudo-end-of-data operational code, it halts the
data transfer process, clears the REG2EEPROM bit, and enables
the AD9522 serial port. Users can then program the EEPROM
buffer segment again and reinitiate the data transfer process by
setting the REG2EEPROM bit (Register 0xB03) to 1 and the
IO_UPDATE bit (Register 0x232) to 1. The internal I²C master
then begins writing to the EEPROM starting from the EEPROM
address held from the last writing.
This sequence enables more discrete instructions to be written
to the EEPROM than would otherwise be possible due to the
limited size of the EEPROM buffer segment. It also permits the
user to write to the same register multiple times with a different
value each time.
The next two bytes are the low byte and high byte of the
memory address (16-bit) of the first register in this group.
Rev. A | Page 61 of 84
AD9522-3
Data Sheet
Table 47. Example of EEPROM Buffer Segment
Reg Addr (Hex)
Bit 7 (MSB)
Start EEPROM Buffer Segment
0xA00
0
0xA01
0xA02
0xA03
0
0xA04
0xA05
0xA06
0
0xA07
0xA08
0xA09
0xA0A
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
Number of bytes [6:0] of the first group of registers
Address [15:8] of the first group of registers
Address [7:0] of the first group of registers
Number of bytes [6:0] of the second group of registers
Address [15:8] of the second group of registers
Address [7:0] of the second group of registers
Number of bytes [6:0] of the third group of registers
Address [15:8] of the third group of registers
Address [7:0] of the third group of registers
IO_UPDATE operational code (0x80)
End-of-data operational code (0xFF)
Rev. A | Page 62 of 84
Data Sheet
AD9522-3
THERMAL PERFORMANCE
Table 48. Thermal Parameters for the 64-Lead LFCSP
Symbol
θJA
θJMA
θJMA
ΨJB
θJC
ΨJT
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
The AD9522 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
TJ = TCASE + (ΨJT × PD)
where TA is the ambient temperature (°C).
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 48.
PD is the power dissipation (see the total power dissipation in
Table 18).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.
Rev. A | Page 63 of 84
AD9522-3
Data Sheet
REGISTER MAP
Register addresses that are not listed in Table 49 are not used, and writing to those registers has no effect. Writing to register addresses
marked unused must have 0x00 written to them, unless otherwise noted. N/A = not applicable.
Table 49. Register Map Overview
Addr
(Hex) Parameter
Serial Port Configuration
Serial port
000
config
(SPI mode)
Serial port
config
(I²C mode)
001
002
Silicon revision
003
Part ID
Readback
004
control
EEPROM ID
EEPROM
005
customer
006
version ID
007
to
00F
PLL
PFD charge
010
pump
011
R counter
012
013
A counter
014
B counter
015
016
PLL_CTRL_1
Bit 7 (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
Default
Value
(Hex)
SDO active
LSB first/
addr incr
Soft reset
(selfclearing)
Soft reset
(selfclearing)
Unused
Unused
LSB first/
addr incr
SDO active
00
Unused
Unused
Soft reset
(selfclearing)
Soft reset
(selfclearing)
Unused
Unused
Unused
Silicon revision (read only)
Part ID (read only)
Unused
PFD polarity
EEPROM customer version ID (LSB)
00
00
Unused
00
Charge pump current
017
PLL_CTRL_2
018
PLL_CTRL_3
019
PLL_CTRL_4
01A
PLL_CTRL_5
Enable STATUS
pin divider
01B
PLL_CTRL_6
Enable VCO
frequency
monitor
01C
PLL_CTRL_7
Disable
switchover
deglitch
Select
REF2
01D
PLL_CTRL_8
Enable
STATUS_EEPROM
at STATUS pin
Enable
XTAL
OSC
Enable CMOS
reference input
dc offset
Charge pump mode
PLL power-down
14-bit R counter, Bits[7:0] (LSB)
14-bit R counter, Bits[13:8] (MSB)
6-bit A counter
13-bit B counter, Bits[7:0] (LSB)
Unused
Reset
R counter
Reset all
Reset
counters
A and B
counters
STATUS pin control
R, A, B counters
SYNC pin reset
00
06
Antibacklash pulse width
00
VCO
calibration
now
06
VCO calibration divider
N path delay
00
LD pin control
Enable
REF1
(REFIN)
frequency
monitor
Use
REF_SEL
pin
Enable
clock
doubler
00
REFMON pin control
Reserved
Disable
PLL status
register
Enable LD
pin
comparator
Rev. A | Page 64 of 84
7D
01
00
00
03
13-bit B counter, Bits[12:8] (MSB)
B counter
Prescaler P
bypass
Disable
Digital
digital
lock
lock detect
detect
window
R path delay
Lock detect counter
Ref freq
monitor
threshold
Enable
REF2
frequency
monitor
N/A
11
61
00
EEPROM customer version ID (MSB)
Unused
Unused
Set CP pin
to VCP/2
Readback
active regs
00
00
Enable
REF2
Enable
REF1
Enable
differential
reference
00
Unused
Enable
external
holdover
Enable
holdover
80
Data Sheet
Addr
(Hex)
01E
01F
AD9522-3
Parameter
PLL_CTRL_9
Bit 7 (MSB)
PLL_READBACK
(read only)
Unused
Bit 6
Unused
VCO cal
finished
Bit 5
Holdover
active
Bit 4
Bit 3
External zero delay
feedback
channel divider select
REF2
VCO freq >
selected
threshold
Bit 2
Enable
external
zero delay
REF2
freq >
threshold
Bit 1
Enable
zero delay
Bit 0 (LSB)
Unused
REF1 freq >
threshold
Digital lock
detect
N/A
OUT0
LVDS
power-down
OUT1
LVDS
power-down
OUT2
LVDS
power-down
OUT3
LVDS
power-down
OUT4
LVDS
power-down
OUT5
LVDS
power-down
OUT6
LVDS
power-down
OUT7
LVDS
power-down
OUT8
LVDS
power-down
OUT9
LVDS
power-down
OUT10
LVDS
power-down
OUT11
LVDS
power-down
CSDLD En
OUT0
CSDLD En
OUT8
62
Output Driver Control
0F0
OUT0 control
OUT0 format
OUT0 CMOS
configuration
OUT0 polarity
OUT0 LVDS
differential voltage
0F1
OUT1 control
OUT1 format
OUT1 CMOS
configuration
OUT1 polarity
OUT1 LVDS
differential voltage
0F2
OUT2 control
OUT2 format
OUT2 CMOS
configuration
OUT2 polarity
OUT2 LVDS
differential voltage
0F3
OUT3 control
OUT3 format
OUT3 CMOS
configuration
OUT3 polarity
OUT3 LVDS
differential voltage
0F4
OUT4 control
OUT4 format
OUT4 CMOS
configuration
OUT4 polarity
OUT4 LVDS
differential voltage
0F5
OUT5 control
OUT5 format
OUT5 CMOS
configuration
OUT5 polarity
OUT5 LVDS
differential voltage
0F6
OUT6 control
OUT6 format
OUT6 CMOS
configuration
OUT6 polarity
OUT6 LVDS
differential voltage
0F7
OUT7 control
OUT7 format
OUT7 CMOS
configuration
OUT7 polarity
OUT7 LVDS
differential voltage
0F8
OUT8 control
OUT8 format
OUT8 CMOS
configuration
OUT8 polarity
OUT8 LVDS
differential voltage
0F9
OUT9 control
OUT9 format
OUT9 CMOS
configuration
OUT9 polarity
OUT9 LVDS
differential voltage
0FA
OUT10 control
OUT10 format
OUT10 CMOS
configuration
OUT10 polarity
OUT10 LVDS
differential voltage
0FB
OUT11 control
OUT11 format
OUT11 CMOS
configuration
OUT11 polarity
OUT11 LVDS
differential voltage
0FC
Enable output
on CSDLD
Enable output
on CSDLD
CSDLD En
OUT7
Unused
0FD
0FE
to
18F
LVDS Channel Dividers
190
Divider 0
191
192
Divider 0
bypass
CSDLD En
OUT6
Unused
CSDLD En
OUT5
Unused
Divider 0 low cycles
Divider 0
Divider 0
force
ignore
high
SYNC
Unused
CSDLD En
OUT4
Unused
CSDLD En
OUT3
CSDLD En
OUT11
Unused
CSDLD En
OUT1
CSDLD En
OUT9
Unused
62
62
62
62
62
62
62
62
62
62
62
00
00
00
Divider 0 high cycles
Divider 0
phase offset
Divider 0
start high
Rev. A | Page 65 of 84
CSDLD En
OUT2
CSDLD En
OUT10
Default
Value
(Hex)
00
Channel 0
powerdown
Reserved
77
00
Disable
Divider 0
DCC
00
AD9522-3
Addr
(Hex)
193
194
Parameter
Divider 1
Data Sheet
Bit 7 (MSB)
Divider 1
bypass
195
196
197
Divider 2
Divider 2
bypass
198
199
19A
Divider 3
Divider 3
bypass
19B
Bit 6
Bit 5
Divider 1 low cycles
Divider 1
Divider 1
ignore
force
SYNC
high
Unused
Divider 2 low cycles
Divider 2
Divider 2
force
ignore
high
SYNC
Unused
Divider 3 low cycles
Divider 3
Divider 3
force
ignore
high
SYNC
Unused
19C
to
1DF
VCO Divider and CLK Input
1E0
VCO divider
1E1
Input CLKs
1E2
to
22A
System
Power-down
230
and SYNC
231
Update All Registers
232
IO_UPDATE
233
to
9FF
EEPROM Buffer Segment
Serial port
A00
configuration
A01
A02
EEPROM
A03
Customer
A04
Version ID
A05
A06
PLL settings
A07
A08
Output driver
A09
control
A0A
A0B
Bit 4
Bit 3
Bit 2
Divider 1
start high
Unused
Divider 2
start high
Unused
Divider 3
start high
Unused
Bit 1
Divider 1 high cycles
Divider 1
phase offset
Bit 0 (LSB)
Channel 1
Reserved
powerdown
Divider 2 high cycles
Divider 2
phase offset
Disable
Divider 1
DCC
Channel 2
Reserved
powerdown
Divider 3 high cycles
Divider 3
phase offset
Disable
Divider 2
DCC
Channel 3
powerdown
Reserved
00
00
Disable
Divider 3
DCC
VCO divider
Powerdown VCO
clock
interface
Disable
power-on
SYNC
00
Powerdown
VCO
and CLK
Select
VCO or CLK
00
Bypass VCO
divider
Unused
Unused
00
00
Unused
Power down
clock
input
section
00
11
00
Unused
Unused
Default
Value
(Hex)
33
00
00
00
Powerdown
SYNC
Unused
Powerdown
distribution
reference
Unused
Soft
SYNC
00
IO_UPDATE
(self-clearing)
Unused
00
00
Unused
00
Data transfer: one byte
Starting address: Address 0x000
00
00
00
02
00
04
0E
00
10
0E
00
F0
Data transfer: three bytes
Starting address: Address 0x004
Data transfer: 16 bytes
Starting address: Address 0x010
Data transfer: 16 bytes
Starting address: Address 0x0F0
Rev. A | Page 66 of 84
Data Sheet
Addr
(Hex) Parameter
LVDS channel
A0C
dividers
A0D
A0E
VDO divider
A0F
and CLK input
A10
A11
Power-down
A12
and SYNC
A13
A14
A15
I/O update
A16
End of data
A17
Unused
to
AFF
EEPROM Control
EEPROM status
B00
(read only)
EEPROM error
B01
checking
(read only)
EEPROM
B02
Control 1
B03
EEPROM
Control 2
AD9522-3
Bit 7 (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Data transfer: 12 bytes
Starting address: Address 0x190
Default
Value
(Hex)
0B
01
90
01
01
E0
01
02
30
80
FF
00
Bit 1
Bit 0 (LSB)
Unused
Unused
00
Unused
Unused
STATUS_
EEPROM
EEPROM
data error
Unused
SOFT_EEPROM
(self-clearing)
00
Unused
Unused
Enable
EEPROM
write
REG2EEPROM
(self-clearing)
Data transfer: two bytes
Starting address: Address 0x1E0
Data transfer: two bytes
Starting address: Address 0x230
Action: IO_UPDATE
Action: end of data
Unused (available for additional EEPROM instructions)
Rev. A | Page 67 of 84
00
00
AD9522-3
Data Sheet
REGISTER MAP DESCRIPTIONS
Table 50 through Table 60 provide a detailed description of each of the control register functions. The registers are listed by hexadecimal
address. Reference to a specific bit or range of bits within a register is indicated by squared brackets. For example, [3] refers to Bit 3 and
[5:2] refers to the range of bits from Bit 5 through Bit 2.
Table 50. SPI Mode Serial Port Configuration
Reg Addr (Hex)
000
Bit(s)
[7]
Name
SDO active
000
[6]
LSB first/addr incr
000
[5]
Soft reset
000
000
[4]
[3:0]
Unused
Mirror[7:4]
002
003
[7:0]
[7:0]
Silicon revision (read only)
Part ID (read only)
004
[0]
Readback active registers
Description
Selects unidirectional or bidirectional data transfer mode.
[7] = 0; SDIO pin used for write and read; SDO is high impedance (default).
[7] = 1; SDO used for read; SDIO used for write; unidirectional mode.
SPI MSB or LSB data orientation. (This register is ignored in I2C mode.)
[6] = 0; data-oriented MSB first; addressing decrements (default).
[6] = 1; data-oriented LSB first; addressing increments.
Soft reset.
[5] = 1 (self-clearing). Soft reset; restores default values to internal registers. This bit
self clears on the next SCLK cycle after the completion of writing to this register and
does not reset the value of Register 0x000.
Bits[3:0] should always mirror Bits[7:4] so that it does not matter whether the part
is in MSB or LSB first mode (see Register 0x000[6]). Set bits as follows:
[0] = [7]
[1] = [6]
[2] = [5]
[3] = [4]
This read only register identifies the revision level of the AD9522.
Uniquely identifies the dash version (AD9522-0 through AD9522-5) of the AD9522.
AD9522-0: 0x20
AD9522-1: 0x60
AD9522-2: 0xA0
AD9522-3: 0x61
AD9522-4: 0xE1
AD9522-5: 0xE0
Select register bank used for a readback.
[0] = 0; read back buffer registers (default).
[0] = 1; read back active registers.
Table 51. I2C Mode Serial Port Configuration
Reg Addr (Hex)
000
000
Bit(s)
[7:6]
[5]
Name
Unused
Soft reset
000
000
[4]
[3:0]
Unused
Mirror[7:4]
002
[7:0]
Silicon revision (read only)
Description
Soft reset.
[5] = 1 (self-clearing). Soft reset; restores default values to internal registers. This bit
self clears on the next SCL cycle after the completion of writing to this register.
Bits[3:0] must always mirror Bits[7:4] so that it does not matter whether the part
is in MSB or LSB first mode (see Register 0x000[6]).. Set bits as follows:
[0] = [7]
[1] = [6]
[2] = [5]
[3] = [4]
This read only register identifies the revision level of the AD9522.
Rev. A | Page 68 of 84
Data Sheet
AD9522-3
Reg Addr (Hex)
003
Bit(s)
[7:0]
Name
Part ID (read only)
004
[0]
Readback active registers
Description
Uniquely identifies the dash version (AD9522-0 through AD9522-5) of the AD9522.
AD9522-0: 0x20
AD9522-1: 0x60
AD9522-2: 0xA0
AD9522-3: 0x61
AD9522-4: 0xE1
AD9522-5: 0xE0
Select register bank used for a readback.
[0] = 0; read back buffer registers (default).
[0] = 1; read back active registers.
Table 52. EEPROM ID
Reg Addr (Hex)
005
Bit(s)
[7:0]
Name
EEPROM customer
version ID (LSB)
006
[7:0]
EEPROM customer
version ID (MSB)
Description
16-bit EEPROM ID[7:0]. This register, along with Register 0x006, allows the user to
store a unique ID to identify which version of the AD9522 register settings is stored
in the EEPROM. It does not affect AD9522 operation in any way (default: 0x00).
16-bit EEPROM ID[15:8]. This register, along with Register 0x005, allows the user to
store a unique ID to identify which version of the AD9522 register settings is stored
in the EEPROM. It does not affect AD9522 operation in any way (default: 0x00).
Table 53. PLL
Reg.
Addr
(Hex) Bit(s) Name
010 [7]
PFD polarity
010
[6:4] CP current
010
[3:2] CP mode
010
011
012
Description
Sets the PFD polarity. Negative polarity is for use (if needed) with external VCO/VCXO only.
The on-chip VCO requires positive polarity, [7] = 0.
[7] = 0; positive (higher control voltage produces higher frequency) (default).
[7] = 1; negative (higher control voltage produces lower frequency).
Charge pump current (with CPRSET = 5.1 kΩ).
[6] [5]
[4]
ICP (mA)
0
0
0
0.6
0
0
1
1.2
0
1
0
1.8
0
1
1
2.4
1
0
0
3.0
1
0
1
3.6
1
1
0
4.2
1
1
1
4.8 (default)
Charge pump operating mode.
[3]
[2]
Charge Pump Mode
0
0
High impedance state.
0
1
Force source current (pump up).
1
0
Force sink current (pump down).
1
1
Normal operation (default).
[1:0] PLL powerPLL operating mode.
down
[1] [0]
Mode
0
0
Normal operation; this mode must be selected to use the PLL.
0
1
Asynchronous power-down (default).
1
0
Unused.
1
1
Synchronous power-down.
[7:0] 14-bit R counter, Reference divider LSBs—lower eight bits. The reference divider (also called the R divider or R counter) is
Bits[7:0] (LSB)
14 bits long. The lower eight bits are in this register (default: 0x01).
[5:0] 14-bit R counter, Reference divider MSBs—upper six bits. The reference divider (also called the R divider or R counter) is
Bits[13:8] (MSB) 14 bits long. The upper six bits are in this register (default: 0x00).
Rev. A | Page 69 of 84
AD9522-3
Data Sheet
Reg.
Addr
(Hex) Bit(s) Name
013 [5:0] 6-bit A counter
Description
A counter (part of N divider). The N divider is also called the feedback divider (default: 0x00).
014
B counter (part of N divider)—lower eight bits. The N divider is also called the feedback divider (default: 0x03).
015
016
[7:0] 13-bit B counter,
Bits[7:0] (LSB)
[4:0] 13-bit B counter,
Bits[12:8] (MSB)
[7]
Set CP pin
to VCP/2
016
[6]
Reset R counter
016
[5]
Reset A and B
counters
016
[4]
Reset all
counters
016
[3]
B counter
bypass
016
[2:0] Prescaler P
017
[7:2] STATUS
pin control
B counter (part of N divider)—upper five bits. The N divider is also called the feedback divider (default: 0x00).
Sets the CP pin to one-half of the VCP supply voltage.
[7] = 0; CP normal operation (default).
[7] = 1; CP pin set to VCP/2.
Reset R counter (R divider).
[6] = 0; normal (default).
[6] = 1; hold R counter in reset.
Reset A and B counters (part of N divider).
[5] = 0; normal (default).
[5] = 1; hold A and B counters in reset.
Reset R, A, and B counters.
[4] = 0; normal (default).
[4] = 1; hold R, A, and B counters in reset.
B counter bypass. When this bit is 1, set the A counter in Register 0x013 to 0.
[3] = 0; normal (default).
[3] = 1; B counter is set to divide-by-1. This allows the prescaler setting to determine the divide for
the N divider.
Prescaler: DM = dual modulus and FD = fixed divide. The Prescaler P is part of the feedback divider.
[2] [1]
[0] Mode
Prescaler
0
0
0
FD
Divide-by-1.
0
0
1
FD
Divide-by-2.
0
1
0
DM
Divide-by-2 and divide-by-3 when A ≠ 0; divide-by-2 when A = 0.
0
1
1
DM
Divide-by-4 and divide-by-5 when A ≠ 0; divide-by-4 when A = 0.
1
0
0
DM
Divide-by-8 and divide-by-9 when A ≠ 0; divide-by-8 when A = 0.
1
0
1
DM
Divide-by-16 and divide-by-17 when A ≠ 0; divide-by-16 when A = 0.
1
1
0
DM
Divide-by-32 and divide-by-33 when A ≠ 0; divide-by-32 when A = 0 (default).
1
1
1
FD
Divide-by-3.
Selects the signal that appears at the STATUS pin. Register 0x01D[7] must be 0 to reprogram the STATUS pin.
Level or
Dynamic
[7] [6] [5] [4] [3]
[2] Signal
Signal at STATUS Pin
0
0
0
0
0
0
LVL
Ground, dc (default).
0
0
0
0
0
1
DYN
N divider output (after the delay).
0
0
0
0
1
0
DYN
R divider output (after the delay).
0
0
0
0
1
1
DYN
A divider output.
0
0
0
1
0
0
DYN
Prescaler output.
0
0
0
1
0
1
DYN
PFD up pulse.
0
0
0
1
1
0
DYN
PFD down pulse.
0
X
X
X
X
X
LVL
Ground (dc); for all other cases of 0XXXXX not specified.
The selections that follow are the same as for REFMON.
1
0
0
0
0
0
LVL
Ground (dc).
1
0
0
0
0
1
DYN
REF1 clock (differential reference when in differential mode).
1
0
0
0
1
0
DYN
REF2 clock (not applicable in differential mode).
1
0
0
0
1
1
DYN
Selected reference to PLL (differential reference when in
differential mode).
1
0
0
1
0
0
DYN
Unselected reference to PLL (not available in differential
mode).
Rev. A | Page 70 of 84
Data Sheet
Reg.
Addr
(Hex) Bit(s) Name
017
[1:0] Antibacklash
pulse width
018
[7]
018
[6:5] Lock detect
counter
Enable CMOS
reference input
dc offset
AD9522-3
Description
[7]
1
[6]
0
[5]
0
[4]
1
[3]
0
Level or
Dynamic
[2] Signal
1
LVL
1
0
0
1
1
0
LVL
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
0
1
1
1
1
1
1
1
1
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
LVL
LVL
LVL
LVL
LVL
LVL
LVL
LVL
LVL
LVL
DYN
DYN
DYN
1
1
0
1
0
0
DYN
1
1
0
1
0
1
LVL
1
1
0
1
1
0
LVL
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
LVL
LVL
LVL
LVL
LVL
LVL
Signal at STATUS Pin
Status of selected reference (status of differential reference);
active high.
Status of unselected reference (not available in differential
mode); active high.
Status REF1 frequency (active high).
Status REF2 frequency (active high).
(Status REF1 frequency) AND (status REF2 frequency).
(DLD) AND (status of selected reference) AND (status of VCO).
Status of VCO frequency (active high).
Selected reference (low = REF1, high = REF2).
DLD; active high.
Holdover active (active high).
LD pin comparator output (active high).
VS (PLL power supply).
REF1 clock (differential reference when in differential mode).
REF2 clock (not available in differential mode).
Selected reference to PLL (differential reference when in
differential mode).
Unselected reference to PLL (not available when in
differential mode).
Status of selected reference (status of differential reference);
active low.
Status of unselected reference (not available in differential
mode); active low.
Status of REF1 frequency (active low).
Status of REF2 frequency (active low).
(Status of REF1 frequency) AND (status of REF2 frequency).
(DLD) AND (Status of selected reference) AND (status of VCO).
Status of VCO frequency (active low).
Selected reference (low = REF2, high = REF1).
1
1
1
1
0
1
LVL
DLD (active low).
1
1
1
1
1
0
LVL
Holdover active (active low).
1
1
1
1
1
1
LVL
LD pin comparator output (active low).
[1] [0]
Antibacklash Pulse Width (ns)
0
0
2.9 (default)
0
1
1.3
1
0
6.0
1
1
2.9
Enables dc offset in single-ended CMOS input mode to prevent chattering when ac-coupled and input is lost.
[7] = 0; disable dc offset (default).
[7] = 1; enable dc offset.
Required consecutive number of PFD cycles with edges inside lock detect window before the DLD indicates
a locked condition.
[6] [5]
PFD Cycles to Determine Lock
0
0
5 (default)
0
1
16
1
0
64
1
1
255
Rev. A | Page 71 of 84
AD9522-3
Reg.
Addr
(Hex) Bit(s) Name
018 [4]
Digital lock
detect window
018
[3]
Disable digital
lock detect
018
[2:1] VCO calibration
divider
018
[0]
019
[7:6] R, A, B counters
SYNC pin reset
VCO calibration
now
Data Sheet
Description
If the time difference of the rising edges at the inputs to the PFD are less than the lock detect window time, the
digital lock detect flag is set. The flag remains set until the time difference is greater than the loss-of-lock threshold.
[4] = 0; high range. The default setting is 3 ns.
[4] = 1; low range.
Digital lock detect operation.
[3] = 0; normal lock detect operation (default).
[3] = 1; disable lock detect.
Divider used to generate the VCO calibration clock from the PLL reference clock (see the VCO Calibration section for
the recommended setting of the VCO calibration divider based on the PFD rate).
[2] [1]
VCO Calibration Clock Divider
0
0
2. This setting is fine for PFD frequencies < 12.5 MHz. The PFD frequency is fREF/R.
0
1
4. This setting is fine for PFD frequencies < 25 MHz. The PFD frequency is fREF/R.
1
0
8. This setting is fine for PFD frequencies < 50 MHz.
1
1
16 (default). This setting is fine for any PFD frequency, but results in the longest VCO calibration time.
Bit used to initiate the VCO calibration. This bit must be toggled from 0 to 1 in the active registers. The
sequence to initiate a calibration follows: program to 0, followed by an IO_UPDATE bit (Register 0x232[0]);
then program to 1, followed by another IO_UPDATE bit (Register 0x232[0]). This sequence gives complete
control over when the VCO calibration occurs relative to the programming of other registers that can impact
the calibration (default = 0). Note that the VCO divider (Register 0x1E0[2:0]) must not be static during VCO
calibration.
[7]
[6]
Action
0
0
Do nothing on SYNC (default).
0
1
1
019
019
01A
01A
01A
1
0
1
Asynchronous reset.
Synchronous reset.
Do nothing on SYNC.
[5:3] R path delay
[2:0] N path delay
[7]
Enable STATUS
pin divider
R path delay, see Table 2 (default: 0x0).
N path delay, see Table 2 (default: 0x0).
Enables a divide-by-4 on the STATUS pin. This makes it easier to look at low duty-cycle signals out of the
R and N dividers.
[7] = 0; divide-by-4 disabled on STATUS pin (default).
[7] = 1; divide-by-4 enabled on STATUS pin.
[6]
Ref freq monitor Sets the reference (REF1/REF2) frequency monitor’s detection threshold frequency. This does not affect the VCO
threshold
frequency monitor’s detection threshold (see Table 17, REF1, REF2, and VCO frequency status monitor parameter).
[6] = 0; frequency valid if frequency is above 1.02 MHz (default).
[6] = 1; frequency valid if frequency is above 8 kHz.
[5:0] LD pin
Selects the signal that is connected to the LD pin.
control
Level or
Dynamic
Signal at LD Pin
[5] [4] [3]
[2]
[1] [0] Signal
0
0
0
0
0
0
LVL
Digital lock detect (high = lock; low = unlock, default).
0
0
0
0
0
1
DYN
P-channel, open-drain lock detect (analog lock detect).
0
0
0
0
1
0
DYN
N-channel, open-drain lock detect (analog lock detect).
0
0
0
0
1
1
HIZ
Tristate (high-Z) LD pin.
0
0
0
1
0
0
CUR
Current source lock detect (110 µA when DLD is true).
0
X
X
X
X
X
LVL
Ground (dc); for all other cases of 0XXXXX not specified.
The selections that follow are the same as for REFMON.
1
0
0
0
0
0
LVL
Ground (dc).
1
0
0
0
0
1
DYN
REF1 clock (differential reference when in differential mode).
1
0
0
0
1
0
DYN
REF2 clock (not applicable in differential mode).
1
0
0
0
1
1
DYN
Selected reference to PLL (differential reference when in
differential mode).
1
0
0
1
0
0
DYN
Unselected reference to PLL (not available in differential mode).
Rev. A | Page 72 of 84
Data Sheet
Reg.
Addr
(Hex) Bit(s) Name
01B
[7]
Enable VCO
frequency
monitor
01B
[6]
Enable REF2
frequency
monitor
01B
[5]
Enable REF1
(REFIN)
frequency
monitor
AD9522-3
Description
Level or
Dynamic
Signal at LD Pin
[5] [4] [3]
[2]
[1] [0] Signal
1
0
0
1
0
1
LVL
Status of selected reference (status of differential reference);
active high.
1
0
0
1
1
0
LVL
Status of unselected reference (not available in differential
mode); active high.
1
0
0
1
1
1
LVL
Status REF1 frequency (active high).
1
0
1
0
0
0
LVL
Status REF2 frequency (active high).
1
0
1
0
0
1
LVL
(Status REF1 frequency) AND (status REF2 frequency).
1
0
1
0
1
0
LVL
(DLD) AND (status of selected reference) AND (status of VCO).
1
0
1
0
1
1
LVL
Status of VCO frequency (active high).
1
0
1
1
0
0
LVL
Selected reference (low = REF1, high = REF2).
1
0
1
1
0
1
LVL
DLD; active high.
1
0
1
1
1
0
LVL
Holdover active (active high).
1
0
1
1
1
1
LVL
Not applicable, do not use.
1
1
0
0
0
0
LVL
VS (PLL supply).
1
1
0
0
0
1
DYN
REF1 clock (differential reference when in differential mode).
1
1
0
0
1
0
DYN
REF2 clock (not available in differential mode).
1
1
0
0
1
1
DYN
Selected reference to PLL (differential reference when in
differential mode).
1
1
0
1
0
0
DYN
Unselected reference to PLL (not available when in differential
mode).
1
1
0
1
0
1
LVL
Status of selected reference (status of differential reference);
active low.
1
1
0
1
1
0
LVL
Status of unselected reference (not available in differential
mode); active low.
1
1
0
1
1
1
LVL
Status of REF1 frequency (active low).
1
1
1
0
0
0
LVL
Status of REF2 frequency (active low).
1
1
1
0
0
1
LVL
(Status of REF1 frequency) AND (status of REF2 frequency).
1
1
1
0
1
0
LVL
(DLD) AND (Status of selected reference) AND (status of VCO).
1
1
1
0
1
1
LVL
Status of VCO frequency (active low).
1
1
1
1
0
0
LVL
Selected reference (low = REF2, high = REF1).
1
1
1
1
0
1
LVL
DLD; active low.
1
1
1
1
1
0
LVL
Holdover active (active low).
1
1
1
1
1
1
LVL
Not applicable, do not use.
Enables or disables the VCO frequency monitor.
[7] = 0; disable the VCO frequency monitor (default).
[7] = 1; enable the VCO frequency monitor.
Enables or disables the REF2 frequency monitor.
[6] = 0; disable the REF2 frequency monitor (default).
[6] = 1; enable the REF2 frequency monitor.
REF1 (REFIN) frequency monitor enabled; this is for both REF1 (single-ended) and REFIN (differential) inputs
(as selected by differential reference mode).
[5] = 0; disable the REF1 (REFIN) frequency monitor (default).
[5] = 1; enable the REF1 (REFIN) frequency monitor.
Rev. A | Page 73 of 84
AD9522-3
Reg.
Addr
(Hex) Bit(s) Name
01B [4:0] REFMON pin
control
01C
[7]
Disable
switchover
deglitch
01C
[6]
Select REF2
01C
[5]
Use REF_SEL
pin
Data Sheet
Description
Selects the signal that is connected to the REFMON pin.
Level or
Dynamic
[4] [3] [2] [1] [0] Signal
Signal at REFMON Pin
0
0
0
0
0
LVL
Ground, dc (default).
0
0
0
0
1
DYN
REF1 clock (differential reference when in differential mode).
0
0
0
1
0
DYN
REF2 clock (not applicable in differential mode).
0
0
0
1
1
DYN
Selected reference to PLL (differential reference when in differential
mode).
0
0
1
0
0
DYN
Unselected reference to PLL (not available in differential mode).
0
0
1
0
1
LVL
Status of selected reference (status of differential reference);
active high.
0
0
1
1
0
LVL
Status of unselected reference (not available in differential mode);
active high.
0
0
1
1
1
LVL
Status REF1 frequency (active high).
0
1
0
0
0
LVL
Status REF2 frequency (active high).
0
1
0
0
1
LVL
(Status REF1 frequency) AND (status REF2 frequency).
0
1
0
1
0
LVL
(DLD) AND (status of selected reference) AND (status of VCO).
0
1
0
1
1
LVL
Status of VCO frequency (active high).
0
1
1
0
0
LVL
Selected reference (low = REF1, high = REF2).
0
1
1
0
1
LVL
DLD; active high.
0
1
1
1
0
LVL
Holdover active (active high).
0
1
1
1
1
LVL
LD pin comparator output (active high).
1
0
0
0
0
LVL
VS (PLL supply).
1
0
0
0
1
DYN
REF1 clock (differential reference when in differential mode).
1
0
0
1
0
DYN
REF2 clock (not available in differential mode).
1
0
0
1
1
DYN
Selected reference to PLL (differential reference when in
differential mode).
1
0
1
0
0
DYN
Unselected reference to PLL (not available when in differential mode).
1
0
1
0
1
LVL
Status of selected reference (status of differential reference);
active low.
1
0
1
1
0
LVL
Status of unselected reference (not available in differential mode);
active low.
1
0
1
1
1
LVL
Status of REF1 frequency (active low).
1
1
0
0
0
LVL
Status of REF2 frequency (active low).
1
1
0
0
1
LVL
(Status of REF1 frequency) AND (status of REF2 frequency).
1
1
0
1
0
LVL
(DLD) AND (status of selected reference) AND (status of VCO).
1
1
0
1
1
LVL
Status of VCO frequency (active low).
1
1
1
0
0
LVL
Selected reference (low = REF2, high = REF1).
1
1
1
0
1
LVL
DLD; active low.
1
1
1
1
0
LVL
Holdover active (active low).
1
1
1
1
1
LVL
LD pin comparator output (active low).
Disables or enables the switchover deglitch circuit.
[7] = 0; enable the switchover deglitch circuit (default).
[7] = 1; disable the switchover deglitch circuit.
If Register 0x01C[5] = 0, selects the reference for PLL when in manual; register selected reference control.
[6] = 0; select REF1 (default).
[6] = 1; select REF2.
If Register 0x01C[4] = 0 (manual), sets the method of PLL reference selection.
[5] = 0; use Register 0x01C[6] (default).
[5] = 1; use REF_SEL pin.
Rev. A | Page 74 of 84
Data Sheet
AD9522-3
Reg.
Addr
(Hex) Bit(s) Name
01C [4:3] Reserved
01C [2]
Enable REF2
Description
Default: 00b.
This bit turns the REF2 power on.
[2] = 0; REF2 power off (default).
[2] = 1; REF2 power on.
Enable REF1
This bit turns the REF1 power on.
[1] = 0; REF1 power off (default).
[1] = 1; REF1 power on.
Enable
Selects the PLL reference mode, differential or single-ended. Register 0x01C[2:1] must be cleared when
differential
this bit is set.
reference
[0] = 0; single-ended reference mode (default).
[0] = 1; differential reference mode.
Enable
Enables the STATUS_EEPROM signal at the STATUS pin.
STATUS_EEPROM [7] = 0; the STATUS pin is controlled by the Register 0x017[7:2] selection.
at STATUS pin
[7] = 1; select the STATUS_EEPROM signal at STATUS pin. This bit overrides Register 0x017[7:2] (default).
Enable
Enables the maintaining amplifier needed by a crystal oscillator at the PLL reference input.
XTAL OSC
[6] = 0; crystal oscillator maintaining amplifier disabled (default).
[6] = 1; crystal oscillator maintaining amplifier enabled.
Enable clock
Enable PLL reference input clock doubler.
doubler
[5] = 0; doubler disabled (default).
[5] = 1; doubler enabled.
Disable PLL
Disables the PLL status register readback.
status register
[4] = 0; PLL status register enabled (default).
[4] = 1; PLL status register disabled. If this bit is set, Register 01F is not automatically updated.
Enable LD pin
Enables the LD pin voltage comparator. This is used with the LD pin current source lock detect mode.
When the AD9522 is in internal (automatic) holdover mode, this enables the use of the voltage on the
comparator
LD pin to determine if the PLL was previously in a locked state (see Figure 48). Otherwise, this can be used
with the REFMON and STATUS pins to monitor the voltage on the LD pin.
[3] = 0; disable LD pin comparator and ignore the LD pin voltage; internal/automatic holdover
controller treats this pin as true (high, default).
[3] = 1; enable LD pin comparator (use LD pin voltage to determine if the PLL was previously locked).
Enable external Enables the external hold control through the SYNC pin. (This disables the internal holdover mode.)
holdover
[1] = 0; automatic holdover mode, holdover controlled by automatic holdover circuit (default).
01C
[1]
01C
[0]
01D
[7]
01D
[6]
01D
[5]
01D
[4]
01D
[3]
01D
[1]
01D
[0]
01E
[4:3] External zero
delay
feedback
channel
divider select
01E
[2]
Enable external
zero delay
01E
[1]
Enable zero
delay
01F
[6]
VCO calibration
finished
(read only)
[1] = 1; external holdover mode, holdover controlled by SYNC pin.
Enable
holdover
Enables the internally controlled holdover function.
[0] = 0; holdover disabled (default).
[0] = 1; holdover enabled.
[4]
[3]
Selects Which Channel Divider to Use in the External Zero-Delay Path
0
0
Select Channel Divider 0 (default).
0
1
Select Channel Divider 1.
1
0
Select Channel Divider 2.
1
1
Select Channel Divider 3
Selects which zero delay mode to use.
[2] = 0; enables internal zero delay mode if Register 0x01E[1] = 1 (default).
[2] = 1; enables external zero delay mode if Register 0x01E[1] = 1.
Enables zero delay function.
[1] = 0; disables zero delay function (default).
[1] = 1; enables zero delay function.
Readback register. Indicates the status of the VCO calibration.
[6] = 0; VCO calibration not finished.
[6] = 1; VCO calibration finished.
Rev. A | Page 75 of 84
AD9522-3
Data Sheet
Reg.
Addr
Description
(Hex) Bit(s) Name
01F [5]
Holdover active Readback register. Indicates if the part is in the holdover state (see Figure 48). This is not the same as
(read only)
holdover enabled.
[5] = 0; not in holdover.
[5] = 1; holdover state active.
01F [4]
REF2 selected
Readback register. Indicates which PLL reference is selected as the input to the PLL.
(read only)
[4] = 0; REF1 selected (or differential reference if in differential mode).
[4] = 1; REF2 selected.
01F [3]
VCO frequency Readback register. Indicates if the VCO frequency is greater than the threshold (see Table 17, REF1, REF2, and
> threshold
VCO frequency status monitor parameter).
(read only)
[3] = 0; VCO frequency is less than the threshold.
[3] = 1; VCO frequency is greater than the threshold.
01F [2]
REF2 frequency Readback register. Indicates if the frequency of the signal at REF2 is greater than the threshold frequency
> threshold
set by Register 0x01A[6].
(read only)
[2] = 0; REF2 frequency is less than the threshold frequency.
[2] = 1; REF2 frequency is greater than the threshold frequency.
01F [1]
REF1 frequency Readback register. Indicates if the frequency of the signal at REF1 is greater than the threshold frequency
> threshold
set by Register 0x01A[6].
(read only)
[1] = 0; REF1 frequency is less than the threshold frequency.
[1] = 1; REF1 frequency is greater than the threshold frequency.
01F [0]
Digital lock
Readback register. Digital lock detect.
detect
[0] = 0; PLL is not locked.
(read only)
[0] = 1; PLL is locked.
Table 54. Output Driver Control
Reg.
Addr
(Hex) Bit(s) Name
0F0 [7]
OUT0 format
0F0
[6:5]
OUT0 CMOS
configuration
0F0
[4:3]
OUT0 polarity
0F0
[2:1]
OUT0 LVDS
differential
voltage
Description
Selects the output type for OUT0.
[7] = 0; LVDS (default).
[7] = 1; CMOS.
Sets the CMOS output configuration for OUT0 when Register 0x0F0[7] = 1.
[6:5]
OUT0A
OUT0B
00
Tristate
Tristate
01
On
Tristate
10
Tristate
On
11 (default)
On
On
Sets the output polarity for OUT0.
[7]
[4]
[3]
Output Type
OUT0A
OUT0B
0 (default)
X
0
LVDS
Noninverting
Inverting
0
X
1
LVDS
Inverting
Noninverting
1
0 (default)
0 (default)
CMOS
Noninverting
Noninverting
1
0
1
CMOS
Inverting
Inverting
1
1
0
CMOS
Noninverting
Inverting
1
1
1
CMOS
Inverting
Noninverting
Sets the LVDS output differential voltage (VOD).
[2]
[1]
IOD (mA)
0
0
1.75 (VOD = 175 mV for 100 Ω termination across differential pair)
0 (default)
1 (default)
3.5 (VOD = 350 mV for 100 Ω termination across differential pair)
1
0
5.25 (VOD = 525 mV for 100 Ω termination across differential pair)
1
1
7.0 (VOD = 700 mV for 100 Ω termination across differential pair)
Rev. A | Page 76 of 84
Data Sheet
Reg.
Addr
(Hex) Bit(s) Name
0F0 [0]
OUT0 LVDS
power-down
AD9522-3
Description
LVDS power-down.
[0] = 0; normal operation (default).
[0] = 1; power-down. Output driver is in a high impedance state.
This register controls OUT1, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT2, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT3, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT4, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT5, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT6, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT7, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT8, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT9, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT10, and the bit assignments for this register are identical to Register 0x0F0.
This register controls OUT11, and the bit assignments for this register are identical to Register 0x0F0.
OUT7 is enabled only if CSDLD is high.
[7]
CSDLD Signal OUT7 Enable Status
0
0
Not affected by CSDLD signal (default).
1
0
Asynchronous power-down.
1
1
Asynchronously enable OUT7 if not powered down by other settings.
To use this feature, the user must use current source digital lock detect,
and set the enable LD pin comparator bit (Register 0x01D[3]).
OUT6 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT5 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT4 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT3 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT2 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT1 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT0 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT11 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
0F1
0F2
0F3
0F4
0F5
0F6
0F7
0F8
0F9
0FA
0FB
0FC
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7:0]
[7]
OUT1 control
OUT2 control
OUT3 control
OUT4 control
OUT5 control
OUT6 control
OUT7 control
OUT8 control
OUT9 control
OUT10 control
OUT11 control
CSDLD En OUT7
0FC
0FC
0FC
0FC
0FC
0FC
0FC
0FD
[6]
[5]
[4]
[3]
[2]
[1]
[0]
[3]
0FD
[2]
0FD
0FD
[1]
[0]
CSDLD En OUT6
CSDLD En OUT5
CSDLD En OUT4
CSDLD En OUT3
CSDLD En OUT2
CSDLD En OUT1
CSDLD En OUT0
CSDLD En
OUT11
CSDLD En
OUT10 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
OUT10
CSDLD En OUT9 OUT9 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
CSDLD En OUT8 OUT8 is enabled only if CSDLD is high. Setting is identical to Register 0x0FC[7].
Table 55. LVDS Channel Dividers
Reg.
Addr
(Hex) Bit(s) Name
190
[7:4] Divider 0 low cycles
190
[3:0]
Divider 0 high cycles
191
[7]
Divider 0 bypass
191
[6]
Divider 0 ignore SYNC
Description
Number of clock cycles (minus 1) of the divider input during which divider output stays low.
A value of 0x7 means the divider is low for eight input clock cycles (default: 0x7).
Number of clock cycles (minus 1) of the divider input during which divider output stays high.
A value of 0x7 means the divider is high for eight input clock cycles (default: 0x7).
Bypasses and powers down the divider; routes input to divider output.
[7] = 0; use the divider (default).
[7] = 1; bypass the divider.
Ignore SYNC.
[6] = 0; obey chip-level SYNC signal (default).
[6] = 1; ignore chip-level SYNC signal.
Rev. A | Page 77 of 84
AD9522-3
Reg.
Addr
(Hex) Bit(s) Name
191
[5]
Divider 0 force high
191
[4]
Divider 0 start high
191
192
[3:0]
[2]
Divider 0 phase offset
Channel 0 power-down
192
[0]
Disable Divider 0 DCC
193
[7:4]
Divider 1 low cycles
193
[3:0]
Divider 1 high cycles
194
[7]
Divider 1 bypass
194
[6]
Divider 1 ignore SYNC
194
[5]
Divider 1 force high
194
[4]
Divider 1 start high
194
195
[3:0]
[2]
Divider 1 phase offset
Channel 1 power-down
195
[0]
Disable Divider 1 DCC
196
[7:4]
Divider 2 low cycles
196
[3:0]
Divider 2 high cycles
197
[7]
Divider 2 bypass
197
[6]
Divider 2 ignore SYNC
Data Sheet
Description
Forces divider output to a specific state. This requires that ignore SYNC also be set. Note that
this bit has no effect if the channel divider is bypassed.
[5] = 0; divider output forced to low (default).
[5] = 1; divider output forced to high.
Selects clock output to start high or start low.
[4] = 0; start low (default).
[4] = 1; start high.
Phase offset (default: 0x0).
Channel 0 powers down.
[2] = 0; normal operation (default).
[2] = 1; powered down. (OUT0/OUT0, OUT1/OUT1, and OUT2/OUT2 are put into the high
impedance power-down mode by setting this bit.)
Duty-cycle correction function.
[0] = 0; enable duty-cycle correction (default).
[0] = 1; disable duty-cycle correction.
Number of clock cycles (minus 1) of the divider input during which the divider output stays
low. A value of 0x3 means the divider is low for four input clock cycles (default: 0x3).
Number of clock cycles (minus 1) of the divider input during which the divider output stays
high. A value of 0x3 means the divider is high for four input clock cycles (default: 0x3).
Bypasses and powers down the divider; routes input to divider output.
[7] = 0; use divider (default).
[7] = 1; bypass divider.
Ignore SYNC.
[6] = 0; obey chip-level SYNC signal (default).
[6] = 1; ignore chip-level SYNC signal.
Forces divider output to a specific state. This requires that ignore SYNC also be set. Note that
this bit has no effect if the channel divider is bypassed.
[5] = 0; divider output forced to low (default).
[5] = 1; divider output forced to high.
Selects clock output to start high or start low.
[4] = 0; start low (default).
[4] = 1; start high.
Phase offset (default: 0x0).
Channel 1 powers down.
[2] = 0; normal operation (default).
[2] = 1; powered down. (OUT3/OUT3, OUT4/OUT4, and OUT5/OUT5 are put into the high
impedance power-down mode by setting this bit.)
Duty-cycle correction function.
[0] = 0; enable duty-cycle correction (default).
[0] = 1; disable duty-cycle correction.
Number of clock cycles (minus 1) of the divider input during which the divider output stays
low. A value of 0x1 means the divider is low for two input clock cycles (default: 0x1).
Number of clock cycles (minus 1) of the divider input during which the divider output stays
high. A value of 0x1 means the divider is high for two input clock cycles (default: 0x1).
Bypasses and powers down the divider; routes input to divider output.
[7] = 0; use divider (default).
[7] = 1; bypass divider.
Ignore SYNC.
[6] = 0; obey chip-level SYNC signal (default).
[6] = 1; ignore chip-level SYNC signal.
Rev. A | Page 78 of 84
Data Sheet
Reg.
Addr
(Hex) Bit(s) Name
197
[5]
Divider 2 force high
197
[4]
Divider 2 start high
197
198
[3:0]
[2]
Divider 2 phase offset
Channel 2 power-down
198
[0]
Disable Divider 2 DCC
199
[7:4]
Divider 3 low cycles
199
[3:0]
Divider 3 high cycles
19A
[7]
Divider 3 bypass
19A
[6]
Divider 3 ignore SYNC
19A
[5]
Divider 3 force high
19A
[4]
Divider 3 start high
19A
19B
[3:0]
[2]
Divider 3 phase offset
Channel 3 power-down
19B
[0]
Disable Divider 3 DCC
AD9522-3
Description
Forces divider output to a specific state. This requires that ignore SYNC also be set. Note that
this bit has no effect if the channel divider is bypassed.
[5] = 0; divider output forced to low (default).
[5] = 1; divider output forced to high.
Selects clock output to start high or start low.
[4] = 0; start low (default).
[4] = 1; start high.
Phase offset(default: 0x0).
Channel 2 powers down.
[2] = 0; normal operation (default).
[2] = 1; powered down. (OUT6/OUT6, OUT7/OUT7, and OUT8/OUT8 are put into the high
impedance power-down mode by setting this bit.)
Duty-cycle correction function.
[0] = 0; enable duty-cycle correction (default).
[0] = 1; disable duty-cycle correction.
Number of clock cycles (minus 1) of the divider input during which the divider output stays
low. A value of 0x0 means the divider is low for one input clock cycle (default: 0x0).
Number of clock cycles (minus 1) of the divider input during which the divider output stays
high. A value of 0x0 means the divider is high for one input clock cycle (default: 0x0).
Bypasses and powers down the divider; routes input to divider output.
[7] = 0; use divider (default).
[7] = 1; bypass divider.
Ignore SYNC.
[6] = 0; obey chip-level SYNC signal (default).
[6] = 1; ignore chip-level SYNC signal.
Forces divider output to a specific state. This requires that ignore SYNC also be set. Note that
this bit has no effect if the channel divider is bypassed.
[5] = 0; divider output forced to low (default).
[5] = 1; divider output forced to high.
Selects clock output to start high or start low.
[4] = 0; start low (default).
[4] = 1; start high.
Phase offset (default: 0x0).
Channel 3 powers down.
[2] = 0; normal operation (default).
[2] = 1; powered down. (OUT9/OUT9, OUT10/OUT10, and OUT11/OUT11 are put into the high
impedance power-down mode by setting this bit.)
Duty-cycle correction function.
[0] = 0; enable duty-cycle correction (default).
[0] = 1; disable duty-cycle correction.
Rev. A | Page 79 of 84
AD9522-3
Data Sheet
Table 56. VCO Divider and CLK Input
Reg.
Addr
(Hex) Bit(s) Name
1E0 [2:0] VCO divider
1E1
[4]
1E1
[3]
1E1
[2]
1E1
[1]
1E1
[0]
Description
[2]
[1]
[0]
Divide
0
0
0
2 (default)
0
0
1
3
0
1
0
4
0
1
1
5
1
0
0
6
1
0
1
Output static
1
1
0
1 (bypass)
1
1
1
Output static
Power-down clock input section Powers down the clock input section (including CLK buffer, VCO divider, and CLK tree).
[4] = 0; normal operation (default).
[4] = 1; power down.
Power-down VCO clock interface Powers down the interface block between VCO and clock distribution.
[3] = 0; normal operation (default).
[3] = 1; power down.
Power-down VCO and CLK
Powers down both the CLK input and VCO.
[2] = 0; normal operation (default).
[2] = 1; power down.
Select VCO or CLK
Selects either the VCO or the CLK as the input to VCO divider.
[1] = 0; select external CLK as input to VCO divider (default).
[1] = 1; select VCO as input to VCO divider; cannot bypass VCO divider when this is selected.
This bit must be set to use the PLL with the internal VCO.
Bypass VCO divider
Bypasses or uses the VCO divider.
[0] = 0; use VCO divider (default).
[0] = 1; bypass VCO divider; cannot select VCO as input when this is selected.
Table 57. System
Reg.
Addr
(Hex) Bit(s) Name
230 [3]
Disable power-on SYNC
230
[2]
Power-down SYNC
230
[1]
Power-down distribution reference
230
[0]
Soft SYNC
Description
Power-on SYNC mode. Used to disable the antiruntpulse circuitry.
[3] = 0; enable the antiruntpulse circuitry (default).
[3] = 1; disable the antiruntpulse circuitry.
Powers down the SYNC function.
[2] = 0; normal operation of the SYNC function (default).
[2] = 1; power-down SYNC circuitry.
Powers down the reference for the distribution section.
[1] = 0; normal operation of the reference for the distribution section (default).
[1] = 1; powers down the reference for the distribution section.
The soft SYNC bit works the same as the SYNC pin, except that the polarity of the bit
is reversed; that is, a high level forces selected channels into a predetermined static
state, and a 1-to-0 transition triggers a SYNC.
[0] = 0; same as SYNC high.
[0] = 1; same as SYNC low.
Rev. A | Page 80 of 84
Data Sheet
AD9522-3
Table 58. Update All Registers
Reg.
Addr
(Hex) Bit(s) Name
232 [0]
IO_UPDATE
Description
This bit must be set to 1 to transfer the contents of the buffer registers into the active registers. This bit is selfclearing; that is, it does not have to be set back to 0.
[0] = 1 (self-clearing); update all active registers to the contents of the buffer registers.
Table 59. EEPROM Buffer Segment
Reg.
Addr
(Hex) Bit(s) Name
A00 to [7:0] EEPROM Buffer
Segment Register 1
A16
to EEPROM Buffer
Segment Register 23
Description
The EEPROM buffer segment section stores the starting address and number of bytes that are to be
stored and read back to and from the EEPROM. Because the AD9522 register space is noncontiguous,
the EEPROM controller needs to know the starting address and number of bytes in the AD9522 register
space to store and retrieve from the EEPROM. In addition, there are special instructions for the EEPROM
controller, operational codes (that is, IO_UPDATE and end-of-data) that are also stored in the EEPROM
buffer segment. The on-chip default setting of the EEPROM buffer segment registers is designed such
that all registers are transferred to/from the EEPROM, and an IO_UPDATE is issued after transfer. See the
Programming the EEPROM Buffer Segment section for more information.
Table 60. EEPROM Control
Reg.
Addr
Description
(Hex) Bit(s) Name
B00 [0]
STATUS_EEPROM This read only register indicates the status of the data transferred between the EEPROM and the buffer
register bank during the writing and reading of the EEPROM. This signal is also available at the STATUS pin
(read only)
when Register 0x01D[7] is set.
[0] = 0; data transfer is done.
[0] = 1; data transfer is not done.
B01 [0]
EEPROM
This read only register indicates an error during the data transferred between the EEPROM and the buffer.
data error
[0] = 0; no error. Data is correct.
(read only)
[0] = 1; incorrect data detected.
B02 [1]
SOFT_EEPROM When the EEPROM pin is tied low, setting SOFT_EEPROM resets the AD9522 using the settings saved
in EEPROM.
[1] = 1; soft reset with EEPROM settings (self-clearing). This bit self clears on the next serial port clock
cycle after the completion of writing to this register.
B02 [0]
Enable EEPROM Enables the user to write to the EEPROM.
write
[0] = 0; EEPROM write protection is enabled. User cannot write to EEPROM (default).
[0] = 1; EEPROM write protection is disabled. User can write to EEPROM.
B03 [0]
REG2EEPROM
Transfers data from the buffer register to the EEPROM (self-clearing).
[0] = 1; setting this bit initiates the data transfer from the buffer register to the EEPROM (writing process);
it is reset by the I²C master after the data transfer is done.
Rev. A | Page 81 of 84
AD9522-3
Data Sheet
APPLICATIONS INFORMATION
Within the AD9522 family, lower VCO frequencies generally
result in slightly better jitter. The difference in integrated jitter
(from 12 kHz to 20 MHz offset) for the same output frequency is
usually less than 150 fs over the entire VCO frequency range
(1.4 GHz to 2.95 GHz) of the AD9522 family. If the desired
frequency plan can be achieved with a version of the AD9522
that has a lower VCO frequency, choosing the lower frequency
part results in the lowest phase noise and the lowest jitter.
However, choosing a higher VCO frequency can result in more
flexibility in frequency planning.
Choosing a nominal charge pump current in the middle of the
allowable range as a starting point allows the designer to increase or
decrease the charge pump current, and thus allows the designer
to fine-tune the PLL loop bandwidth in either direction.
ADIsimCLK is a powerful PLL modeling tool that is a very
accurate tool for determining the optimal loop filter for a given
application.
USING THE AD9522 OUTPUTS FOR ADC CLOCK
APPLICATIONS
Any high speed ADC is extremely sensitive to the quality of the
sampling clock of the AD9522. An ADC can be thought of as a
sampling mixer, and any noise, distortion, or time jitter on the
clock is combined with the desired signal at the analog-to-digital
output. Clock integrity requirements scale with the analog input
frequency and resolution, with higher analog input frequency
applications at ≥14-bit resolution being the most stringent. The
theoretical SNR of an ADC is limited by the ADC resolution and
the jitter on the sampling clock. Considering an ideal ADC of
infinite resolution where the step size and quantization error
can be ignored, the available SNR can be expressed
approximately by
tJ =
100
fs
tJ =
80
14
200
fs
tJ =
400
fs
tJ =
1ps
tJ =
2ps
70
60
50
12
10
8
tJ =
10p
s
40
6
30
10
100
1k
fA (MHz)
Figure 71. SNR and ENOB vs. Analog Input Frequency
See the AN-756 Application Note, Sampled Systems and the Effects
of Clock Phase Noise and Jitter, and the AN-501 Application Note,
Aperture Uncertainty and ADC System Performance.
Many high performance ADCs feature differential clock inputs
to simplify the task of providing the required low jitter clock on
a noisy PCB. Distributing a single-ended clock on a noisy PCB
can result in coupled noise on the sampling clock. Differential
distribution has inherent common-mode rejection that can
provide superior clock performance in a noisy environment.
The differential LVDS outputs of the AD9522 enable clock
solutions that maximize converter SNR performance.
Consider the input requirements of the ADC (differential or
single-ended, logic level termination) when selecting the best
clocking/converter solution. In some cases, the LVPECL outputs of
the AD9520 may be desirable for clocking a converter instead of
the LVDS outputs of the AD9522.
LVDS CLOCK DISTRIBUTION
The AD9522 provides clock outputs that are selectable as either
CMOS or LVDS level outputs. LVDS is a differential output option
that uses a current mode output stage. The nominal current is
3.5 mA, which yields 350 mV output swing across a 100 Ω resistor.
An output current of 7 mA is also available in cases where a larger
output swing is required. The LVDS output meets or exceeds all
ANSI/TIA/EIA-644 specifications.
A recommended termination circuit for the LVDS outputs is
shown in Figure 72. If ac coupling is necessary, place decoupling
capacitors either before or after the 100 Ω termination resistor.
VS




where:
fA is the highest analog frequency being digitized.
tJ is the rms jitter on the sampling clock.
16
90
LVDS
VS
100Ω
DIFFERENTIAL (COUPLES) 100Ω
LVDS
07224-047
 1
SNR(dB) = 20log 

 2πf At J
18
1
SNR = 20log 2πf t
A J
100
ENOB
The AD9522 has four frequency dividers: the reference (or R)
divider, the feedback (or N) divider, the VCO divider, and the
channel divider. When trying to achieve a particularly difficult
frequency divide ratio requiring a large amount of frequency
division, some of the frequency division can be done by either the
VCO divider or the channel divider, thus allowing a higher phase
detector frequency and more flexibility in choosing the loop
bandwidth.
110
07224-044
The AD9522 is a highly flexible PLL. When choosing the PLL
settings and version of the AD9522, keep the following
guidelines in mind.
Figure 71 shows the required sampling clock jitter as a function
of the analog frequency and effective number of bits (ENOB).
SNR (dB)
FREQUENCY PLANNING USING THE AD9522
Figure 72. LVDS Output Termination
See the AN-586 Application Note for more information on LVDS.
Rev. A | Page 82 of 84
Data Sheet
AD9522-3
CMOS CLOCK DISTRIBUTION
The output drivers of the AD9522 can be configured as CMOS
drivers. When selected as a CMOS driver, each output becomes
a pair of CMOS outputs, each of which can be individually
turned on or off and set as inverting or noninverting. These
outputs are 3.3 V CMOS compatible.
When single-ended CMOS clocking is used, some of the
following guidelines apply.
VS
10Ω
60.4Ω
(1.0 INCH)
MICROSTRIP
CMOS
10Ω
50Ω
100Ω
CMOS
100Ω
Figure 74. CMOS Output with Far-End Termination
Because of the limitations of single-ended CMOS clocking,
consider using differential outputs when driving high speed
signals over long traces. The AD9522 offers LVDS outputs that
are better suited for driving long traces where the inherent noise
immunity of differential signaling provides superior
performance for clocking converters.
07224-076
The value of the resistor is dependent on the board design and
timing requirements (typically 10 Ω to 100 Ω is used). CMOS
outputs are also limited in terms of the capacitive load or trace
length that they can drive. Typically, trace lengths less than
3 inches are recommended to preserve signal rise/fall times and
signal integrity.
CMOS
07224-077
Point-to-point connections must be designed such that each
driver has only one receiver, if possible. Connecting outputs in
this manner allows for simple termination schemes and minimizes
ringing due to possible mismatched impedances on the output
trace. Series termination at the source is generally required to
provide transmission line matching and/or to reduce current
transients at the driver.
CMOS
Termination at the far end of the PCB trace is a second option.
The CMOS outputs of the AD9522 do not supply enough current
to provide a full voltage swing with a low impedance resistive, farend termination, as shown in Figure 74. The far-end termination
network must match the PCB trace impedance and provide the
desired switching point. The reduced signal swing may still meet
receiver input requirements in some applications. This can be
useful when driving long trace lengths on less critical nets.
Figure 73. Series Termination of CMOS Output
Rev. A | Page 83 of 84
AD9522-3
Data Sheet
OUTLINE DIMENSIONS
9.10
9.00 SQ
8.90
0.30
0.23
0.18
0.60 MAX
0.60
MAX
64 1
49
48
PIN 1
INDICATOR
PIN 1
INDICATOR
8.85
8.75 SQ
8.65
0.50
BSC
0.50
0.40
0.30
0.25 MIN
7.50 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
SEATING
PLANE
PKG-1184
16
17
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
06-03-2013-C
12° MAX
33
32
BOTTOM VIEW
TOP VIEW
1.00
0.85
0.80
6.35
6.20 SQ
6.05
EXPOSED
PAD
Figure 75. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
CP-64-4
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9522-3BCPZ
AD9522-3BCPZ-REEL7
AD9522-3/PCBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Z = RoHS Compliant Part.
©2008–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07224-0-3/15(A)
Rev. A | Page 84 of 84
Package Option
CP-64-4
CP-64-4