v2.0 BGA Handling Instructions H um i d i t y Co n t r o l Follow the instructions on the packaging bag to keep devices dry prior to board assembly. Lo a di n g t he D ev i ce i n t o t he Pr og ra m m i ng S oc k et 1. Carefully align the device with the socket and gently lower the device into the socket (Figure 2). Position the corner pin of the device to the pin 1 orientation mark on the socket module. 2. Do not force the device into the socket. 3. Release the vacuum by depressing the vacuum switch. The device will be self-aligned to the socket. H an dl i n g Tr ay s The tray stack should be kept fastened with straps during transportation to prevent devices from coming out of their sockets. If a single loaded tray is to be moved, an empty tray should be placed over it as a cover and both trays should be taped to secure the devices in position Socket. D ev i ce P r og ra m m i n g Always use the vacuum wand provided to transfer devices. Users need to wear ESD straps when handling the devices. Removing Devices from Tray 1. Position the vacuum needle at the proper angle so that your index finger can rest on the vacuum switch (Figure 1). 2. Slightly depress the vacuum switch and then place the vacuum cup on the surface of the device. 3. Release the vacuum switch while holding the cup down to generate the vacuum that causes the cup to adhere to the device body. 4. Make certain to transfer a device within 5 to 8 seconds. Note: To completely release the vacuum, the switch should be pressed down further than when pressed to generate the vacuum. Otherwise, a partial vacuum will pull the device back. 4. Close the lid. The device is ready for programming. Figure 2 • Inserting the Device in the Socket R em o vi n g t he D ev i c e f r om t h e Pr og ra m m i ng S oc k et When the programming of the device is complete, use the vacuum wand to remove the device from the socket and to place it in a tray labeled "programmed devices". For soldering, please refer to the reflow temperature profile online: http://www.actel.com/docs/sockets/temp_graph.pdf. C l ea ni n g t he V ac u um W a n d Figure 1 • Vacuum Wand M a y 20 0 2 © 2002 Actel Corporation The suction cup of the vacuum wand should be cleaned periodically using IPA to minimize possible leakage in vacuum. 1 Actel and the Actel logo are registered trademarks of Actel Corporation. All other trademarks are the property of their owners. http://www.actel.com Actel Europe Ltd. Maxfli Court, Riverside Way Camberley, Surrey GU15 3YL United Kingdom Tel: +44 (0)1276 401450 Fax: +44 (0)1276 401590 Actel Corporation 955 East Arques Avenue Sunnyvale, California 94086 USA Tel: (408) 739-1010 Fax: (408) 739-1540 Actel Asia-Pacific EXOS Ebisu Bldg. 4F 1-24-14 Ebisu Shibuya-ku Tokyo 150 Japan Tel: +81-(0)3-3445-7671 Fax: +81-(0)3-3445-7668 5192710-0/5.02