BBY66... Silicon Tuning Diodes • High capacitance ratio • High Q hyperabrupt tuning diode • Low series resistance • Designed for low tuning voltage operation for VCO's in mobile communications equipment • Very low capacitance spread • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BBY66-02V BBY66-05 BBY66-05W ! , , Type BBY66-02V BBY66-05 BBY66-05W Package SC79 SOT23 SOT323 Configuration single common cathode common cathode LS(nH) 0.6 1.8 1.4 Marking h O1s / O2s** OBs **For differences see next page Capacitance groups Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 12 V Forward current IF 50 mA Operating temperature range Top -55 ... 150 °C Storage temperature Tstg -55 ... 150 1Pb-containing Value Unit package may be available upon special request 1 2007-04-20 BBY66... Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Parameter min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 10 V - - 20 VR = 10 V, TA = 65 °C - - 200 AC Characteristics Diode capacitance1) pF CT VR = 1 V, f = 1 MHz 66 68.7 71.5 VR = 2 V, f = 1 MHz 33 35.4 38 VR = 3 V, f = 1 MHz 19.7 20.95 22.2 12 12.7 13.5 CT1 /CT4.5 5 5.41 - rS - 0.25 0.4 VR = 4.5 V, f = 1 MHz Capacitance ratio VR = 1 V, VR = 4.5 V Series resistance Ω VR = 1 V, f = 470 MHz 1Capacitance CT/groups groups at 1V, coded 01; 02 (only BBY66-05) 01 02 C1V min 66pF 68.5pF C1V max 69pF 71.5pF Deliveries contain either CT group 01 or group 02 (marked on reel). No direct order of CT groups possible 2 2007-04-20 BBY66... Diode capacitance CT = ƒ (VR) Temperature coefficient of the diode f = 1MHz capacitance TCc = ƒ (VR) 1200 80 pF ppm/°C TCC CT 60 50 600 40 30 300 20 10 0 0 1 2 V 3 0 1 5 VR 2 3 V 5 VR Reverse current IR = ƒ(VR) TA = Parameter 10 4 pA TA=+85°C 10 3 IR TA=+65°C TA=+25°C 10 2 10 1 10 0 2 3 4 5 6 7 8 9 10 V 12 VR 3 2007-04-20 Package SC79 BBY66... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 ±0.1 0.2 ±0.05 10˚MAX. 1.6 ±0.1 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 2 0.55 ±0.04 0.35 1.35 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Cathode marking 0.4 0.93 0.2 8 1.96 Reel with 2 mm Pitch 2 1.33 Standard 4 Cathode marking 4 0.66 2007-04-20 BBY66... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 5 2007-04-20 Package SOT23 BBY66... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 6 2007-04-20 Package SOT323 BBY66... Package Outline 0.9 ±0.1 2 ±0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 ±0.1 0.1 MIN. 2.1 ±0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 7 2007-04-20 BBY66... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2007-04-20