INFINEON HYS72D128321GBR-6-B

Data Sheet, Rev. 0.5, Dec. 2003
HYS72D128300GBR-[5/6/7]-B
HYS72D256320GBR-[5/6/7]-B
HYS72D128500HR-[7F/7]-B
HYS72D128321GBR-[5/6/7]-B
184-Pin Registered Double Data Rate SDRAM Module
Reg DIMM
DDR SDRAM
Green Product
Lead Containing Product
Memory Products
N e v e r
s t o p
t h i n k i n g .
Edition 2003-12
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Data Sheet, Rev. 0.5, Dec. 2003
HYS72D128300GBR-[5/6/7]-B
HYS72D256320GBR-[5/6/7]-B
HYS72D128500HR-[7F/7]-B
HYS72D128321GBR-[5/6/7]-B
184-Pin Registered Double Data Rate SDRAM Module
Reg DIMM
Memory Products
N e v e r
s t o p
t h i n k i n g .
HYS72D128300GBR-[5/6/7]-B, HYS72D256320GBR-[5/6/7]-B, HYS72D128500HR-[7F/7]-B
Revision History:
Rev. 0.5
2003-12
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Template: mp_a4_v2.0_2003-06-06.fm
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
1
1.1
1.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
3.1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4
SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6
Application Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Data Sheet
5
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Overview
1
Overview
1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
184-pin Registered 8-Byte Dual-In-Line DDR SDRAM Module for “1U” PC, Workstation and Server main
memory applications
One rank 128M × 72 organization and two rank 256M × 72 organization
JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM) with a single + 2.5 V (± 0.2 V) power
supply and +2.6(± 0.1 V) power supply for DDR400
Built with DDR SDRAMs in 66-Lead TSOPII and FBGA 60 package
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All inputs and outputs SSTL_2 compatible
Re-drive for all input signals using register and PLL devices.
Serial Presence Detect with E2PROM
Low Profile Modules form factor: 133.35 mm × 28.58 mm (1.1”) × 4.00 mm and 133.35 mm × 30.48 mm
(1.2”) × 4.00 mm
Based on Jedec standard reference card layout RawCard “B”, “C“ and “D“
Gold plated contacts
Table 1
Performance
Part Number Speed Code
–5
–6
–7
–7F
Unit
Speed Grade
Component
DDR400B
DDR333B
DDR266A
DDR266
—
Module
PC3200–3033 PC2700–2533 PC2100–2033 PC2100–2022 —
fCK3 200
@ CL = 2.5 fCK2.5 166
@ CL = 2 fCK2 133
max. Clock Frequency @ CL = 3
1.2
166
—
—
MHz
166
143
143
MHz
133
133
133
MHz
Description
The HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B are low profile versions of the standard
Registered DIMM modules with 1.1” inch (28.58) and 1.2” inch (30,40 mm) height for 1U Server Applications. The
Low Profile DIMM versions are available as 128M × 72 (1 GB) and 256M × 72 (2 GB).
The memory array is designed with Double Data Rate Synchronous DRAMs for ECC applications. All control and
address signals are re-driven on the DIMM using register devices and a PLL for the clock distribution. This reduces
capacitive loading to the system bus, but adds one cycle to the SDRAM timing. A variety of decoupling capacitors
are mounted on the PC board. The DIMMs feature serial presence detect based on a serial E2PROM device using
the 2-pin I2C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
available to the customer.
Data Sheet
6
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Overview
Table 2
Ordering Information1)2)
Compliance Code2)
Description
HYS72D128300GBR–5–B
PC3200R–30331–C0
one rank 1 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128321GBR–5–B
PC3200R–30331–B0
two ranks 1 GByte Reg. ECC DIMM 512 MBit (×8)
HYS72D256320GBR–5–B
PC3200R–30331–D0
two ranks 2 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128300GBR–6–B
PC2700R–25330–C0
one rank 1 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128321GBR–6–B
PC2700R–25330–B0
two ranks 1 GByte Reg. ECC DIMM 512 MBit (×8)
HYS72D256320GBR–6–B
PC2700R–25330–D0
two ranks 2 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128300GBR–7–B
PC2100R–20330–C0
one rank 1 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128321GBR–7–B
PC2100R–20330–B0
two ranks1 GByte Reg. ECC DIMM 512 MBit (×8)
HYS72D256320GBR–7–B
PC2100R–20330–D0
two ranks 2 GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128500HR–7F–B
PC2100R–20220–M
one rank 1GByte Reg. ECC DIMM 512 MBit (×4)
HYS72D128500HR–7–B
PC2100R–20330–M
one rank 1GByte Reg. ECC DIMM 512 MBit (×4)
Type
SDRAM
Technology
PC3200 (CL=3)
PC2700 (CL=2.5)
PC2100 (CL=2)
1) All part numbers end with a place code (not shown), designating the silicon-die revision. Reference information available
on request. Example: HYS72D128300GBR-[5/6/7]-B, indicating Rev.B die are used for SDRAM components.
2) The Compliance Code is printed on the module labels and describes the speed sort for example “PC2100R”, the latencies
(for example “20330” means CAS latency = 2.5, tRCD latency = 3 and tRP latency =3 ) and the Raw Card used for this module
Data Sheet
7
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
2
Pin Configuration
Table 3
Pin Definitions and Functions
Symbol
Type
Function
A0 - A11,A12
Address Inputs
BA0, BA1
Bank Selects
DQ0 - DQ63
Data Input/Output
CB0 - CB7
Check Bits (×72 organization only)
RAS,CAS,WE
Command Inputs
CKE0, CKE1
Clock Enable
DQS0 - DQS8
SDRAM low data strobes
CK0, CK0
Differential Clock Input
DM0 - DM8
DQS9 - DQS17
SDRAM low data mask/
high data strobes
S0 - S1
Chip Selects
VDD
VSS
VDDQ
VDDID
VDDSPD
VREF
Power (+2.5 V)
SCL
Serial bus clock
SDA
Serial bus data line
SA0 - SA2
slave address select
NC
no connect
Ground
I/O Driver power supply
VDD Indentification flag
EEPROM power supply
I/O reference supply
DU
don’t use
RESET
Reset pin (forces register inputs low)1)
1) for detailed description of the Power Up and Power Management on DDR Registered DIMMs see the Application Note at
the end of this datasheet
Data Sheet
8
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
Table 4
Pin Configuration1)
PIN#
Symbol
PIN#
Symbol
PIN#
Symbol
PIN#
Symbol
1
VREF
48
A0
94
DQ4
141
A10
2
DQ0
49
CB2
95
DQ5
142
CB6
3
VSS
50
VSS
96
VDDQ
143
VDDQ
4
DQ1
51
CB3
97
DQS9
144
CB7
5
DQS0
52
6
DQ2
7
VDD
8
BA1
98
DQ6
KEY
99
DQ7
145
KEY
VSS
53
DQ32
100
VSS
146
DQ36
DQ3
54
VDDQ
101
NC
147
DQ37
9
NC
55
DQ33
102
NC
148
VDD
10
RESET
56
DQS4
103
NC
149
DM4/DQS13
11
VSS
57
DQ34
104
VDDQ
150
DQ38
12
DQ8
58
VSS
105
DQ12
151
DQ39
13
DQ9
59
BA0
106
DQ13
152
VSS
14
DQS1
60
DQ35
107
DQS10
153
DQ44
15
VDDQ
61
DQ40
108
VDD
154
RAS
16
DU
62
VDDQ
109
DQ14
155
DQ45
17
DU
63
WE
110
DQ15
156
VDDQ
18
VSS
64
DQ41
111
CKE1
157
S0
19
DQ10
65
CAS
112
VDDQ
158
S1
20
DQ11
66
VSS
113
NC
159
DQS14
21
CKE0
67
DQS5
114
DQ20
160
VSS
22
VDDQ
68
DQ42
115
NC / A12
161
DQ46
23
DQ16
69
DQ43
116
VSS
162
DQ47
24
DQ17
70
VDD
117
DQ21
163
NC
25
DQS2
71
NC
118
A11
164
VDDQ
26
VSS
72
DQ48
119
DQS11
165
DQ52
27
A9
73
DQ49
120
VDD
166
DQ53
28
DQ18
74
VSS
121
DQ22
167
NC
29
A7
75
DU
122
A8
168
VDD
30
VDDQ
76
DU
123
DQ23
169
DQS15
31
DQ19
77
VDDQ
124
VSS
170
DQ54
32
A5
78
DQS6
125
A6
171
DQ55
33
DQ24
79
DQ50
126
DQ28
172
VDDQ
34
VSS
80
DQ51
127
DQ29
173
NC
35
DQ25
81
128
VDDQ
174
DQ60
36
DQS3
82
VSS
VDDID
129
DQS12
175
DQ61
37
A4
83
DQ56
130
A3
176
VSS
38
VDD
84
DQ57
131
DQ30
177
DQS16
39
DQ26
85
VDD
132
VSS
178
DQ62
40
DQ27
86
DQS7
133
DQ31
179
DQ63
41
A2
87
DQ58
134
CB4
180
VDDQ
Data Sheet
9
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
Pin Configuration1) (cont’d)
Table 4
PIN#
Symbol
PIN#
Symbol
PIN#
Symbol
PIN#
Symbol
42
VSS
88
DQ59
135
CB5
181
SA0
43
A1
89
VSS
136
VDDQ
182
SA1
44
CB0
90
NC
137
CK0
183
SA2
45
CB1
91
SDA
138
CK0
184
VDDSPD
46
VDD
92
SCL
139
VSS
–
–
47
DQS8
93
VSS
140
DQS17
–
–
1) A12 is used for 256Mbit and 512Mbit based modules only.
Table 5
Address Format
Density Organization
Memory
Ranks
1 GB
128M x 72
1
1 GB
128M x 72
2 GB
256M x 72
Data Sheet
SDRAMs
# of
SDRAMs
# of row/bank/
column bits
Refresh
Period Interval
128M × 4 18
13/2/12
8K
64 ms
7.8 µs
2
64M × 8
18
13/2/11
8K
64 ms
7.8 µs
2
128M × 4 36
13/2/12
8K
64 ms
7.8 µs
10
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
VSS
RS0
DQS0
DM0/DQS9
DQ0
DQ1
DQ2
DQ3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DQ8
DQ9
DQ10
DQ11
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DQ16
DQ17
DQ18
DQ19
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ24
DQ25
DQ26
DQ27
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ32
DQ33
DQ34
DQ35
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DM
DQ4
DQ5
DQ6
DQ7
D0
DQ12
DQ13
DQ14
DQ15
D1
S
DM
I/O 0
I/O 1
I/O 2
I/O 3
DM
D10
DM2/DQS11
DM
DQ20
DQ21
DQ22
DQ23
D2
DQS3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DM
D11
DM3/DQS12
S
DM
DQ28
DQ29
DQ30
DQ31
D3
DQS4
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DM4/DQS13
S
DQ36
DQ37
DQ38
DQ39
D4
DQ40
DQ41
DQ42
DQ43
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DQ48
DQ49
DQ50
DQ51
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DQ56
DQ57
DQ58
DQ59
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DM
DQS6
DM6/DQS15
DM
DQ52
DQ53
DQ54
DQ55
D6
DQS7
I/O 0
I/O 1
I/O 2
I/O 3
DM5/DQS14
DQ44
DQ45
DQ46
DQ47
D5
S
DQS
DM
DQS5
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DM
D12
S
DM
D13
S
DM
VDDSPD
Serial PD
VDDQ
D0-D17
VDD
D0-D17
VREF
D0-D17
VSS
D0-D17
VDDID
Strap: see Note 4
D14
Serial PD
DQS S
I/O 0
I/O 1
D15
I/O 2
I/O 3
DM
SCL
SDA
WP A0
A1
A2
SA0 SA1 SA2
DM7/DQS16
CB0
CB1
CB2
CB3
R
E
G
I
S
T
E
R
S0
BA0-BA1
A0-A136
RAS
CAS
CKE0
WE
PCK
PCK
Data Sheet
DQS
DM
DQS2
Figure 1
D9
S
DM1/DQS10
DQS1
DQS8
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DM
DQ60
DQ61
DQ62
DQ63
D7
D8
DM
DM8/DQS17
CB4
CB5
CB6
CB7
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
S
DM
D16
S
D17
DM
Notes:
1. DQ-to-I/O wiring may be changed
within a byte.
2. DQ/DQS/DM/CKE/S relationships
must be maintained as shown.
3. DQ/DQS resistors should be 22
Ohms.
4. VDDID strap connections
(for memory device VDD, VDDQ):
STRAP OUT (OPEN): VDD = VDDQ
STRAP IN (VSS): VDD ≠ VDDQ.
5. Address and control resistors
should be 22 Ohms.
6. A13 is not wired for raw card B.
RS0 -> CS : SDRAMs D0-D17
RBA0-RBA1 -> BA0-BA1: SDRAMs D0-D17
RA0-RA136 -> A0-A136: SDRAMs D0-D17
RRAS -> RAS: SDRAMs D0-D17
RCAS -> CAS: SDRAMs D0-D17
RCKE0A -> CKE: SDRAMs D0-D17
CK0, CK0 --------- PLL*
RWE -> WE: SDRAMs D0-D17
* Wire per Clock Loading Table/Wiring Diagrams
RESET
Block Diagram: 1 Rank 128M × 72 DDR SDRAM DIMM HYS72D128[300/500]GBR–[5/6/7/7F]–B
11
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
RS1
RS0
DQS0
DM0/DQS9
DQS4
DM4/DQS13
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D0
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
D9
DQS1
DM1/DQS10
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D4
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D13
DQS5
DM5/DQS14
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
D1
DQS2
DM2/DQS11
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D2
CS DQS
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
D10
CS
CS DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D5
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
D14
DQS6
DM6/DQS15
DQS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
D11
DQS3
DM3/DQS12
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D6
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D15
DQS7
DM7DQS16
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
D3
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
D12
CS DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D7
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
D16
DQS8
DM8/DQS17
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
S0
S1
BA0-BA1
A0-A137
RAS
CAS
CKE0
CKE1
WE
R
E
G
I
S
T
E
R
PCK
PCK
Figure 2
Data Sheet
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
D8
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS
DQS
VDDSPD
D17
Serial PD
SDA
WP A0
A1
Serial PD
D0-D17
D0-D17
VDDQ
SCL
A2
SA0 SA1 SA2
VDD
VREF
VSS
VDDID
D0-D17
D0-D17
Strap: see Note 4
CK0, CK0 --------- PLL*
RS0 -> CS : SDRAMs D0-D8
*
Wire
per
Clock
Loading
Table/Wiring
Diagrams
RS1 -> CS : SDRAMs D9-D17
Notes:
RBA0-RBA1 -> BA0-BA1: SDRAMs D0-D17
1. DQ-to-I/O wiring may be changed within a byte.
RA0-RA137 -> A0-A137: SDRAMs D0-D17
2. DQ/DQS/DM/CKE/S relationships must be maintained as shown.
RRAS -> RAS: SDRAMs D0-D17
3. DQ/DQS resistors should be 22 Ohms.
RCAS -> CAS: SDRAMs D0-D17
4. VDDID strap connections (for memory device VDD, VDDQ):
RCKE0 -> CKE: SDRAMs D0-D8
STRAP OUT (OPEN): VDD = VDDQ
RCKE1 -> CKE: SDRAMs D9-D17
STRAP IN (VSS): VDD ≠ VDDQ.
RWE -> WE: SDRAMs D0-D17
5. RS0 and RS1 alternate between the back and front sides of the DIMM.
6. Address and control resistors should be 22 Ohms.
RESET
7. A13 is not wired for raw card A.
Block Diagram – 2 Ranks 64M × 72 DDR SDRAM HYS72D128321GBR-[5/6/7]–B
12
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Pin Configuration
VSS
RS1
RS0
DQS0
DM0/DQS9
DQ0
DQ1
DQ2
DQ3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ8
DQ9
DQ10
DQ11
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQ16
DQ17
DQ18
DQ19
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQ24
DQ25
DQ26
DQ27
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQ32
DQ33
DQ34
DQ35
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQ40
DQ41
DQ42
DQ43
CS
DQ48
DQ49
DQ50
DQ51
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQ56
DQ57
DQ58
DQ59
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
CB0
CB1
CB2
CB3
CS
DM
D0
DQS
I/O 3
I/O 2
I/O 1
I/O 0
CS
DM
DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ4
DQ5
DQ6
DQ7
D18
CS
DM
D9
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D27
DM1/DQS10
DQS1
CS
DM
D1
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
DQ12
DQ13
DQ14
DQ15
D19
DQS2
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D10
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D28
DM2/DQS11
DM
D2
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
DQ20
DQ21
DQ22
DQ23
D20
DQS3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D11
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D12
CS
DM
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D29
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D30
CS
DM
DM3/DQS12
DM
D3
DM
DQ28
DQ29
DQ30
DQ31
D21
DQS4
CS
DM
CS
DM
DM4/DQS13
DM
D4
DQS
DM
DQ36
DQ37
DQ38
DQ39
D22
DQS5
DM
D5
DM5/DQS14
DM
DQS6
DM
I/O 0
I/O 1
I/O 2
I/O 3
CS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D13
DQS
DQ44
DQ45
DQ46
DQ47
D23
CS
I/O 0
I/O 1
I/O 2
I/O 3
DM
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D14
CS
DM
D31
CS
DM
D32
DM6/DQS15
DM
D6
DM
DQ52
DQ53
DQ54
DQ55
D24
DQS7
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D15
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D33
DM7/DQS16
DM
D7
DM
DQ60
DQ61
DQ62
DQ63
D25
DQS8
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D16
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D34
DM8/DQS17
D8
DM
DM
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CB4
CB5
CB6
CB7
D26
CK0, CK0 --------- PLL*
* Wire per Clock Loading Table/Wiring Diagrams
R
E
G
I
S
T
E
R
WE
PCK
PCK
Figure 3
Data Sheet
RSO -> CS : SDRAMs D0-D17
RS1 -> CS: SDRAMs D18-D35
RBA0-RBA1 -> BA0-BA1: SDRAMs D0-D35
RA0-RA13 -> A0-A13: SDRAMs D0- D35
RRAS -> RAS: SDRAMs D0-D35
RCAS -> CAS: SDRAMs D0-D35
RCKE0 -> CKE: SDRAMs D0-D17
RCKE1 -> CKE: SDRAMs D18-D35
RWE -> WE: SDRAMs D0-D35
RESET
WP A0
A1
D17
VDDSPD
Serial PD
SCL
S0
S1
BA0-BA1
A0-A13
RAS
CAS
CKE0
CKE1
CS
A2
SA0 SA1 SA2
VDDQ
SDA VDD
VREF
VSS
VDDID
DM
DQS
I/O 0
I/O 1
I/O 2
I/O 3
CS
DM
D35
Serial PD
D0-D35
D0-D35
D0-D35
D0-D35
Strap: see Note 4
Notes:
1. DQ-to-I/O wiring may be changed within a byte.
2. DQ/DQS/DM/CKE/S relationships must be maintained as shown.
3. DQ/DQS resistors should be 22 Ohms.
4. VDDID strap connections (for memory device VDD, VDDQ):
STRAP OUT (OPEN): VDD = VDDQ
STRAP IN (VSS): VDD ≠ VDDQ.
5. Address and control resistors should be 22 Ohms.
6. Each Chip Select and CKE pair alternate between decks for thermal enhancement.
Block Diagram – 2 Ranks 128M × 72 DDR SDRAM HYS72D256320GBR-[5/6/7]–B
13
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
3
Electrical Characteristics
3.1
Operating Conditions
Table 6
Absolute Maximum Ratings
Parameter
Symbol
Voltage on I/O pins relative to VSS
VIN, VOUT
Values
min.
typ.
max.
Unit Note/ Test
Condition
–0.5
–
VDDQ +
V
–
0.5
Voltage on inputs relative to VSS
Voltage on VDD supply relative to VSS
Voltage on VDDQ supply relative to VSS
Operating temperature (ambient)
Storage temperature (plastic)
Power dissipation (per SDRAM component)
Short circuit output current
VIN
VDD
VDDQ
TA
TSTG
PD
IOUT
–1
–
+3.6
V
–
–1
–
+3.6
V
–
–1
–
+3.6
V
–
0
–
+70
°C
–
-55
–
+150
°C
–
–
1
–
W
–
–
50
–
mA
–
Attention: Permanent damage to the device may occur if “Absolute Maximum Ratings” are exceeded. This
is a stress rating only, and functional operation should be restricted to recommended operation
conditions. Exposure to absolute maximum rating conditions for extended periods of time may
affect device reliability and exceeding only one of the values may cause irreversible damage to
the integrated circuit.
Table 7
Electrical Characteristics and DC Operating Conditions
Parameter
Symbol
VDD
Device Supply Voltage
VDD
Output Supply Voltage
VDDQ
Output Supply Voltage
VDDQ
EEPROM supply voltage
VDDSPD
Supply Voltage, I/O Supply VSS,
Voltage
VSSQ
Input Reference Voltage
VREF
I/O Termination Voltage
VTT
Device Supply Voltage
Unit Note/Test Condition 1)
Values
Min.
Typ.
Max.
2.3
2.5
2.7
V
2.5
2.6
2.7
V
2.3
2.5
2.7
V
2.5
2.6
2.7
V
fCK ≤ 166 MHz
fCK > 166 MHz 2)
fCK ≤ 166 MHz 3)
fCK > 166 MHz 2)3)
2.3
2.5
3.6
V
—
0
V
—
0
0.49 × VDDQ 0.5 × VDDQ 0.51 × VDDQ V
4)
VREF – 0.04
VREF + 0.04 V
5)
Input High (Logic1) Voltage VIH(DC)
VREF + 0.15
8)
Input Low (Logic0) Voltage VIL(DC)
–0.3
Input Voltage Level,
CK and CK Inputs
VIN(DC)
–0.3
VDDQ + 0.3 V
VREF – 0.15 V
VDDQ + 0.3 V
Input Differential Voltage,
CK and CK Inputs
VID(DC)
0.36
VDDQ + 0.6
V
8)6)
VI-Matching Pull-up
Current to Pull-down
Current
VIRatio
0.71
1.4
—
7)
(System)
Data Sheet
14
8)
8)
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 7
Electrical Characteristics and DC Operating Conditions (cont’d)
Parameter
Symbol
Unit Note/Test Condition 1)
Values
Min.
Typ.
Max.
Input Leakage Current
II
–2
2
µA
Any input 0 V ≤ VIN ≤ VDD;
All other pins not under test
= 0 V 8)9)
Output Leakage Current
IOZ
–5
5
µA
DQs are disabled;
0 V ≤ VOUT ≤ VDDQ
Output High Current,
Normal Strength Driver
IOH
—
–16.2
mA
VOUT = 1.95 V
Output Low
Current, Normal Strength
Driver
IOL
16.2
—
mA
VOUT = 0.35 V
1) 0 °C ≤ TA ≤ 70 °C
2) DDR400 conditions apply for all clock frequencies above 166 MHz
3) Under all conditions, VDDQ must be less than or equal to VDD.
4) Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC). VREF is also expected to track noise variations in VDDQ.
5) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal
to VREF, and must track variations in the DC level of VREF.
6) VID is the magnitude of the difference between the input level on CK and the input level on CK.
7) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire
temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the
maximum difference between pull-up and pull-down drivers due to process variation.
8) Inputs are not recognized as valid until VREF stabilizes.
9) Values are shown per DDR SDRAM component
Data Sheet
15
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 8
IDD Conditions
Parameter
Symbol
Operating Current 0
one bank; active/ precharge; DQ, DM, and DQS inputs changing once per clock cycle;
address and control inputs changing once every two clock cycles.
IDD0
Operating Current 1
one bank; active/read/precharge; Burst Length = 4; see component data sheet.
IDD1
Precharge Power-Down Standby Current
all banks idle; power-down mode; CKE ≤ VIL,MAX
IDD2P
Precharge Floating Standby Current
CS ≥ VIH,,MIN, all banks idle; CKE ≥ VIH,MIN;
address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS and DM.
IDD2F
Precharge Quiet Standby Current
CS ≥ VIHMIN, all banks idle; CKE ≥ VIH,MIN; VIN = VREF for DQ, DQS and DM;
address and other control inputs stable at ≥ VIH,MIN or ≤ VIL,MAX.
IDD2Q
Active Power-Down Standby Current
one bank active; power-down mode; CKE ≤ VILMAX; VIN = VREF for DQ, DQS and DM.
IDD3P
Active Standby Current
one bank active; CS ≥ VIH,MIN; CKE ≥ VIH,MIN; tRC = tRAS,MAX;
DQ, DM and DQS inputs changing twice per clock cycle;
address and control inputs changing once per clock cycle.
IDD3N
Operating Current Read
one bank active; Burst Length = 2; reads; continuous burst;
address and control inputs changing once per clock cycle;
50% of data outputs changing on every clock edge;
CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B; IOUT = 0 mA
IDD4R
Operating Current Write
one bank active; Burst Length = 2; writes; continuous burst;
address and control inputs changing once per clock cycle;
50% of data outputs changing on every clock edge;
CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B
IDD4W
Auto-Refresh Current
tRC = tRFCMIN, burst refresh
IDD5
Self-Refresh Current
CKE ≤ 0.2 V; external clock on
IDD6
Operating Current 7
four bank interleaving with Burst Length = 4; see component data sheet.
IDD7
Data Sheet
16
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Symbol
IDD0
IDD1
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
IDD6
IDD7
HYS72D128500HR–7–B
HYS72D128300GBR–7–B
HYS72D128321GBR–7–B
HYS72D256320GBR–7–B
IDD Specification for –7
HYS72D128500HR–7F–B
Part Number & Organization
Table 9
1 GB
1 GB
1 GB
2 GB
×72
×72
×72
×72
1 Rank
1 Rank
2 Ranks
2 Ranks
–7F
–7
–7
–7
Unit
Note 1)2)
typ.
max.
typ.
max.
typ.
max.
typ.
max.
2158
2452
2028
2298
1587
1776
2586
2964
mA
3)
2354
2746
2208
2568
1677
1911
2766
3234
mA
3)4)
430
448
430
448
430
448
484
520
mA
5)
736
808
736
808
736
808
1096
1240
mA
5)
646
754
646
754
646
754
916
1132
mA
5)
538
610
538
610
538
610
700
844
mA
5)
934
1042
934
1042
934
1042
1492
1708
mA
5)
2179
2460
2118
2388
1632
1821
2676
3054
mA
3)4)
2273
2554
2208
2478
1677
1866
2766
3144
mA
3)
4499
5263
4278
4998
2712
3126
4836
5664
mA
3)
414
468
414
468
414
468
451
560
mA
5)
5493
6376
5088
5898
3117
3576
5646
6564
mA
3)4)
1) DRAM component currents only
2) Test condition for maximum values: VDD = 2.7 V, TA = 10 °C
3) The module IDDx values are calculated from the component IDDx data sheet values as:
m × IDDx[component] + n × IDD3N[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank modules
4) DQ I/O (IDDQ) currents are not included into calculations: module IDD values will be measured differently depending on load
conditions
5) The module IDDx values are calculated from the corrponent IDDx data sheet values as: (m + n) × IDDx[component]
Data Sheet
17
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Symbol
IDD0
IDD1
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
IDD6
IDD7
HYS72D128321GBR–6–B
HYS72D256320GBR–6–B
IDD Specification for –6
HYS72D128300GBR–6–B
Part Number & Organization
Table 10
1GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–6
–6
–6
Unit
Note 1)2)
typ.
max.
typ.
max.
typ.
max.
2350
2710
1873
2116
3016
3502
mA
3)
2620
2980
2008
2251
3286
3772
mA
3)4)
484
502
484
502
538
574
mA
5)
880
970
880
970
1330
1510
mA
5)
736
862
736
862
1042
1294
mA
5)
628
700
628
700
826
970
mA
5)
1096
1222
1096
1222
1762
2014
mA
5)
2620
2980
2008
2251
3286
3772
mA
3)4)
2710
3070
2053
2296
3376
3862
mA
3)
4690
5500
3043
3511
5356
6292
mA
3)
475
523.6
475
523.6
520
617.2
mA
5)
6310
7300
3853
4411
6976
8092
mA
3)4)
1) DRAM component currents only
2) Test condition for maximum values: VDD = 2.7 V, TA = 10 °C
3) The module IDDx values are calculated from the component IDDx data sheet values as:
m × IDDx[component] + n × IDD3N[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank
modules
4) DQ I/O (IDDQ) currents are not included into calculations: module IDD values will be measured differently depending on
load conditions
5) The module IDDx values are calculated from the corrponent IDDx data sheet values as: (m + n) × IDDx[component]
Data Sheet
18
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Symbol
IDD0
IDD1
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
IDD6
IDD7
HYS72D128321GBR–5–B
HYS72D256320GBR–5–B
IDD Specification for –5
HYS72D128300GBR–5–B
Part Number & Organization
Table 11
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–5
–5
–5
Unit
Note 1)2)
typ.
max.
typ.
max.
typ.
max.
2680
3040
3436
3940
3436
3940
mA
3)
2950
3400
3706
4300
3706
4300
mA
3)4)
698
734
752
824
752
824
mA
5)
1184
1292
1724
1940
1724
1940
mA
5)
986
1112
1328
1580
1328
1580
mA
5)
860
932
1076
1220
1076
1220
mA
5)
1400
1544
2156
2444
2156
2444
mA
5)
3040
3490
3796
4390
3796
4390
mA
3)4)
3130
3580
3886
4480
3886
4480
mA
3)
5290
6190
6046
7090
6046
7090
mA
3)
696.2
737.6
748.4
831.2
748.4
831.2
mA
5)
7090
8260
7846
9160
7846
9160
mA
3)4)
1) DRAM component currents only
2) Test condition for maximum values: VDD = 2.7 V, TA = 10 °C
3) The module IDDx values are calculated from the component IDDx data sheet values as:
m × IDDx[component] + n × IDD3N[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank
modules
4) DQ I/O (IDDQ) currents are not included into calculations: module IDD values will be measured differently depending on
load conditions
5) The module IDDx values are calculated from the corrponent IDDx data sheet values as: (m + n) × IDDx[component]
Data Sheet
19
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 12
AC Timing - Absolute Specifications –6/–5
Parameter
DQ output access time from CK/CK
DQS output access time from CK/CK
CK high-level width
CK low-level width
Clock Half Period
Symbol
tAC
tDQSCK
tCH
tCL
tHP
tCK
–5
–6
DDR400B
DDR333
Unit Note/ Test
Condition 1)
Min.
Max.
Min.
Max.
–0.6
+0.6
–0.7
+0.7
ns
2)3)4)5)
–0.5
+0.5
–0.6
+0.6
ns
2)3)4)5)
0.45
0.55
0.45
0.55
2)3)4)5)
0.45
0.55
0.45
0.55
tCK
tCK
min. (tCL, tCH) ns
2)3)4)5)
min. (tCL, tCH)
2)3)4)5)
5
12
—
—
ns
CL = 3.0 2)3)4)5)
6
12
6
12
ns
CL = 2.5 2)3)4)5)
7.5
12
7.5
12
ns
CL = 2.0 2)3)4)5)
0.4
—
0.45
—
ns
2)3)4)5)
0.4
—
0.45
—
ns
2)3)4)5)
2.2
—
2.2
—
ns
2)3)4)5)6)
tDIPW
Data-out high-impedance time from CK/CK tHZ
Data-out low-impedance time from CK/CK
tLZ
st
Write command to 1 DQS latching transition tDQSS
DQS-DQ skew (DQS and associated DQ
tDQSQ
1.75
—
1.75
—
ns
2)3)4)5)6)
–0.6
+0.6
–0.7
+0.7
ns
2)3)4)5)7)
–0.6
+0.6
–0.7
+0.7
ns
2)3)4)5)7)
0.75
1.25
0.75
1.25
tCK
2)3)4)5)
—
+0.40
—
+0.40
ns
TFBGA 2)3)4)5)
signals)
—
+0.40
—
+0.45
ns
TSOPII 2)3)4)5)
—
+0.50
—
+0.50
ns
TFBGA 2)3)4)5)
—
+0.50
—
+0.55
ns
TSOPII 2)3)4)5)
Clock cycle time
DQ and DM input hold time
DQ and DM input setup time
Control and Addr. input pulse width (each
input)
tDH
tDS
tIPW
DQ and DM input pulse width (each input)
Data hold skew factor
tQHS
tQH
DQS input low (high) pulse width (write cycle) tDQSL,H
DQS falling edge to CK setup time (write
tDSS
DQ/DQS output hold time
tHP –tQHS
tHP –tQHS
ns
2)3)4)5)
0.35
—
0.35
—
2)3)4)5)
0.2
—
0.2
—
tCK
tCK
2)3)4)5)
cycle)
DQS falling edge hold time from CK (write
cycle)
tDSH
0.2
—
0.2
—
tCK
2)3)4)5)
Mode register set command cycle time
tMRD
tWPRES
tWPST
tWPRE
tIS
2
—
2
—
tCK
2)3)4)5)
0
—
0
—
ns
2)3)4)5)8)
0.40
0.60
0.40
0.60
2)3)4)5)9)
0.25
—
0.25
—
tCK
tCK
0.6
—
0.75
—
ns
fast slew rate
Write preamble setup time
Write postamble
Write preamble
Address and control input setup time
2)3)4)5)
3)4)5)6)10)
0.7
—
0.8
—
ns
slow slew rate
3)4)5)6)10)
Address and control input hold time
tIH
0.6
—
0.75
—
ns
fast slew rate
3)4)5)6)10)
0.7
—
0.8
—
ns
slow slew rate
3)4)5)6)10)
Read preamble
Read postamble
Data Sheet
tRPRE
tRPST
0.9
1.1
0.9
1.1
0.40
0.60
0.40
0.60
20
tCK
tCK
2)3)4)5)
2)3)4)5)
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 12
AC Timing - Absolute Specifications –6/–5 (cont’d)
Parameter
Symbol
–5
–6
DDR400B
DDR333
Unit Note/ Test
Condition 1)
Min.
Max.
Min.
Max.
tRAS
tRC
40
70E+3
42
70E+3
ns
2)3)4)5)
55
—
60
—
ns
2)3)4)5)
Auto-refresh to Active/Auto-refresh
command period
tRFC
65
—
72
—
ns
2)3)4)5)
Active to Read or Write delay
tRCD
tRP
tRAP
tRRD
tWR
tDAL
15
—
18
—
ns
2)3)4)5)
15
—
18
—
ns
2)3)4)5)
15
—
18
—
ns
2)3)4)5)
10
—
12
—
ns
2)3)4)5)
15
—
15
—
ns
2)3)4)5)
(tWR/tCK) +
(tRP/tCK)
tCK
2)3)4)5)11)
tWTR
tXSNR
tXSRD
tREFI
1
—
1
—
tCK
2)3)4)5)
75
—
75
—
ns
2)3)4)5)
Active to Precharge command
Active to Active/Auto-refresh command
period
Precharge command period
Active to Autoprecharge delay
Active bank A to Active bank B command
Write recovery time
Auto precharge write recovery + precharge
time
Internal write to read command delay
Exit self-refresh to non-read command
Exit self-refresh to read command
Average Periodic Refresh Interval
(tWR/tCK) +
(tRP/tCK)
200
—
200
—
tCK
2)3)4)5)
—
7.8
—
7.8
µs
2)3)4)5)12)
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V
(DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) These parameters guarantee device timing, but they are not necessarily tested on each device.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
10) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns,
measured between VOH(ac) and VOL(ac).
11) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock
cycle time.
12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
Data Sheet
21
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 13
AC Timing - Absolute Specifications –7/–7F
Parameter
Symbol
–7F
–7
DDR266
DDR266A
Min.
DQ output access time from CK/CK
DQS output access time from CK/CK
CK high-level width
CK low-level width
Clock Half Period
Clock cycle time
tAC
tDQSCK
tCH
tCL
tHP
tCK
Max.
Min.
Unit Note/ Test
Condition
1)1)
Max.
–0.75 +0.75
–0.75 +0.75
ns
2)2)3)3)4)4)5)5)
–0.75 +0.75
–0.75 +0.75
ns
2)3)4)5)
0.45
0.55
0.45
0.55
2)3)4)5)
0.45
0.55
0.45
0.55
tCK
tCK
ns
2)3)4)5)
ns
CL = 2.5
min. (tCL, tCH)
7.5
12
min. (tCL, tCH)
7.5
12
2)3)4)5)
2)3)4)5)
7.5
12
7.5
12
ns
CL = 2.0
2)3)4)5)
tDH
DQ and DM input setup time
tDS
Control and Addr. input pulse width (each input) tIPW
DQ and DM input pulse width (each input)
tDIPW
Data-out high-impedance time from CK/CK
tHZ
Data-out low-impedance time from CK/CK
tLZ
Write command to 1st DQS latching transition
tDQSS
DQS-DQ skew (DQS and associated DQ
tDQSQ
DQ and DM input hold time
0.5
—
0.5
—
ns
2)3)4)5)
0.5
—
0.5
—
ns
2)3)4)5)
2.2
—
2.2
—
ns
2)3)4)5)6)
1.75
—
1.75
—
ns
2)3)4)5)6)
2)3)4)5)7)
–0.75 +0.75
–0.75 +0.75
ns
–0.75 +0.75
–0.75 +0.75
ns
2)3)4)5)7)
0.75
1.25
0.75
1.25
tCK
2)3)4)5)
—
+0.5
—
+0.5
ns
TFBGA
2)3)4)5)
signals)
—
+0.5
—
+0.5
ns
TSOPII
2)3)4)5)
Data hold skew factor
tQHS
—
+0.75
—
+0.75
ns
TFBGA
2)3)4)5)
—
+0.75
—
+0.75
ns
TSOPII
2)3)4)5)
tQH
DQS input low (high) pulse width (write cycle)
tDQSL,H
DQS falling edge to CK setup time (write cycle) tDSS
DQS falling edge hold time from CK (write cycle) tDSH
Mode register set command cycle time
tMRD
Write preamble setup time
tWPRES
Write postamble
tWPST
Write preamble
tWPRE
Address and control input setup time
tIS
DQ/DQS output hold time
tHP – tQHS
tHP – tQHS
ns
2)3)4)5)
0.35
—
0.35
—
2)3)4)5)
0.2
—
0.2
—
0.2
—
0.2
—
2
—
2
—
tCK
tCK
tCK
tCK
0
—
0
—
ns
2)3)4)5)8)
0.40
0.60
0.40
0.60
2)3)4)5)9)
0.25
—
0.25
—
tCK
tCK
0.9
—
0.9
—
ns
fast slew
rate
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
3)4)5)6)10)
0.9
—
0.9
—
ns
slow slew
rate
3)4)5)6)10)
Data Sheet
22
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
Table 13
AC Timing - Absolute Specifications –7/–7F
Parameter
Address and control input hold time
Symbol
tIH
–7F
–7
DDR266
DDR266A
Min.
Max.
Min.
Max.
0.9
—
0.9
—
Unit Note/ Test
Condition
1)1)
ns
fast slew
rate
3)4)5)6)10)
1.0
—
1.0
—
ns
slow slew
rate
3)4)5)6)10)
Read preamble
Read postamble
Active to Precharge command
Active to Active/Auto-refresh command period
Auto-refresh to Active/Auto-refresh command
period
tRPRE
tRPST
tRAS
tRC
tRFC
tRCD
Precharge command period
tRP
Active to Autoprecharge delay
tRAP
Active bank A to Active bank B command
tRRD
Write recovery time
tWR
Auto precharge write recovery + precharge time tDAL
Active to Read or Write delay
Internal write to read command delay
Exit self-refresh to non-read command
Exit self-refresh to read command
Average Periodic Refresh Interval
tCK
tCK
2)3)4)5)
120E+3 45
120E+3 ns
2)3)4)5)
65
—
65
—
ns
2)3)4)5)
75
—
75
—
ns
2)3)4)5)
20
—
20
—
ns
2)3)4)5)
20
—
20
—
ns
2)3)4)5)
20
—
20
—
ns
2)3)4)5)
15
—
15
—
ns
2)3)4)5)
15
—
15
—
ns
2)3)4)5)
tCK
2)3)4)5)11)
0.9
1.1
0.9
1.1
0.40
0.60
0.40
0.60
45
(tWR/tCK) +
(tRP/tCK)
tWTR
tXSNR
tXSRD
tREFI
(tWR/tCK) +
(tRP/tCK)
2)3)4)5)
1
—
1
—
tCK
2)3)4)5)
75
—
75
—
ns
2)3)4)5)
200
—
200
—
tCK
2)3)4)5)
—
7.8
—
7.8
µs
2)3)4)5)12)
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V
(DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) These parameters guarantee device timing, but they are not necessarily tested on each device.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
10) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns,
measured between VOH(ac) and VOL(ac).
Data Sheet
23
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Electrical Characteristics
11) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock
cycle time.
12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
Data Sheet
24
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
SPD Codes for HYS72D[128/256][300/321/320]GBR–5–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–5
–5
–5
Label Code
PC3200R–30331
PC3200R–30331
PC3200R–30331
JEDEC SPD Revision
Rev. 1.0
Rev. 1.0
Rev. 1.0
Description
HEX
HEX
HEX
0
Programmed SPD Bytes in E2PROM
80
80
80
1
Total number of Bytes in E2PROM
08
08
08
2
Memory Type (DDR = 07h)
07
07
07
3
Number of Row Addresses
0D
0D
0D
4
Number of Column Addresses
0C
0B
0C
5
Number of DIMM Ranks
01
02
02
6
Data Width (LSB)
48
48
48
7
Data Width (MSB)
00
00
00
8
Interface Voltage Levels
04
04
04
9
tCK @ CLmax (Byte 18) [ns]
50
50
50
10
tAC SDRAM @ CLmax (Byte 18) [ns]
50
50
50
11
Error Correction Support (non- / ECC)
02
02
02
12
Refresh Rate
82
82
82
13
Primary SDRAM Width
04
08
04
14
Error Checking SDRAM Width
04
08
04
15
tCCD [cycles]
01
01
01
16
Burst Length Supported
0E
0E
0E
17
Number of Banks on SDRAM Device
04
04
04
18
CAS Latency
1C
1C
1C
19
CS Latency
01
01
01
20
Write Latency
02
02
02
21
DIMM Attributes
26
26
26
22
Component Attributes
C1
C1
C1
23
tCK @ CLmax -0.5 (Byte 18) [ns]
60
60
60
Part Number & Organization
HYS72D256320GBR–5–B
Table 14
HYS72D128321GBR–5–B
SPD Contents
HYS72D128300GBR–5–B
4
Byte#
24
tAC SDRAM @ CLmax -0.5 [ns]
50
50
50
25
tCK @ CLmax -1 (Byte 18) [ns]
75
75
75
Data Sheet
25
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–5–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–5
–5
–5
Label Code
PC3200R–30331
PC3200R–30331
PC3200R–30331
JEDEC SPD Revision
Rev. 1.0
Rev. 1.0
Rev. 1.0
Description
HEX
HEX
HEX
26
tAC SDRAM @ CLmax -1 [ns]
50
50
50
27
tRPmin [ns]
3C
3C
3C
28
tRRDmin [ns]
28
28
28
29
tRCDmin [ns]
3C
3C
3C
30
tRASmin [ns]
28
28
28
31
Module Density per Rank
01
80
01
32
tAS, tCS [ns]
60
60
60
33
tAH, TCH [ns]
60
60
60
34
tDS [ns]
40
40
40
35
tDH [ns]
40
40
40
36 – 40
not used
00
00
00
41
tRCmin [ns]
37
37
37
42
tRFCmin [ns]
41
41
41
43
tCKmax [ns]
28
28
28
44
tDQSQmax [ns]
28
28
28
45
tQHSmax [ns]
50
50
50
46
not used
00
00
00
47
DIMM PCB Height
01
01
01
48 – 61
not used
00
00
00
62
SPD Revision
10
10
10
63
Checksum of Byte 0-62
E1
68
E2
64
JEDEC ID Code of Infineon (1)
C1
C1
C1
65 – 71
JEDEC ID Code of Infineon (2)
00
00
00
72
Module Manufacturer Location
xx
xx
xx
73
Part Number, Char 1
37
37
37
74
Part Number, Char 2
32
32
32
75
Part Number, Char 3
44
44
44
Part Number & Organization
HYS72D128321GBR–5–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–5–B
HYS72D128300GBR–5–B
Table 14
Byte#
Data Sheet
26
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–5–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–5
–5
–5
Label Code
PC3200R–30331
PC3200R–30331
PC3200R–30331
JEDEC SPD Revision
Rev. 1.0
Rev. 1.0
Rev. 1.0
Description
HEX
HEX
HEX
76
Part Number, Char 4
31
31
32
77
Part Number, Char 5
32
32
35
78
Part Number, Char 6
38
38
36
79
Part Number, Char 7
33
33
33
80
Part Number, Char 8
30
32
32
81
Part Number, Char 9
30
31
30
82
Part Number, Char 10
47
47
47
83
Part Number, Char 11
42
42
42
84
Part Number, Char 12
52
52
52
85
Part Number, Char 13
35
35
35
86
Part Number, Char 14
42
42
42
87
Part Number, Char 15
20
20
20
88
Part Number, Char 16
20
20
20
89
Part Number, Char 17
20
20
20
90
Part Number, Char 18
20
20
20
91
Module Revision Code
xx
xx
xx
Part Number & Organization
HYS72D128321GBR–5–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–5–B
HYS72D128300GBR–5–B
Table 14
Byte#
92
Test Program Revision Code
xx
xx
xx
93
Module Manufacturing Date Year
xx
xx
xx
94
Module Manufacturing Date Week
xx
xx
xx
95 – 98
Module Serial Number (1 - 4)
xx
xx
xx
00
00
00
99 – 127 not used
Data Sheet
27
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–6–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–6
–6
–6
Label Code
PC2700R–25330
PC2700R–25330
PC2700R–25330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
0
Programmed SPD Bytes in E2PROM
80
80
80
1
Total number of Bytes in E2PROM
08
08
08
2
Memory Type (DDR = 07h)
07
07
07
3
Number of Row Addresses
0D
0D
0D
4
Number of Column Addresses
0C
0B
0C
5
Number of DIMM Ranks
01
02
02
6
Data Width (LSB)
48
48
48
7
Data Width (MSB)
00
00
00
8
Interface Voltage Levels
04
04
04
9
tCK @ CLmax (Byte 18) [ns]
60
60
60
10
tAC SDRAM @ CLmax (Byte 18) [ns]
70
70
70
11
Error Correction Support (non- / ECC)
02
02
02
12
Refresh Rate
82
82
82
13
Primary SDRAM Width
04
08
04
14
Error Checking SDRAM Width
04
08
04
15
tCCD [cycles]
01
01
01
16
Burst Length Supported
0E
0E
0E
17
Number of Banks on SDRAM Device
04
04
04
18
CAS Latency
0C
0C
0C
19
CS Latency
01
01
01
20
Write Latency
02
02
02
21
DIMM Attributes
26
26
26
22
Component Attributes
C1
C1
C1
23
tCK @ CLmax -0.5 (Byte 18) [ns]
75
75
75
Part Number & Organization
HYS72D128321GBR–6–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–6–B
HYS72D128300GBR–6–B
Table 15
Byte#
24
tAC SDRAM @ CLmax -0.5 [ns]
70
70
70
25
tCK @ CLmax -1 (Byte 18) [ns]
00
00
00
Data Sheet
28
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–6–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–6
–6
–6
Label Code
PC2700R–25330
PC2700R–25330
PC2700R–25330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
26
tAC SDRAM @ CLmax -1 [ns]
00
00
00
27
tRPmin [ns]
48
48
48
28
tRRDmin [ns]
30
30
30
29
tRCDmin [ns]
48
48
48
30
tRASmin [ns]
2A
2A
2A
31
Module Density per Rank
01
80
01
32
tAS, tCS [ns]
75
75
75
33
tAH, TCH [ns]
75
75
75
34
tDS [ns]
45
45
45
35
tDH [ns]
45
45
45
36 – 40
not used
00
00
00
41
tRCmin [ns]
3C
3C
3C
42
tRFCmin [ns]
48
48
48
43
tCKmax [ns]
30
30
30
44
tDQSQmax [ns]
28
28
28
45
tQHSmax [ns]
50
50
50
46
not used
00
00
00
47
DIMM PCB Height
00
00
00
48 – 61
not used
00
00
00
62
SPD Revision
00
00
00
63
Checksum of Byte 0-62
CA
51
CB
64
JEDEC ID Code of Infineon (1)
C1
C1
C1
65 – 71
JEDEC ID Code of Infineon (2 - 8)
00
00
00
72
Module Manufacturer Location
xx
xx
xx
73
Part Number, Char 1
37
37
37
74
Part Number, Char 2
32
32
32
75
Part Number, Char 3
44
44
44
Part Number & Organization
HYS72D128321GBR–6–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–6–B
HYS72D128300GBR–6–B
Table 15
Byte#
Data Sheet
29
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–6–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
–6
–6
–6
Label Code
PC2700R–25330
PC2700R–25330
PC2700R–25330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
76
Part Number, Char 4
31
31
32
77
Part Number, Char 5
32
32
35
78
Part Number, Char 6
38
38
36
79
Part Number, Char 7
33
33
33
80
Part Number, Char 8
30
32
32
81
Part Number, Char 9
30
31
30
82
Part Number, Char 10
47
47
47
83
Part Number, Char 11
42
42
42
84
Part Number, Char 12
52
52
52
85
Part Number, Char 13
36
36
36
86
Part Number, Char 14
42
42
42
87
Part Number, Char 15
20
20
20
88
Part Number, Char 16
20
20
20
89
Part Number, Char 17
20
20
20
90
Part Number, Char 18
20
20
20
91
Module Revision Code
xx
xx
xx
Part Number & Organization
HYS72D128321GBR–6–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–6–B
HYS72D128300GBR–6–B
Table 15
Byte#
92
Test Program Revision Code
xx
xx
xx
93
Module Manufacturing Date Year
xx
xx
xx
94
Module Manufacturing Date Week
xx
xx
xx
95 – 98
Module Serial Number (1 - 4)
xx
xx
xx
00
00
00
99 – 127 not used
Data Sheet
30
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–7–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
reg
reg
reg
Label Code
PC2100R–20330
PC2100R–20330
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
0
Programmed SPD Bytes in E2PROM
80
80
80
1
Total number of Bytes in E2PROM
08
08
08
2
Memory Type (DDR = 07h)
07
07
07
3
Number of Row Addresses
0D
0D
0D
4
Number of Column Addresses
0C
0B
0C
5
Number of DIMM Ranks
01
02
02
6
Data Width (LSB)
48
48
48
7
Data Width (MSB)
00
00
00
8
Interface Voltage Levels
04
04
04
9
tCK @ CLmax (Byte 18) [ns]
70
70
70
10
tAC SDRAM @ CLmax (Byte 18) [ns]
75
75
75
11
Error Correction Support (non- / ECC)
02
02
02
12
Refresh Rate
82
82
82
13
Primary SDRAM Width
04
08
04
14
Error Checking SDRAM Width
04
08
04
15
tCCD [cycles]
01
01
01
16
Burst Length Supported
0E
0E
0E
17
Number of Banks on SDRAM Device
04
04
04
18
CAS Latency
0C
0C
0C
19
CS Latency
01
01
01
20
Write Latency
02
02
02
21
DIMM Attributes
26
26
26
22
Component Attributes
C1
C1
C1
23
tCK @ CLmax -0.5 (Byte 18) [ns]
75
75
75
Part Number & Organization
HYS72D128321GBR–7–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–7–B
HYS72D128300GBR–7–B
Table 16
Byte#
24
tAC SDRAM @ CLmax -0.5 [ns]
75
75
75
25
tCK @ CLmax -1 (Byte 18) [ns]
00
00
00
Data Sheet
31
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–7–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
reg
reg
reg
Label Code
PC2100R–20330
PC2100R–20330
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
26
tAC SDRAM @ CLmax -1 [ns]
00
00
00
27
tRPmin [ns]
50
50
50
28
tRRDmin [ns]
3C
3C
3C
29
tRCDmin [ns]
50
50
50
30
tRASmin [ns]
2D
2D
2D
31
Module Density per Rank
01
80
01
32
tAS, tCS [ns]
90
90
90
33
tAH, TCH [ns]
90
90
90
34
tDS [ns]
50
50
50
35
tDH [ns]
50
50
50
36 – 40
not used
00
00
00
41
tRCmin [ns]
41
41
41
42
tRFCmin [ns]
4B
4B
4B
43
tCKmax [ns]
30
30
30
44
tDQSQmax [ns]
32
32
32
45
tQHSmax [ns]
75
75
75
46
not used
00
00
00
47
DIMM PCB Height
00
00
00
48 – 61
not used
00
00
00
62
SPD Revision
00
00
00
63
Checksum of Byte 0-62
86
0D
87
64
JEDEC ID Code of Infineon (1)
C1
C1
C1
65 – 71
JEDEC ID Code of Infineon (2 - 8)
00
00
00
72
Module Manufacturer Location
xx
xx
xx
73
Part Number, Char 1
37
37
37
74
Part Number, Char 2
32
32
32
75
Part Number, Char 3
44
44
44
Part Number & Organization
HYS72D128321GBR–7–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–7–B
HYS72D128300GBR–7–B
Table 16
Byte#
Data Sheet
32
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D256320GBR–7–B
1 GB
1 GB
2 GB
×72
×72
×72
1 Rank
2 Ranks
2 Ranks
reg
reg
reg
Label Code
PC2100R–20330
PC2100R–20330
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
HEX
76
Part Number, Char 4
31
31
32
77
Part Number, Char 5
32
32
35
78
Part Number, Char 6
38
38
36
79
Part Number, Char 7
33
33
33
80
Part Number, Char 8
30
32
32
81
Part Number, Char 9
30
31
30
82
Part Number, Char 10
47
47
47
83
Part Number, Char 11
42
42
42
84
Part Number, Char 12
52
52
52
85
Part Number, Char 13
37
37
37
86
Part Number, Char 14
42
42
42
87
Part Number, Char 15
20
20
20
88
Part Number, Char 16
20
20
20
89
Part Number, Char 17
20
20
20
90
Part Number, Char 18
20
20
20
91
Module Revision Code
xx
xx
xx
Part Number & Organization
HYS72D128321GBR–7–B
SPD Codes for HYS72D[128/256][300/321/320]GBR–7–B
HYS72D128300GBR–7–B
Table 16
Byte#
92
Test Program Revision Code
xx
xx
xx
93
Module Manufacturing Date Year
xx
xx
xx
94
Module Manufacturing Date Week
xx
xx
xx
95 – 98
Module Serial Number (1 - 4)
xx
xx
xx
00
00
00
99 – 127 not used
Data Sheet
33
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D128500HR–7F–B
HYS72D128500HR–7–B
SPD Codes for HYS72D128500HR–[7F/7]–B
Part Number & Organization
Table 17
1 GB
1 GB
×72
×72
1 Rank
1 Rank
reg
reg
Label Code
PC2100R–20220
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
0
Programmed SPD Bytes in E2PROM
80
80
1
Total number of Bytes in E2PROM
08
08
2
Memory Type (DDR = 07h)
07
07
3
Number of Row Addresses
0D
0D
Byte#
4
Number of Column Addresses
0C
0C
5
Number of DIMM Ranks
01
01
6
Data Width (LSB)
48
48
7
Data Width (MSB)
00
00
8
Interface Voltage Levels
04
04
9
tCK @ CLmax (Byte 18) [ns]
70
70
10
tAC SDRAM @ CLmax (Byte 18) [ns]
75
75
11
Error Correction Support (non- / ECC)
02
02
12
Refresh Rate
82
82
13
Primary SDRAM Width
04
04
14
Error Checking SDRAM Width
04
04
15
tCCD [cycles]
01
01
16
Burst Length Supported
0E
0E
17
Number of Banks on SDRAM Device
04
04
18
CAS Latency
0C
0C
19
CS Latency
01
01
20
Write Latency
02
02
21
DIMM Attributes
26
26
22
Component Attributes
C1
C1
23
tCK @ CLmax -0.5 (Byte 18) [ns]
75
75
24
tAC SDRAM @ CLmax -0.5 [ns]
75
75
25
tCK @ CLmax -1 (Byte 18) [ns]
00
00
Data Sheet
34
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D128500HR–7F–B
HYS72D128500HR–7–B
SPD Codes for HYS72D128500HR–[7F/7]–B
Part Number & Organization
Table 17
1 GB
1 GB
×72
×72
1 Rank
1 Rank
reg
reg
Label Code
PC2100R–20220
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
26
tAC SDRAM @ CLmax -1 [ns]
00
00
27
tRPmin [ns]
3C
50
28
tRRDmin [ns]
3C
3C
29
tRCDmin [ns]
3C
50
30
tRASmin [ns]
2D
2D
31
Module Density per Rank
01
01
32
tAS, tCS [ns]
90
90
33
tAH, TCH [ns]
90
90
34
tDS [ns]
50
50
35
tDH [ns]
50
50
36 – 40
not used
00
00
41
tRCmin [ns]
3C
41
42
tRFCmin [ns]
4B
4B
43
tCKmax [ns]
30
30
44
tDQSQmax [ns]
32
32
45
tQHSmax [ns]
75
75
46
not used
00
00
47
DIMM PCB Height
00
00
48 – 61
not used
00
00
62
SPD Revision
00
00
63
Checksum of Byte 0-62
59
86
64
JEDEC ID Code of Infineon (1)
C1
C1
65 – 71
JEDEC ID Code of Infineon (2 – 8)
00
00
72
Module Manufacturer Location
xx
xx
73
Part Number, Char 1
37
37
74
Part Number, Char 2
32
32
75
Part Number, Char 3
44
44
Byte#
Data Sheet
35
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
SPD Contents
HYS72D128500HR–7F–B
HYS72D128500HR–7–B
SPD Codes for HYS72D128500HR–[7F/7]–B
Part Number & Organization
Table 17
1 GB
1 GB
×72
×72
1 Rank
1 Rank
reg
reg
Label Code
PC2100R–20220
PC2100R–20330
Jedec SPD Revision
Rev. 0.0
Rev. 0.0
Description
HEX
HEX
76
Part Number, Char 4
31
31
77
Part Number, Char 5
32
32
78
Part Number, Char 6
38
38
79
Part Number, Char 7
35
35
80
Part Number, Char 8
30
30
81
Part Number, Char 9
30
30
82
Part Number, Char 10
48
48
83
Part Number, Char 11
52
52
84
Part Number, Char 12
37
37
85
Part Number, Char 13
46
42
86
Part Number, Char 14
42
20
87
Part Number, Char 15
20
20
88
Part Number, Char 16
20
20
89
Part Number, Char 17
20
20
90
Part Number, Char 18
20
20
91
Module Revision Code
xx
xx
92
Test Program Revision Code
xx
xx
93
Module Manufacturing Date Year
xx
xx
94
Module Manufacturing Date Week
xx
xx
95 – 98
Module Serial Number (1 – 4)
xx
xx
99 – 127
not used
00
00
Byte#
Data Sheet
36
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Package Outlines
Package Outlines
0.1 A B C
5
133.35
0.15 A B C
128.95
4 MAX.
28.58 ±0.13
4 ±0.1
A
1
2.5 ±0.1
ø0.1 A B C
92
6.62
B C
2.175
0.4
6.35
64.77
1.27 ±0.1
49.53
1.8 ±0.1
0.1 A B C
184
17.8
93
10
3.8 ±0.13
95 x 1.27 = 120.65
3 MIN.
0.2
2.5 ±0.2
Detail of contacts
1.27
1 ±0.05
0.1 A B C
Burr max. 0.4 allowed
L-DIM-184-22-2
Figure 4
Data Sheet
Package Outline – Raw Card C DDR Registered DIMM HYS72D128300GBR–[5/6/7]–B
37
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
0.1 A B C
Package Outlines
133.35
0.15 A B C
128.95
4 MAX.
28.58 ±0.13
4 ±0.1
A
1
2.5 ±0.1
ø0.1 A B C
92
6.62
B C
2.175
0.4
6.35
64.77
1.27 ±0.1
49.53
1.8 ±0.1
0.1 A B C
184
17.8
93
10
3.8 ±0.13
95 x 1.27 = 120.65
3 MIN.
0.2
2.5 ±0.2
Detail of contacts
1.27
1 ±0.05
0.1 A B C
Burr max. 0.4 allowed
L-DIM-184-23-2
Figure 5
Data Sheet
Package Outline – Raw Card B DDR Registered DIMM HYS72D128321HR–[5/6/7]–B
38
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Package Outlines
0.1 A B C
133.35
0.15 A B C
128.95
4 MAX.
30.48 ±0.13
4 ±0.1
A
92
ø0.1 A B C
B C
6.62
2.175
0.4
6.35
49.53
1.8 ±0.1
0.1 A B C
93
184
10
3.8 ±0.13
64.77
1.27 ±0.1
17.8
1
2.5 ±0.1
3 MIN.
0.2
2.5 ±0.2
Detail of contacts
1.27
1 ±0.05
0.1 A B C
L-DIM-184-25
Burr max. 0.4 allowed
Figure 6
Data Sheet
Package Outline – Raw Card D DDR Registered DIMM HYS72D256320GBR–[5/6/7]–B
39
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Package Outlines
0.1 A B C
133.35
0.15 A B C
128.95
4 MAX.
A
30.48 ±0.13
4 ±0.1
1)
1
2.5 ±0.1
ø0.1 A B C
92
6.62
B C
2.175
0.4
6.35
64.77
1.27 ±0.1
49.53
0.1 A B C
93
184
17.8
1.8 ±0.1
10
3.8 ±0.13
95 x 1.27 = 120.65
1)
3 MIN.
0.2
2.5 ±0.2
Detail of contacts
1.27
1 ±0.05
0.1 A B C
1) On ECC modules only
Burr max. 0.4 allowed
Figure 7
Data Sheet
L-DIM-184-12-3
Package Outline – Raw Card M DDR Registered DIMM HYS72D128500HR–[7/7F]–B
40
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Application Note
6
Application Note
Power Up and Power Management on DDR Registered DIMMs
(according to JEDEC ballot JC-42.5 Item 1173)
184-pin Double Data Rate (DDR) Registered DIMMs include two new features to facilitate controlled power-up and
to minimize power consumption during low power mode. One feature is externally controlled via a systemgenerated RESET signal; the second is based on module detection of the input clocks. These enhancements
permit the modules to power up with SDRAM outputs in a High-Z state (eliminating risk of high current dissipations
and/or dotted I/Os), and result in the powering-down of module support devices (registers and Phase-Locked
Loop) when the memory is in Self-Refresh mode.
The new RESET pin controls power dissipation on the module’s registers and ensures that CKE and other SDRAM
inputs are maintained at a valid ‘low’ level during power-up and self refresh. When RESET is at a low level, all the
register outputs are forced to a low level, and all differential register input receivers are powered down, resulting
in very low register power consumption. The RESET pin, located on DIMM tab #10, is driven from the system as
an asynchronous signal according to the attached details. Using this function also permits the system and DIMM
clocks to be stopped during memory Self Refresh operation, while ensuring that the SDRAMs stay in Self Refresh
mode.
Table 18
The function for RESET is as follows:1)
Register Inputs
Register Outputs
RESET
CK
CK
Data in (D)
Data out (Q)
H
Rising
Falling
H
H
H
Rising
Falling
L
L
H
L or H
L or H
X
Qo
H
High Z
High Z
X
Illegal input conditions
L
X or Hi-Z
X or Hi-Z
X or Hi-Z
L
1) X : Don’t care, Hi-Z : High Impedance, Qo: Data latched at the previous of CK risning and CK falling
As described in the table above, a low on the RESET input ensures that the Clock Enable (CKE) signal(s) are
maintained low at the SDRAM pins (CKE being one of the 'Q' signals at the register output). Holding CKE low
maintains a high impedance state on the SDRAM DQ, DQS and DM outputs — where they will remain until
activated by a valid ‘read’ cycle. CKE low also maintains SDRAMs in Self Refresh mode when applicable.
The DDR PLL devices automatically detect clock activity above 20MHz. When an input clock frequency of 20MHz
or greater is detected, the PLL begins operation and initiates clock frequency lock (the minimum operating
frequency at which all specifications will be met is 95MHz). If the clock input frequency drops below 20MHz (actual
detect frequency will vary by vendor), the PLL VCO (Voltage Controlled Oscillator) is stopped, outputs are made
High-Z, and the differential inputs are powered down — resulting in a total PLL current consumption of less than
1mA. Use of this low power PLL function makes the use of the PLL RESET (or G pin) unnecessary, and it is tied
inactive on the DIMM.
This application note describes the required and optional system sequences associated with the DDR Registered
DIMM 'RESET' function. It is important to note that all references to CKE refer to both CKE0 and CKE1 for a 2bank DIMM. Because RESET applies to all DIMM register devices, it is therefore not possible to uniquely control
CKE to one physical DIMM bank through the use of the RESET pin.
Data Sheet
41
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Application Note
Power-Up Sequence with RESET — Required
1. The system sets RESET at a valid low level. This is the preferred default state during power-up. This input
condition forces all register outputs to a low state independent of the condition on the register inputs (data and
clock), ensuring that CKE is at a stable low-level at the DDR SDRAMs.
2. The power supplies should be initialized according to the JEDEC-approved initialization sequence for DDR
SDRAMs.
3. Stabilization of Clocks to the SDRAM The system must drive clocks to the application frequency (PLL
operation is not assured until the input clock reaches 20MHz). Stability of clocks at the SDRAMs will be
affected by all applicable system clock devices, and time must be allotted to permit all clock devices to settle.
Once a stable clock is received at the DIMM PLL, the required PLL stabilization time (assuming power to the
DIMM is stable) is 100 microseconds. When a stable clock is present at the SDRAM input (driven from the
PLL), the DDR SDRAM requires 200 µsec prior to SDRAM operation.
4. The system applies valid logic levels to the data inputs of the register (address and controls at the DIMM
connector). CKE must be maintained low and all other inputs should be driven to a known state. In general
these commands can be determined by the system designer. One option is to apply an SDRAM ‘NOP’
command (with CKE low), as this is the first command defined by the JEDEC initialization sequence (ideally
this would be a ‘NOP Deselect’ command). A second option is to apply low levels on all of the register inputs
to be consistent with the state of the register outputs.
5. The system switches RESET to a logic ‘high’ level. The SDRAM is now functional and prepared to receive
commands. Since the RESET signal is asynchronous, setting the RESET timing in relation to a specific clock
edge is not required (during this period, register inputs must remain stable).
6. The system must maintain stable register inputs until normal register operation is attained. The registers have
an activation time that allows their clock receivers, data input receivers, and output drivers sufficient time to be
turned on and become stable. During this time the system must maintain the valid logic levels described in step
5. It is also a functional requirement that the registers maintain a low state at the CKE outputs to guarantee
that the DDR SDRAMs continue to receive a low level on CKE. Register activation time (t (ACT) ), from
asynchronous switching of RESET from low to high until the registers are stable and ready to accept an input
signal, is specified in the register and DIMM do-umentation.
7. The system can begin the JEDEC-defined DDR SDRAM power-up sequence (according to the JEDECpproved initialization sequence).
Self Refresh Entry (RESET low, clocks powered off) — Optional
Self Refresh can be used to retain data in DDR SDRAM DIMMs even if the rest of the system is powered down
and the clocks are off. This mode allows the DDR SDRAMs on the DIMM to retain data without external clocking.
Self Refresh mode is an ideal time to utilize the RESET pin, as this can reduce register power consumption
(RESET low deactivates register CK and CK, data input receivers, and data output drivers).
1. The system applies Self Refresh entry command. (CKE→Low, CS→Low, RAS → Low, CAS→ Low, WE→
High)
Note: Note: The commands reach the DDR SDRAM one clock later due to the additional register pipelining on a
Registered DIMM. After this command is issued to the SDRAM, all of the address and control and clock input
conditions to the SDRAM are Don’t Cares— with the exception of CKE.
2. The system sets RESET at a valid low level. This input condition forces all register outputs to a low state,
independent of the condition on the registerm inputs (data and clock), and ensures that CKE, and all other
control and address signals, are a stable low-level at the DDR SDRAMs. Since the RESET signal is
asynchronous, setting the RESET timing in relation to a specific clock edge is not required.
3. The system turns off clock inputs to the DIMM. (Optional)
a. In order to reduce DIMM PLL current, the clock inputs to the DIMM are turned off, resulting in High-Z clock
inputs to both the SDRAMs and the registers. This must be done after the RESET deactivate time of the
register (t (INACT) ). The deactivate time defines the time in which the clocks and the control and address
Data Sheet
42
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Application Note
signals must maintain valid levels after RESET low has been applied and is specified in the register and DIMM
documentation.
b. The system may release DIMM address and control inputs to High-Z. This can be done after the RESET
deactivate time of the register. The deactivate time defines the time in which the clocks and the control and the
address signals must maintain valid levels after RESET low has been applied. It is highly recommended that
CKE continue to remain low during this operation.
4. The DIMM is in lowest power Self Refresh mode.
Self Refresh Exit (RESET low, clocks powered off) — Optional
1. Stabilization of Clocks to the SDRAM. The system must drive clocks to the application frequency (PLL
operation is not assured until the input clock reaches ~20MHz). Stability of clocks at the SDRAMs will be
affected by all applicable system clock devices, and time must be allotted to permit all clock devices to settle.
Once a stable clock is received at the DIMM PLL, the required PLL stabilization time (assuming power to the
DIMM is stable) is 100 microseconds.
2. The system applies valid logic levels to the data inputs of the register (address and controls at the DIMM
connector). CKE must be maintained low and all other inputs should be driven to a known state. In general
these commands can be determined by the system designer. One option is to apply an SDRAM ‘NOP’
command (with CKE low), as this is the first command defined by the JEDEC Self Refresh Exit sequence
(ideally this would be a ‘NOP Deselect’ command). A second option is to apply low levels on all of the register
inputs, to be consistent with the state of the register outputs.
3. The system switches RESET to a logic ‘high’ level. The SDRAM is now functional and prepared to receive
commands. Since the RESET signal is asynchronous, RESET timing relationship to a specific clock edge is
not required (during this period, register inputs must remain stable).
4. The system must maintain stable register inputs until normal register operation is attained. The registers have
an activation time that allows the clock receivers, input receivers, and output drivers sufficient time to be turned
on and become stable. During this time the system must maintain the valid logic levels described in Step 2. It
is also a functional requirement that the registers maintain a low state at the CKE outputs to guarantee that the
DDR SDRAMs continue to receive a low level on CKE. Register activation time (t (ACT) ), from asynchronous
switching of RESET from low to high until the registers are stable and ready to accept an input signal, is
specified in the register and DIMM do-umentation.
5. System can begin the JEDEC-defined DDR SDRAM Self Refresh Exit Procedure.
Self Refresh Entry (RESET low, clocks running) — Optional
Although keeping the clocks running increases power consumption from the on-DIMM PLL during self refresh, this
is an alternate operating mode for these DIMMs.
1. System enters Self Refresh entry command. (CKE→ Low, CS→ Low, RAS→ Low, CAS→ Low, WE→ High)
Note: Note: The commands reach the DDR SDRAM one clock later due to the additional register pipelining on a
Registered DIMM. After this command is issued to the SDRAM, all of the address and control and clock input
conditions to the SDRAM are Don’t Cares — with the exception of CKE.
2. The system sets RESET at a valid low level. This input condition forces all register outputs to a low state,
independent of the condition on the data and clock register inputs, and ensures that CKE is a stable low-level
at the DDR SDRAMs.
3. The system may release DIMM address and control inputs to High-Z. This can be done after the RESET
deactivate time of the register (t (INACT) ). The deactivate time describes the time in which the clocks and the
control and the address signals must maintain valid levels after RESET low has been applied. It is highly
recommended that CKE continue to remain low during the operation.
4. The DIMM is in a low power, Self Refresh mode.
Data Sheet
43
Rev. 0.5, 2003-12
HYS72D[128/256][300/320/321/500][GBR/HR]-[5/6/7/7F]-B
Registered Double Data Rate SDRAM Module
Application Note
Self Refresh Exit (RESET low, clocks running) — Optional
1. The system applies valid logic levels to the data inputs of the register (address and controls at the DIMM
connector). CKE must be maintained low and all other inputs should be driven to a known state. In general
these commands can be determined by the system designer. One option is to apply an SDRAM ‘NOP’
command (with CKE low), as this is the first command defined by the Self Refresh Exit sequence (ideally this
would be a ‘NOP Deselect’ command). A second option is to apply low levels on all of the register inputs to be
consistent with the state of the register outputs.
2. The system switches RESET to a logic 'high' level. The SDRAM is now functional and prepared to receive
commands. Since the RESET signal is asynchronous, it does not need to be tied to a particular clock edge
(during this period, register inputs must continue to remain stable).
3. The system must maintain stable register inputs until normal register operation is attained. The registers have
an activation time that allows the clock receivers, input receivers, and output drivers sufficient time to be turned
on and become stable. During this time the system must maintain the valid logic levels described in Step 1. It
is also a functional requirement that the registers maintain a low state at the CKE outputs in order to guarantee
that the DDR SDRAMs continue to receive a low level on CKE. This activation time, from asynchronous
switching of RESET from low to high, until the registers are stable and ready to accept an input signal, is t (ACT
) as specified in the register and DIMM documentation.
4. The system can begin JEDEC defined DDR SDRAM Self Refresh Exit Procedure.
Self Refresh Entry/Exit (RESET high, clocks running) — Optional
As this sequence does not involve the use of the RESET function, the JEDEC standard SDRAM specification
explains in detail the method for entering and exiting Self Refresh for this case.
Self Refresh Entry (RESET high, clocks powered off) — Not Permissible
In order to maintain a valid low level on the register output, it is required that either the clocks be running and the
system drive a low level on CKE, or the clocks are powered off and RESET is asserted low according to the
sequence defined in this application note. In the case where RESET remains high and the clocks are powered off,
the PLL drives a High-Z clock input into the register clock input. Without the low level on RESET an unknown DIMM
state will result.
Data Sheet
44
Rev. 0.5, 2003-12
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