INFINEON SAF-XC164GM

D a t a S h e e t , V 1 .2 , M a r c h 2007
XC164GM
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
Edition 2007-03
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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D a t a S h e e t , V 1 .2 , M a r c h 2007
XC164GM
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
XC164GM
Derivatives
XC164GM
Revision History: V1.2, 2007-03
Previous Version(s):
V1.1, 2006-08
V1.0, 2005-11
Page
Subjects (major changes since last revision)
6
Design steps of the derivatives differentiated.
52
Power consumption of the derivatives differentiated.
53
Figure 10 adapted.
54
Figure 12 adapted.
64
Packages of the derivatives differentiated.
65
Thermal resistances of the derivatives differentiated.
all
“Preliminary” removed
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Data Sheet
V1.2, 2007-03
XC164GM
Derivatives
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Unit (CAPCOM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) . . . . . . . . . .
High Speed Synchronous Serial Channels (SSC0/SSC1) . . . . . . . . . . . .
TwinCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LXBus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
15
18
20
25
26
29
33
35
36
37
38
39
40
41
42
43
44
4
4.1
4.2
4.3
4.4
4.4.1
4.4.2
4.4.3
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-chip Flash Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
47
47
50
55
58
58
62
63
5
5.1
5.2
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Data Sheet
3
V1.2, 2007-03
16-Bit Single-Chip Microcontroller with C166SV2 Core
XC166 Family
1
XC164GM
Summary of Features
For a quick overview or reference, the XC164GM’s properties are listed here in a
condensed way.
•
•
•
•
•
•
•
High Performance 16-bit CPU with 5-Stage Pipeline
– 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution)
– 1-Cycle Multiplication (16 × 16 bit), Background Division (32 / 16 bit) in 21 Cycles
– 1-Cycle Multiply-and-Accumulate (MAC) Instructions
– Enhanced Boolean Bit Manipulation Facilities
– Zero-Cycle Jump Execution
– Additional Instructions to Support HLL and Operating Systems
– Register-Based Design with Multiple Variable Register Banks
– Fast Context Switching Support with Two Additional Local Register Banks
– 16 Mbytes Total Linear Address Space for Code and Data
– 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)
16-Priority-Level Interrupt System with up to 63 Sources, Sample-Rate down to 50 ns
8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via
Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space
Clock Generation via on-chip PLL (factors 1:0.15 … 1:10), or
via Prescaler (factors 1:1 … 60:1)
On-Chip Memory Modules
– 2 Kbytes On-Chip Dual-Port RAM (DPRAM)
– 0/2/4 Kbytes1) On-Chip Data SRAM (DSRAM)
– 2 Kbytes On-Chip Program/Data SRAM (PSRAM)
– 32/64/1281) Kbytes On-Chip Program Memory (Flash Memory)
On-Chip Peripheral Modules
– 14-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and
Conversion Time (down to 2.55 μs or 2.15 μs)
– 16-Channel General Purpose Capture/Compare Unit (CAPCOM2)
– Multi-Functional General Purpose Timer Unit with 5 Timers
– Two Synchronous/Asynchronous Serial Channels (USARTs)
– Two High-Speed-Synchronous Serial Channels
– On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects
(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality
– On-Chip Real Time Clock, Driven by the Main Oscillator
Idle, Sleep, and Power Down Modes with Flexible Power Management
1) Depends on the respective derivative. See Table 1 “XC164GM Derivative Synopsis” on Page 6.
Data Sheet
4
V1.2, 2007-03
XC164GM
Derivatives
Summary of Features
•
•
•
•
•
•
Programmable Watchdog Timer and Oscillator Watchdog
Up to 47 General Purpose I/O Lines,
partly with Selectable Input Thresholds and Hysteresis
On-Chip Bootstrap Loader
On-Chip Debug Support via JTAG Interface
64-Pin Green LQFP Package for the -16F derivatives, 0.5 mm (19.7 mil) pitch (RoHS
compliant)
64-Pin TQFP Package for the -4F/8F derivatives, 0.5 mm (19.7 mil) pitch (RoHS
compliant)
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
•
•
the derivative itself, i.e. its function set, the temperature range, and the supply voltage
the package and the type of delivery.
For the available ordering codes for the XC164GM please refer to your responsible sales
representative or your local distributor.
This document describes several derivatives of the XC164GM group. Table 1
enumerates these derivatives and summarizes the differences. As this document refers
to all of these derivatives, some descriptions may not apply to a specific product.
For simplicity all versions are referred to by the term XC164GM throughout this
document.
Data Sheet
5
V1.2, 2007-03
XC164GM
Derivatives
Summary of Features
Table 1
XC164GM Derivative Synopsis
Derivative1)
Temp.
Range
Program
Memory
SAF-XC164GM-16F40F
SAF-XC164GM-16F20F
-40 to
85 °C
128 Kbytes 2 Kbytes DPRAM,
Flash
4 Kbytes DSRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
SAF-XC164GM-8F40F
SAF-XC164GM-8F20F
-40 to
85 °C
64 Kbytes
Flash
2 Kbytes DPRAM,
2 Kbytes DSRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
SAF-XC164GM-4F40F
SAF-XC164GM-4F20F
-40 to
85 °C
32 Kbytes
Flash
2 Kbytes DPRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
On-Chip RAM
Interfaces
1) This Data Sheet is valid for:
devices starting with and including design step BA for the -16F derivatives, and for
devices starting with and including design step AA for -4F/8F derivatives.
Data Sheet
6
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
2
General Device Information
The XC164GM derivatives are high-performance members of the Infineon
XC166 Family of full featured single-chip CMOS microcontrollers. These devices extend
the functionality and performance of the C166 Family in terms of instructions (MAC unit),
peripherals, and speed. They combine high CPU performance (up to 40 million
instructions per second) with high peripheral functionality and enhanced IO-capabilities.
They also provide clock generation via PLL and various on-chip memory modules such
as program Flash, program RAM, and data RAM.
VAREF
VAGND
VDDI/P
PORT1
14 bit
XTAL1
XTAL2
NMI
VSS
XC164GM
RSTIN
Port 5
14 bit
Port 3
15 bit
Port 9
6 bit
TRST
MCA05554_XC164GM
Figure 1
Data Sheet
Logic Symbol
7
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
2.1
Pin Configuration and Definition
NMI
RSTIN
TRST
XTAL2
XTAL1
V SS
V DDI
V DDP
P1L.7/CC22IO
P1L.6
P1L.5
P1L.4
P1L.3
P1L.2
P1L.1
P1L.0
The pins of the XC164GM are described in detail in Table 2, including all their alternate
functions. Figure 2 summarizes all pins in a condensed way, showing their location on
the 4 sides of the package. E* marks pins to be used as alternate external interrupt
inputs.
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
47
2
46
3
4
45
44
5
6
43
7
42
8
41
9
40
10
39
38
11
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
XC164GM
P5.6/AN6
P5.7/AN7
V AREF
V AGN D
P5.12/AN12/T6IN
P5.13/AN13/T5IN
P5.14/AN14/T4EUD
P5.15/AN15/T2EUD
V SS
V DDI
VD DP
P3.1/T6OUT/RxD1/TCK/E*
P3.2/CAPIN/TDI
P3.3/T3OUT /TDO
P3.4/T3EUD/TMS
P3.5/T4IN/TxD1/BRKOUT
P1H.0/EX0IN/CC23IO
P1H.1/EX1IN/MRST1
P1H.2/EX2IN/MTRS1
P1H.3/EX3IN/T7IN/SCLK1
P1H.4/CC24IO/EX4IN
P1H.5/CC25IO/EX5IN
VSS
V DDP
P5.0/AN0
P5.1/AN1
P5.2/AN2
P5.3/AN3
P5.4/AN4
P5.5/AN5
P5.10/AN10/T6EUD
P5.11/AN11/T5EUD
Figure 2
Data Sheet
P9.5/CC21IO
P9.4/CC20IO
P9.3/CC19IO/CAN1_TxD
P9.2/CC18IO/CAN1_RxD/E*
P9.1/CC17IO/CAN2_TxD
P9.0/CC16IO/CAN2_RxD/E*
P3.15/CLKOUT/FOUT
V SS
V DDP
P3.13/SCLK0/E*
P3.11/RxD0/E*
P3.10/TxD0/E*
P3.9/MTSR0
P3.8/MRST0
P3.7/T2IN/BRKIN
P3.6/T3IN
mc_xc164gm_pinout.vsd
Pin Configuration (top view)
8
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
Table 2
Pin Definitions and Functions
Symbol
Pin
Num.
Input Function
Outp.
RSTIN
63
I
Reset Input with Schmitt-Trigger characteristics. A low-level
at this pin while the oscillator is running resets the XC164GM.
A spike filter suppresses input pulses < 10 ns. Input pulses
> 100 ns safely pass the filter. The minimum duration for a
safe recognition should be 100 ns + 2 CPU clock cycles.
Note: The reset duration must be sufficient to let the
hardware configuration signals settle.
External circuitry must guarantee low-level at the
RSTIN pin at least until both power supply voltages
have reached the operating range.
NMI
64
I
Non-Maskable Interrupt Input. A high to low transition at this
pin causes the CPU to vector to the NMI trap routine. When
the PWRDN (power down) instruction is executed, the NMI
pin must be low in order to force the XC164GM into power
down mode. If NMI is high, when PWRDN is executed, the
part will continue to run in normal mode.
If not used, pin NMI should be pulled high externally.
Port 9
43-48
IO
P9.0
43
P9.1
44
P9.2
45
P9.3
46
P9.4
P9.5
47
48
I/O
I
I
I/O
O
I/O
I
I
I/O
O
I/O
I/O
Port 9 is a 6-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance state)
or output (configurable as push/pull or open drain driver). The
input threshold of Port 9 is selectable (standard or special).
The following Port 9 pins also serve for alternate functions:
CC16IO: (CAPCOM2) CC16 Capture Inp./Compare Outp.,
CAN2_RxD: (CAN Node 2) Receive Data Input1),
EX5IN: (Fast External Interrupt 5) Input (alternate pin A)
CC17IO: (CAPCOM2) CC17 Capture Inp./Compare Outp.,
CAN2_TxD: (CAN Node 2) Transmit Data Output,
CC18IO: (CAPCOM2) CC18 Capture Inp./Compare Outp.,
CAN1_RxD: (CAN Node 1) Receive Data Input1),
EX4IN: (Fast External Interrupt 4) Input (alternate pin A)
CC19IO: (CAPCOM2) CC19 Capture Inp./Compare Outp.,
CAN1_TxD: (CAN Node 1) Transmit Data Output,
CC20IO: (CAPCOM2) CC20 Capture Inp./Compare Outp.
CC21IO: (CAPCOM2) CC21 Capture Inp./Compare Outp.
Note: At the end of an external reset P9.4 and P9.5 also may
input startup configuration values.
Data Sheet
9
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pin
Num.
Input Function
Outp.
Port 5
9-18,
21-24
I
P5.0
P5.1
P5.2
P5.3
P5.4
P5.5
P5.10
P5.11
P5.6
P5.7
P5.12
P5.13
P5.14
P5.15
9
10
11
12
13
14
15
16
17
18
21
22
23
24
I
I
I
I
I
I
I
I
I
I
I
I
I
I
TRST
62
I
Data Sheet
Port 5 is a 14-bit input-only port.
The pins of Port 5 also serve as analog input channels for the
A/D converter, or they serve as timer inputs:
AN0
AN1
AN2
AN3
AN4
AN5
AN10 (T6EUD): GPT2 Timer T6 Ext. Up/Down Ctrl. Inp.
AN11 (T5EUD): GPT2 Timer T5 Ext. Up/Down Ctrl. Inp.
AN6
AN7
AN12 (T6IN): GPT2 Timer T6 Count/Gate Input
AN13 (T5IN): GPT2 Timer T5 Count/Gate Input
AN14 (T4EUD): GPT1 Timer T4 Ext. Up/Down Ctrl. Inp.
AN15 (T2EUD): GPT1 Timer T2 Ext. Up/Down Ctrl. Inp.
Test-System Reset Input. For normal system operation, pin
TRST should be held low. A high level at this pin at the rising
edge of RSTIN enables the hardware configuration and
activates the XC164GM’s debug system. In this case, pin
TRST must be driven low once to reset the debug system.
10
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pin
Num.
Port 3
28-39, IO
42
P3.1
28
P3.2
29
P3.3
30
P3.4
31
P3.5
32
P3.6
P3.7
33
34
P3.8
P3.9
P3.10
35
36
37
P3.11
38
P3.13
39
P3.15
42
Data Sheet
Input Function
Outp.
O
I/O
I
I
I
I
O
O
I
I
I
O
O
I
I
I
I/O
I/O
O
I
I/O
I
I/O
I
O
O
Port 3 is a 13-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance state)
or output (configurable as push/pull or open drain driver). The
input threshold of Port 3 is selectable (standard or
special).The following Port 3 pins also serve for alternate
functions:
T6OUT: [GPT2] Timer T6 Toggle Latch Output,
RxD1: [ASC1] Data Input (Async.) or Inp./Outp. (Sync.),
EX1IN: [Fast External Interrupt 1] Input (alternate pin A),
TCK: [Debug System] JTAG Clock Input
CAPIN: [GPT2] Register CAPREL Capture Input,
TDI: [Debug System] JTAG Data In
T3OUT: [GPT1] Timer T3 Toggle Latch Output,
TDO: [Debug System] JTAG Data Out
T3EUD: [GPT1] Timer T3 External Up/Down Control Input,
TMS: [Debug System] JTAG Test Mode Selection
T4IN: [GPT1] Timer T4 Count/Gate/Reload/Capture Inp.
TxD1: [ASC0] Clock/Data Output (Async./Sync.),
BRKOUT: [Debug System] Break Out
T3IN: [GPT1] Timer T3 Count/Gate Input
T2IN: [GPT1] Timer T2 Count/Gate/Reload/Capture Inp.
BRKIN: [Debug System] Break In
MRST0: [SSC0] Master-Receive/Slave-Transmit In/Out.
MTSR0: [SSC0] Master-Transmit/Slave-Receive Out/In.
TxD0: [ASC0] Clock/Data Output (Async./Sync.),
EX2IN: [Fast External Interrupt 2] Input (alternate pin B)
RxD0: [ASC0] Data Input (Async.) or Inp./Outp. (Sync.),
EX2IN: [Fast External Interrupt 2] Input (alternate pin A)
SCLK0: [SSC0] Master Clock Output / Slave Clock Input.,
EX3IN: [Fast External Interrupt 3] Input (alternate pin A)
CLKOUT: System Clock Output (= CPU Clock),
FOUT: Programmable Frequency Output
11
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
Input Function
Outp.
PORT1 1-6,
49-56
IO
P1L.7
P1H.0
56
1
P1H.1
2
P1H.2
3
P1H.3
3
P1H.4
5
P1H.5
6
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
PORT1 consists of one 8-bit and one 6-bit bidirectional I/O
port P1L and P1H. Each pin can be programmed for input
(output driver in high-impedance state) or output.
The following PORT1 pins also serve for alt. functions:
CC22IO: [CAPCOM2] CC22 Capture Inp./Compare Outp.
EX0IN: [Fast External Interrupt 0] Input (default pin),
CC23IO: [CAPCOM2] CC23 Capture Inp./Compare Outp.
EX1IN: [Fast External Interrupt 1] Input (default pin),
MRST1: [SSC1] Master-Receive/Slave-Transmit In/Out.
EX2IN: [Fast External Interrupt 2] Input (default pin),
MTSR1: [SSC1] Master-Transmit/Slave-Receive Out/Inp.
T7IN: [CAPCOM2] Timer T7 Count Input,
SCLK1: [SSC1] Master Clock Output / Slave Clock Input,
EX3IN: [Fast External Interrupt 3] Input (default pin),
CC24IO: [CAPCOM2] CC24 Capture Inp./Compare Outp.,
EX4IN: [Fast External Interrupt 4] Input (default pin)
CC25IO: [CAPCOM2] CC25 Capture Inp./Compare Outp.,
EX5IN: [Fast External Interrupt 5] Input (default pin)
Note: At the end of an external reset P1H.4 and P1H.5 also
may input startup configuration values
XTAL2
XTAL1
61
60
O
I
XTAL2: Output of the oscillator amplifier circuit
XTAL1: Input to the oscillator amplifier and input to the
internal clock generator
To clock the device from an external source, drive XTAL1,
while leaving XTAL2 unconnected. Minimum and maximum
high/low and rise/fall times specified in the AC Characteristics
must be observed.
Note: Input pin XTAL1 belongs to the core voltage domain.
Therefore, input voltages must be within the range
defined for VDDI.
VAREF
VAGND
VDDI
19
–
Reference voltage for the A/D converter
20
–
Reference ground for the A/D converter
26, 58 –
Data Sheet
Digital Core Supply Voltage (On-Chip Modules):
+2.5 V during normal operation and idle mode.
Please refer to the Operating Condition Parameters
12
V1.2, 2007-03
XC164GM
Derivatives
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pin
Num.
Input Function
Outp.
VDDP
8, 27, –
40, 57
Digital Pad Supply Voltage (Pin Output Drivers):
+5 V during normal operation and idle mode.
Please refer to the Operating Condition Parameters
VSS
7, 25, –
41, 59
Digital Ground
Connect decoupling capacitors to adjacent VDD/VSS pin pairs
as close as possible to the pins.
All VSS pins must be connected to the ground-line or groundplane.
1) The CAN interface lines are assigned to port P9 under software control.
Data Sheet
13
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3
Functional Description
The architecture of the XC164GM combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a very well-balanced way. In
addition, the on-chip memory blocks allow the design of compact systems-on-silicon with
maximum performance (computing, control, communication).
The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data
SRAM) and the set of generic peripherals are connected to the CPU via separate buses.
Another bus, the LXBus, connects additional on-chip resources (see Figure 3).
This bus structure enhances the overall system performance by enabling the concurrent
operation of several subsystems of the XC164GM.
The following block diagram gives an overview of the different on-chip components and
of the advanced, high bandwidth internal bus structure of the XC164GM.
PSRAM
DPRAM
2 Kbytes
2 Kbytes
DSRAM
0/2/4 Kbytes
ProgMem
32/64/128 Kbytes
reduced
LXBus
Control
EBC
DMU
PMU
Flash
CPU
C166SV2-Core
OCDS
XTAL
Osc / PLL
Clock Generation
RTC WDT
L XBu s
Debug Support
Interrupt & PEC
Interrupt Bus
Peripheral Data Bus
ADC
GPT ASC0 ASC1 SSC0 SSC1
8/10-Bit
14
C hannels
T2
(U SAR T) (U SAR T)
(SPI)
CC2
(SPI)
Twin
CAN
T7
T3
T8
T4
A
T5
T6
Port 9
BR Gen
BR Gen
BR Gen
Port 5
6
B
BR Gen
Port 3
13
14
POR T1
14
Mc_xc164gm_block1.vsd
Figure 3
Data Sheet
Block Diagram
14
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC164GM is configured in a von Neumann architecture, which
means that all internal and external resources, such as code memory, data memory,
registers and I/O ports, are organized within the same linear address space. This
common memory space includes 16 Mbytes and is arranged as 256 segments of
64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each.
The entire memory space can be accessed byte wise or word wise. Portions of the
on-chip DPRAM and the register spaces (E/SFR) have additionally been made directly
bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
accesses to the program memories, such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
accesses to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected via the high-speed system bus to exchange
data. This is required if operands are read from program memory, code or data is written
to the PSRAM, or data is read from or written to peripherals on the LXBus (such as
TwinCAN). The system bus allows concurrent two-way communication for maximum
transfer performance.
32/64/128 Kbytes1) of on-chip Flash memory store code or constant data. The on-chip
Flash memory is organized as four 8-Kbyte sectors and up to three 32-Kbyte sectors.
Each sector can be separately write protected2), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A password sequence
temporarily unlocks protected areas. The Flash module combines very fast 64-bit onecycle read accesses with protected and efficient writing algorithms for programming and
erasing. Thus, program execution out of the internal Flash results in maximum
performance. Dynamic error correction provides extremely high read data security for all
read accesses.
Programming typically takes 2 ms per 128-byte block (5 ms max.), erasing a sector
typically takes 200 ms (500 ms max.).
2 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data.
The PSRAM is accessed via the PMU and is therefore optimized for code fetches.
0/2/4 Kbytes1) of on-chip Data SRAM (DSRAM) are provided as a storage for general
user data. The DSRAM is accessed via the DMU and is therefore optimized for data
accesses. DSRAM is not available in the XC164GM-4F derivatives.
1) Depends on the respective derivative. See Table 1 “XC164GM Derivative Synopsis” on Page 6.
2) Each two 8-Kbyte sectors are combined for write-protection purposes.
Data Sheet
15
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user
defined variables, for the system stack, general purpose register banks. A register bank
can consist of up to 16 word wide (R0 to R15) and/or byte wide (RL0, RH0, …, RL7, RH7)
so-called General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word wide registers which are
used for controlling and monitoring functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC166 Family. Therefore, they should
either not be accessed, or written with zeros, to ensure upward compatibility.
Table 3
XC164GM Memory Map
Address Area
Start Loc.
End Loc.
Area Size1)
Notes
Flash register space
FF’F000H
FF’FFFFH
4 Kbytes
2)
Reserved (Acc. trap)
F8’0000H
FF’FFFFH
508 Kbytes
–
Reserved for PSRAM
E0’0800H
F7’FFFFH
< 1.5 Mbytes Minus PSRAM
Program SRAM
E0’0000H
E0’07FFH
2 Kbytes
–
Reserved for pr. mem.
C2’0000H
DF’FFFFH
< 2 Mbytes
Minus Flash
Program Flash
C0’0000H
C1’FFFFH
128 Kbytes
XC164GM-16F
C0’0000H
C0’FFFFH
64 Kbytes
XC164GM-8F
C0’0000H
C0’7FFFH
32 Kbytes
XC164GM-4F
Reserved
20’0800H
BF’FFFFH
< 10 Mbytes
Minus TwinCAN
TwinCAN registers
20’0000H
20’07FFH
2 Kbytes
Accessed via EBC
Reserved
01’0000H
1F’FFFFH
< 2 Mbytes
Minus segment 0
SFR area
00’FE00H
00’FFFFH
0.5 Kbyte
–
Dual-Port RAM
00’F600H
00’FDFFH
2 Kbytes
–
Reserved for DPRAM
00’F200H
00’F5FFH
1 Kbyte
–
ESFR area
00’F000H
00’F1FFH
0.5 Kbyte
–
XSFR area
00’E000H
00’EFFFH
4 Kbytes
–
Reserved
00’D000H
00’DFFFH
6 Kbytes
–
Data SRAM
00’C000H
00’CFFFH
4 Kbytes
3)
Reserved for DSRAM
00’8000H
00’BFFFH
16 Kbytes
–
Reserved
00’0000H
00’7FFFH
32 Kbytes
–
1) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.
Data Sheet
16
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
2) Not defined register locations return a trap code (1E9BH).
3) Depends on the respective derivative. See Table 1 “XC164GM Derivative Synopsis” on Page 6.
Data Sheet
17
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3.2
Central Processing Unit (CPU)
The main core of the CPU consists of a 5-stage execution pipeline with a 2-stage
instruction-fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply
and accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply and divide unit, a bit-mask generator, and a barrel
shifter.
PSRAM
Flash/RO M
PM U
CPU
P refetch
U nit
B ranch
U nit
FIFO
CSP
VECSEG
CPUCON1
CPUCON2
R eturn
S tack
ID X 0
ID X 1
QX0
QX1
QR0
QR1
+ /-
+ /-
M ultiply
U nit
IP
MRW
+ /-
MCW
MSW
MAH
MAL
2-S tage
P refetch
P ipeline
T FR
Injection/
Exception
Handler
5-S tage
P ipeline
IFU
DPRAM
IPIP
DPP0
DPP1
DPP2
DPP3
SPSEG
SP
S TK O V
S TK U N
ADU
D ivisio n U n it
B it-M a sk-G e n .
M u ltip ly U n it
B a rre l-S h ifte r
MDC
CP
RR1515
RR1414
R 15
R 14
R 15
R 14
GPRs
GPRs
GPRs
GPRs
RR1 1
RR0 0R 1
R0
R1
R0
RF
PSW
+ /-
MDH
MDL
ZERO S
ONES
M AC
B u ffer
ALU
WB
DSRAM
EBC
Peripherals
DM U
m ca04917_x.vsd
Figure 4
CPU Block Diagram
Based on these hardware provisions, most of the XC164GM’s instructions can be
executed in just one machine cycle which requires 25 ns at 40 MHz CPU clock. For
Data Sheet
18
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
example, shift and rotate instructions are always processed during one machine cycle
independent of the number of bits to be shifted. Also multiplication and most MAC
instructions execute in one single cycle. All multiple-cycle instructions have been
optimized so that they can be executed very fast as well: for example, a 32-/16-bit
division is started within 4 cycles, while the remaining 15 cycles are executed in the
background. Another pipeline optimization, the branch target prediction, allows
eliminating the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 word
wide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank to be accessed by the CPU at any time. The number of
register banks is only restricted by the available internal RAM space. For easy parameter
passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided as a storage for temporary data. The
system stack can be allocated to any location within the address space (preferably in the
on-chip RAM area), and it is accessed by the CPU via the stack pointer (SP) register.
Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack
pointer value upon each stack access for the detection of a stack overflow or underflow.
The high performance offered by the hardware implementation of the CPU can efficiently
be utilized by a programmer via the highly efficient XC164GM instruction set which
includes the following instruction classes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Arithmetic Instructions
DSP-Oriented Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
Data Sheet
19
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3.3
Interrupt System
With an interrupt response time of typically 8 CPU clocks (in case of internal program
execution), the XC164GM is capable of reacting very fast to the occurrence of nondeterministic events.
The architecture of the XC164GM supports several mechanisms for fast and flexible
response to service requests that can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to
being serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is
suspended and a branch to the interrupt vector table is performed, just one cycle is
‘stolen’ from the current CPU activity to perform a PEC service. A PEC service implies a
single byte or word data transfer between any two memory locations with an additional
increment of either the PEC source, or the destination pointer, or both. An individual PEC
transfer counter is implicitly decremented for each PEC service except when performing
in the continuous transfer mode. When this counter reaches zero, a standard interrupt is
performed to the corresponding source related vector location. PEC services are very
well suited, for example, for supporting the transmission or reception of blocks of data.
The XC164GM has 8 PEC channels each of which offers such fast interrupt-driven data
transfer capabilities.
A separate control register which contains an interrupt request flag, an interrupt enable
flag and an interrupt priority bit field exists for each of the possible interrupt nodes. Via
its related register, each node can be programmed to one of sixteen interrupt priority
levels. Once having been accepted by the CPU, an interrupt service can only be
interrupted by a higher prioritized service request. For the standard interrupt processing,
each of the possible interrupt nodes has a dedicated vector location.
Fast external interrupt inputs are provided to service external interrupts with high
precision requirements. These fast interrupt inputs feature programmable edge
detection (rising edge, falling edge, or both edges).
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with
an individual trap (interrupt) number.
Table 4 shows all of the possible XC164GM interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.
Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes), may
be used to generate software controlled interrupt requests by setting the
respective interrupt request bit (xIR).
Data Sheet
20
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
Table 4
XC164GM Interrupt Nodes
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Location1)
Trap
Number
EX0IN
CC1_CC8IC
xx’0060H
18H / 24D
EX1IN
CC1_CC9IC
xx’0064H
19H / 25D
EX2IN
CC1_CC10IC
xx’0068H
1AH / 26D
EX3IN
CC1_CC11IC
xx’006CH
1BH / 27D
EX4IN
CC1_CC12IC
xx’0070H
1CH / 28D
EX5IN
CC1_CC13IC
xx’0074H
1DH / 29D
CAPCOM Register 16
CC2_CC16IC
xx’00C0H
30H / 48D
CAPCOM Register 17
CC2_CC17IC
xx’00C4H
31H / 49D
CAPCOM Register 18
CC2_CC18IC
xx’00C8H
32H / 50D
CAPCOM Register 19
CC2_CC19IC
xx’00CCH
33H / 51D
CAPCOM Register 20
CC2_CC20IC
xx’00D0H
34H / 52D
CAPCOM Register 21
CC2_CC21IC
xx’00D4H
35H / 53D
CAPCOM Register 22
CC2_CC22IC
xx’00D8H
36H / 54D
CAPCOM Register 23
CC2_CC23IC
xx’00DCH
37H / 55D
CAPCOM Register 24
CC2_CC24IC
xx’00E0H
38H / 56D
CAPCOM Register 25
CC2_CC25IC
xx’00E4H
39H / 57D
CAPCOM Register 26
CC2_CC26IC
xx’00E8H
3AH / 58D
CAPCOM Register 27
CC2_CC27IC
xx’00ECH
3BH / 59D
CAPCOM Register 28
CC2_CC28IC
xx’00F0H
3CH / 60D
CAPCOM Register 29
CC2_CC29IC
xx’0110H
44H / 68D
CAPCOM Register 30
CC2_CC30IC
xx’0114H
45H / 69D
CAPCOM Register 31
CC2_CC31IC
xx’0118H
46H / 70D
CAPCOM Timer 7
CC2_T7IC
xx’00F4H
3DH / 61D
CAPCOM Timer 8
CC2_T8IC
xx’00F8H
3EH / 62D
GPT1 Timer 2
GPT12E_T2IC
xx’0088H
22H / 34D
GPT1 Timer 3
GPT12E_T3IC
xx’008CH
23H / 35D
GPT1 Timer 4
GPT12E_T4IC
xx’0090H
24H / 36D
GPT2 Timer 5
GPT12E_T5IC
xx’0094H
25H / 37D
GPT2 Timer 6
GPT12E_T6IC
xx’0098H
26H / 38D
Data Sheet
21
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
Table 4
XC164GM Interrupt Nodes (cont’d)
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Location1)
Trap
Number
GPT2 CAPREL Register
GPT12E_CRIC
xx’009CH
27H / 39D
A/D Conversion Complete
ADC_CIC
xx’00A0H
28H / 40D
A/D Overrun Error
ADC_EIC
xx’00A4H
29H / 41D
ASC0 Transmit
ASC0_TIC
xx’00A8H
2AH / 42D
ASC0 Transmit Buffer
ASC0_TBIC
xx’011CH
47H / 71D
ASC0 Receive
ASC0_RIC
xx’00ACH
2BH / 43D
ASC0 Error
ASC0_EIC
xx’00B0H
2CH / 44D
ASC0 Autobaud
ASC0_ABIC
xx’017CH
5FH / 95D
SSC0 Transmit
SSC0_TIC
xx’00B4H
2DH / 45D
SSC0 Receive
SSC0_RIC
xx’00B8H
2EH / 46D
SSC0 Error
SSC0_EIC
xx’00BCH
2FH / 47D
PLL/OWD
PLLIC
xx’010CH
43H / 67D
ASC1 Transmit
ASC1_TIC
xx’0120H
48H / 72D
ASC1 Transmit Buffer
ASC1_TBIC
xx’0178H
5EH / 94D
ASC1 Receive
ASC1_RIC
xx’0124H
49H / 73D
ASC1 Error
ASC1_EIC
xx’0128H
4AH / 74D
ASC1 Autobaud
ASC1_ABIC
xx’0108H
42H / 66D
End of PEC Subchannel
EOPIC
xx’0130H
4CH / 76D
SSC1 Transmit
SSC1_TIC
xx’0144H
51H / 81D
SSC1 Receive
SSC1_RIC
xx’0148H
52H / 82D
SSC1 Error
SSC1_EIC
xx’014CH
53H / 83D
CAN0
CAN_0IC
xx’0150H
54H / 84D
CAN1
CAN_1IC
xx’0154H
55H / 85D
CAN2
CAN_2IC
xx’0158H
56H / 86D
CAN3
CAN_3IC
xx’015CH
57H / 87D
CAN4
CAN_4IC
xx’0164H
59H / 89D
CAN5
CAN_5IC
xx’0168H
5AH / 90D
CAN6
CAN_6IC
xx’016CH
5BH / 91D
CAN7
CAN_7IC
xx’0170H
5CH / 92D
RTC
RTC_IC
xx’0174H
5DH / 93D
Data Sheet
22
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
Table 4
XC164GM Interrupt Nodes (cont’d)
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Location1)
Trap
Number
Unassigned node
–
xx’0040H
10H / 16D
Unassigned node
–
xx’0044H
11H / 17D
Unassigned node
–
xx’0048H
12H / 18D
Unassigned node
–
xx’004CH
13H / 19D
Unassigned node
–
xx’0050H
14H / 20D
Unassigned node
–
xx’0054H
15H / 21D
Unassigned node
–
xx’0058H
16H / 22D
Unassigned node
–
xx’005CH
17H / 23D
Unassigned node
–
xx’0078H
1EH / 30D
Unassigned node
–
xx’007CH
1FH / 31D
Unassigned node
–
xx’0080H
20H / 32D
Unassigned node
–
xx’0084H
21H / 33D
Unassigned node
–
xx’00FCH
3FH / 63D
Unassigned node
–
xx’0100H
40H / 64D
Unassigned node
–
xx’0104H
41H / 65D
Unassigned node
–
xx’012CH
4BH / 75D
Unassigned node
–
xx’0134H
4DH / 77D
Unassigned node
–
xx’0138H
4EH / 78D
Unassigned node
–
xx’013CH
4FH / 79D
Unassigned node
–
xx’0140H
50H / 80D
Unassigned node
–
xx’0160H
58H / 88D
1) Register VECSEG defines the segment where the vector table is located to.
Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table
represents the default setting, with a distance of 4 (two words) between two vectors.
Data Sheet
23
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
The XC164GM also provides an excellent mechanism to identify and to process
exceptions or error conditions that arise during run-time, so-called ‘Hardware Traps’.
Hardware traps cause immediate non-maskable system reaction which is similar to a
standard interrupt service (branching to a dedicated vector table location). The
occurrence of a hardware trap is additionally signified by an individual bit in the trap flag
register (TFR). Except when another higher prioritized trap service is in progress, a
hardware trap will interrupt any actual program execution. In turn, hardware trap services
can normally not be interrupted by standard or PEC interrupts.
Table 5 shows all of the possible exceptions or error conditions that can arise during runtime:
Table 5
Hardware Trap Summary
Trap
Vector
Vector
Trap
Trap
1)
Location
Number Priority
RESET
RESET
RESET
xx’0000H
xx’0000H
xx’0000H
00H
00H
00H
III
III
III
NMI
STKOF
STKUF
SOFTBRK
NMITRAP
STOTRAP
STUTRAP
SBRKTRAP
xx’0008H
xx’0010H
xx’0018H
xx’0020H
02H
04H
06H
08H
II
II
II
II
UNDOPC
PACER
PRTFLT
BTRAP
BTRAP
BTRAP
xx’0028H
xx’0028H
xx’0028H
0AH
0AH
0AH
I
I
I
ILLOPA
BTRAP
xx’0028H
0AH
I
Reserved
–
–
[2CH - 3CH] [0BH 0FH]
–
Software Traps
• TRAP Instruction
–
–
Any
Any
[xx’0000H - [00H xx’01FCH] 7FH]
in steps of
4H
Current
CPU
Priority
Exception Condition
Trap
Flag
Reset Functions:
• Hardware Reset
• Software Reset
• W-dog Timer Overflow
–
Class A Hardware Traps:
• Non-Maskable Interrupt
• Stack Overflow
• Stack Underflow
• Software Break
Class B Hardware Traps:
• Undefined Opcode
• PMI Access Error
• Protected Instruction
Fault
• Illegal Word Operand
Access
1) Register VECSEG defines the segment where the vector table is located to.
Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table
represents the default setting, with a distance of 4 (two words) between two vectors.
Data Sheet
24
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3.4
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system provides a broad range of debug and emulation
features built into the XC164GM. The user software running on the XC164GM can thus
be debugged within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface,
consisting of the IEEE-1149-conforming JTAG port and a break interface. The debugger
controls the OCDS via a set of dedicated registers accessible via the JTAG interface.
Additionally, the OCDS system can be controlled by the CPU, e.g. by a monitor program.
An injection interface allows the execution of OCDS-generated instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported as well as the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU-halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing data can be obtained via the JTAG interface.
The debug interface uses a set of 6 interface signals (4 JTAG lines, 2 break lines) to
communicate with external circuitry. These interface signals are realized as alternate
functions on Port 3 pins.
Data Sheet
25
V1.2, 2007-03
XC164GM
Derivatives
Functional Description
3.5
Capture/Compare Unit (CAPCOM2)
The CAPCOM unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of 1 system clock cycle (8 cycles in staggered
mode). The CAPCOM unit is typically used to handle high speed I/O tasks such as pulse
and waveform generation, pulse width modulation (PWM), Digital to Analog (D/A)
conversion, software timing, or time recording relative to external events.
Two 16-bit timers (T7/T8) with reload registers provide two independent time bases for
the capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution and allows
precise adjustments to the application specific requirements. In addition, an external
count input for CAPCOM timer T7 allows event scheduling for the capture/compare
registers relative to external events.
The capture/compare register array contains 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer (T7 or T8,
respectively), and programmed for capture or compare function.
10 registers of the CAPCOM2 module have each one port pin associated with it which
serves as an input pin for triggering the capture function, or as an output pin to indicate
the occurrence of a compare event.
Table 6
Compare Modes (CAPCOM2)
Compare Modes
Function
Mode 0
Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1
Pin toggles on each compare match;
Several compare events per timer period are possible
Mode 2
Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode
Generates single edges or pulses;
Can be used with any compare mode
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
Data Sheet
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V1.2, 2007-03
XC164GM
Derivatives
Functional Description
register in response to an external event at the port pin which is associated with this
register. In addition, a specific interrupt request for this capture/compare register is
generated. Either a positive, a negative, or both a positive and a negative external signal
transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes
are continuously compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the selected compare mode.
Data Sheet
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Derivatives
Functional Description
Reload Reg.
T7REL
fC C
T7IN
T6OUF
T7
Input
Control
Timer T7
CCxIO
CCxIO
CCxIRQ
CCxIRQ
Mode
Control
(Capture
or
Compare)
Sixteen
16-bit
Capture/
Compare
Registers
CCxIO
fC C
T6OUF
T7IRQ
CCxIRQ
T8
Input
Control
Timer T8
T8IRQ
Reload Reg.
T8REL
CAPCOM2 provides channels x = 16 … 31.
(see signals CCxIO and CCxIRQ)
MCB05569_2
Figure 5
Data Sheet
CAPCOM2 Unit Block Diagram
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Derivatives
Functional Description
3.6
General Purpose Timer (GPT12E) Unit
The GPT12E unit represents a very flexible multifunctional timer/counter structure which
may be used for many different time related tasks such as event timing and counting,
pulse width and duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers which are organized in two separate
modules, GPT1 and GPT2. Each timer in each module may operate independently in a
number of different modes, or may be concatenated with another timer of the same
module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation, which are Timer, Gated Timer, Counter, and
Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from
the system clock, divided by a programmable prescaler, while Counter Mode allows a
timer to be clocked in reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes, each timer has one associated port pin (TxIN) which serves as gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The count direction (up/down) for each timer is programmable by software or may
additionally be altered dynamically by an external signal on a port pin (TxEUD) to
facilitate e.g. position tracking.
In Incremental Interface Mode the GPT1 timers (T2, T3, T4) can be directly connected
to the incremental position sensor signals A and B via their respective inputs TxIN and
TxEUD. Direction and count signals are internally derived from these two input signals,
so the contents of the respective timer Tx corresponds to the sensor position. The third
position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload
or capture registers for timer T3. When used as capture or reload registers, timers T2
and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a
signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2
or T4 triggered either by an external signal or by a selectable state transition of its toggle
latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite
state transitions of T3OTL with the low and high times of a PWM signal, this signal can
be constantly generated without software intervention.
Data Sheet
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V1.2, 2007-03
XC164GM
Derivatives
Functional Description
T3CON.BPS1
f GPT
2n:1
Basic Clock
Interrupt
Request
(T2IRQ)
Aux. Timer T2
T2IN
T2EUD
T2
Mode
Control
U/D
Reload
Capture
Interrupt
Request
(T3IRQ)
T3IN
T3
Mode
Control
T3EUD
Core Timer T3
T3OTL
T3OUT
Toggle
Latch
U/D
Capture
T4IN
T4EUD
T4
Mode
Control
Reload
Aux. Timer T4
U/D
Interrupt
Request
(T4IRQ)
MCA05563
Figure 6
Block Diagram of GPT1
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
Data Sheet
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Derivatives
Functional Description
count direction (up/down) for each timer is programmable by software or may
additionally be altered dynamically by an external signal on a port pin (TxEUD).
Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6,
which changes its state on each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can additionally be used to clock the
CAPCOM2 timers, and to cause a reload from the CAPREL register.
The CAPREL register may capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN), and timer T5 may optionally be cleared
after the capture procedure. This allows the XC164GM to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of
GPT1 timer T3’s inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
Data Sheet
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Derivatives
Functional Description
T6CON.BPS2
fGPT
2n:1
Basic Clock
Interrupt
Request
(T5IRQ)
GPT2 Timer T5
T5IN
T5
Mode
Control
U/D
Clear
Capture
CAPIN
T3IN/
T3EUD
CAPREL
Mode
Control
GPT2 CAPREL
Interrupt
Request
(CRIRQ)
Reload
Clear
Interrupt
Request
(T6IRQ)
Toggle
FF
T6IN
T6
Mode
Control
GPT2 Timer T6
T6OTL
T6OUT
T6OUF
U/D
MCA05564
Figure 7
Data Sheet
Block Diagram of GPT2
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Derivatives
Functional Description
3.7
Real Time Clock
The Real Time Clock (RTC) module of the XC164GM is directly clocked via a separate
clock driver with the prescaled on-chip main oscillator frequency (fRTC = fOSCm/32). It is
therefore independent from the selected clock generation mode of the XC164GM.
The RTC basically consists of a chain of divider blocks:
•
•
•
A selectable 8:1 divider (on - off)
The reloadable 16-bit timer T14
The 32-bit RTC timer block (accessible via registers RTCH and RTCL), made of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
fRTC
MUX
:8
Interrupt Sub Node
RUN
PRE
CNT
INT0
CNT
INT1
CNT
INT2
RTCINT
CNT
INT3
REL-Register
fCNT
T14REL
10 Bits
6 Bits
6 Bits
10 Bits
T14
10 Bits
6 Bits
6 Bits
10 Bits
T14-Register
CNT-Register
MCB05568
Figure 8
RTC Block Diagram
Note: The registers associated with the RTC are not affected by a reset in order to
maintain the correct system time even when intermediate resets are executed.
Data Sheet
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Derivatives
Functional Description
The RTC module can be used for different purposes:
•
•
•
•
System clock to determine the current time and date,
optionally during idle mode, sleep mode, and power down mode
Cyclic time based interrupt, to provide a system time tick independent of CPU
frequency and other resources, e.g. to wake up regularly from idle mode
48-bit timer for long term measurements (maximum timespan is > 100 years)
Alarm interrupt for wake-up on a defined time
Data Sheet
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Derivatives
Functional Description
3.8
A/D Converter
For analog signal measurement, a 10-bit A/D converter with 14 multiplexed input
channels and a sample and hold circuit has been integrated on-chip. It uses the method
of successive approximation. The sample time (for loading the capacitors) and the
conversion time is programmable (in two modes) and can thus be adjusted to the
external circuitry. The A/D converter can also operate in 8-bit conversion mode, where
the conversion time is further reduced.
Overrun error detection/protection is provided for the conversion result register
(ADDAT): either an interrupt request will be generated when the result of a previous
conversion has not been read from the result register at the time the next conversion is
complete, or the next conversion is suspended in such a case until the previous result
has been read.
For applications which require less analog input channels, the remaining channel inputs
can be used as digital input port pins.
The A/D converter of the XC164GM supports four different conversion modes. In the
standard Single Channel conversion mode, the analog level on a specified channel is
sampled once and converted to a digital result. In the Single Channel Continuous mode,
the analog level on a specified channel is repeatedly sampled and converted without
software intervention. In the Auto Scan mode, the analog levels on a prespecified
number of channels are sequentially sampled and converted. In the Auto Scan
Continuous mode, the prespecified channels are repeatedly sampled and converted. In
addition, the conversion of a specific channel can be inserted (injected) into a running
sequence without disturbing this sequence. This is called Channel Injection Mode.
The Peripheral Event Controller (PEC) may be used to automatically store the
conversion results into a table in memory for later evaluation, without requiring the
overhead of entering and exiting interrupt routines for each data transfer.
After each reset and also during normal operation the ADC automatically performs
calibration cycles. This automatic self-calibration constantly adjusts the converter to
changing operating conditions (e.g. temperature) and compensates process variations.
These calibration cycles are part of the conversion cycle, so they do not affect the normal
operation of the A/D converter.
In order to decouple analog inputs from digital noise and to avoid input trigger noise
those pins used for analog input can be disconnected from the digital input stages under
software control. This can be selected for each pin separately via register P5DIDIS
(Port 5 Digital Input Disable).
The Auto-Power-Down feature of the A/D converter minimizes the power consumption
when no conversion is in progress.
Data Sheet
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Derivatives
Functional Description
3.9
Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)
The Asynchronous/Synchronous Serial Interfaces ASC0/ASC1 (USARTs) provide serial
communication with other microcontrollers, processors, terminals or external peripheral
components. They are upward compatible with the serial ports of the Infineon 8-bit
microcontroller families and support full-duplex asynchronous communication and halfduplex synchronous communication. A dedicated baudrate generator with a fractional
divider precisely generates all standard baud rates without oscillator tuning. For
transmission, reception, error handling, and baud rate detection 5 separate interrupt
vectors are provided.
In asynchronous mode, 8- or 9-bit data frames (with optional parity bit) are transmitted
or received, preceded by a start bit and terminated by one or two stop bits. For
multiprocessor communication, a mechanism to distinguish address from data bytes has
been included (8-bit data plus wake-up bit mode). IrDA data transmissions up to
115.2 kbit/s with fixed or programmable IrDA pulse width are supported.
In synchronous mode, bytes (8 bits) are transmitted or received synchronously to a shift
clock which is generated by the ASC0/1. The LSB is always shifted first.
In both modes, transmission and reception of data is FIFO-buffered. An autobaud
detection unit allows to detect asynchronous data frames with its baudrate and mode
with automatic initialization of the baudrate generator and the mode control bits.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. A parity bit can automatically be generated on
transmission or be checked on reception. Framing error detection allows to recognize
data frames with missing stop bits. An overrun error will be generated, if the last
character received has not been read out of the receive buffer register at the time the
reception of a new character is complete.
Summary of Features
•
•
•
•
•
Full-duplex asynchronous operating modes
– 8- or 9-bit data frames, LSB first, one or two stop bits, parity generation/checking
– Baudrate from 2.5 Mbit/s to 0.6 bit/s (@ 40 MHz)
– Multiprocessor mode for automatic address/data byte detection
– Support for IrDA data transmission/reception up to max. 115.2 kbit/s (@ 40 MHz)
– Auto baudrate detection
Half-duplex 8-bit synchronous operating mode at 5 Mbit/s to 406.9 bit/s (@ 40 MHz)
Buffered transmitter/receiver with FIFO support (8 entries per direction)
Loop-back option available for testing purposes
Interrupt generation on transmitter buffer empty condition, last bit transmitted
condition, receive buffer full condition, error condition (frame, parity, overrun error),
start and end of an autobaud detection
Data Sheet
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XC164GM
Derivatives
Functional Description
3.10
High Speed Synchronous Serial Channels (SSC0/SSC1)
The High Speed Synchronous Serial Channels SSC0/SSC1 support full-duplex and halfduplex synchronous communication. It may be configured so it interfaces with serially
linked peripheral components, full SPI functionality is supported.
A dedicated baud rate generator allows to set up all standard baud rates without
oscillator tuning. For transmission, reception and error handling three separate interrupt
vectors are provided.
The SSC transmits or receives characters of 2 … 16 bits length synchronously to a shift
clock which can be generated by the SSC (master mode) or by an external master (slave
mode). The SSC can start shifting with the LSB or with the MSB and allows the selection
of shifting and latching clock edges as well as the clock polarity.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. Transmit error and receive error supervise the correct
handling of the data buffer. Phase error and baudrate error detect incorrect serial data.
Summary of Features
•
•
•
•
•
•
•
Master or Slave mode operation
Full-duplex or Half-duplex transfers
Baudrate generation from 20 Mbit/s to 305.18 bit/s (@ 40 MHz)
Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB-first or MSB-first
– Programmable clock polarity: idle low or idle high
– Programmable clock/data phase: data shift with leading or trailing clock edge
Loop back option available for testing purposes
Interrupt generation on transmitter buffer empty condition, receive buffer full
condition, error condition (receive, phase, baudrate, transmit error)
Three pin interface with flexible SSC pin configuration
Data Sheet
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XC164GM
Derivatives
Functional Description
3.11
TwinCAN Module
The integrated TwinCAN module handles the completely autonomous transmission and
reception of CAN frames in accordance with the CAN specification V2.0 part B (active),
i.e. the on-chip TwinCAN module can receive and transmit standard frames with 11-bit
identifiers as well as extended frames with 29-bit identifiers.
Two Full-CAN nodes share the TwinCAN module’s resources to optimize the CAN bus
traffic handling and to minimize the CPU load. The module provides up to 32 message
objects, which can be assigned to one of the CAN nodes and can be combined to FIFOstructures. Each object provides separate masks for acceptance filtering.
The flexible combination of Full-CAN functionality and FIFO architecture reduces the
efforts to fulfill the real-time requirements of complex embedded control applications.
Improved CAN bus monitoring functionality as well as the number of message objects
permit precise and comfortable CAN bus traffic handling.
Gateway functionality allows automatic data exchange between two separate CAN bus
systems, which reduces CPU load and improves the real time behavior of the entire
system.
The bit timing for both CAN nodes is derived from the master clock and is programmable
up to a data rate of 1 Mbit/s. Each CAN node uses two pins of Port 9 to interface to an
external bus transceiver. The interface pins are assigned via software.
TwinCAN Module Kernel
Clock
Control
Address
Decoder
Interrupt
Control
fCAN
CAN
Node A
CAN
Node B
Message
Object
Buffer
TxDCA
RxDCA
Port
Control
TxDCB
RxDCB
TwinCAN Control
MCB05567
Figure 9
Data Sheet
TwinCAN Module Block Diagram
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Derivatives
Functional Description
Summary of Features
•
•
•
•
•
•
•
CAN functionality according to CAN specification V2.0 B active
Data transfer rate up to 1 Mbit/s
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality and Basic CAN functionality for each message object
32 flexible message objects
– Assignment to one of the two CAN nodes
– Configuration as transmit object or receive object
– Concatenation to a 2-, 4-, 8-, 16-, or 32-message buffer with FIFO algorithm
– Handling of frames with 11-bit or 29-bit identifiers
– Individual programmable acceptance mask register for filtering for each object
– Monitoring via a frame counter
– Configuration for Remote Monitoring Mode
Up to eight individually programmable interrupt nodes can be used
CAN Analyzer Mode for bus monitoring is implemented
3.12
LXBus Controller (EBC)
The EBC only controls accesses to resources connected to the on-chip LXBus. The
LXBus is an internal representation of the external bus and allows accessing integrated
peripherals and modules in the same way as external components.
The TwinCAN module is connected and accessed via the LXBus.
Data Sheet
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Derivatives
Functional Description
3.13
Watchdog Timer
The Watchdog Timer represents one of the fail-safe mechanisms which have been
implemented to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can be disabled
until the EINIT instruction has been executed (compatible mode), or it can be disabled
and enabled at any time by executing instructions DISWDT and ENWDT (enhanced
mode). Thus, the chip’s start-up procedure is always monitored. The software has to be
designed to restart the Watchdog Timer before it overflows. If, due to hardware or
software related failures, the software fails to do so, the Watchdog Timer overflows and
generates an internal hardware reset.
The Watchdog Timer is a 16-bit timer, clocked with the system clock divided by
2/4/128/256. The high byte of the Watchdog Timer register can be set to a prespecified
reload value (stored in WDTREL) in order to allow further variation of the monitored time
interval. Each time it is serviced by the application software, the high byte of the
Watchdog Timer is reloaded and the low byte is cleared. Thus, time intervals between
13 μs and 419 ms can be monitored (@ 40 MHz).
The default Watchdog Timer interval after reset is 3.28 ms (@ 40 MHz).
Data Sheet
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Derivatives
Functional Description
3.14
Clock Generation
The Clock Generation Unit uses a programmable on-chip PLL with multiple prescalers
to generate the clock signals for the XC164GM with high flexibility. The master clock fMC
is the reference clock signal, and is used for TwinCAN and is output to the external
system. The CPU clock fCPU and the system clock fSYS are derived from the master clock
either directly (1:1) or via a 2:1 prescaler (fSYS = fCPU = fMC / 2). See also Section 4.4.1.
The on-chip oscillator can drive an external crystal or accepts an external clock signal.
The oscillator clock frequency can be multiplied by the on-chip PLL (by a programmable
factor) or can be divided by a programmable prescaler factor.
If the bypass mode is used (direct drive or prescaler) the PLL can deliver an independent
clock to monitor the clock signal generated by the on-chip oscillator. This PLL clock is
independent from the XTAL1 clock. When the expected oscillator clock transitions are
missing the Oscillator Watchdog (OWD) activates the PLL Unlock/OWD interrupt node
and supplies the CPU with an emergency clock, the PLL clock signal. Under these
circumstances the PLL will oscillate with its basic frequency.
The oscillator watchdog can be disabled by switching the PLL off. This reduces power
consumption, but also no interrupt request will be generated in case of a missing
oscillator clock.
Data Sheet
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Derivatives
Functional Description
3.15
Parallel Ports
The XC164GM provides up to 47 I/O lines which are organized into three input/output
ports and one input port. All port lines are bit-addressable, and all input/output lines are
individually (bit-wise) programmable as inputs or outputs via direction registers. The I/O
ports are true bidirectional ports which are switched to high impedance state when
configured as inputs. The output drivers of some I/O ports can be configured (pin by pin)
for push/pull operation or open-drain operation via control registers. During the internal
reset, all port pins are configured as inputs.
The edge characteristics (shape) and driver characteristics (output current) of the port
drivers can be selected via registers POCONx.
The input threshold of some ports is selectable (TTL or CMOS like), where the special
CMOS like input threshold reduces noise sensitivity due to the input hysteresis. The
input threshold may be selected individually for each byte of the respective ports.
All port lines have programmable alternate input or output functions associated with
them. All port lines that are not used for these alternate functions may be used as general
purpose IO lines.
Table 7
Summary of the XC164GM’s Parallel Ports
Port
Control
Alternate Functions
PORT1
Pad drivers
Capture inputs or compare outputs,
Serial interface lines
Port 3
Pad drivers,
Open drain,
Input threshold
Timer control signals, serial interface lines,
System clock output CLKOUT (or FOUT)
Port 5
–
Analog input channels to the A/D converter,
Timer control signals
Port 9
Pad drivers,
Open drain,
Input threshold
Capture inputs or compare outputs
CAN interface lines1)
1) Can be assigned by software.
Data Sheet
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Derivatives
Functional Description
3.16
Power Management
The XC164GM provides several means to control the power it consumes either at a
given time or averaged over a certain timespan. Three mechanisms can be used (partly
in parallel):
•
•
•
Power Saving Modes switch the XC164GM into a special operating mode (control
via instructions).
Idle Mode stops the CPU while the peripherals can continue to operate.
Sleep Mode and Power Down Mode stop all clock signals and all operation (RTC may
optionally continue running). Sleep Mode can be terminated by external interrupt
signals.
Clock Generation Management controls the distribution and the frequency of
internal and external clock signals. While the clock signals for currently inactive parts
of logic are disabled automatically, the user can reduce the XC164GM’s CPU clock
frequency which drastically reduces the consumed power.
External circuitry can be controlled via the programmable frequency output FOUT.
Peripheral Management permits temporary disabling of peripheral modules (control
via register SYSCON3). Each peripheral can separately be disabled/enabled.
The on-chip RTC supports intermittent operation of the XC164GM by generating cyclic
wake-up signals. This offers full performance to quickly react on action requests while
the intermittent sleep phases greatly reduce the average power consumption of the
system.
Data Sheet
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Derivatives
Functional Description
3.17
Instruction Set Summary
Table 8 lists the instructions of the XC164GM in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation
of the instructions, parameters for conditional execution of instructions, and the opcodes
for each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 8
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise exclusive OR, (word/byte operands)
2/4
BCLR/BSET
Clear/Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR
Shift left/right direct word GPR
2
Data Sheet
44
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XC164GM
Derivatives
Functional Description
Table 8
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
ROL/ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS/Z
Move byte operand to word op. with sign/zero extension
2/4
JMPA/I/R
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
JB(C)
Jump relative if direct bit is set (and clear bit)
4
JNB(S)
Jump relative if direct bit is not set (and set bit)
4
CALLA/I/R
Call absolute/indirect/relative subroutine if condition is met 4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH/POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET(P)
Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS
Return from inter-segment subroutine
2
RETI
Return from interrupt service subroutine
2
SBRK
Software Break
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
Enter Power Down Mode (supposes NMI-pin being low)
4
SRVWDT
Service Watchdog Timer
4
DISWDT/ENWDT
Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
Data Sheet
45
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Derivatives
Functional Description
Table 8
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
NOP
Null operation
2
CoMUL/CoMAC
Multiply (and accumulate)
4
CoADD/CoSUB
Add/Subtract
4
Co(A)SHR
(Arithmetic) Shift right
4
CoSHL
Shift left
4
CoLOAD/STORE
Load accumulator/Store MAC register
4
CoCMP
Compare
4
CoMAX/MIN
Maximum/Minimum
4
CoABS/CoRND
Absolute value/Round accumulator
4
CoMOV
Data move
4
CoNEG/NOP
Negate accumulator/Null operation
4
Data Sheet
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V1.2, 2007-03
XC164GM
Derivatives
Electrical Parameters
4
Electrical Parameters
The operating range for the XC164GM is defined by its electrical parameters. For proper
operation the indicated limitations must be respected when designing a system.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
Table 9
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
TST
TJ
VDDI
-65
150
°C
1)
-40
150
°C
Under bias
-0.5
3.25
V
–
Voltage on VDDP pins with
respect to ground (VSS)
VDDP
-0.5
6.2
V
–
Voltage on any pin with
respect to ground (VSS)
VIN
-0.5
VDDP +
V
2)
Input current on any pin
during overload condition
–
-10
10
mA
–
Absolute sum of all input
currents during overload
condition
–
–
|100|
mA
–
Storage temperature
Junction temperature
Voltage on VDDI pins with
respect to ground (VSS)
0.5
1) Moisture Sensitivity Level (MSL) 3, conforming to Jedec J-STD-020C for 260 °C.
2) Input pin XTAL1 belongs to the core voltage domain. Therefore, input voltages must be within the range
defined for VDDI.
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
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XC164GM
Derivatives
Electrical Parameters
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC164GM. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Table 10
Operating Condition Parameters
Parameter
Symbol
Limit Values
Min.
Max.
Unit Notes
Digital supply voltage for
the core
VDDI
2.35
2.7
V
Active mode,
fCPU = fCPUmax1)
Digital supply voltage for
IO pads
VDDP
4.4
5.5
V
Active mode2)3)
-0.5
–
V
VDDP - VDDI4)
V
Reference voltage
Supply Voltage Difference ΔVDD
Digital ground voltage
VSS
IOV
0
-5
5
mA
Per IO pin5)6)
-2
5
mA
Per analog input
pin5)6)
Overload current coupling KOVA
factor for analog inputs7)
–
1.0 × 10-4 –
–
1.5 × 10-3 –
Overload current coupling KOVD
factor for digital I/O pins7)
–
5.0 × 10-3 –
–
1.0 × 10-2 –
Absolute sum of overload
currents
Σ|IOV|
–
50
mA
6)
External Load
Capacitance
CL
–
50
pF
Pin drivers in
default mode8)
Ambient temperature
TA
0
70
°C
SAB-XC164…
-40
85
°C
SAF-XC164…
-40
125
°C
SAK-XC164…
Overload current
IOV > 0
IOV < 0
IOV > 0
IOV < 0
1) fCPUmax = 40 MHz for devices marked … 40F, fCPUmax = 20 MHz for devices marked … 20F.
2) External circuitry must guarantee low-level at the RSTIN pin at least until both power supply voltages have
reached the operating range.
3) The specified voltage range is allowed for operation. The range limits may be reached under extreme
operating conditions. However, specified parameters, such as leakage currents, refer to the standard
operating voltage range of VDDP = 4.75 V to 5.25 V.
4) This limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down,
and power-save modes.
Data Sheet
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XC164GM
Derivatives
Electrical Parameters
5) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VDDP + 0.5 V (IOV > 0) or VOV < VSS - 0.5 V (IOV < 0). The absolute sum of
input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the
specified limits.
Proper operation is not guaranteed if overload conditions occur on functional pins such as XTAL1.
6) Not subject to production test - verified by design/characterization.
7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pin’s leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.
The total current through a pin is |ITOT| = |IOZ| + (|IOV| × KOV). The additional error current may distort the input
voltage on analog inputs.
8) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
Parameter Interpretation
The parameters listed in the following partly represent the characteristics of the
XC164GM and partly its demands on the system. To aid in interpreting the parameters
right, when evaluating them for a design, they are marked in column “Symbol”:
CC (Controller Characteristics):
The logic of the XC164GM will provide signals with the respective characteristics.
SR (System Requirement):
The external system must provide signals with the respective characteristics to the
XC164GM.
Data Sheet
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XC164GM
Derivatives
Electrical Parameters
4.2
DC Parameters
These parameters are static or average values, which may be exceeded during
switching transitions (e.g. output current).
Table 11
DC Characteristics (Operating Conditions apply)1)
Parameter
Symbol
Limit Values
Min.
Max.
Unit Test Condition
Input low voltage TTL
(all except XTAL1)
VIL
SR
-0.5
0.2 × VDDP V
- 0.1
–
Input low voltage
XTAL12)
VILC
SR
-0.5
0.3 × VDDI
V
–
Input low voltage
(Special Threshold)
VILS
SR
-0.5
0.45 ×
V
3)
Input high voltage TTL VIH
(all except XTAL1)
SR
0.2 × VDDP
+ 0.9
VDDP
VDDP + 0.5 V
–
Input high voltage
XTAL12)
VIHC
SR
0.7 × VDDI
VDDI + 0.5 V
–
Input high voltage
(Special Threshold)
VIHS
SR
0.8 × VDDP VDDP + 0.5 V
- 0.2
3)
Input Hysteresis
(Special Threshold)
HYS
0.04 ×
VDDP in [V],
Output low voltage
VOL
V
VDDP
CC –
–
Output high voltage6)
–
VOH
Series resistance = 0 Ω3)
1.0
V
0.45
V
CC VDDP - 1.0 –
VDDP -
V
–
V
±300
nA
0 V < VIN < VDDP,
TA ≤ 125 °C
±200
nA
0 V < VIN < VDDP,
TA ≤ 85 °C12)
±500
nA
0.45 V < VIN <
0.45
Input leakage current
(Port 5)7)
Input leakage current
(all other8))7)
Configuration pull-up
current9)
Data Sheet
IOZ1
CC –
IOZ2
CC –
10)
ICPUH
ICPUL11)
–
-10
μA
-100
–
μA
50
IOL ≤ IOLmax4)
IOL ≤ IOLnom4)5)
IOH ≥ IOHmax4)
IOH ≥ IOHnom4)5)
VDDP
VIN = VIHmin
VIN = VILmax
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Electrical Parameters
Table 11
DC Characteristics (Operating Conditions apply)1) (cont’d)
Parameter
Symbol
Limit Values
Min.
XTAL1 input current
Pin capacitance12)
(digital inputs/outputs)
IIL
CIO
Unit Test Condition
Max.
CC –
±20
μA
0 V < VIN < VDDI
CC –
10
pF
–
1) Keeping signal levels within the limits specified in this table, ensures operation without overload conditions.
For signal levels outside these specifications, also refer to the specification of the overload current IOV.
2) If XTAL1 is driven by a crystal, reaching an amplitude (peak to peak) of 0.4 × VDDI is sufficient.
3) This parameter is tested for P3, P9.
4) The maximum deliverable output current of a port driver depends on the selected output driver mode, see
Table 12, Current Limits for Port Output Drivers. The limit for pin groups must be respected.
5) As a rule, with decreasing output current the output levels approach the respective supply level (VOL → VSS,
VOH → VDDP). However, only the levels for nominal output currents are guaranteed.
6) This specification is not valid for outputs which are switched to open drain mode. In this case the respective
output will float and the voltage results from the external circuitry.
7) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to
the definition of the overload coupling factor KOV.
8) The driver of P3.15 is designed for faster switching, because this pin can deliver the system clock (CLKOUT).
The maximum leakage current for P3.15 is, therefore, increased to 1 μA.
9) During a hardware reset this specification is valid for configuration on P1H.4, P1H.5, P9.4 and P9.5.
After a hardware reset this specification is valid for NMI.
10) The maximum current may be drawn while the respective signal line remains inactive.
11) The minimum current must be drawn to drive the respective signal line active.
12) Not subject to production test - verified by design/characterization.
Table 12
Current Limits for Port Output Drivers
Port Output Driver
Mode
Maximum Output Current
(IOLmax, -IOHmax)1)
Nominal Output Current
(IOLnom, -IOHnom)
Strong driver
10 mA
2.5 mA
Medium driver
4.0 mA
1.0 mA
Weak driver
0.5 mA
0.1 mA
1) An output current above |IOXnom| may be drawn from up to three pins at the same time.
For any group of 16 neighboring port output pins the total output current in each direction (ΣIOL and Σ-IOH) must
remain below 50 mA.
Data Sheet
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XC164GM
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Electrical Parameters
Table 13
Power Consumption XC164GM (Operating Conditions apply)
Parameter
SymLimit Values
bol
Min. Max.
Unit Test Condition
Power supply current (active)
with all peripherals active
IDDI
15 +
2.6 × fCPU
mA
10 +
2.6 × fCPU
mA
–
5
mA
3)
–
15 +
1.2 × fCPU
mA
fCPU in [MHz]2),
10 +
1.2 × fCPU
mA
84,000
× e-α
mA
128,000
× e-α
mA
–
–
Pad supply current
Idle mode supply current with
all peripherals active
IDDP
IIDX
–
Sleep and Power down mode
supply current caused by
leakage4)
IPDL5) –
–
Sleep and Power down mode IPDM7) –
supply current caused by
leakage and the RTC running,
clocked by the main oscillator4)
fCPU in [MHz]1)2),
-16F derivatives
fCPU in [MHz]1)2),
-4F/8F derivatives
-16F derivatives
fCPU in [MHz]2),
-4F/8F derivatives
VDDI = VDDImax6)
TJ in [°C]
α = 4380 / (273 + TJ)
-16F derivatives
0.6 +
mA
0.02 ×
fOSC + IPDL
α = 4670 / (273 + TJ)
-4F/8F derivatives
VDDI = VDDImax
fOSC in [MHz]
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in Figure 10.
These parameters are tested at VDDImax and maximum CPU clock frequency with all outputs disconnected and
all inputs at VIL or VIH.
3) The pad supply voltage pins (VDDP) mainly provides the current consumed by the pin output drivers. A small
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the VDDP supply.
4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage
current and the frequency dependent current for RTC and main oscillator.
5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the
junction temperature (see Figure 12). The junction temperature TJ is the same as the ambient temperature TA
if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be
taken into account.
6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP, all outputs (including
pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for TJ ≥ 25 °C.
7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see
Figure 11). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The
given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.
Data Sheet
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Derivatives
Electrical Parameters
I [mA]
-16F
IDDImax
140
-4F/8F
-16F
120
IDDItyp
-4F/8F
100
80
-16F
IIDXmax
-4F/8F
60
-16F
IIDXtyp
-4F/8F
40
20
10
Figure 10
Data Sheet
20
30
40
fCPU [MHz]
Supply/Idle Current as a Function of Operating Frequency
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Electrical Parameters
I [mA]
3.0
2.0
IPDMmax
IPDMtyp
1.0
4
Figure 11
8
12
16
fOSC [MHz]
Sleep and Power Down Supply Current due to RTC and Oscillator
Running, as a Function of Oscillator Frequency
IPDL
[mA]
1.5
-16F
1.0
-4F/8F
0.5
-50
Figure 12
Data Sheet
0
50
100
150
TJ [°C]
Sleep and Power Down Leakage Supply Current as a Function of
Temperature
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Electrical Parameters
4.3
Analog/Digital Converter Parameters
These parameters describe how the optimum ADC performance can be reached.
Table 14
A/D Converter Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Min.
Analog reference supply
VAREF
SR 4.5
Max.
Unit Test
Condition
VDDP
V
1)
VSS + 0.1
VAREF
V
–
V
2)
20
MHz
3)
+ 0.1
VAGND
Analog input voltage range VAIN
Basic clock frequency
fBC
Conversion time for 10-bit tC10P
result4)
tC10
Conversion time for 8-bit
tC8P
4)
result
tC8
Calibration time after reset tCAL
SR VSS - 0.1
CC 484
11,696
tBC
5)
Total unadjusted error
TUE
CC –
±2
LSB
1)
Total capacitance
of an analog input
CAINT
CC –
15
pF
6)
Switched capacitance
of an analog input
CAINS
CC –
10
pF
6)
Resistance of
the analog input path
RAIN
CC –
2
kΩ
6)
Total capacitance
of the reference input
CAREFT CC –
20
pF
6)
Switched capacitance
of the reference input
CAREFS CC –
15
pF
6)
Resistance of
the reference input path
RAREF
1
kΩ
6)
Analog reference ground
SR VAGND
0.5
CC 52 × tBC + tS + 6 × tSYS –
Post-calibr. on
CC 40 × tBC + tS + 6 × tSYS –
Post-calibr. off
CC 44 × tBC + tS + 6 × tSYS –
Post-calibr. on
CC 32 × tBC + tS + 6 × tSYS –
Post-calibr. off
CC –
1) TUE is tested at VAREF = VDDP + 0.1 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range.
If the analog reference supply voltage drops below 4.5 V (i.e. VAREF ≥ 4.0 V) or exceeds the power supply
voltage by up to 0.2 V (i.e. VAREF = VDDP + 0.2 V) the maximum TUE is increased to ±3 LSB. This range is not
subject to production test.
The specified TUE is guaranteed only, if the absolute sum of input overload currents on Port 5 pins (see IOV
specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the respective period of
time. During the reset calibration sequence the maximum TUE may be ±4 LSB.
Data Sheet
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XC164GM
Derivatives
Electrical Parameters
2) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
3) The limit values for fBC must not be exceeded when selecting the peripheral frequency and the ADCTC setting.
4) This parameter includes the sample time tS, the time for determining the digital result and the time to load the
result register with the conversion result (tSYS = 1/fSYS).
Values for the basic clock tBC depend on programming and can be taken from Table 15.
When the post-calibration is switched off, the conversion time is reduced by 12 × tBC.
5) The actual duration of the reset calibration depends on the noise on the reference signal. Conversions
executed during the reset calibration increase the calibration time. The TUE for those conversions may be
increased.
6) Not subject to production test - verified by design/characterization.
The given parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) reduced values can be used for calculations. At room temperature and nominal
supply voltage the following typical values can be used:
CAINTtyp = 12 pF, CAINStyp = 7 pF, RAINtyp = 1.5 kΩ, CAREFTtyp = 15 pF, CAREFStyp = 13 pF, RAREFtyp = 0.7 kΩ.
RSource
V AIN
R AIN, On
C AINT - C AINS
C Ext
A/D Converter
CAINS
MCS05570
Figure 13
Data Sheet
Equivalent Circuitry for Analog Inputs
56
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Derivatives
Electrical Parameters
Sample time and conversion time of the XC164GM’s A/D Converter are programmable.
In compatibility mode, the above timing can be calculated using Table 15.
The limit values for fBC must not be exceeded when selecting ADCTC.
Table 15
A/D Converter Computation Table1)
ADCON.15|14
(ADCTC)
A/D Converter
Basic Clock fBC
ADCON.13|12
(ADSTC)
00
fSYS / 4
fSYS / 2
fSYS / 16
fSYS / 8
00
01
10
11
01
10
11
Sample Time
tS
tBC × 8
tBC × 16
tBC × 32
tBC × 64
1) These selections are available in compatibility mode. An improved mechanism to control the ADC input clock
can be selected.
Converter Timing Example:
Assumptions:
Basic clock
Sample time
fSYS
fBC
tS
= 40 MHz (i.e. tSYS = 25 ns), ADCTC = ‘01’, ADSTC = ‘00’
= fSYS / 2 = 20 MHz, i.e. tBC = 50 ns
= tBC × 8 = 400 ns
Conversion 10-bit:
With post-calibr. tC10P
Post-calibr. off
tC10
= 52 × tBC + tS + 6 × tSYS = (2600 + 400 + 150) ns = 3.15 μs
= 40 × tBC + tS + 6 × tSYS = (2000 + 400 + 150) ns = 2.55 μs
Conversion 8-bit:
With post-calibr. tC8P
Post-calibr. off
Data Sheet
tC8
= 44 × tBC + tS + 6 × tSYS = (2200 + 400 + 150) ns = 2.75 μs
= 32 × tBC + tS + 6 × tSYS = (1600 + 400 + 150) ns = 2.15 μs
57
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Electrical Parameters
4.4
AC Parameters
These parameters describe the dynamic behavior of the XC164GM.
4.4.1
Definition of Internal Timing
The internal operation of the XC164GM is controlled by the internal master clock fMC.
The master clock signal fMC can be generated from the oscillator clock signal fOSC via
different mechanisms. The duration of master clock periods (TCMs) and their variation
(and also the derived external timing) depend on the used mechanism to generate fMC.
This influence must be regarded when calculating the timings for the XC164GM.
Phase Locked Loop Operation (1:N)
f OSC
f MC
TCM
Direct Clock Drive (1:1)
f OSC
f MC
TCM
Prescaler Operation (N:1)
f OSC
f MC
TCM
MCT05555
Figure 14
Generation Mechanisms for the Master Clock
Note: The example for PLL operation shown in Figure 14 refers to a PLL factor of 1:4,
the example for prescaler operation refers to a divider factor of 2:1.
Data Sheet
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Electrical Parameters
The used mechanism to generate the master clock is selected by register PLLCON.
CPU and EBC are clocked with the CPU clock signal fCPU. The CPU clock can have the
same frequency as the master clock (fCPU = fMC) or can be the master clock divided by
two: fCPU = fMC / 2. This factor is selected by bit CPSYS in register SYSCON1.
The specification of the external timing (AC Characteristics) depends on the period of the
CPU clock, called “TCP”.
The other peripherals are supplied with the system clock signal fSYS which has the same
frequency as the CPU clock signal fCPU.
Bypass Operation
When bypass operation is configured (PLLCTRL = 0xB) the master clock is derived from
the internal oscillator (input clock signal XTAL1) through the input- and outputprescalers:
fMC = fOSC / ((PLLIDIV + 1) × (PLLODIV + 1)).
If both divider factors are selected as ‘1’ (PLLIDIV = PLLODIV = ‘0’) the frequency of fMC
directly follows the frequency of fOSC so the high and low time of fMC is defined by the duty
cycle of the input clock fOSC.
The lowest master clock frequency is achieved by selecting the maximum values for both
divider factors:
fMC = fOSC / ((3 + 1) × (14 + 1)) = fOSC / 60.
Phase Locked Loop (PLL)
When PLL operation is configured (PLLCTRL = 11B) the on-chip phase locked loop is
enabled and provides the master clock. The PLL multiplies the input frequency by the
factor F (fMC = fOSC × F) which results from the input divider, the multiplication factor, and
the output divider (F = PLLMUL+1 / (PLLIDIV+1 × PLLODIV+1)). The PLL circuit
synchronizes the master clock to the input clock. This synchronization is done smoothly,
i.e. the master clock frequency does not change abruptly.
Due to this adaptation to the input clock the frequency of fMC is constantly adjusted so it
is locked to fOSC. The slight variation causes a jitter of fMC which also affects the duration
of individual TCMs.
The timing listed in the AC Characteristics refers to TCPs. Because fCPU is derived from
fMC, the timing must be calculated using the minimum TCP possible under the respective
circumstances.
The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is
constantly adjusting its output frequency so it corresponds to the applied input frequency
(crystal or oscillator) the relative deviation for periods of more than one TCP is lower than
for one single TCP (see formula and Figure 15).
Data Sheet
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Derivatives
Electrical Parameters
This is especially important for bus cycles using waitstates and e.g. for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler (K = PLLODIV+1) to generate the master clock signal fMC. Therefore,
the number of VCO cycles can be represented as K × N, where N is the number of
consecutive fMC cycles (TCM).
For a period of N × TCM the accumulated PLL jitter is defined by the deviation DN:
DN [ns] = ±(1.5 + 6.32 × N / fMC); fMC in [MHz], N = number of consecutive TCMs.
So, for a period of 3 TCMs @ 20 MHz and K = 12: D3 = ±(1.5 + 6.32 × 3 / 20) = 2.448 ns.
This formula is applicable for K × N < 95. For longer periods the K × N = 95 value can be
used. This steady value can be approximated by: DNmax [ns] = ±(1.5 + 600 / (K × fMC)).
Acc. jitter DN
K = 12
K=8
K = 15 K = 10
ns
±8
K=6 K=5
±7
±6
±5
±4
10 MHz
20 MHz
±3
±2
±1
0
40 MHz
0 1
5
10
15
20
25
N
MCD05566
Figure 15
Approximated Accumulated PLL Jitter
Note: The bold lines indicate the minimum accumulated jitter which can be achieved by
selecting the maximum possible output prescaler factor K.
Data Sheet
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Derivatives
Electrical Parameters
Different frequency bands can be selected for the VCO, so the operation of the PLL can
be adjusted to a wide range of input and output frequencies:
Table 16
VCO Bands for PLL Operation1)
PLLCON.PLLVB
VCO Frequency Range
Base Frequency Range
00
100 … 150 MHz
20 … 80 MHz
01
150 … 200 MHz
40 … 130 MHz
10
200 … 250 MHz
60 … 180 MHz
11
Reserved
1) Not subject to production test - verified by design/characterization.
Data Sheet
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Electrical Parameters
4.4.2
On-chip Flash Operation
The XC164GM’s Flash module delivers data within a fixed access time (see Table 17).
Accesses to the Flash module are controlled by the PMI and take 1+WS clock cycles,
where WS is the number of Flash access waitstates selected via bitfield WSFLASH in
register IMBCTRL. The resulting duration of the access phase must cover the access
time tACC of the Flash array. The required Flash waitstates depend on the actual system
frequency.
The Flash access waitstates only affect non-sequential accesses. Due to prefetching
mechanisms, the performance for sequential accesses (depending on the software
structure) is only partially influenced by waitstates.
In typical applications, eliminating one waitstate increases the average performance by
5% … 15%.
Table 17
Flash Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Min.
tACC CC –
Programming time per 128-byte block tPR
CC –
tER CC –
Erase time per sector
Flash module access time
Unit
Typ.
Max.
–
501)
ns
22)
5
ms
2002)
500
ms
1) The actual access time is influenced by the system frequency, see Table 18.
2) Programming and erase time depends on the system frequency. Typical values are valid for 40 MHz.
Example: For an operating frequency of 40 MHz (clock cycle = 25 ns), the Flash
accesses must be executed with 1 waitstate: ((1+1) × 25 ns) ≥ 50 ns.
Table 18 indicates the interrelation of waitstates and system frequency.
Table 18
Flash Access Waitstates
Required Waitstates
Frequency Range
0 WS (WSFLASH = 00B)
fCPU ≤ 20 MHz
fCPU ≤ 40 MHz
1 WS (WSFLASH = 01B)
Note: The maximum achievable system frequency is limited by the properties of the
respective derivative, i.e. 40 MHz (or 20 MHz for XC164GM-xF20F devices).
Data Sheet
62
V1.2, 2007-03
XC164GM
Derivatives
Electrical Parameters
4.4.3
External Clock Drive XTAL1
These parameters define the external clock supply for the XC164GM.
Table 19
External Clock Drive Characteristics (Operating Conditions apply)
Parameter
Symbol
tOSC
t1
t2
t3
t4
Oscillator period
High time2)
Low time
2)
Rise time
2)
Fall time2)
Limit Values
Unit
Min.
Max.
SR
25
2501)
ns
SR
6
–
ns
SR
6
–
ns
SR
–
8
ns
SR
–
8
ns
1) The maximum limit is only relevant for PLL operation to ensure the minimum input frequency for the PLL.
2) The clock input signal must reach the defined levels VILC and VIHC.
t3
t1
t4
V IHC
V ILC
0.5 V DDI
t2
t OSC
MCT05572
Figure 16
External Clock Drive XTAL1
Note: If the on-chip oscillator is used together with a crystal or a ceramic resonator, the
oscillator frequency is limited to a range of 4 MHz to 16 MHz.
It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimum
parameters for the oscillator operation. Please refer to the limits specified by the
crystal supplier.
When driven by an external clock signal it will accept the specified frequency
range. Operation at lower input frequencies is possible but is verified by design
only (not subject to production test).
Data Sheet
63
V1.2, 2007-03
XC164GM
Derivatives
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following information ensures proper
integration of the XC164GM into the target system.
5.1
Packaging
These parameters describe the housing rather than the silicon.
Package Outlines
Figure 17
Data Sheet
PG-LQFP-64-4 (Plastic Green Low profile Quad Flat Package),
valid for the -16F derivatives
64
V1.2, 2007-03
XC164GM
Derivatives
+0.07 2)
0.6 ±0.15
C
7.5
7˚ MAX.
H
0.5
0.2 -0.03
0.15 +0.03
-0.06
1.6 MAX.
1.4 ±0.05
0.1 ±0.05
Package and Reliability
0.08
0.08 M A-B D C 64x
12
0.2 A-B D 4x
10 1)
0.2 A-B D H 4x
D
12
B
10 1)
A
64
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
2) Does not include dambar protrusion of 0.08 max. per side
Figure 18
PG-TQFP-64-8 (Plastic Thin Quad Flat Package),
valid for the -4F/8F derivatives
You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products
Dimensions in mm.
Table 20
Package Parameters
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Notes
PG-LQFP-64-4
Thermal resistance
junction to case
RΘJC
–
8
K/W
–
Thermal resistance
junction to leads
RΘJL
–
23
K/W
–
Thermal resistance
junction to case
RΘJC
–
9
K/W
–
Thermal resistance
junction to leads
RΘJL
–
19
K/W
–
PG-TQFP-64-8
Data Sheet
65
V1.2, 2007-03
XC164GM
Derivatives
Package and Reliability
5.2
Flash Memory Parameters
The data retention time of the XC164GM’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Table 21
Flash Parameters
Parameter
Data retention time
Symbol
tRET
Flash Erase Endurance NER
Data Sheet
Limit Values
Unit
Notes
103 erase/program
cycles
Min.
Max.
15
–
years
20 × 103
–
cycles Data retention time
5 years
66
V1.2, 2007-03
w w w . i n f i n e o n . c o m
B158-H8887-G1-X-7600
Published by Infineon Technologies AG