ADM1063-EP数据手册

FEATURES
FUNCTIONAL BLOCK DIAGRAM
For more information about the ADM1063 register map,
refer to the AN-698 Application Note at www.analog.com.
Rev. A
REFIN REFOUT REFGND SDA SCL A1
D1P D1N D2P D2N
TEMP
SENSOR
VREF
INTERNAL
DIODE
MUX
Complete supervisory and sequencing solution for up to
10 supplies
Extended temperature range: −40°C to +105°C
10 supply fault detectors enable supervision of supplies to
<0.5% accuracy at all voltages at 25°C
<1.0% accuracy across all voltages and temperatures
5 selectable input attenuators allow supervision of supplies to
14.4 V on VH
6 V on VP1 to VP4 (VPx)
5 dual-function inputs, VX1 to VX5 (VXx)
High impedance input to supply fault detector with
thresholds between 0.573 V and 1.375 V
General-purpose logic input
10 programmable driver outputs, PDO1 to PDO10 (PDOx)
Open-collector with external pull-up
Push/pull output, driven to VDDCAP or VPx
Open collector with weak pull-up to VDDCAP or VPx
Internally charge-pumped high drive for use with external
N-FET (PDO1 to PDO6 only)
Sequencing engine (SE) implements state machine control of
PDOx outputs
State changes conditional on input events
Enables complex control of boards
Power-up and power-down sequence control
Fault event handling
Interrupt generation on warnings
Watchdog function can be integrated in SE
Program software control of sequencing through SMBus
Complete voltage margining solution for 6 voltage rails
12-bit ADC for readback of all supervised voltages
1 internal and 2 external temperature sensors
Reference input (REFIN) has 2 input options
Driven directly from 2.048 V (±0.25%) REFOUT pin
More accurate external reference for improved ADC
performance
Device powered by the highest of VPx, VH for improved
redundancy
User EEPROM: 256 bytes
Industry-standard, 2-wire bus interface (SMBus)
Guaranteed PDO low with VH, VPx = 1.2 V
Available in 40-lead, 6 mm × 6 mm LFCSP package
A0
SMBus
INTERFACE
12-BIT
SAR ADC
EEPROM
CLOSED-LOOP
MARGINING SYSTEM
VX1
VX2
VX3
VX4
VX5
PDO1
DUALFUNCTION
INPUTS
CONFIGURABLE
OUTPUT
DRIVERS
(LOGIC INPUTS
OR
SFDs)
(HV CAPABLE OF
DRIVING GATES
OF N-FET)
PDO6
CONFIGURABLE
OUTPUT
DRIVERS
PDO8
(LV CAPABLE
OF DRIVING
LOGIC SIGNALS)
PDO10
PDO2
PDO3
PDO4
PDO5
SEQUENCING
ENGINE
VP1
VP3
PROGRAMMABLE
RESET
GENERATORS
VP4
(SFDs)
VP2
VH
PDO7
PDO9
PDOGND
AGND
VDD
ARBITRATOR
ADM1063-EP
VCCP GND
VDDCAP
09116-001
Data Sheet
Multisupply Supervisor/Sequencer with
ADC and Temperature Monitoring
ADM1063-EP
Figure 1.
APPLICATIONS
Central office systems
Servers/routers
Multivoltage system line cards
DSP/FPGA supply sequencing
In-circuit testing of margined supplies
GENERAL DESCRIPTION
The ADM1063-EP is a configurable supervisory/sequencing
device that offers a single-chip solution for supply monitoring
and sequencing in multiple supply systems. In addition to these
functions, the ADM1063-EP integrates a 12-bit ADC that can
be used to accurately read back up to 12 separate voltages.
The device also provides up to 10 programmable inputs for
monitoring undervoltage faults, overvoltage faults, or out-ofwindow faults on up to 10 supplies. In addition, 10 programmable
outputs can be used as logic enables. Six of these programmable
outputs can provide up to a 12 V output for driving the gate of
an N-FET that can be placed in the path of a supply.
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2010–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADM1063-EP
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Thermal Resistance .......................................................................7
Functional Block Diagram .............................................................. 1
ESD Caution...................................................................................7
Applications ....................................................................................... 1
Pin Configuration and Function Descriptions..............................8
General Description ......................................................................... 1
Typical Performance Characteristics ..............................................9
Revision History ............................................................................... 2
Outline Dimensions ....................................................................... 12
Detailed Block Diagram .................................................................. 3
Ordering Guide .......................................................................... 12
Specifications..................................................................................... 4
Absolute Maximum Ratings ............................................................ 7
REVISION HISTORY
8/13—Rev. 0 to Rev. A
Changes to Serial Bus Timing Parameters; Table 1 ...................... 6
Updated Outline Dimensions ....................................................... 12
5/10—Revision 0: Initial Version
Rev. A | Page 2 of 12
Data Sheet
ADM1063-EP
Temperature measurement is possible with the ADM1063-EP.
The device contains one internal temperature sensor and two
pairs of differential inputs for remote thermal diodes. These are
measured by the 12-bit ADC.
The device is controlled via configuration data that can be
programmed into an EEPROM. The entire configuration can
be programmed using an intuitive GUI-based software package
provided by Analog Devices, Inc.
The logical core of the device is a sequencing engine. This statemachine-based construction provides up to 63 different states.
This design enables very flexible sequencing of the outputs
based on the condition of the inputs.
Full details about this enhanced product are available in the
ADM1063 data sheet, which should be consulted in conjunction
with this data sheet.
DETAILED BLOCK DIAGRAM
REFIN REFOUT
D1P D1N D2P D2N
REFGND SDA SCL A1
A0
ADM1063-EP
TEMP
SENSOR
INTERNAL
DIODE
VREF
SMBus
INTERFACE
OSC
12-BIT
SAR ADC
DEVICE
CONTROLLER
EEPROM
GPI SIGNAL
CONDITIONING
VX1
CONFIGURABLE
OUTPUT DRIVER
(HV)
SFD
PDO1
PDO2
PDO3
VX2
VX3
PDO4
VX4
PDO5
GPI SIGNAL
CONDITIONING
SEQUENCING
ENGINE
VX5
VP1
CONFIGURABLE
OUTPUT DRIVER
(HV)
PDO6
CONFIGURABLE
OUTPUT DRIVER
(LV)
PDO7
SFD
SELECTABLE
ATTENUATOR
SFD
VP2
VP3
PDO8
VP4
PDO9
VH
SELECTABLE
ATTENUATOR
SFD
PDO10
PDOGND
AGND
REG 5.25V
CHARGE PUMP
VDD
ARBITRATOR
GND
VCCP
09116-002
VDDCAP
CONFIGURABLE
OUTPUT DRIVER
(LV)
Figure 2.
Rev. A | Page 3 of 12
ADM1063-EP
Data Sheet
SPECIFICATIONS
VH = 3.0 V to 14.4 V 1, VPx = 3.0 V to 6.0 V1, TA = −40°C to +105°C, unless otherwise noted.
Table 1.
Parameter
POWER SUPPLY ARBITRATION
VH, VPx
VPx
VH
VDDCAP
CVDDCAP
POWER SUPPLY
Supply Current, IVH, IVPx
Additional Currents
All PDO FET Drivers On
Min
Typ
Max
Unit
Test Conditions/Comments
4.75
6.0
14.4
5.4
V
V
V
V
µF
Minimum supply required on one of VH, VPx
Maximum VDDCAP = 5.1 V, typical
VDDCAP = 4.75 V
Regulated LDO output
Minimum recommended decoupling capacitance
4.2
6
mA
VDDCAP = 4.75 V, PDO1 to PDO10 off, ADC off
mA
3.0
2.7
10
1
1
10
mA
mA
VDDCAP = 4.75 V, PDO1 to PDO6 loaded with
1 µA each, PDO7 to PDO10 off
Maximum additional load that can be drawn from
all PDO pull-ups to VDDCAP
Running round-robin loop
1 ms duration only, VDDCAP = 3 V
52
±0.05
kΩ
%
Midrange and high range
Current Available from VDDCAP
ADC Supply Current
EEPROM Erase Current
SUPPLY FAULT DETECTORS
VH Pin
Input Impedance
Input Attenuator Error
Detection Ranges
High Range
Midrange
VPx Pins
Input Impedance
Input Attenuator Error
Detection Ranges
Midrange
Low Range
Ultralow Range
VXx Pins
Input Impedance
Detection Range
Ultralow Range
Absolute Accuracy
Threshold Resolution
Digital Glitch Filter
2
6
2.5
14.4
6
52
±0.05
2.5
1.25
0.573
6
3
1.375
1
mA
V
V
kΩ
%
Low range and midrange
V
V
V
No input attenuation error
MΩ
0.573
1.375
±1
8
0
100
V
%
Bits
µs
µs
Rev. A | Page 4 of 12
No input attenuation error
VREF error + DAC nonlinearity + comparator offset
error + input attenuation error
Minimum programmable filter length
Maximum programmable filter length
Data Sheet
Parameter
ANALOG-TO-DIGITAL CONVERTER
Signal Range
ADM1063-EP
Min
0
Input Reference Voltage on REFIN Pin, VREFIN
Resolution
INL
Gain Error
Conversion Time
Minimum Load Capacitance
PSRR
PROGRAMMABLE DRIVER OUTPUTS
High Voltage (Charge Pump) Mode
(PDO1 to PDO6)
Output Impedance
VOH
IOUTAVG
Standard (Digital Output) Mode
(PDO1 to PDO10)
VOH
Max
Unit
Test Conditions/Comments
VREFIN
V
The ADC can convert signals presented to the VH,
VPx, and VXx pins; VPx and VH input signals are
attenuated depending on the selected range;
a signal at the pin corresponding to the selected
range is from 0.573 V to 1.375 V at the ADC input
2.048
12
0.25
V
Bits
LSB
%
ms
ms
LSB
LSB rms
±3
−1.7
±3
−3
200
12
0
128
0.125
°C
°C/V
°C
°C
µA
µA
°C
°C
°C
±2.5
±0.05
0.44
84
Offset Error
Input Noise
TEMPERATURE SENSOR 2
Local Sensor Accuracy
Local Sensor Supply Voltage Coefficient
Remote Sensor Accuracy
Remote Sensor Supply Voltage Coefficient
Remote Sensor Current Source
Temperature for Code 0x800
Temperature for Code 0xC00
Temperature Resolution per Code
REFERENCE OUTPUT
Reference Output Voltage
Load Regulation
Typ
±2
2.043
2.048
−0.25
0.25
2.053
1
60
11
10.5
500
12.5
12
20
14
13.5
2.4
VOL
IOL 3
ISINK3
RPULL-UP
ISOURCE (VPx)3
Three-State Output Leakage Current
Oscillator Frequency
VPU − 0.3
0
19
20
90
100
VDDCAP = 4.75 V
VDDCAP = 4.75 V
High level
Low level
VDDCAP = 4.75 V
VDDCAP = 4.75 V
V
mV
mV
µF
dB
No load
Sourcing current, IDACxMAX = −100 µA
Sinking current, IDACxMAX = 100 µA
Capacitor required for decoupling, stability
DC
kΩ
V
V
µA
IOH = 0 µA
IOH = 1 µA
2 V < VOH < 7 V
0.50
20
60
29
2
V
V
V
V
mA
mA
kΩ
mA
10
110
µA
kHz
4.5
Endpoint corrected, VREFIN = 2.048 V
VREFIN = 2.048 V
One conversion on one channel
All 12 channels selected, 16× averaging enabled
VREFIN = 2.048 V
Direct input (no attenuator)
Rev. A | Page 5 of 12
VPU (pull-up to VDDCAP or VPx) = 2.7 V, IOH = 0.5 mA
VPU to VPx = 6.0 V, IOH = 0 mA
VPU ≤ 2.7 V, IOH = 0.5 mA
IOL = 20 mA
Maximum sink current per PDOx pin
Maximum total sink for all PDOx pins
Internal pull-up
Current load on any VPx pull-ups, that is, total source
current available through any number of PDOx
pull-up switches configured onto any one VPx pin
VPDO = 14.4 V
All on-chip time delays derived from this clock
ADM1063-EP
Parameter
DIGITAL INPUTS (VXx, A0, A1)
Input High Voltage, VIH
Input Low Voltage, VIL
Input High Current, IIH
Input Low Current, IIL
Input Capacitance
Programmable Pull-Down Current,
IPULL-DOWN
SERIAL BUS DIGITAL INPUTS (SDA, SCL)
Input High Voltage, VIH
Input Low Voltage, VIL
Output Low Voltage, VOL3
SERIAL BUS TIMING 4
Clock Frequency, fSCLK
Bus Free Time, tBUF
Start Setup Time, tSU;STA
Stop Setup Time, tSU;STO
Start Hold Time, tHD;STA
SCL Low Time, tLOW
SCL High Time, tHIGH
SCL, SDA Rise Time, tR
SCL, SDA Fall Time, tF
Data Setup Time, tSU;DAT
Data Hold Time, tHD;DAT
Input Low Current, IIL
SEQUENCING ENGINE TIMING
State Change Time
Data Sheet
Min
Typ
Max
2.0
0.8
−1
1
5
20
2.0
0.8
0.4
400
1.3
0.6
0.6
0.6
1.3
0.6
300
300
100
5
1
10
Unit
Test Conditions/Comments
V
V
µA
µA
pF
µA
Maximum VIN = 5.5 V
Maximum VIN = 5.5 V
VIN = 5.5 V
VIN = 0 V
VDDCAP = 4.75 V, TA = 25°C if known logic state
is required
V
V
V
IOUT = −3.0 mA
kHz
µs
µs
µs
µs
µs
µs
ns
ns
ns
ns
µA
VIN = 0 V
µs
At least one of the VH, VPx pins must be ≥3.0 V to maintain the device supply on VDDCAP.
All temperature sensor measurements are taken with round-robin loop enabled and at least one other voltage input being measured.
Specification is not production tested but is supported by characterization data at initial product release.
4
Timing specifications are guaranteed by design and supported by characterization data.
1
2
3
Rev. A | Page 6 of 12
Data Sheet
ADM1063-EP
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
Voltage on VH Pin
Voltage on VPx Pins
Voltage on VXx Pins
Voltage on A0, A1 Pins
Voltage on REFIN, REFOUT Pins
Voltage on VDDCAP, VCCP Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Voltage on DxN, DxP Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature
(Soldering Vapor Phase, 60 sec)
Rating
16 V
7V
−0.3 V to +6.5 V
−0.3 V to +7 V
5V
6.5 V
16 V
7V
−0.3 V to +0.3 V
−0.3 V to +5 V
±5 mA
±20 mA
150°C
−65°C to +150°C
215°C
ESD Rating, All Pins
2000 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
40-Lead LFCSP
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 7 of 12
θJA
26.5
Unit
°C/W
ADM1063-EP
Data Sheet
34
33
32
31
VX1 1
PIN 1
INDICATOR
VX2 2
30
PDO1
29
PDO2
VX3 3
28
PDO3
VX4 4
27
PDO4
VX5 5
ADM1063-EP
VP1 6
TOP VIEW
(Not to Scale)
21
PDO10
12
13
REFIN
11
14
15
16
17
18
19
20
NC
PDO9
VH 10
NC
22
SCL
PDO8
VP4 9
SDA
PDO7
23
NC
24
VP3 8
NC
VP2 7
REFOUT
PDO6
AGND
PDO5
25
REFGND
26
NC = NO CONNECT
09116-003
VCCP
PDOGND
35
A1
36
A0
37
D2P
38
D2N
39
D1P
40
D1N
GND
VDDCAP
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1 to 5
6 to 9
10
11
12
13
14
15, 16, 19, 20
17
18
21 to 30
31
32
33
34
35
36
37
38
39
40
EPAD
Mnemonic
VX1 to VX5 (VXx)
VP1 to VP4 (VPx)
VH
AGND (In a typical application, all ground pins are connected together.)
REFGND (In a typical application, all ground pins are connected together.)
REFIN
REFOUT
NC
SCL
SDA
PDO10 to PDO1
PDOGND (In a typical application, all ground pins are connected together.)
VCCP
A0
A1
D2N
D2P
D1N
D1P
VDDCAP
GND (In a typical application, all ground pins are connected together.)
Exposed pad. This pad is a no connect (NC). If possible, this pad should be soldered to the board for improved mechanical stability.
Rev. A | Page 8 of 12
Data Sheet
ADM1063-EP
TYPICAL PERFORMANCE CHARACTERISTICS
6
180
160
5
140
120
IVP1 (µA)
VVDDCAP (V)
4
3
2
100
80
60
40
1
0
1
2
3
4
5
6
VVP1 (V)
0
09116-050
0
0
1
2
3
4
5
6
VVP1 (V)
Figure 4. VVDDCAP vs. VVP1
09116-053
20
Figure 7. IVP1 vs. VVP1 (VP1 Not as Supply)
6
5.0
4.5
5
4.0
3.5
3.0
IVH (mA)
VVDDCAP (V)
4
3
2
2.5
2.0
1.5
1.0
1
0
2
4
6
8
10
12
14
16
VVH (V)
0
09116-051
0
0
2
4
6
8
10
12
14
16
VVH (V)
Figure 5. VVDDCAP vs. VVH
09116-054
0.5
Figure 8. IVH vs. VVH (VH as Supply)
350
5.0
4.5
300
4.0
250
IVH (µA)
3.0
2.5
2.0
1.5
200
150
100
1.0
50
0
0
1
2
3
4
VVP1 (V)
5
6
0
0
1
2
3
4
VVH (V)
Figure 9. IVH vs. VVH (VH Not as Supply)
Figure 6. IVP1 vs. VVP1 (VP1 as Supply)
Rev. A | Page 9 of 12
5
6
09116-055
0.5
09116-052
IVP1 (mA)
3.5
ADM1063-EP
Data Sheet
14
1.0
0.8
0.6
10
0.4
0.2
DNL (LSB)
CHARGE-PUMPED V PDO1 (V)
12
8
6
0
–0.2
–0.4
4
–0.6
2
2.5
5.0
7.5
10.0
12.5
15.0
ILOAD (µA)
–1.0
0
1000
4.5
0.8
4.0
0.6
3.5
0.4
INL (LSB)
3.0
VP1 = 5V
2.5
VP1 = 3V
2.0
0.2
0
–0.2
1.5
–0.4
1.0
–0.6
0.5
–0.8
0
3
4
5
6
ILOAD (mA)
–1.0
09116-057
VPDO1 (V)
1.0
2
4000
Figure 13. DNL for ADC
5.0
1
3000
CODE
Figure 10. Charge-Pumped VPDO1 (FET Drive Mode) vs. ILOAD
0
2000
1000
0
2000
3000
4000
CODE
09116-063
0
09116-056
0
09116-066
–0.8
Figure 14. INL for ADC
Figure 11. VPDO1 (Strong Pull-Up to VPx) vs. ILOAD
12000
4.5
4.0
9894
10000
3.5
VP1 = 5V
HITS PER CODE
2.5
VP1 = 3V
2.0
1.5
8000
6000
4000
1.0
2000
0.5
0
10
20
30
40
50
ILOAD (µA)
60
Figure 12. VPDO1 (Weak Pull-Up to VPx) vs. ILOAD
81
0
2047
2048
2049
CODE
Figure 15. ADC Noise, Midcode Input, 10,000 Reads
Rev. A | Page 10 of 12
09116-064
25
0
09116-058
VPDO1 (V)
3.0
Data Sheet
ADM1063-EP
2.058
VP1 = 3.0V
2.048
VP1 = 4.75V
2.043
2.038
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
100
09116-061
REFOUT (V)
2.053
Figure 16. REFOUT vs. Temperature
Rev. A | Page 11 of 12
ADM1063-EP
Data Sheet
OUTLINE DIMENSIONS
0.30
0.25
0.18
31
40
30
0.50
BSC
1
0.80
0.75
0.70
0.45
0.40
0.35
10
11
20
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
4.25
4.10 SQ
3.95
EXPOSED
PAD
21
TOP VIEW
PIN 1
INDICATOR
BOTTOM VIEW
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD.
05-06-2011-A
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
Figure 17. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADM1063BCPZ-EP-RL7
1
Temperature Range
−40°C to +105°C
Package Description
40-Lead LFCSP_WQ
Z = RoHS Compliant Part.
©2010–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09116-0-8/13(A)
Rev. A | Page 12 of 12
Package Option
CP-40-9