Compliant to IEC 61249-2-21:2003 JEDEC J-STD-609A Product Marking and/or Pkg. Labeling e1 Package Homogeneous Materials: 8.1 Electronics (e.g. pc boards, displays) Termination Base Alloy: Copper Alloy (Cu) Semiconductor Device Type: 008 CERDIP .300in SAC (F9X) Basic Substance CAS Number Aluninum Oxide Manganese Oxide Silicon oxide Chromium oxide Titanium oxide Iron oxide Magnesium Oxide Cobalt oxide Lead Oxide Tin oxide Boron oxide Silicon oxide Aluminum oxide Titanium oxide Magnesium oxide Zinc oxide Aluminum Copper Magnesium Manganese Zinc Titanium Iron Nickel Silver Cobalt Manganese Zinc (Metal) Silicon Phosphorous Gold Silicon Aluminum Silicon Tin Silver Copper 1344-28-1 1313-13-9 14808-60-7 1308-38-9 13463-67-7 1309-37-1 1309-48-4 1308-06-1 1317-36-8 18282-10-5 1303-88-2 14808-60-7 1344-28-1 13463-67-7 1309-48-4 1314-13-2 7429-90-5 7440-50-8 7439-95-4 7439-96-5 7440-66-6 7440-32-6 7439-89-6 7440-02-0 7440-22-4 7440-48-4 7439-96-5 7440-44-0 7440-21-3 7723-14-0 7440-57-5 7440-21-3 7429-90-5 7440-21-3 7440-31-5 7440-22-4 7440-50-8 "Contained In" Sub-Component Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Base: Ceramics (Black) Seal Glass Seal Glass Seal Glass Seal Glass Seal Glass Seal Glass Seal Glass Seal Glass Lid Lid Lid Lid Lid Lid Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Die Attach Chip (Die) Wire Bond Wire Bond Plating on external leads (pins) Plating on external leads (pins) Plating on external leads (pins) - % Total Weight 41.057 1.631 1.171 0.706 0.706 0.706 0.242 0.242 4.893 1.505 0.752 0.752 0.377 0.377 0.377 0.076 3.492 0.002 0.002 0.002 0.002 0.001 16.431 12.907 0.585 0.307 0.246 0.154 0.092 0.008 1.500 3.500 0.833 0.017 4.198 0.131 0.022 100.000 mg/part 419.76 16.67 11.97 7.22 7.22 7.22 2.47 2.47 50.03 15.39 7.69 7.69 3.86 3.86 3.86 0.77 35.70 0.02 0.02 0.02 0.02 0.01 167.99 131.96 5.99 3.14 2.51 1.57 0.94 0.08 15.34 35.78 8.52 0.17 42.92 1.33 0.22 1022.40 ppm 410567.02 16307.46 11707.92 7061.92 7061.92 7061.92 2415.92 2415.92 48929.81 15049.72 7524.86 7524.86 3771.54 3771.54 3771.54 756.13 34919.50 17.50 17.50 17.50 17.50 10.50 164313.31 129066.00 5854.07 3073.00 2458.40 1536.50 921.90 76.83 15000.00 35000.00 8330.00 170.00 41977.50 1305.00 217.50 1,000,000 1.02240 g Total Mass 475.01 (mg) Total Aluninum Oxide Manganese Oxide Silicon oxide Chromium oxide Titanium oxide Iron oxide Magnesium Oxide Cobalt oxide Base: Ceramics (Black) 1344-28-1 1313-13-9 14808-60-7 1308-38-9 13463-67-7 1309-37-1 1309-48-4 1308-06-1 Total Seal Glass 1317-36-8 18282-10-5 1303-88-2 14808-60-7 1344-28-1 13463-67-7 1309-48-4 1314-13-2 Total Lid 7429-90-5 7440-50-8 7439-95-4 7439-96-5 7440-66-6 7440-32-6 Total Lead Frame 7439-89-6 7440-02-0 7440-22-4 7440-48-4 7439-96-5 7440-44-0 7440-21-3 7723-14-0 Total 35.78 (mg) Total Aluminum Copper Magnesium Manganese Zinc Titanium 314.18 (mg) Total Iron Nickel Silver Cobalt Manganese Zinc (Metal) Silicon Phosphorous 15.34 (mg) Total Die Attach % of Total Weight Gold 7440-57-5 100.00 % ot Total Weight 53.71 16.52 8.26 8.26 4.14 4.14 4.14 0.83 35.78 Total (mg) Chip (Die) Silicon 7440-21-3 Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products. 100.00 100.00 30.73 100.00 1.50 100.00 % of Total Weight 3.50 100.00 100.00 (mg) Total Wire Bond % of Total Weight Aluminum Silicon 7429-90-5 7440-21-3 98.00 2.00 (mg) Total Plating on external leads (pins) - % of Total Weight Tin Silver Copper 7440-31-5 7440-22-4 7440-50-8 96.50 3.00 0.50 Total 44.47 3.50 % of Total Weight 53.47 42.00 1.91 1.00 0.80 0.50 0.30 0.03 Total 8.69 9.11 % ot Total Weight 99.77 0.05 0.05 0.05 0.05 0.03 Total Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices. Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at http://echa.europa.eu/web/guest/candidate-list-table 100.00 (mg) Total Lead Oxide Tin oxide Boron oxide Silicon oxide Aluminum oxide Titanium oxide Magnesium oxide Zinc oxide The protective “tubes” in which the specific semiconductor is shipped and “window envelope” used to hold the packing slip on the outter box are made from polyvinyl chloride (PVC) plastic. 46.46 88.37 3.51 2.52 1.52 1.52 1.52 0.52 0.52 93.14 This assembled package and its homogenous materials is not globally RoHS compliant. This assembled package is EU-RoHS compliant using exemption 7c-I estimated expiration: 21 July 2016 Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. This Product can only be used in exempted end user applications (Refer to EU Directive 2011/65/EU (RoHS Directive) Annex III and Annex IV of Directive). Microchip Technology Incorporated believes the information in this form concerning RoHS restrictive substances in Microchip Technology Incorporated’s parts in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated can not guarantee the completeness and accuracy of data in this form due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by subcontractors and raw material suppliers. This information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished parts. % ot Total Weight Total 0.85 100.00 . 4.35 100.00 1,022.400 Au 100.000 15:02 : 04/18/16