P2X 032 PDIP600in MatteTin

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type: PHE / P
Basic Substance
CAS Number
Silica, vitreous
Epoxy Resin
Phenolic Resin
Epoxy, Cresol Novolac
Carbon Black
Copper
Iron
Silver
Zinc
Phosphorous
Silver (Ag)
Epoxy Resin
Copper ( Cu )
Doped Silicon
Doped Gold
Tin
60676-86-0
Trade Secret
Trade Secret
29690-82-2
1333-86-4
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7723-14-0
7440-22-4
Trade Secret
7440-50-8
7440-21-3
7440-57-5
7440-31-5
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e3
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
(P2X) 032 PDIP (Wide Outline -.600in) Matte Tin
"Contained In"
Sub-Component
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Die Attach
Die Attach
Die Attach
Chip (Die)
Wire Bond
Plating on external leads (pins) - Matte Tin / annealed at 150°C for 1 hour
TOTALS:
% Total
Weight
mg/part
ppm
72.820
5.247
5.247
2.099
0.257
12.783
0.314
0.255
0.017
0.011
0.128
0.027
0.005
0.220
0.030
0.540
100.000
3806.712
274.307
274.307
109.723
13.435
668.240
16.437
13.325
0.874
0.577
6.691
1.422
0.251
11.501
1.568
28.229
5,227.600
728,195
52,473
52,473
20,989
2,570
127,829
3,144
2,549
167
110
1,280
272
48
2,200
300
5,400
1,000,000
4478.48
(mg) Total
Mold Compound
Silica, vitreous
Epoxy Resin
Phenolic Resin
Epoxy, Cresol Novolac
Carbon Black
60676-86-0
Trade Secret
Trade Secret
29690-82-2
1333-86-4
(mg) Total
Copper
Iron
Silver
Zinc
Phosphorous
Lead Frame
7440-50-8
8.36
(mg) Total
Silver (Ag)
Epoxy Resin
Copper ( Cu )
Die Attach
7440-22-4
Trade Secret
7440-50-8
11.50
(mg) Total
7439-89-6
7440-22-4
7440-66-6
7723-14-0
Total
Total
5.2276 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015) and
2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
Chip (Die)
Doped Silicon
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
1.57
(mg) Total
Wire Bond
Doped Gold
28.23
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered
by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance
for semiconductor products.
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
Tin
0.22
0.03
100.00
Total
100.00
Plating on external
leads (pins) - Matte Tin
/ annealed at 150°C for
1 hour
% of Total Weight
7440-31-5
0.54
100.00
Total
5,227.600
Au
(mg) Total
0.16
100.00
% of Total Weight
7440-57-5
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original
packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of
data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier information is often protected from
disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight
of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within
silicon devices (silicon IC) in the finished parts.
13.38
100.00
Total
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain
“reels” may be made from PVC plastic.
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided
by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order
acknowledgement, and invoices.
100.00
% of Total Weight
95.54
2.35
1.91
0.13
0.08
100.00
% of Total Weight
80.00
17.00
3.00
100.00
% of Total Weight
7440-21-3
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology Incorporated's
knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold
of regulatory concern for any regulatory scheme world-wide.
85.67
85.00
6.13
6.13
2.45
0.30
Total
699.45
% ot Total Weight
100.00
100.000
2:12 PM : 8/17/2015