INFINEON SMBT3904

SMBT3904...MMBT3904
NPN Silicon Switching Transistors
• High DC current gain: 0.1 mA to 100 mA
• Low collector-emitter saturation voltage
• For SMBT3904S / SMBT3904U:
Two (galvanic) internal isolated transistors
with good matching in one package
• Complementary types: SMBT3906... MMBT3906
• SMBT3904S / U: For orientation in reel
see package information below
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
SMBT3904S/U
C1
B2
E2
6
5
4
TR2
TR1
1
2
3
E1
B1
C2
EHA07178
Type
Marking
SMBT3904/MMBT3904
s1A
1=B
SMBT3904S
s1A
1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SOT363
SMBT3904U
s1A
1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SC74
1Pb-containing
Pin Configuration
2=E
3=C
-
-
Package
-
SOT23
package may be available upon special request
1
2007-09-20
SMBT3904...MMBT3904
Maximum Ratings
Parameter
Symbol
Value
Collector-emitter voltage
VCEO
40
Collector-base voltage
VCBO
60
Emitter-base voltage
VEBO
6
Collector current
IC
Total power dissipation-
Ptot
200
330
TS ≤ tbd°C
250
TS ≤ 115°C
250
TS ≤ 105°C
330
Tj
Storage temperature
Tstg
Thermal Resistance
Parameter
Junction - soldering point1)
Symbol
RthJS
150
mA
°C
-65 ... 150
Value
SMBT3904/MMBT3904
≤ 245
SMBT3904S
≤ 140
SMBT3904U
≤ 135
1For
V
mW
TS ≤ 69°C
Junction temperature
Unit
Unit
K/W
calculation of RthJA please refer to Application Note Thermal Resistance
2
2007-09-20
SMBT3904...MMBT3904
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO 40
V
IC = 1 mA, IB = 0
Collector-base breakdown voltage
V(BR)CBO
60
-
-
V(BR)EBO
6
-
-
ICBO
-
-
50
IC = 10 µA, IE = 0
Emitter-base breakdown voltage
IE = 10 µA, IC = 0
Collector-base cutoff current
nA
VCB = 30 V, IE = 0
DC current gain1)
-
hFE
IC = 100 µA, VCE = 1 V
40
-
-
IC = 1 mA, VCE = 1 V
70
-
-
IC = 10 mA, VCE = 1 V
100
-
300
IC = 50 mA, VCE = 1 V
60
-
-
IC = 100 mA, VCE = 1 V
30
-
-
Collector-emitter saturation voltage1)
V
VCEsat
IC = 10 mA, IB = 1 mA
-
-
0.2
IC = 50 mA, IB = 5 mA
-
-
0.3
IC = 10 mA, IB = 1 mA
0.65
-
0.85
IC = 50 mA, IB = 5 mA
-
-
0.95
Base emitter saturation voltage1)
1Pulse
VBEsat
test: t < 300µs; D < 2%
3
2007-09-20
SMBT3904...MMBT3904
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
300
-
-
Ccb
-
-
3.5
Ceb
-
-
8
td
-
-
35
tr
-
-
35
tstg
-
-
200
tf
-
-
50
F
-
-
5
AC Characteristics
Transition frequency
fT
MHz
IC = 10 mA, VCE = 20 V, f = 100 MHz
Collector-base capacitance
pF
VCB = 5 V, f = 1 MHz
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz
Delay time
ns
VCC = 3 V, IC = 10 mA, IB1 = 1 mA,
VBE(off) = 0.5 V
Rise time
VCC = 3 V, IC = 10 mA, IB1 = 1 mA,
VBE(off) = 0.5 V
Storage time
VCC = 3 V, IC = 10 mA, IB1 = IB2 = 1 mA
Fall time
VCC = 3 V, IC = 10 mA, IB1 = IB2 = 1 mA
Noise figure
dB
IC = 100 µA, VCE = 5 V, f = 1 kHz,
∆ f = 200 Hz, RS = 1 kΩ
4
2007-09-20
SMBT3904...MMBT3904
Test circuits
Delay and rise time
+3.0 V
300 ns
275 Ω
D = 2%
+10.9 V
0
10 k Ω
C
-0.5 V
<4.0 pF
<1.0 ns
EHN00061
Storage and fall time
+3.0 V
t1
10 < t 1 < 500 µs
D = 2%
275 Ω
+10.9 V
0
-9.1 V
10 kΩ
C
1N916
<1.0 ns
<4.0 pF
EHN00062
5
2007-09-20
SMBT3904...MMBT3904
DC current gain hFE = ƒ(IC)
Saturation voltage IC = ƒ(VBEsat ; VCEsat)
VCE = 10 V, normalized
hFE = 10
EHP00765
10 1
h FE
ΙC
5
EHP00756
2
mA
10 2
5
125 C
V BE
V CE
25 C
10 0
10 1
-55 C
5
5
10 -1
10
-1
5 10 0
5 10 1
10 0
mA 10 2 2
0
0.2
0.4
0.6
ΙC
0.8
1.0 V 1.2
V BE sat , V CE sat
Collector-base capacitance Ccb = ƒ(VCB)
Total power dissipation P tot = ƒ(TS)
Emitter-base capacitance Ceb = ƒ(VEB)
SMBT3904/MMBT3904
360
9
mW
pF
270
6
Ptot
CCB(CEB )
300
7
240
210
5
180
CEB
4
150
120
3
90
2
60
CCB
1
0
0
30
4
8
12
16
A
0
0
22
VCB(VEB
6
15
30
45
60
75
90 105 120
°C 150
TS
2007-09-20
SMBT3904...MMBT3904
Total power dissipation P tot = ƒ(TS)
Total power dissipation P tot = ƒ(TS)
SMBT3904S
SMBT3904U
300
360
mW
250
300
225
270
200
240
Ptot
Ptot
mW
175
210
150
180
125
150
100
120
75
90
50
60
25
30
0
0
15
30
45
60
90 105 120 °C
75
0
0
150
15
30
45
60
90 105 120 °C
75
TS
150
TS
Permissible Pulse Load
Permissible Puls Load RthJS = ƒ (t p)
Ptotmax/PtotDC = ƒ(tp )
SMBT3904S
SMBT3904/MMBT3904
EHP00935
10 3
Ptot max
Ptot DC
10 3
K/W
tp
tp
D=
T
T
RthJS
10 2
10 2
D=
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
5
10 1
10 1
10 0
5
10 0 -6
10
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10
-5
10
-4
10
-3
10
-2
10
tp
-1
s 10
10 -1 -6
10
0
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
7
2007-09-20
SMBT3904...MMBT3904
Permissible Pulse Load
Permissible Puls Load RthJS = ƒ (t p)
Ptotmax/PtotDC = ƒ(tp )
SMBT3904U
SMBT3904S
10 3
-
K/W
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 2
RthJS
Ptotmax/PtotDC
10 3
10 1
10 0 -6
10
10 2
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 1
10
-5
10
-4
10
-3
10
-2
s
10
10 0 -6
10
0
10
-5
10
-4
10
-3
10
-2
s
tp
10
0
tp
Delay time td = ƒ(IC)
Rise time tr = ƒ(IC)
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp )
SMBT3904U
10 2
EHP00761
10 3
Ptotmax /PtotDC
ns
t r ,t d
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
tr
td
h FE = 10
10 2
VCC = 3 V
40 V
15 V
10 1
V BE = 2 V
0V
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
10 0
0
10
0
tp
5 10 1
5 10 2
mA 10 3
ΙC
8
2007-09-20
SMBT3904...MMBT3904
Storage time tstg = ƒ(IC)
Fall time tf = ƒ(IC)
EHP00762
10 3
ns
ns
ts
25 C
125 C
10
EHP00763
10 3
tf
25 C
125 C
h FE = 20
10
VCC = 40 V
2
10
2
h FE = 20
10
h FE = 20
10 1
10 1
10 0
0
10
5 10 1
5 10 2
10 0
0
10
mA 10 3
ΙC
h FE = 10
5 10 1
5 10 2
mA 10 3
ΙC
Rise time tr = ƒ(I C)
EHP00764
10 3
ns
tr
25 C
10
2
VCC = 40 V
h FE = 10
125 C
10 1
10 0
0
10
5 10 1
5 10 2
mA 10 3
ΙC
9
2007-09-20
Package SC74
SMBT3904...MMBT3904
Package Outline
B
1.1 MAX.
1
2
3
0.35 +0.1
-0.05
Pin 1
marking
0.2
B 6x
M
A
0.1 MAX.
0.95
0.2
1.9
1.6 ±0.1
4
10˚ MAX.
5
2.5 ±0.1
6
0.25 ±0.1
0.15 +0.1
-0.06
(0.35)
10˚ MAX.
2.9 ±0.2
(2.25)
M
A
Foot Print
2.9
1.9
0.5
0.95
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Manufacturer
2005, June
Date code (Year/Month)
Pin 1 marking
Laser marking
BCW66H
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
0.2
2.7
8
4
Pin 1
marking
3.15
1.15
10
2007-09-20
Package SOT23
SMBT3904...MMBT3904
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
11
2007-09-20
Package SOT363
SMBT3904...MMBT3904
Package Outline
2 ±0.2
0.9 ±0.1
+0.1
6x
0.2 -0.05
0.1
0.1 MAX.
M
0.1
Pin 1
marking
1
2
3
A
1.25 ±0.1
4
0.1 MIN.
5
2.1 ±0.1
6
0.15 +0.1
-0.05
0.65 0.65
0.2
M
A
Foot Print
1.6
0.9 0.7
0.3
0.65
0.65
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Manufacturer
2005, June
Date code (Year/Month)
Pin 1 marking
Laser marking
BCR108S
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
0.2
2.3
8
4
Pin 1
marking
1.1
2.15
12
2007-09-20
SMBT3904...MMBT3904
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
13
2007-09-20