Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) 144AA / N‐LQ144 GPC AEI Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin B Diluent B Hardener Epoxy Resin A Diluent A Organic Peroxide Dicyandiamide 7440‐22‐4 Proprietary Proprietary Proprietary 9003‐36‐5 Proprietary Proprietary 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Fused Silica Fused Phenol Resin Epoxy Resin A Epoxy Resin B Silica, Crystalline Carbon Black 60676‐86‐0 76361‐86‐9 Proprietary Proprietary Proprietary 14808‐60‐7 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 257.837 8.041 1.608 0.536 268.022 16.943 16.943 0.864 0.068 0.068 0.057 0.045 0.045 0.006 0.003 1.157 1.587 1.587 1.728 1.728 808.221 114.102 58.107 34.864 34.864 3.169 3.169 1056.498 14.058 14.058 1359.993 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 74.7 747000 5.9 59000 5.9 59000 4.9 49000 3.9 39000 3.9 39000 0.5 5000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 76.5 765000 10.8 108000 5.5 55000 3.3 33000 3.3 33000 0.3 3000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 18.96 189587 0.59 5912 0.12 1182 0.04 394 19.71 197076 1.25 12458 1.25 12458 0.06 635 0.01 50 0.01 50 0.00 42 0.00 33 0.00 33 0.00 4 0.00 3 0.09 851 0.12 1167 0.12 1167 0.13 1270 0.13 1270 59.43 594283 8.39 83899 4.27 42726 2.56 25636 2.56 25636 0.23 2331 0.23 2331 77.68 776841 1.03 10337 1.03 10337 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) 144AA / R‐LQ144 GPC AEI Matte Tin (Sn) RoHS Compliant Yes Yes e3 Green Compliant ASE Shanghai REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) 2‐Propenoic Acid, Dodecyl Ester Dicyclopentyldimethylene Diacrylate Diglycidylphenyl Glycidyl Ether Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide Isobornyl Methacrylate 7440‐22‐4 2156‐97‐0 42594‐17‐2 13561‐08‐5 80‐43‐3 7534‐94‐3 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Epoxy Resin Phenol Resin Others Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 257.837 8.041 1.608 0.536 268.022 16.943 16.943 1.033 0.051 0.047 0.047 0.010 0.010 1.197 1.587 1.587 1.728 1.728 942.396 55.994 45.429 10.565 2.113 1056.498 14.058 14.058 1360.033 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 86.3 863000 4.3 43000 3.9 39000 3.9 39000 0.8 8000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 89.2 892000 5.3 53000 4.3 43000 1.0 10000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 18.96 189582 0.59 5912 0.12 1182 0.04 394 19.71 197070 1.25 12458 1.25 12458 0.08 759 0.00 38 0.00 34 0.00 34 0.00 7 0.00 7 0.09 880 0.12 1167 0.12 1167 0.13 1270 0.13 1270 69.29 692922 4.12 41171 3.34 33403 0.78 7768 0.16 1554 77.68 776818 1.03 10336 1.03 10336 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) 144AA / N‐LQ144 / R‐LQ144 GPC AEI Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Amkor Korea / Amkor Philippines REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol F Diglycidyl Ether 1,4‐Bis(2,3‐Epoxypropoxy)Butane 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Dihydro‐3‐(Tetrapropenyl)Furan‐2,5‐Dione Oxirane, 2‐Dodecyl‐ Methylhexahydrophthalic Anhydride 7440‐22‐4 39817‐09‐9 2425‐79‐8 Proprietary 26544‐38‐7 3234‐28‐4 19438‐60‐9 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) A Epoxy Resin Silica (Amorphous) B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 7631‐86‐9 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 264.013 6.505 0.271 0.271 271.061 16.943 16.943 0.861 0.070 0.059 0.059 0.054 0.054 0.032 1.190 1.587 1.587 1.728 1.728 819.843 92.972 92.972 42.260 8.452 1056.498 14.058 14.058 1363.065 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.4 724000 5.9 59000 5.0 50000 5.0 50000 4.5 45000 4.5 45000 2.7 27000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 77.6 776000 8.8 88000 8.8 88000 4.0 40000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 19.37 193691 0.48 4773 0.02 199 0.02 199 19.89 198861 1.24 12430 1.24 12430 0.06 632 0.01 52 0.00 44 0.00 44 0.00 39 0.00 39 0.00 24 0.09 873 0.12 1165 0.12 1165 0.13 1267 0.13 1267 60.15 601470 6.82 68208 6.82 68208 3.10 31004 0.62 6201 77.51 775090 1.03 10313 1.03 10313 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) GPC AEI 144AA / N‐LQ144 Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin B Diluent B Hardener Epoxy Resin A Diluent A Organic Peroxide Dicyandiamide 7440‐22‐4 Proprietary Proprietary Proprietary 9003‐36‐5 Proprietary Proprietary 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Silica Fused Phenol Resin Epoxy Resin A Epoxy Resin B Silica, Crystalline Carbon Black 60676‐86‐0 76361‐86‐9 Proprietary Proprietary Proprietary 14808‐60‐7 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 257.837 8.041 1.608 0.536 268.022 16.943 16.943 0.864 0.068 0.068 0.057 0.045 0.045 0.006 0.003 1.157 1.587 1.587 0.786 0.019 0.805 808.221 114.102 58.107 34.864 34.864 3.169 3.169 1056.498 14.058 14.058 1359.071 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 74.7 747000 5.9 59000 5.9 59000 4.9 49000 3.9 39000 3.9 39000 0.5 5000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 76.5 765000 10.8 108000 5.5 55000 3.3 33000 3.3 33000 0.3 3000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 18.97 189716 0.59 5916 0.12 1183 0.04 394 19.72 197210 1.25 12467 1.25 12467 0.06 636 0.01 50 0.01 50 0.00 42 0.00 33 0.00 33 0.00 4 0.00 3 0.09 851 0.12 1168 0.12 1168 0.06 578 0.00 14 0.06 592 59.47 594687 8.40 83956 4.28 42755 2.57 25653 2.57 25653 0.23 2332 0.23 2332 77.74 777368 1.03 10344 1.03 10344 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) 144AA / R‐LQ144 GPC AEI Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Shanghai REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) 2‐Propenoic Acid, Dodecyl Ester Dicyclopentyldimethylene Diacrylate Diglycidylphenyl Glycidyl Ether Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide Isobornyl Methacrylate 7440‐22‐4 2156‐97‐0 42594‐17‐2 13561‐08‐5 80‐43‐3 7534‐94‐3 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Epoxy Resin Phenol Resin Others Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 257.837 8.041 1.608 0.536 268.022 16.943 16.943 1.033 0.051 0.047 0.047 0.010 0.010 1.197 1.587 1.587 0.786 0.019 0.805 942.396 53.881 36.977 21.130 2.113 1056.498 14.058 14.058 1359.110 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 86.3 863000 4.3 43000 3.9 39000 3.9 39000 0.8 8000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 89.2 892000 5.1 51000 3.5 35000 2.0 20000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 18.97 189710 0.59 5916 0.12 1183 0.04 394 19.72 197204 1.25 12466 1.25 12466 0.08 760 0.00 38 0.00 34 0.00 34 0.00 7 0.00 7 0.09 880 0.12 1168 0.12 1168 0.06 578 0.00 14 0.06 592 69.34 693392 3.96 39645 2.72 27207 1.55 15547 0.16 1555 77.73 777345 1.03 10343 1.03 10343 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.