View detail for

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
144AA / N‐LQ144
GPC
AEI
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Kaohsiung
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin B
Diluent B
Hardener
Epoxy Resin A
Diluent A
Organic Peroxide
Dicyandiamide
7440‐22‐4
Proprietary
Proprietary
Proprietary
9003‐36‐5
Proprietary
Proprietary
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica Fused
Silica Fused
Phenol Resin
Epoxy Resin A
Epoxy Resin B
Silica, Crystalline
Carbon Black
60676‐86‐0
76361‐86‐9
Proprietary
Proprietary
Proprietary
14808‐60‐7
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
257.837
8.041
1.608
0.536
268.022
16.943
16.943
0.864
0.068
0.068
0.057
0.045
0.045
0.006
0.003
1.157
1.587
1.587
1.728
1.728
808.221
114.102
58.107
34.864
34.864
3.169
3.169
1056.498
14.058
14.058
1359.993
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
74.7
747000
5.9
59000
5.9
59000
4.9
49000
3.9
39000
3.9
39000
0.5
5000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
76.5
765000
10.8
108000
5.5
55000
3.3
33000
3.3
33000
0.3
3000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
18.96
189587
0.59
5912
0.12
1182
0.04
394
19.71
197076
1.25
12458
1.25
12458
0.06
635
0.01
50
0.01
50
0.00
42
0.00
33
0.00
33
0.00
4
0.00
3
0.09
851
0.12
1167
0.12
1167
0.13
1270
0.13
1270
59.43
594283
8.39
83899
4.27
42726
2.56
25636
2.56
25636
0.23
2331
0.23
2331
77.68
776841
1.03
10337
1.03
10337
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary
and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users
of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless
otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury
(Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium
(Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09%
(900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl)
in any homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
144AA / R‐LQ144
GPC
AEI
Matte Tin (Sn)
RoHS Compliant
Yes
Yes
e3
Green Compliant
ASE Shanghai
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
2‐Propenoic Acid, Dodecyl Ester
Dicyclopentyldimethylene Diacrylate
Diglycidylphenyl Glycidyl Ether
Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide
Isobornyl Methacrylate
7440‐22‐4
2156‐97‐0
42594‐17‐2
13561‐08‐5
80‐43‐3
7534‐94‐3
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica
Epoxy Resin
Phenol Resin
Others
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
257.837
8.041
1.608
0.536
268.022
16.943
16.943
1.033
0.051
0.047
0.047
0.010
0.010
1.197
1.587
1.587
1.728
1.728
942.396
55.994
45.429
10.565
2.113
1056.498
14.058
14.058
1360.033
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
86.3
863000
4.3
43000
3.9
39000
3.9
39000
0.8
8000
0.8
8000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
89.2
892000
5.3
53000
4.3
43000
1.0
10000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
18.96
189582
0.59
5912
0.12
1182
0.04
394
19.71
197070
1.25
12458
1.25
12458
0.08
759
0.00
38
0.00
34
0.00
34
0.00
7
0.00
7
0.09
880
0.12
1167
0.12
1167
0.13
1270
0.13
1270
69.29
692922
4.12
41171
3.34
33403
0.78
7768
0.16
1554
77.68
776818
1.03
10336
1.03
10336
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or
destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other
limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel
Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement
signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent
Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP),
Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
144AA / N‐LQ144 / R‐LQ144
GPC
AEI
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
Amkor Korea / Amkor Philippines
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol F Diglycidyl Ether
1,4‐Bis(2,3‐Epoxypropoxy)Butane
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Dihydro‐3‐(Tetrapropenyl)Furan‐2,5‐Dione
Oxirane, 2‐Dodecyl‐
Methylhexahydrophthalic Anhydride
7440‐22‐4
39817‐09‐9
2425‐79‐8
Proprietary
26544‐38‐7
3234‐28‐4
19438‐60‐9
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous) A
Epoxy Resin
Silica (Amorphous) B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
7631‐86‐9
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
264.013
6.505
0.271
0.271
271.061
16.943
16.943
0.861
0.070
0.059
0.059
0.054
0.054
0.032
1.190
1.587
1.587
1.728
1.728
819.843
92.972
92.972
42.260
8.452
1056.498
14.058
14.058
1363.065
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
72.4
724000
5.9
59000
5.0
50000
5.0
50000
4.5
45000
4.5
45000
2.7
27000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
77.6
776000
8.8
88000
8.8
88000
4.0
40000
0.8
8000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
19.37
193691
0.48
4773
0.02
199
0.02
199
19.89
198861
1.24
12430
1.24
12430
0.06
632
0.01
52
0.00
44
0.00
44
0.00
39
0.00
39
0.00
24
0.09
873
0.12
1165
0.12
1165
0.13
1267
0.13
1267
60.15
601470
6.82
68208
6.82
68208
3.10
31004
0.62
6201
77.51
775090
1.03
10313
1.03
10313
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration.
Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other
agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate
(BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous
material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
GPC
AEI
144AA / N‐LQ144
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Kaohsiung
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin B
Diluent B
Hardener
Epoxy Resin A
Diluent A
Organic Peroxide
Dicyandiamide
7440‐22‐4
Proprietary
Proprietary
Proprietary
9003‐36‐5
Proprietary
Proprietary
461‐58‐5
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica Fused
Silica Fused
Phenol Resin
Epoxy Resin A
Epoxy Resin B
Silica, Crystalline
Carbon Black
60676‐86‐0
76361‐86‐9
Proprietary
Proprietary
Proprietary
14808‐60‐7
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
257.837
8.041
1.608
0.536
268.022
16.943
16.943
0.864
0.068
0.068
0.057
0.045
0.045
0.006
0.003
1.157
1.587
1.587
0.786
0.019
0.805
808.221
114.102
58.107
34.864
34.864
3.169
3.169
1056.498
14.058
14.058
1359.071
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
74.7
747000
5.9
59000
5.9
59000
4.9
49000
3.9
39000
3.9
39000
0.5
5000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
76.5
765000
10.8
108000
5.5
55000
3.3
33000
3.3
33000
0.3
3000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
18.97
189716
0.59
5916
0.12
1183
0.04
394
19.72
197210
1.25
12467
1.25
12467
0.06
636
0.01
50
0.01
50
0.00
42
0.00
33
0.00
33
0.00
4
0.00
3
0.09
851
0.12
1168
0.12
1168
0.06
578
0.00
14
0.06
592
59.47
594687
8.40
83956
4.28
42755
2.57
25653
2.57
25653
0.23
2332
0.23
2332
77.74
777368
1.03
10344
1.03
10344
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made
to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a
written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
144‐Lead, 20 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
144AA / R‐LQ144
GPC
AEI
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Shanghai
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
2‐Propenoic Acid, Dodecyl Ester
Dicyclopentyldimethylene Diacrylate
Diglycidylphenyl Glycidyl Ether
Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide
Isobornyl Methacrylate
7440‐22‐4
2156‐97‐0
42594‐17‐2
13561‐08‐5
80‐43‐3
7534‐94‐3
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica
Epoxy Resin
Phenol Resin
Others
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
257.837
8.041
1.608
0.536
268.022
16.943
16.943
1.033
0.051
0.047
0.047
0.010
0.010
1.197
1.587
1.587
0.786
0.019
0.805
942.396
53.881
36.977
21.130
2.113
1056.498
14.058
14.058
1359.110
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
86.3
863000
4.3
43000
3.9
39000
3.9
39000
0.8
8000
0.8
8000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
89.2
892000
5.1
51000
3.5
35000
2.0
20000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
18.97
189710
0.59
5916
0.12
1183
0.04
394
19.72
197204
1.25
12466
1.25
12466
0.08
760
0.00
38
0.00
34
0.00
34
0.00
7
0.00
7
0.09
880
0.12
1168
0.12
1168
0.06
578
0.00
14
0.06
592
69.34
693392
3.96
39645
2.72
27207
1.55
15547
0.16
1555
77.73
777345
1.03
10343
1.03
10343
100.00
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Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or
destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other
limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel
Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement
signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent
Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP),
Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.