ROHM BD6381EFV_11

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Bipolar stepping motor driver
TYPE
BD6381EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Power save mode
・Reference voltage output
・Low on resistance DMOS
○Absolute maximum ratings (Ta=25℃)
Item
Symbol
Supply voltage VCC
VCC
Supply voltage VM
VM
Limit
Unit
-0.2~+7.0
V
-0.2~+15.0
V
1.1※1
W
Power dissipation
Pd
4.0※2
W
Input voltage for control pin
VIN
-0.2~(VCC +0.3)
V
RNF maximum voltage
VRNF
0.5
V
Maximum output current
IOUT
1.2※3
A/ch
Operating temperature range
Topr
-25~+75
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
150
℃
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃
※2
4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
※3
Do not exceed Pd, ASO.
○Operating conditions (Ta=-25~+75℃)
Item
Symbol
Supply voltage VCC
VCC
Supply voltage VM
VM
Input voltage for control
VIN
Output current (DC)
IOUT
※4
Min.
2.5
6.0
0
-
Typ.
3.3
7.2
0.6
Do not exceed Pd, ASO.
This product isn’t designed for protection against radioactive rays.
REV. A
Max.
5.5
13.5
VCC
0.8※4
Unit
V
V
V
A/ch
2/4
○
Electrical characteristics (Unless otherwise specified Ta=25℃、VCC=3.3V、VM=7.2V)
Item
Min.
Limit
Typ.
Max.
-
0
1.6
0
0.09
10
3.0
10
0.50
μA
mA
μA
mA
PS=L
PS=H, VLIMX=0.5V
PS=L
PS=H, VLIMX=0.5V
2.0
0
15
-10
30
0
3.3
0.8
60
-
V
V
μA
μA
VIN =3V
VIN =0V
RON
-
1.0
1.25
Ω
ILEAK
-
-
10
μA
IRNF
-40
-2.0
-2.0
0
-10
0.3
0.97
-20
-0.1
-0.1
0.7
1.00
0.5
10
1.2
1.03
μA
μA
μA
V
mV
μs
V
Symbol
Whole
VCC current at standby
ICCST
VCC current
ICC
VM current at standby
IVMST
VM current
IVM
Control input (PS, IN1A, IN1B, IN2A, IN2B)
H level input voltage
VINH
L level input voltage
VINL
H level input current
IINH
L level input current
IINL
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFX input current
SENSEX input current
VLIMX input current
VLIMX input voltage range
Comparator offset voltage
Noise cancel time
VREF voltage
ISENSE
IVLIM
VVLIM
VOFS
tn
VVREF
Unit
○ Input-output logic table
INPUT
OUTPUT
IN1A
IN1B
OUT1A
OUT1B
PS
IN2A
IN2B
OUT2A
OUT2B
L
X
X
OPEN
OPEN
All circuit Standby
H
L
L
OPEN
OPEN
Standby
H
H
L
H
L
Forward
H
L
H
L
H
Backward
H
H
H
L
L
Brake
X: H or L
REV. A
Conditions
IOUT =±0.6A, VM=7.2V
Sum of upper and lower
RNFX=0V
SENSEX=0V
VLIMX=0V
R=39kΩ, C=1000pF
IVREF=0~1mA
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○ Package outline
Product No.
BD6381
Lot No.
HTSSOP-B24 (Unit:mm)
○Block diagram
○Pin No. / Pin name
VCC
24
VREF
VREF 23
Current Limit Comp.
VLIM1 3
9 VM1
Predriver
10 OUT1A
11 OUT1B
12 RNF1
CR1 5
CR
Timer
4 SENSE1
PS 2
UVLO
IN1A 6
IN1B 7
IN2A 19
IN2B 18
CR2 20
Logic
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
Pin name
GND
PS
VLIM1
SENSE1
CR1
IN1A
IN1B
NC
VM1
OUT1A
OUT1B
RNF1
TSD
NC : Non Connection
OCP
16 VM2
CR
Timer
Predriver
15 OUT2A
14 OUT2B
13 RNF2
VLIM2 22
Current Limit Comp.
21 SENSE2
1
GND
REV. A
Pin No.
13
14
15
16
17
18
19
20
21
22
23
24
Pin name
RNF2
OUT2B
OUT2A
VM2
NC
IN2B
IN2A
CR2
SENSE2
VLIM2
VREF
VCC
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to
decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the product
and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a
physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND
pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to
use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as wide
as possible with heat dissipation pattern not only on the board surface but also the backside.
(5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(6) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(7) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent
runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the
TSD function to protect peripheral equipment.
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal ground
voltage. Be careful not to change the GND wiring pattern of any external components, either.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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R1120A