DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage MBD128 BGA2022 MMIC mixer Objective specification Supersedes data of 1999 Feb 25 1999 Jul 23 Philips Semiconductors Objective specification MMIC mixer BGA2022 FEATURES PINNING • Large frequency range: PIN DESCRIPTION – Cellular band (900 MHz) 1 LO - GND – PCS band (1900 MHz) 2 LO - signal – WLAN band (2.4 GHz). 3 VS • High isolation 4 IF - out • High linearity 5 RF - feedback • High conversion gain. 6 RF - signal APPLICATIONS RF handbook, halfpage Receiver side of wireless systems that require high conversion gain and high linearity at low supply current, such as CDMA. Trade-off between gain and intermodulation is determined by one external inductor. 6 5 RFfb IF 4 BIAS CONTROL DESCRIPTION 1 Silicon double poly MMIC mixer in a 6-lead plastic SOT363 package. Top view 2 3 MAM428 LO GND LO VS Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VS supply voltage 2.7 2.8 2.85 V IS supply current − 6 − mA Gconv conversion gain fRF = 900 MHz − 6 − dB NF noise figure fRF = 900 MHz − 9 − dB IP3 input third order intercept point fRF = 900 MHz − 6 − dBm LO − RF isolation fRF = 900 MHz − 30 − dB 1999 Jul 23 2 Philips Semiconductors Objective specification MMIC mixer BGA2022 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS supply voltage − 4 V IS supply current − 20 mA PLO oscillator power note 1 − tbf dBm PRF RF power note 1 − tbf dBm Ptot total power dissipation Ts ≤ tbf °C; note 2 − 60 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Notes 1. LO and RF signals always AC coupled; no external DC voltage supplied to pin 1, 2 and 6. 2. Ts is the temperature at the soldering point of the ground tab. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to solder point Note 1. Ts is the temperature at the soldering point of the ground tab. 1999 Jul 23 3 CONDITIONS VALUE UNIT Ts ≤ tbf °C; Ptot = 17 mW; note 1 tbf K/W Philips Semiconductors Objective specification MMIC mixer BGA2022 CHARACTERISTICS fRF = 900 MHz; fLO = 983 MHz; fIF = 83 MHz; VS = 2.8 V; PLO = 0 dBm; Tj = 25 °C; unless otherwise specified. SYMBOL PARAMETER fLO local oscillator frequency fRF signal frequency fIF intermediate frequency CONDITIONS external matching MIN. TYP. MAX. UNIT 0.5 − 2.5 GHz 0.5 − 2.5 GHz 10 − 400 MHz VS supply voltage 2.7 2.8 2.85 V IS supply current − 6 − mA Gconv(p) power conversion gain − 6 − dB NF IP3 noise figure intercept point third order intermodulation 900 MHz 1900 MHz − 6 − dB 2.4 GHz − 6 − dB DSB; 900 MHz − 9 − dB DSB; 1900 MHz − 9 − dB DSB; 2.4 GHz − 9 − dB 900 MHz; ∆fRF = 100 kHz − 6 − dBm 1900 MHz; ∆fRF = 100 kHz − 6 − dBm 2.4 GHz; ∆fRF = 100 kHz − 6 − dBm RF − LO isolation − −26 − dB LO − RF isolation − −30 − dB LO − IF isolation − −20 − dB RF − IF isolation − −29 − dB VSWRLO voltage standing wave ratio on LO input − 1.5 2 ZIF IF output impedance − tbf − 1999 Jul 23 open collector 4 kΩ Philips Semiconductors Objective specification MMIC mixer handbook, full pagewidth BGA2022 RF input IF output RF RFfb IF BIAS CONTROL × LO GND LO VS MGS528 LO input Vsupply Fig.2 Application diagram (values tbf). 1999 Jul 23 5 Philips Semiconductors Objective specification MMIC mixer BGA2022 PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 v M A 4 5 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 1999 Jul 23 REFERENCES IEC JEDEC EIAJ SC-88 6 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Objective specification MMIC mixer BGA2022 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 125006/04/pp8 Date of release: 1999 Jul 23 Document order number: 9397 750 06135