PHILIPS BGA2022

DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
MBD128
BGA2022
MMIC mixer
Objective specification
Supersedes data of 1999 Feb 25
1999 Jul 23
Philips Semiconductors
Objective specification
MMIC mixer
BGA2022
FEATURES
PINNING
• Large frequency range:
PIN
DESCRIPTION
– Cellular band (900 MHz)
1
LO - GND
– PCS band (1900 MHz)
2
LO - signal
– WLAN band (2.4 GHz).
3
VS
• High isolation
4
IF - out
• High linearity
5
RF - feedback
• High conversion gain.
6
RF - signal
APPLICATIONS
RF
handbook, halfpage
Receiver side of wireless systems that require high
conversion gain and high linearity at low supply current,
such as CDMA. Trade-off between gain and
intermodulation is determined by one external inductor.
6
5
RFfb
IF
4
BIAS
CONTROL
DESCRIPTION
1
Silicon double poly MMIC mixer in a 6-lead plastic SOT363
package.
Top view
2
3
MAM428
LO GND
LO
VS
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VS
supply voltage
2.7
2.8
2.85
V
IS
supply current
−
6
−
mA
Gconv
conversion gain
fRF = 900 MHz
−
6
−
dB
NF
noise figure
fRF = 900 MHz
−
9
−
dB
IP3
input third order intercept point
fRF = 900 MHz
−
6
−
dBm
LO − RF isolation
fRF = 900 MHz
−
30
−
dB
1999 Jul 23
2
Philips Semiconductors
Objective specification
MMIC mixer
BGA2022
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VS
supply voltage
−
4
V
IS
supply current
−
20
mA
PLO
oscillator power
note 1
−
tbf
dBm
PRF
RF power
note 1
−
tbf
dBm
Ptot
total power dissipation
Ts ≤ tbf °C; note 2
−
60
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Notes
1. LO and RF signals always AC coupled; no external DC voltage supplied to pin 1, 2 and 6.
2. Ts is the temperature at the soldering point of the ground tab.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
thermal resistance from junction to solder point
Note
1. Ts is the temperature at the soldering point of the ground tab.
1999 Jul 23
3
CONDITIONS
VALUE
UNIT
Ts ≤ tbf °C; Ptot = 17 mW;
note 1
tbf
K/W
Philips Semiconductors
Objective specification
MMIC mixer
BGA2022
CHARACTERISTICS
fRF = 900 MHz; fLO = 983 MHz; fIF = 83 MHz; VS = 2.8 V; PLO = 0 dBm; Tj = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
fLO
local oscillator frequency
fRF
signal frequency
fIF
intermediate frequency
CONDITIONS
external matching
MIN.
TYP.
MAX.
UNIT
0.5
−
2.5
GHz
0.5
−
2.5
GHz
10
−
400
MHz
VS
supply voltage
2.7
2.8
2.85
V
IS
supply current
−
6
−
mA
Gconv(p)
power conversion gain
−
6
−
dB
NF
IP3
noise figure
intercept point third order
intermodulation
900 MHz
1900 MHz
−
6
−
dB
2.4 GHz
−
6
−
dB
DSB; 900 MHz
−
9
−
dB
DSB; 1900 MHz
−
9
−
dB
DSB; 2.4 GHz
−
9
−
dB
900 MHz; ∆fRF = 100 kHz
−
6
−
dBm
1900 MHz; ∆fRF = 100 kHz
−
6
−
dBm
2.4 GHz; ∆fRF = 100 kHz
−
6
−
dBm
RF − LO isolation
−
−26
−
dB
LO − RF isolation
−
−30
−
dB
LO − IF isolation
−
−20
−
dB
RF − IF isolation
−
−29
−
dB
VSWRLO
voltage standing wave ratio
on LO input
−
1.5
2
ZIF
IF output impedance
−
tbf
−
1999 Jul 23
open collector
4
kΩ
Philips Semiconductors
Objective specification
MMIC mixer
handbook, full pagewidth
BGA2022
RF input
IF output
RF
RFfb
IF
BIAS
CONTROL
×
LO GND
LO
VS
MGS528
LO input
Vsupply
Fig.2 Application diagram (values tbf).
1999 Jul 23
5
Philips Semiconductors
Objective specification
MMIC mixer
BGA2022
PACKAGE OUTLINE
Plastic surface mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
v M A
4
5
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
1999 Jul 23
REFERENCES
IEC
JEDEC
EIAJ
SC-88
6
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Objective specification
MMIC mixer
BGA2022
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jul 23
7
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For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1999
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125006/04/pp8
Date of release: 1999
Jul 23
Document order number:
9397 750 06135