INTEGRATED CIRCUITS SA57022-XX 500 mA LDO with ON/OFF control and Vref bypass Product data Supersedes data of 2001 Oct 03 2003 Oct 13 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX GENERAL DESCRIPTION The SA57022-XX has an extremely precise fixed output with a typical accuracy of ±2%. It is designed to provide very low dropout and ultra low noise with an optional Bypass pin, and fast transient response. Supply current is reduced to zero (typical). The SA57022-XX incorporates both over-temperature and over-current protection. The SA57022-XX is stable with an output capacitor of only 1.0 µF and has a maximum output current of 500 mA. It is available in the 7-pin small outline package (SOP002). FEATURES APPLICATIONS • Very low dropout voltage: 300 mV typ. (Iout = 500 mA) • High precision output voltage: ±2% • Output current capacity: 500 mA • Low noise: 75 µVrms typ. @ 20 Hz to 80 KHz, for Cn = 470 pF. • Extremely good line regulation: 10 mV typical • Extremely good load regulation: 20 mV typical • Low temperature drift co-efficient to Vout: ±100 ppm/°C • Internal current limit and thermal shut-down circuits • Input voltage range: –0.3 V to 12 V • Wide preset output voltage range: 1.8 V to 5 V • Wide operating temperature range: –40 °C to +85 °C • Battery-operated systems • Portable computers • Cameras, VCRs and camcorders • PCMCIA cards, modems, pagers • Cellular/GSM/PHS phones • Linear post-regulator for SMPS • Instrumentation SIMPLIFIED SYSTEM DIAGRAM VIN 7 1 VOUT CURRENT LIMIT DRIVER 5 R REFERENCE BIAS ON/OFF THERMAL SHUTDOWN R GND 3 4 BYPASS SL01527 Figure 1. Simplified system diagram. 2003 Oct 13 2 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX ORDERING INFORMATION PACKAGE TYPE NUMBER SA57022-XXD DESCRIPTION VERSION TEMPERATURE RANGE small outline 7-pin surface mount (see dimensional drawing) SOP002 –40 to +85 °C NOTE: The device has six voltage output options, indicated by the XX on the order code. XX VOLTAGE (Typical) 18 1.8 V 25 2.5 V Part number marking Each package is marked with a four letter code. The first three letters designate the product. The fourth letter, represented by ‘x’, is a date tracking code. Part number Marking SA57022-18 ALMx SA57022-25 ALNx SA57022-28 ALPx SA57022-30 ALRx 28 2.8 V 30 3.0 V 33 3.3 V SA57022-33 ALSx 50 5.0 V SA57022-50 ALTx PIN CONFIGURATION VOUT PIN DESCRIPTION 1 NC 2 GND 3 BYPASS 4 7 SA57022-XX VIN 6 GND PIN SYMBOL 1 VOUT 2 NC Regulated output voltage. No connection. 3 GND 4 BYPASS Reference bypass input. Connecting a 470 pF capacitor further reduces output noise. 5 ON/OFF Output voltage On/Off control pin. 6 GND 7 VIN ON/OFF 5 DESCRIPTION Ground. SL01525 Figure 2. Pin configuration. Substrate ground pin. This pin must be connected to ground. Power supply input. MAXIMUM RATINGS SYMBOL PARAMETER MIN. MAX. UNIT –0.3 +12 V VOUT(typ) + 0.5 VOUT(typ) + 10 V VIN Supply voltage VIN(OPR) Operating voltage IOUT Output current 0 500 mA Toper Operating temperature –40 +85 °C Tstg Storage temperature –40 +150 °C PD Power dissipation (Note 1) – 400 mW PD Power dissipation (Note 2) – 950 mW NOTES: 1. Unattached. 2. Mounted on double-sided glass epoxy PCB, with copper ground plane 192 × 142 × 1.2 mm. 2003 Oct 13 3 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX ELECTRICAL CHARACTERISTICS Tamb = 25 °C; VON/OFF = 1.6 V, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IOUT = 0 mA – 1.9 5 mA ICC No-load input current ICC(OFF) Input current (off) VON/OFF = 0 V – 0 1 µA VOUT Output voltage (as % of Vnom) IOUT = 250 mA 98% – 102% V SA57022-18 1.764 1.8 1.836 V SA57022-25 2.450 2.5 2.550 V SA57022-28 2.744 2.8 2.856 V SA57022-30 2.940 3.0 3.060 V SA57022-33 3.234 3.3 3.060 V SA57022-50 4.900 5.0 5.100 V VIN = VOUT – 0.2 V; IOUT = 250 mA – 0.3 0.5 V VIO Dropout voltage (Note 2) ∆V1 Line regulation VIN = VOUT +1.5 V to VIN = VOUT +2.5 V; IOUT = 250 mA – 10 20 mV ∆V2 Load regulation IOUT = 0 to 250 mA – 20 120 mV ∆VOUT/∆T VOUT Temperature coefficient (Note 1) Tj = –30 to +85 °C – 100 – ppm/°C RR Ripple rejection (Note 1) f = 120 Hz; Vripple = 1 V; IOUT = 250 mA 50 64 – dB Vn Output noise voltage (Note 1) fBW = 20 to 80 kHz; Cn = 470 pF – 75 – µVrms ION/OFF ON/OFF pin input current VON/OFF = VIN 10 20 30 µA VON/OFF(H) ON/OFF HIGH threshold voltage 1.6 – VIN+0.3 V VON/OFF(L) ON/OFF LOW threshold voltage -0.3 – 0.4 V NOTES: 1. The parameter is guaranteed by design. 2. This parameter is not guaranteed if VOUT is less than 2 V. 2003 Oct 13 4 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX APPLICATION INFORMATION VOLTAGE INPUT CIN = 1 µF CERAMIC 7 VIN TO LOAD 6 5 SUB ON/OFF VOUT NC GND BYPASS 1 2 3 4 COUT = 2.2 µF CERAMIC Cn = 470 pF CERAMIC SL01526 Figure 3. Typical application circuit. Input capacitor Thermal shutdown An input capacitor of 1.0 µF (min) should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is operated as the power source. The capacitor should be less than 1 cm from the input pin. Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150 °C. The regulator remains off until the die temperature drops to approximately 140 °C. Power dissipation Aluminum electrolytic or tantalum capacitor types can be used. (Because many aluminum electrolytic capacitors freeze at approximately –30 °C, solid tantalums are recommended for applications operating below –25 °C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: P D [ ǒV IN(max) * V OUT(min)Ǔ Eqn. (1) Where: PD = worst case actual power dissipation VIN(max) = maximum voltage on VIN VOUT(min) = minimum regulator output voltage ILOAD(max) = maximum output (load) current Output capacitor Phase compensation is used to ensure stable operation even if load current varies. For this reason, an output capacitor with good frequency characteristics is needed. Set it as close to the circuit as possible, with wires as short as possible. A 1.0 µF capacitor from VOUT to ground is recommended. The output capacitor should have an ESR (effective series resistance) of 5.0 Ω or less, and a resonant frequency above 1.0 MHz. The maximum allowable power dissipation, as shown in Equation (2), is a function of the maximum ambient temperature (Tamb(max)), the maximum allowable die temperature (125 °C), and the thermal resistance from junction-to-air (Rth(j–a)). Optional BYPASS capacitor P D(max) + A 470 pF capacitor connected from the BYPASS input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. This capacitor must have low leakage, because the pin is high impedance. If output noise is not a concern, this pin may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. T j(max) * T amb(max) R th(j*a) Eqn. (2) The SUB (heat sink) pin must be connected to ground with a wide trace. PCB layout hints The component placement around the LDO should be done carefully to achieve good dynamic line and load response. The input and noise capacitor should be kept close to the LDO. The rise in junction temperature depends on how efficiently the heat is carried away from the junction to ambient. The junction to lead thermal impedance is a characteristic of the package and fixed. The thermal impedance between lead to ambient can be reduced by increasing the copper area on PCB. Increase the input, output and ground trace area to reduce the junction-to-ambient impedance. ON/OFF The regulator is fully enabled when a logic HIGH is applied to this input. The regulator enters shutdown when a logic LOW is appplied to this input. During shutdown, regulator output voltage falls to zero,and supply current is reduced to 1.0 µA max, and VOUT falls to zero. For use as an always-on regulator, connect ON/OFF pin to the supply voltage, as shown in Figure 3. Optional BYPASS diode If the voltage on the output pin rises above the input voltage, as might happen in some applications, the overcurrrent will flow via internal parasitic diodes from output to input. To prevent this, connect a bypass diode between the output and input pins. 2003 Oct 13 I LOAD(max) 5 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX PACKING METHOD The SA57003 is packed in reels, as shown in Figure 4. GUARD BAND TAPE REEL ASSEMBLY TAPE DETAIL COVER TAPE CARRIER TAPE BARCODE LABEL BOX SL01305 Figure 4. Tape and reel packing method 2003 Oct 13 6 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass Plastic small outline package; 7 leads; body width 4.4 mm 2003 Oct 13 7 SA57022-XX SOP002 Philips Semiconductors Product data 500 mA LDO with ON/OFF control and Vref bypass SA57022-XX REVISION HISTORY Rev Date Description _2 20031013 Product data (9397 750 12112). ECN 853-2293 30328 of 09 September 2003. Modifications: • Change package name from SOP-7B to SOP002 in Ordering information and Package outline sections. _1 20011003 Product data (9397 750 08967). ECN 853-2293 27197 of 03 October 2001. Data sheet status Level Data sheet status [1] Product status [2] [3] Definitions I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Koninklijke Philips Electronics N.V. 2003 All rights reserved. Printed in U.S.A. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 Date of release: 10-03 For sales offices addresses send e-mail to: [email protected]. Document order number: 2003 Oct 13 8 9397 750 12112