BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 07 — 12 May 2006 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package Configuration Philips JEITA 1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/ common cathode 1PS88SB48 SOT363 SC-88 quadruple common cathode/ common cathode BAS40XY SOT363 SC-88 quadruple; 2 series BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 1.2 Features n High switching speed n High breakdown voltage n Low leakage current n Low capacitance 1.3 Applications n Ultra high-speed switching n Voltage clamping 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit - - 120 mA - - 380 mV - - 40 V Per diode forward current IF VF forward voltage VR reverse voltage [1] [1] IF = 1 mA Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 2. Pinning information Table 3. Pin Pinning Description Simplified outline Symbol BAS40H; 1PS76SB40; 1PS79SB40 1 cathode 2 anode [1] 1 1 2 2 sym001 001aab540 BAS40L 1 cathode 2 anode [1] 1 1 2 2 sym001 Transparent top view BAS40; BAS40W; 1PS70SB40 1 anode 2 not connected 3 cathode 3 3 1 2 n.c. 006aaa436 1 2 006aaa144 BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 2 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes Table 3. Pinning …continued Pin Description Simplified outline Symbol BAS40-04; BAS40-04W; 1PS70SB44 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 3 3 1 2 006aaa437 1 2 006aaa144 BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1), cathode (diode 2) 3 3 1 2 006aaa438 1 2 006aaa144 BAS40-06; BAS40-06W; 1PS70SB46 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1), anode (diode 2) 3 3 1 2 006aaa439 1 2 006aaa144 BAS40-07 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1) 4 1 3 4 2 1 3 2 006aaa434 BAS40-07V 1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1) BAS40_1PSXXSB4X_SER_7 Product data sheet 6 5 4 1 2 3 6 5 4 1 2 3 006aaa440 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 3 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Table 3. Pin Pinning …continued Description Simplified outline Symbol BAS40-05V; 1PS88SB48 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 3), cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4) 6 6 5 1 2 4 6 5 1 2 4 3 001aab555 3 006aaa446 cathode (diode 1), cathode (diode 2) BAS40XY 1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1), anode (diode 2) [1] 5 4 1 2 3 6 5 4 1 2 3 006aaa256 The marking bar indicates the cathode. BAS40_1PSXXSB4X_SER_7 Product data sheet 6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 4 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 3. Ordering information Table 4. Ordering information Type number Package Name Description Version 1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm SOD882 BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 5 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 4. Marking Table 5. Marking codes Type number Marking code[1] Type number Marking code[1] 1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 40 V IF forward current - 120 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 120 mA IFSM non-repetitive peak forward current tp ≤ 10 ms - 200 mA Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Tj = 25 °C prior to surge. BAS40_1PSXXSB4X_SER_7 Product data sheet [1] © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 6 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 6. Thermal characteristics Table 7. Symbol Thermal characteristics Parameter Conditions Min Typ Max Unit thermal resistance from junction to ambient in free air SOT23 - - 500 K/W SOT143B - - 500 K/W SOT363 (1PS88SB48) - - 416 K/W Per device Rth(j-a) [1] SOT416 - - 833 K/W SOT666 (BAS40-05V) [2] - - 225 K/W SOT666 (BAS40-07V) [2] - - 416 K/W SOD123F [2] - - 330 K/W - - 450 K/W SOD523 [2] - - 450 K/W SOD882 [2] - - 500 K/W - - 625 K/W - - 260 K/W SOD323 SOT323 Rth(j-sp) thermal resistance from junction to solder point [3] SOT363 (BAS40XY) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 1 mA - - 380 mV IF = 10 mA - - 500 mV Per diode VF IR Cd [1] [1] forward voltage reverse current diode capacitance IF = 40 mA - - 1 V VR = 30 V - - 1 µA VR = 40 V - - 10 µA VR = 0 V; f = 1 MHz - - 5 pF Pulse test: tp ≤ 300 µs; δ ≤ 0.02. BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 7 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes mlc361 102 mlc362 103 IR (µA) IF (mA) (1) 102 10 10 (1) (2) (3) (4) (2) 1 1 10−1 10−1 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 1 10−2 0 10 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C 20 30 VR (V) 40 (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values mlc364 103 Fig 2. Reverse current as a function of reverse voltage; typical values mlc363 5 Cd (pF) rdif (Ω) 4 102 3 2 10 1 1 10−1 1 10 IF (mA) 102 0 0 20 30 VR (V) 40 Tamb = 25 °C; f = 1 MHz f = 10 kHz Fig 3. Differential resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS40_1PSXXSB4X_SER_7 Product data sheet 10 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 8 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 8. Package outline 1.35 1.15 1.1 0.8 0.65 0.58 0.45 0.15 1 2.7 2.3 0.85 0.75 1 1.8 1.6 1.65 1.25 1.55 1.15 2 2 0.40 0.25 0.25 0.10 0.34 0.26 Dimensions in mm 03-12-17 Fig 5. Package outline SOD323 (SC-76) 3.0 2.8 0.17 0.11 Dimensions in mm 02-12-13 Fig 6. Package outline SOD523 (SC-79) 1.7 1.5 1.1 0.9 1.2 1.0 1 3 0.55 0.35 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 1 2.7 2.5 2 0.48 0.38 1.9 2 0.15 0.09 Dimensions in mm 04-11-04 Fig 7. Package outline SOT23 (TO-236AB) 0.70 0.55 Dimensions in mm 04-11-29 Fig 8. Package outline SOD123F 2.2 1.8 0.50 0.46 0.62 0.55 0.25 0.10 1.1 0.8 0.45 0.15 3 2 0.30 0.22 0.65 0.30 0.22 1.02 0.95 2.2 1.35 2.0 1.15 1 0.55 0.47 1 0.4 0.3 cathode marking on top side Dimensions in mm Fig 9. Package outline SOD882 0.25 0.10 1.3 03-04-17 Dimensions in mm 04-11-04 Fig 10. Package outline SOT323 (SC-70) BAS40_1PSXXSB4X_SER_7 Product data sheet 2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 9 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 3.0 2.8 2.2 1.8 1.1 0.9 1.9 6 4 2.5 2.1 1.1 0.8 5 4 2 3 0.45 0.15 3 0.45 0.15 1.4 1.2 1 2.2 1.35 2.0 1.15 pin 1 index 2 0.88 0.78 1 0.48 0.38 0.15 0.09 0.25 0.10 0.3 0.2 0.65 1.3 1.7 Dimensions in mm 04-11-16 Fig 11. Package outline SOT143B Dimensions in mm 04-11-08 Fig 12. Package outline SOT363 (SC-88) 1.7 1.5 0.95 0.60 1.8 1.4 3 6 0.45 0.15 0.6 0.5 5 4 0.3 0.1 1.75 0.9 1.45 0.7 1.7 1.5 1.3 1.1 pin 1 index 1 2 1 0.30 0.15 0.25 0.10 Fig 13. Package outline SOT416 (SC-75) 0.18 0.08 1 04-11-04 Dimensions in mm 04-11-08 Fig 14. Package outline SOT666 BAS40_1PSXXSB4X_SER_7 Product data sheet 3 0.27 0.17 0.5 1 Dimensions in mm 2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 10 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 4000 8000 10000 1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB40 SOD523 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel 1PS88SB48 BAS40XY SOT363 SOT363 - -115 - - 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 [1] For further information and the availability of packing methods, see Section 13. [2] T1: normal taping [3] T2: reverse taping BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 11 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist 2.75 1.20 occupied area MSA415 preferred transport direction during soldering Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) 2.15 solder paste 0.50 0.60 1.20 solder lands 0.30 0.40 solder resist occupied area 1.80 1.90 MGS343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 12 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 19. Wave soldering footprint SOT23 (TO-236AB) BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 13 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 R = 0.05 (8×) solder lands 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder resist occupied area solder paste 0.30 (2×) 0.40 (2×) 0.50 (2×) MBL872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 14 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder resist 0.50 (3x) 1.90 3 0.60 2.35 0.85 (3x) occupied area 1 0.55 (3x) 2.40 solder paste MSA429 Dimensions in mm Fig 22. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 solder lands solder resist 2 occupied area 3.65 3 2.10 2.70 1 0.90 (2x) MSA419 preferred transport direction during soldering Dimensions in mm Fig 23. Wave soldering footprint SOT323 (SC-70) BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 15 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) solder resist 4 3 2.70 occupied area 1.30 3.00 1 2 solder paste msa441 0.90 1.00 2.50 Dimensions in mm Fig 24. Reflow soldering footprint SOT143B 4.45 1.20 (3x) solder lands 4 solder resist 3 occupied area 1.15 4.00 4.60 1 2 preferred transport direction during soldering 1.00 MSA422 3.40 Dimensions in mm Fig 25. Wave soldering footprint SOT143B BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 16 of 21 BAS40 series; 1PSxxSB4x series Philips Semiconductors General-purpose Schottky diodes 2.65 0.60 (2×) 0.40 0.90 2.10 (2×) 2.35 solder paste 0.50 (4×) solder lands solder resist 0.50 (4×) occupied area 1.20 2.40 MSA432 Dimensions in mm Fig 26. Reflow soldering footprint SOT363 (SC-88) 5.25 0.30 1.00 4.00 4.50 solder lands solder resist occupied area 1.15 3.75 transport direction during soldering Dimensions in mm sot363 Fig 27. Wave soldering footprint SOT363 (SC-88) BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 17 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 2.20 0.60 1.10 0.70 solder lands 2 solder resist 3 2.00 0.85 1.50 1 0.50 (3x) occupied area solder paste MSA438 0.60 (3x) 1.90 Dimensions in mm Fig 28. Reflow soldering footprint SOT416 2.75 2.45 2.10 1.60 0.15 (4×) 0.40 (6×) 2.00 1.70 1.00 0.55 (2×) 0.30 (2×) 0.375 (4×) 1.20 2.20 2.50 solder lands placement area solder resist occupied area 0.075 Dimensions in mm Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 18 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 11. Revision history Table 10. Revision history Document ID Release date BAS40_1PSXXSB4X_ 20060512 SER_7 Modifications: • • • • • Data sheet status Change notice Supersedes Product data sheet - BAS40_1PSXXSB4X_ SER_6 Type number BAS40XY added Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523 Figure 27 “Wave soldering footprint SOT363 (SC-88)”: amended Figure 29 “Reflow soldering footprint SOT666”: amended Section 12 “Legal information”: updated BAS40_1PSXXSB4X_ 20050809 SER_6 Product data sheet - 1PS70SB40_3 1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3 BAS40_SERIES_5 1PS70SB40_3 19990426 Product specification - 1PS70SB40_2 1PS75SB45_2 19990426 Product specification - 1PS75SB45_1 1PS76SB40_3 20040126 Product specification - 1PS76SB40_2 1PS79SB40_2 19990426 Product specification - 1PS79SB40_1 1PS88SB48_3 20021107 Product specification - 1PS88SB48_2 BAS40H_1 20050425 Product data sheet - - BAS40L_1 20030520 Product specification - - BAS40-05V_1 20021121 Product specification - - BAS40-07V_1 20020327 Product specification - - BAS40W_3 19990426 Product specification - BAS40W_2 BAS40_SERIES_5 20011010 Product specification - BAS40_4 BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 19 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] BAS40_1PSXXSB4X_SER_7 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 07 — 12 May 2006 20 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: [email protected]. Date of release: 12 May 2006 Document identifier: BAS40_1PSXXSB4X_SER_7