BUK78150-55A TrenchMOS™ standard level FET Rev. 01 — 30 January 2001 M3D087 Product specification 1. Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™1 technology, featuring very low on-state resistance. Product availability: BUK78150-55A in SOT223 (SC-73). 2. Features ■ ■ ■ ■ TrenchMOS™ technology Q101 compliant 150 °C rated Standard level compatible. 3. Applications c c ■ Automotive and general purpose power switching: ◆ 12 V and 24 V loads ◆ Motors, lamps and solenoids. 4. Pinning information Table 1: Pinning - SOT223 (SC-73), simplified outline and symbol Pin Description 1 gate (g) 2 drain (d) 3 source (s) 4 drain (d) Simplified outline Symbol 4 d g 1 Top view 2 3 MSB002 - 1 SOT223 (SC-73) 1. TrenchMOS is a trademark of Royal Philips Electronics. MBB076 s BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 5. Quick reference data Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit − 55 V VDS drain-source voltage (DC) ID drain current (DC) Tsp = 25 °C; VGS = 10 V − 5.5 A Ptot total power dissipation Tsp = 25 °C − 8 W Tj junction temperature − 150 °C RDSon drain-source on-state resistance Tj = 25 °C 128 150 Tj = 150 °C − 278 mΩ mΩ VGS = 10 V; ID = 5 A 6. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS drain-source voltage (DC) VDGR drain-gate voltage (DC) VGS gate-source voltage (DC) ID drain current (DC) Conditions RGS = 20 kΩ Min Max Unit − 55 V − 55 V − ±20 V Tsp = 25 °C; VGS = 10 V; Figure 2 and 3 − 5.5 A Tsp = 100 °C; VGS = 10 V; Figure 2 − 3.8 A IDM peak drain current Tsp = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 − 22 A Tsp = 25 °C; Figure 1 Ptot total power dissipation − 8 W Tstg storage temperature −55 +150 °C Tj operating junction temperature −55 +150 °C Source-drain diode IDR reverse drain current (DC) Tsp = 25 °C − 5.5 A IDRM pulsed reverse drain current Tsp = 25 °C; pulsed; tp ≤ 10 µs − 22 A unclamped inductive load; ID = 5 A; VDS ≤ 55 V; VGS = 10 V; RGS = 50 Ω; starting Tsp = 25 °C − 25 mJ Avalanche ruggedness WDSS non-repetitive avalanche energy © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 2 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 03aa25 03aa17 120 120 Pder (%) 100 Ider (%) 100 80 80 60 60 40 40 20 20 0 0 0 25 50 75 100 125 Tsp 150 (oC) 0 175 25 50 75 100 125 150 175 Tsp (oC) VGS ≥ 4.5 V P tot P der = ---------------------- × 100% P ° ID I der = ------------------- × 100% I ° tot ( 25 C ) D ( 25 C ) Fig 1. Normalized total power dissipation as a function of solder point temperature. Fig 2. Normalized continuous drain current as a function of solder point temperature. 03nc19 102 ID (A) RDSon = VDS/ ID tp = 10 us 10 100 us 1 ms 1 δ= P tp D.C. 10 ms T 100 ms 10-1 t tp T 10-2 1 10 VDS (V) 102 Tamb = 25 °C; IDM is single pulse. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 3 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient Figure 4 70 K/W Rth(j-sp) thermal resistance from junction to solder point 15 K/W 7.1 Transient thermal impedance 03nc18 102 Zth(j-sp) (K/W) 10 δ = 0.5 0.2 0.1 1 0.05 0.02 δ= P tp T 10-1 Single Shot t tp T 10-2 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 4 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 8. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Tj = 25 °C 55 − − V Tj = −55 °C 50 − − V Tj = 25 °C 2 3 4 V Tj = 150 °C 1 − − V Tj = −55 °C − − 4.4 V Tj = 25 °C − 0.05 10 µA Tj = 150 °C − − 500 µA − 2 100 nA Tj = 25 °C − 128 150 mΩ Tj = 150 °C − − 278 mΩ Static characteristics V(BR)DSS VGS(th) IDSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 drain-source leakage current VDS = 55 V; VGS = 0 V IGSS gate-source leakage current VGS = ±20 V; VDS = 0 V RDSon drain-source on-state resistance VGS = 10 V; ID = 5 A; Figure 7 and 8 Dynamic characteristics Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 VDD = 30 V; RL = 2.7 Ω; VGS = 10 V; RG = 5.6 Ω − 170 230 pF − 54 65 pF − 37 52 pF − 3 − ns tr rise time − 26 − ns td(off) turn-off delay time − 8 − ns tf fall time − 10 − ns © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 5 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET Table 5: Characteristics…continued Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Source-drain diode VSD source-drain (diode forward) voltage IS = 5 A; VGS = 0 V; Figure 15 − 0.85 1.2 V trr reverse recovery time − 32 − ns Qr recovered charge IS = 10 A; dIS/dt = −100 A/µs VGS = −10 V; VDS = 30 V − 50 − nC 03nb91 30 ID (A) 25 VGS (V) = 11 12 14 03nb90 200 RDSon (mΩ) 16 20 20 180 160 9.5 15 8.5 7.5 10 140 120 6.5 5 5.5 100 4.5 0 80 0 2 4 6 8 10 VDS (V) 5 Tj = 25 °C 10 15 VGS (V) 20 Tj = 25 °C; ID = 5 A Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values. 03nb92 350 RDSon (mΩ) 5.5 6.5 6 7 8 VGS (V) = 10 Fig 6. Drain-source on-state resistance as a function of gate-source voltage; typical values. 03nc24 2.2 a 2 1.8 300 1.6 1.4 250 1.2 200 0.8 1 0.6 0.4 150 0.2 0 100 -60 0 5 10 15 ID (A) Tj = 25 °C 20 60 100 140 180 Tj (oC) R DSon a = --------------------------R DSon ( 25 °C ) Fig 7. Drain-source on-state resistance as a function of drain current; typical values. Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification -20 20 Rev. 01 — 30 January 2001 6 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 03aa32 5 VGS(th) 4.5 4 (V) 03aa35 10-1 ID (A) max. 10-2 3.5 3 10-3 typ. 2.5 min 2 typ max 10-4 min 1.5 1 10-5 0.5 0 10-6 -60 -20 20 60 100 140 Tj (oC) 180 0 1 2 3 4 VGS (V) 5 Tj = 25 °C; VDS = VGS ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. 03nb88 3.5 gfs (S) 3 Fig 10. Sub-threshold drain current as a function of gate-source voltage. 03nb93 350 C (pF) 300 2.5 250 2 200 1.5 150 1 100 0.5 50 0 0 0 2 4 6 8 ID (A) 10-2 10 Tj = 25 °C; VDS = 25 V Coss Crss 10-1 1 10 102 VDS (V) VGS = 0 V; f = 1 MHz Fig 11. Forward transconductance as a function of drain current; typical values. Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Ciss Rev. 01 — 30 January 2001 7 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 03nc22 10 ID (A) 03nb87 10 VGS (V) 9 8 VDD= 14 V 8 7 6 VDD= 44 V 6 5 4 4 3 2 2 O Tj = 25 C O Tj = 150 C 1 0 0 0 2 4 6 8 10 VGS (V) 0 2 4 QG (nC) 6 Tj = 25 °C; ID = 5 A VDS = 25 V Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values. Fig 14. Gate-source voltage as a function of turn-on gate charge; typical values. 03nc23 60 IS (A) 50 40 30 O O Tj = 150 C 20 Tj = 25 C 10 0 0.0 0.5 1.0 1.5 2.0 2.5 VSD (V) VGS = 0 V Fig 15. Reverse diode current as a function of reverse diode voltage; typical values. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 8 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 9. Package outline Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION SOT223 REFERENCES IEC JEDEC EIAJ SC-73 EUROPEAN PROJECTION ISSUE DATE 97-02-28 99-09-13 Fig 16. SOT223 (SC-73). © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 9 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 10. Soldering 7.00 3.85 3.60 3.50 0.30 solder lands 1.20 (4x) solder resist 4 occupied area solder paste 7.40 3.90 4.80 7.65 1 2 3 1.20 (3x) 1.30 (3x) 5.90 6.15 MSA443 Dimensions in mm. Fig 17. Reflow soldering footprint for SOT223 (SC-73). 11. Revision history Table 6: Revision history Rev Date 01 20010130 CPCN Description - Product specification; initial version. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 10 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET 12. Data sheet status Datasheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued data sheet before initiating or completing a design. 13. Definitions 14. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. © Philips Electronics N.V. 2001 All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 11 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: Tel. +36 1 382 1700, Fax. +36 1 382 1800 India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2451, Fax. +886 22 134 2874 Thailand: Tel. +66 23 61 7910, Fax. +66 23 98 3447 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825 Internet: http://www.semiconductors.philips.com (SCA71) © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07738 Product specification Rev. 01 — 30 January 2001 12 of 13 BUK78150-55A Philips Semiconductors TrenchMOS™ standard level FET Contents 1 2 3 4 5 6 7 7.1 8 9 10 11 12 13 14 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 © Philips Electronics N.V. 2001. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 30 January 2001 Document order number: 9397 750 07738