PHILIPS 74LVC2G32GM

74LVC2G32
Dual 2-input OR gate
Rev. 07 — 6 June 2008
Product data sheet
1. General description
The 74LVC2G32 provides a 2-input OR gate function.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant outputs in the Power-down mode
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low power consumption
Complies with JEDEC standard:
u JESD8-7 (1.65 V to 1.95 V)
u JESD8-5 (2.3 V to 2.7 V)
u JESD8-B/JESD36 (2.7 V to 3.6 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
ESD protection:
u HBM JESD22-A114E exceeds 2000 V
u MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from −40 °C to +85 °C and −40 °C to +125 °C
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC2G32DP
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G32DC
−40 °C to +125 °C
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
74LVC2G32GT
−40 °C to +125 °C
XSON8
plastic extremely thin small outline package; no leads; SOT833-1
8 terminals; body 1 × 1.95 × 0.5 mm
74LVC2G32GD
−40 °C to +125 °C
XSON8U
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
74LVC2G32GM
−40 °C to +125 °C
XQFN8U
plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm
SOT902-1
4. Marking
Table 2.
Marking codes
Type number
Marking code
74LVC2G32DP
V32
74LVC2G32DC
V32
74LVC2G32GT
V32
74LVC2G32GD
V32
74LVC2G32GM
V32
5. Functional diagram
≥1
1A
1B
2A
2B
1Y
≥1
2Y
001aah792
001aah791
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
B
Y
A
mna166
Fig 3.
Logic diagram (one gate)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
2 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
6. Pinning information
6.1 Pinning
74LVC2G32
1A
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
74LVC2G32
1A
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
001aab743
Transparent top view
001aab742
Fig 4.
Pin configuration SOT505-2 (TSSOP8) and
SOT765-1 (VSSOP8)
Fig 5.
Pin configuration SOT833-1 (XSON8)
74LVC2G32
74LVC2G32
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
1
2B
2A
8
1Y
7
1A
2
6
1B
3
5
2Y
GND
4
1A
VCC
terminal 1
index area
001aai244
Transparent top view
Fig 6.
001aae994
Transparent top view
Pin configuration SOT996-2 (XSON8U)
Fig 7.
Pin configuration SOT902-1 (XQFN8U)
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
SOT505-2, SOT765-1,
SOT833-1 and SOT996-2
Description
SOT902-1
1A, 2A
1, 5
7, 3
data input
1B, 2B
2, 6
6, 2
data input
GND
4
4
ground (0 V)
1Y, 2Y
7, 3
1, 5
data output
VCC
8
8
supply voltage
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
3 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
7. Functional description
Table 4.
Function table [1]
Input
Output
nA
nB
nY
L
L
L
L
H
H
H
L
H
H
H
H
[1]
H = HIGH voltage level; L = LOW voltage level.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
VO
output voltage
Conditions
Min
Max
Unit
−0.5
+6.5
V
[1]
−0.5
+6.5
V
Active mode
[1]
−0.5
VCC + 0.5
V
Power-down mode
[2]
−0.5
+6.5
V
IIK
input clamping current
VI < 0 V
−50
-
mA
IOK
output clamping current
VO < 0 V or VO > VCC
-
±50
mA
IO
output current
VO = 0 V to VCC
-
±50
mA
ICC
supply current
-
100
mA
IGND
ground current
−100
-
mA
Tstg
storage temperature
−65
+150
°C
-
300
mW
total power dissipation
Ptot
Tamb = −40 °C to +125 °C
[3]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal condition.
[3]
For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K.
For XSON8, XSON8U and XQFN8U packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
4 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
9. Recommended operating conditions
Table 6.
Operating conditions
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
1.65
5.5
V
VI
input voltage
0
5.5
V
VO
output voltage
Active mode
0
VCC
V
Power-down mode
0
5.5
V
−40
+125
°C
VCC = 1.65 V to 2.7 V
-
20
ns/V
VCC = 2.7 V to 5.5 V
-
10
ns/V
Tamb
ambient temperature
∆t/∆V
input transition rise and fall rate
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = −40 °C to +85
VIH
VIL
VOH
VOL
Conditions
Min
VCC = 1.65 V to 1.95 V
Typ
Max
Unit
0.65 × VCC -
-
V
°C[1]
HIGH-level input voltage
LOW-level input voltage
VCC = 2.3 V to 2.7 V
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
V
VCC = 4.5 V to 5.5 V
0.7 × VCC
-
-
V
VCC = 1.65 V to 1.95 V
-
-
0.35 × VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
V
VCC = 4.5 V to 5.5 V
-
-
0.3 × VCC
V
IO = −100 µA; VCC = 1.65 V to 5.5 V
VCC − 0.1
-
-
V
IO = −4 mA; VCC = 1.65 V
1.2
1.53
-
V
IO = −8 mA; VCC = 2.3 V
1.9
2.13
-
V
IO = −12 mA; VCC = 2.7 V
2.2
2.50
-
V
IO = −24 mA; VCC = 3.0 V
2.3
2.60
-
V
IO = −32 mA; VCC = 4.5 V
3.8
4.10
-
V
-
-
0.1
V
HIGH-level output voltage VI = VIH or VIL
LOW-level output voltage
VI = VIH or VIL
IO = 100 µA; VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
-
0.08
0.45
V
IO = 8 mA; VCC = 2.3 V
-
0.14
0.3
V
IO = 12 mA; VCC = 2.7 V
-
0.19
0.4
V
IO = 24 mA; VCC = 3.0 V
-
0.37
0.55
V
IO = 32 mA; VCC = 4.5 V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
IOFF
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
74LVC2G32_7
Product data sheet
-
0.43
0.55
V
-
±0.1
±5
µA
-
±0.1
±10
µA
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
5 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
ICC
supply current
VI = 5.5 V or GND;
VCC = 1.65 V to 5.5 V; IO = 0 A
-
0.1
10
µA
∆ICC
additional supply current
per pin; VI = VCC − 0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
5
500
µA
Ci
input capacitance
-
2.5
-
pF
Tamb = −40 °C to +125 °C
HIGH-level input voltage
VIH
LOW-level input voltage
VIL
VOH
0.65 × VCC -
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
V
VCC = 4.5 V to 5.5 V
0.7 × VCC
-
-
V
VCC = 1.65 V to 1.95 V
-
-
0.35 × VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
V
VCC = 4.5 V to 5.5 V
-
-
0.3 × VCC
V
IO = −100 µA; VCC = 1.65 V to 5.5 V
VCC − 0.1
-
-
V
IO = −4 mA; VCC = 1.65 V
0.95
-
-
V
IO = −8 mA; VCC = 2.3 V
1.7
-
-
V
IO = −12 mA; VCC = 2.7 V
1.9
-
-
V
IO = −24 mA; VCC = 3.0 V
2.0
-
-
V
IO = −32 mA; VCC = 4.5 V
3.4
-
-
V
HIGH-level output voltage VI = VIH or VIL
LOW-level output voltage
VOL
VCC = 1.65 V to 1.95 V
VI = VIH or VIL
IO = 100 µA; VCC = 1.65 V to 5.5 V
-
-
0.1
V
IO = 4 mA; VCC = 1.65 V
-
-
0.70
V
IO = 8 mA; VCC = 2.3 V
-
-
0.45
V
IO = 12 mA; VCC = 2.7 V
-
-
0.60
V
IO = 24 mA; VCC = 3.0 V
-
-
0.80
V
IO = 32 mA; VCC = 4.5 V
-
-
0.80
V
-
-
±20
µA
II
input leakage current
IOFF
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
-
-
±20
µA
ICC
supply current
VI = 5.5 V or GND;
VCC = 1.65 V to 5.5 V; IO = 0 A
-
-
40
µA
∆ICC
additional supply current
per pin; VI = VCC − 0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
-
5000
µA
[1]
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
All typical values are measured at Tamb = 25 °C.
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
6 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground 0 V); for test circuit see Figure 9.
Symbol Parameter
−40 °C to +85 °C
Conditions
Min
Max
Min
Max
VCC = 1.65 V to 1.95 V
1.3
3.9
8.8
1.3
11
ns
VCC = 2.3 V to 2.7 V
0.8
2.4
4.7
0.8
5.9
ns
VCC = 2.7 V
0.8
2.7
4.8
0.8
6.0
ns
VCC = 3.0 V to 3.6 V
0.9
2.2
4.2
0.9
5.3
ns
VCC = 4.5 V to 5.5 V
0.7
1.7
3.2
0.7
4.0
ns
-
14
-
-
-
pF
[2]
propagation delay nA, nB to nY; see Figure 8
tpd
power dissipation
capacitance
CPD
−40 °C to +125 °C Unit
Typ[1]
[3]
per gate; VI = GND to VCC
[1]
Typical values are measured at nominal VCC and at Tamb = 25 °C.
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of outputs.
12. Waveforms
VI
VM
nA, nB input
GND
t PHL
t PLH
VOH
VM
nY output
VOL
mna224
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8.
Input (nA, nB) to output (nY) propagation delays
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
7 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
1.65 V to 1.95 V
0.5VCC
0.5VCC
2.3 V to 2.7 V
0.5VCC
0.5VCC
2.7 V
1.5 V
1.5 V
3.0 V to 3.6 V
1.5 V
1.5 V
4.5 V to 5.5 V
0.5VCC
0.5VCC
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VCC
VI
PULSE
GENERATOR
RL
VO
DUT
RT
CL
RL
001aae235
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistor
CL = Load capacitance including jig and probe capacitance
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
VEXT = Test voltage for switching times
Fig 9.
Table 10.
Load circuitry for switching times
Test data
Supply voltage
Input
VCC
VI
tr, tf
Load
CL
RL
VEXT
tPLH, tPHL
1.65 V to 1.95 V
VCC
≤ 2.0 ns
30 pF
1 kΩ
open
2.3 V to 2.7 V
VCC
≤ 2.0 ns
30 pF
500 Ω
open
2.7 V
2.7 V
≤ 2.5 ns
50 pF
500 Ω
open
3.0 V to 3.6 V
2.7 V
≤ 2.5 ns
50 pF
500 Ω
open
4.5 V to 5.5 V
VCC
≤ 2.5 ns
50 pF
500 Ω
open
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
8 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 10. Package outline SOT505-2 (TSSOP8)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
9 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 11. Package outline SOT765-1 (VSSOP8)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
10 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Fig 12. Package outline SOT833-1 (XSON8)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
11 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
B
D
SOT996-2
A
A
E
A1
detail X
terminal 1
index area
e1
v
w
b
e
L1
1
4
8
5
C
C A B
C
M
M
y
y1 C
L2
L
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
L
L1
L2
v
w
y
y1
mm
0.5
0.05
0.00
0.35
0.15
2.1
1.9
3.1
2.9
0.5
1.5
0.5
0.3
0.15
0.05
0.6
0.4
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT996-2
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-12-18
07-12-21
Fig 13. Package outline SOT996-2 (XSON8U)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
12 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
XQFN8U: plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
B
D
SOT902-1
A
terminal 1
index area
E
A
A1
detail X
L1
e
e
C
∅v M C A B
∅w M C
L
4
y1 C
y
5
3
metal area
not for soldering
e1
b
2
6
e1
7
1
terminal 1
index area
8
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
1.65
1.55
1.65
1.55
0.55
0.5
0.35
0.25
0.15
0.05
0.1
0.05
0.05
0.05
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT902-1
---
MO-255
---
EUROPEAN
PROJECTION
ISSUE DATE
05-11-25
07-11-14
Fig 14. Package outline SOT902-1 (XQFN8U)
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
13 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC2G32_7
20080606
Product data sheet
-
74LVC2G32_6
Modifications:
•
Added type number 74LVC2G32GD (XSON8U package)
74LVC2G32_6
20080227
Product data sheet
-
74LVC2G32_5
74LVC2G32_5
20070904
Product data sheet
-
74LVC2G32_4
74LVC2G32_4
20060515
Product data sheet
-
74LVC2G32_3
74LVC2G32_3
20050201
Product specification
-
74LVC2G32_2
74LVC2G32_2
20040922
Product specification
-
74LVC2G32_1
74LVC2G32_1
20031027
Product specification
-
-
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
14 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74LVC2G32_7
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 07 — 6 June 2008
15 of 16
74LVC2G32
NXP Semiconductors
Dual 2-input OR gate
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 June 2008
Document identifier: 74LVC2G32_7