PHILIPS LPC2290

LPC2290
16/32-bit ARM microcontroller with CAN, 10-bit ADC and
external memory interface
Rev. 03 — 16 November 2006
Product data sheet
1. General description
The LPC2290 microcontroller is based on a 16/32-bit ARM7TDMI-S CPU with real-time
emulation and embedded trace support. For critical code size applications, the alternative
16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
With its 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit
ADC, two advanced CAN channels, PWM channels and up to nine external interrupt pins
this microcontroller is particularly suitable for automotive and industrial control
applications as well as medical systems and fault-tolerant maintenance buses. The
LPC2290 provides up to 76 GPIOs depending on bus configuration. With a wide range of
additional serial communications interfaces, it is also suited for communication gateways
and protocol converters as well as many other general-purpose applications.
Remark: Throughout the data sheet, the term ‘LPC2290’ will apply to devices with and
without the /01 suffix. New devices will use the /01 suffix to differentiate from the original
devices only when necessary.
2. Features
2.1 Enhancements introduced with LPC2290/01 device
n CPU clock up to 72 MHz and 64 kB of on-chip static RAM.
n Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original
LPC2290. A port pin can be read at any time regardless of its function.
n Dedicated result registers for ADC reduce interrupt overhead.
n UART0/1 include fractional baud rate generator, auto-bauding capabilities and
handshake flow-control fully implemented in hardware.
n SSP serial controller supporting SPI, 4-wire SSI, and Microwire buses.
2.2 Key features common for LPC2290 and LPC2290/01
n 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 package.
n 16/64 kB on-chip static RAM.
n Serial bootloader using UART0 provides in-system download and programming
capabilities.
n EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software as well as high-speed real-time tracing of instruction
execution.
n Two interconnected CAN interfaces with advanced acceptance filters. Additional serial
interfaces include two UARTs (16C550), Fast I2C-bus (400 kbit/s) and two SPIs.
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
n Eight channel 10-bit ADC with conversion time as low as 2.44 µs.
n Two 32-bit timers (with four capture and four compare channels), PWM unit (six
outputs), Real-Time Clock (RTC) and watchdog.
n Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
n Configurable external memory interface with up to four banks, each up to 16 MB and
8/16/32-bit data width.
n Up to 76 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive
external interrupt pins available.
n 60/72 MHz maximum CPU clock available from programmable on-chip PLL with
settling time of 100 µs.
n On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz.
n Power saving modes include Idle and Power-down.
n Processor wake-up from Power-down mode via external interrupt.
n Individual enable/disable of peripheral functions for power optimization.
n Dual power supply:
u CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V).
u I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads.
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2290FBD144
LQFP144
plastic low profile quad flat package;
144 leads; body 20 × 20 × 1.4 mm
SOT486-1
LPC2290FBD144/01
LQFP144
plastic low profile quad flat package;
144 leads; body 20 × 20 × 1.4 mm
SOT486-1
3.1 Ordering options
Table 2.
Ordering options
Type number
RAM
CAN
LPC2290FBD144
16 kB
2 channels None
−40 °C to +85 °C
2 channels Higher CPU clock, more
on-chip SRAM, Fast I/Os,
improved UARTs, added SSP,
upgraded ADC
−40 °C to +85 °C
LPC2290FBD144/01 64 kB
Enhancements
LPC2290_3
Product data sheet
Temperature range
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
2 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
4. Block diagram
TMS(1) TDI(1)
TRST(1) TCK(1) TDO(1)
EMULATION TRACE
MODULE
TEST/DEBUG
INTERFACE
LPC2290
LPC2290/01
ARM7TDMI-S
P0[31:0]
P1[31:16], P1[1:0]
FAST GENERAL
PURPOSE I/O(3)
XTAL2
RST
XTAL1
AHB BRIDGE
ARM7 local
bus
SYSTEM
FUNCTIONS
PLL
system
clock
VECTORED
INTERRUPT
CONTROLLER
AMBA Advanced High-performance
Bus(AHB)
INTERNAL
SRAM
CONTROLLER
16/64 kB
SRAM
AHB
DECODER
AHB TO APB
BRIDGE
APB
DIVIDER
CS3 to CS0(2)
A23 to A0(2)
BLS3 to BLS0(2)
OE, WE(2)
D31 to D0(2)
EXTERNAL MEMORY
CONTROLLER
Advanced
Peripheral Bus
(APB)
EINT3 to EINT0
EXTERNAL
INTERRUPTS
I2C-BUS SERIAL
INTERFACE
CAPTURE/
COMPARE
TIMER 0/TIMER 1
SPI AND SSP(3)
SERIAL INTERFACES
0 AND 1
SCL
SDA
SCK0, SCK1
4 × CAP0
4 × CAP1
4 × MAT0
4 × MAT1
MOSI0, MOSI1
MISO0, MISO1
SSEL0, SSEL1
TXD0, TXD1
AIN3 to AIN0
A/D CONVERTER
UART0/UART1
GENERAL
PURPOSE I/O
CAN
PWM0
WATCHDOG
TIMER
REAL-TIME CLOCK
SYSTEM
CONTROL
RXD0, RXD1
DSR1, CTS1,
DCD1, RI1
AIN7 to AIN4
P0[30:0]
P1[31:16], P1[1:0]
P2[31:0]
TD2, TD1
RD2, RD1
P3[31:0]
PWM6 to PWM1
002aaa796
(1) When test/debug interface is used, GPIO/other functions sharing these pins are not available.
(2) Pins shared with GPIO.
(3) Available in LPC2290/01 only.
Fig 1. Block diagram
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
3 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
5. Pinning information
109
144
5.1 Pinning
1
108
LPC2290
72
73
37
36
002aaa797
Fig 2. LQFP144 pinning
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
4 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
5.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0.0 to P0.31
Type
Description
I/O
Port 0: Port 0 is a 32-bit bidirectional I/O port with individual direction controls
for each bit. The operation of port 0 pins depends upon the pin function
selected via the Pin Connect Block.
Pins 26 and 31 of port 0 are not available.
P0.0/TXD0/
PWM1
P0.1/RXD0/
PWM3/EINT0
42[1]
49[2]
P0.2/SCL/
CAP0.0
50[3]
P0.3/SDA/
MAT0.0/EINT1
58[3]
P0.4/SCK0/
CAP0.1
59[1]
P0.5/MISO0/
MAT0.1
61[1]
P0.6/MOSI0/
CAP0.2
68[1]
P0.7/SSEL0/
PWM2/EINT2
69[2]
P0.8/TXD1/
PWM4
75[1]
I/O
P0.0 — General purpose digital input/output pin.
O
TXD0 — Transmitter output for UART0.
O
PWM1 — Pulse Width Modulator output 1.
I/O
P0.1 — General purpose digital input/output pin.
I
RXD0 — Receiver input for UART0.
O
PWM3 — Pulse Width Modulator output 3.
I
EINT0 — External interrupt 0 input
I/O
P0.2 — General purpose digital input/output pin.
I/O
SCL — I2C-bus clock input/output. Open-drain output (for I2C-bus
compliance).
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
P0.3 — General purpose digital input/output pin.
I/O
SDA — I2C-bus data input/output. Open-drain output (for I2C-bus
compliance).
O
MAT0.0 — Match output for Timer 0, channel 0.
I
EINT1 — External interrupt 1 input.
I/O
P0.4 — General purpose digital input/output pin.
I/O
SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.
I
CAP0.1 — Capture input for Timer 0, channel 1.
I/O
P0.5 — General purpose digital input/output pin.
I/O
MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data
output from SPI slave.
O
MAT0.1 — Match output for Timer 0, channel 1.
I/O
P0.6 — General purpose digital input/output pin.
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data
input to SPI slave.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I/O
P0.7 — General purpose digital input/output pin.
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O
PWM2 — Pulse Width Modulator output 2.
I
EINT2 — External interrupt 2 input.
I/O
P0.8 — General purpose digital input/output pin.
O
TXD1 — Transmitter output for UART1.
O
PWM4 — Pulse Width Modulator output 4.
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
5 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.9/RXD1/
PWM6/EINT3
76[2]
I/O
P0.9 — General purpose digital input/output pin.
I
RXD1 — Receiver input for UART1.
O
PWM6 — Pulse Width Modulator output 6.
I
EINT3 — External interrupt 3 input.
I/O
P0.10 — General purpose digital input/output pin.
O
RTS1 — Request to Send output for UART1.
I
CAP1.0 — Capture input for Timer 1, channel 0.
P0.10/RTS1/
CAP1.0
78[1]
P0.11/CTS1/
CAP1.1
83[1]
P0.12/DSR1/
MAT1.0
84[1]
P0.13/DTR1/
MAT1.1
85[1]
P0.14/DCD1/
EINT1
92[2]
I/O
P0.11 — General purpose digital input/output pin.
I
CTS1 — Clear to Send input for UART1.
I
CAP1.1 — Capture input for Timer 1, channel 1.
I/O
P0.12 — General purpose digital input/output pin.
I
DSR1 — Data Set Ready input for UART1.
O
MAT1.0 — Match output for Timer 1, channel 0.
I/O
P0.13 — General purpose digital input/output pin.
O
DTR1 — Data Terminal Ready output for UART1.
O
MAT1.1 — Match output for Timer 1, channel 1.
I/O
P0.14 — General purpose digital input/output pin.
I
DCD1 — Data Carrier Detect input for UART1.
I
EINT1 — External interrupt 1 input.
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take
over control of the part after reset.
P0.15/RI1/
EINT2
99[2]
P0.16/EINT0/
100[2]
MAT0.2/CAP0.2
P0.17/CAP1.2/
SCK1/MAT1.2
P0.18/CAP1.3/
MISO1/MAT1.3
101[1]
121[1]
I/O
P0.15 — General purpose digital input/output pin.
I
RI1 — Ring Indicator input for UART1.
I
EINT2 — External interrupt 2 input.
I/O
P0.16 — General purpose digital input/output pin.
I
EINT0 — External interrupt 0 input.
O
MAT0.2 — Match output for Timer 0, channel 2.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I/O
P0.17 — General purpose digital input/output pin.
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
SCK1 — Serial Clock for SPI1/SSP. SPI clock output from master or input to
slave (SSP is available in LPC2290/01 only).
O
MAT1.2 — Match output for Timer 1, channel 2.
I/O
P0.18 — General purpose digital input/output pin.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
MISO1 — Master In Slave Out for SPI1/SSP. Data input to SPI master or data
output from SPI slave (SSP is available in LPC2290/01 only).
O
MAT1.3 — Match output for Timer 1, channel 3.
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
6 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.19/MAT1.2/
MOSI1/CAP1.2
122[1]
I/O
P0.19 — General purpose digital input/output pin.
O
MAT1.2 — Match output for Timer 1, channel 2.
I/O
MOSI1 — Master Out Slave In for SPI1/SSP. Data output from SPI master or
data input to SPI slave (SSP is available in LPC2290/01 only).
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
P0.20 — General purpose digital input/output pin.
O
MAT1.3 — Match output for Timer 1, channel 3.
I
SSEL1 — Slave Select for SPI1/SSP. Selects the SPI interface as a slave
(SSP is available in LPC2290/01 only).
I
EINT3 — External interrupt 3 input.
I/O
P0.21 — General purpose digital input/output pin.
O
PWM5 — Pulse Width Modulator output 5.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
P0.22 — General purpose digital input/output pin.
I
CAP0.0 — Capture input for Timer 0, channel 0.
O
MAT0.0 — Match output for Timer 0, channel 0.
I/O
P0.23 — General purpose digital input/output pin.
I
RD2 — CAN2 receiver input.
I/O
P0.24 — General purpose digital input/output pin.
O
TD2 — CAN2 transmitter output.
I/O
P0.25 — General purpose digital input/output pin.
I
RD1 — CAN1 receiver input.
I/O
P0.27 — General purpose digital input/output pin.
P0.20/MAT1.3/
SSEL1/EINT3
P0.21/PWM5/
CAP1.3
123[2]
4[1]
P0.22/CAP0.0/
MAT0.0
5[1]
P0.23/RD2
6[1]
P0.24/TD2
8[1]
P0.25
21[1]
P0.27/AIN0/
CAP0.1/MAT0.1
23[4]
P0.28/AIN1/
CAP0.2/MAT0.2
P0.29/AIN2/
CAP0.3/MAT0.3
P0.30/AIN3/
EINT3/CAP0.0
P1.0 to P1.31
25[4]
32[4]
33[4]
I
AIN0 — ADC, input 0. This analog input is always connected to its pin.
I
CAP0.1 — Capture input for Timer 0, channel 1.
O
MAT0.1 — Match output for Timer 0, channel 1.
I/O
P0.28 — General purpose digital input/output pin.
I
AIN1 — ADC, input 1. This analog input is always connected to its pin.
I
CAP0.2 — Capture input for Timer 0, channel 2.
O
MAT0.2 — Match output for Timer 0, channel 2.
I/O
P0.29 — General purpose digital input/output pin.
I
AIN2 — ADC, input 2. This analog input is always connected to its pin.
I
CAP0.3 — Capture input for Timer 0, Channel 3.
O
MAT0.3 — Match output for Timer 0, channel 3.
I/O
P0.30 — General purpose digital input/output pin.
I
AIN3 — ADC, input 3. This analog input is always connected to its pin.
I
EINT3 — External interrupt 3 input.
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls
for each bit. The operation of port 1 pins depends upon the pin function
selected via the Pin Connect Block.
Pins 2 through 15 of port 1 are not available.
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
7 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1.0/CS0
91[5]
I/O
P1.0 — General purpose digital input/output pin.
O
CS0 — LOW-active Chip Select 0 signal.
I/O
P1.1 — General purpose digital input/output pin.
O
OE — LOW-active Output Enable signal.
I/O
P1.16 — General purpose digital input/output pin.
O
TRACEPKT0 — Trace Packet, bit 0. Standard I/O port with internal pull-up.
I/O
P1.17 — General purpose digital input/output pin.
O
TRACEPKT1 — Trace Packet, bit 1. Standard I/O port with internal pull-up.
I/O
P1.18 — General purpose digital input/output pin.
O
TRACEPKT2 — Trace Packet, bit 2. Standard I/O port with internal pull-up.
I/O
P1.19 — General purpose digital input/output pin.
O
TRACEPKT3 — Trace Packet, bit 3. Standard I/O port with internal pull-up.
I/O
P1.20 — General purpose digital input/output pin.
O
TRACESYNC — Trace Synchronization. Standard I/O port with internal
pull-up.
(Bank 0 addresses range 0x8000 0000 to 0x80FF FFFF)
P1.1/OE
90[5]
P1.16/
TRACEPKT0
34[5]
P1.17/
TRACEPKT1
24[5]
P1.18/
TRACEPKT2
15[5]
P1.19/
TRACEPKT3
7[5]
P1.20/
TRACESYNC
102[5]
Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to
operate as Trace port after reset.
P1.21/
PIPESTAT0
95[5]
P1.22/
PIPESTAT1
86[5]
P1.23/
PIPESTAT2
82[5]
P1.24/
TRACECLK
70[5]
P1.25/EXTIN0
60[5]
P1.26/RTCK
52[5]
I/O
P1.21 — General purpose digital input/output pin.
O
PIPESTAT0 — Pipeline Status, bit 0. Standard I/O port with internal pull-up.
I/O
P1.22 — General purpose digital input/output pin.
O
PIPESTAT1 — Pipeline Status, bit 1. Standard I/O port with internal pull-up.
I/O
P1.23 — General purpose digital input/output pin.
O
PIPESTAT2 — Pipeline Status, bit 2. Standard I/O port with internal pull-up.
I/O
P1.24 — General purpose digital input/output pin.
O
TRACECLK — Trace Clock. Standard I/O port with internal pull-up.
I/O
P1.25 — General purpose digital input/output pin.
I
EXTIN0 — External Trigger Input. Standard I/O with internal pull-up.
I/O
P1.26 — General purpose digital input/output pin.
I/O
RTCK — Returned Test Clock output. Extra signal added to the JTAG port.
Assists debugger synchronization when processor frequency varies.
Bidirectional pin with internal pull-up.
Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to
operate as Debug port after reset.
P1.27/TDO
144[5]
P1.28/TDI
140[5]
P1.29/TCK
126[5]
P1.30/TMS
113[5]
I/O
P1.27 — General purpose digital input/output pin.
O
TDO — Test Data out for JTAG interface.
I/O
P1.28 — General purpose digital input/output pin.
I
TDI — Test Data in for JTAG interface.
I/O
P1.29 — General purpose digital input/output pin.
I
TCK — Test Clock for JTAG interface.
I/O
P1.30 — General purpose digital input/output pin.
I
TMS — Test Mode Select for JTAG interface.
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
8 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1.31/TRST
43[5]
I/O
P1.31 — General purpose digital input/output pin.
I
TRST — Test Reset for JTAG interface.
I/O
Port 2 — Port 2 is a 32-bit bidirectional I/O port with individual direction
controls for each bit. The operation of port 2 pins depends upon the pin
function selected via the Pin Connect Block.
I/O
P2.0 — General purpose digital input/output pin.
I/O
D0 — External memory data line 0.
P2.0 to P2.31
P2.0/D0
98[5]
P2.1/D1
105[5]
P2.2/D2
106[5]
P2.3/D3
108[5]
P2.4/D4
109[5]
P2.5/D5
114[5]
P2.6/D6
115[5]
P2.7/D7
116[5]
P2.8/D8
117[5]
P2.9/D9
118[5]
P2.10/D10
120[5]
P2.11/D11
124[5]
P2.12/D12
125[5]
P2.13/D13
127[5]
P2.14/D14
129[5]
P2.15/D15
130[5]
P2.16/D16
131[5]
P2.17/D17
132[5]
I/O
P2.1 — General purpose digital input/output pin.
I/O
D1 — External memory data line 1.
I/O
P2.2 — General purpose digital input/output pin.
I/O
D2 — External memory data line 2.
I/O
P2.3 — General purpose digital input/output pin.
I/O
D3 — External memory data line 3.
I/O
P2.4 — General purpose digital input/output pin.
I/O
D4 — External memory data line 4.
I/O
P2.5 — General purpose digital input/output pin.
I/O
D5 — External memory data line 5.
I/O
P2.6 — General purpose digital input/output pin.
I/O
D6 — External memory data line 6.
I/O
P2.7 — General purpose digital input/output pin.
I/O
D7 — External memory data line 7.
I/O
P2.8 — General purpose digital input/output pin.
I/O
D8 — External memory data line 8.
I/O
P2.9 — General purpose digital input/output pin.
I/O
D9 — External memory data line 9.
I/O
P2.10 — General purpose digital input/output pin.
I/O
D10 — External memory data line 10.
I/O
P2.11 — General purpose digital input/output pin.
I/O
D11 — External memory data line 11.
I/O
P2.12 — General purpose digital input/output pin.
I/O
D12 — External memory data line 12.
I/O
P2.13 — General purpose digital input/output pin.
I/O
D13 — External memory data line 13.
I/O
P2.14 — General purpose digital input/output pin.
I/O
D14 — External memory data line 14.
I/O
P2.15 — General purpose digital input/output pin.
I/O
D15 — External memory data line 15.
I/O
P2.16 — General purpose digital input/output pin.
I/O
D16 — External memory data line 16.
I/O
P2.17 — General purpose digital input/output pin.
I/O
D17 — External memory data line 17.
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
9 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P2.18/D18
133[5]
I/O
P2.18 — General purpose digital input/output pin.
I/O
D18 — External memory data line 18.
P2.19/D19
134[5]
I/O
P2.19 — General purpose digital input/output pin.
I/O
D19 — External memory data line 19.
P2.20/D20
136[5]
I/O
P2.20 — General purpose digital input/output pin.
I/O
D20 — External memory data line 20.
P2.21/D21
137[5]
I/O
P2.21 — General purpose digital input/output pin.
I/O
D21 — External memory data line 21.
P2.22/D22
1[5]
I/O
P2.22 — General purpose digital input/output pin.
I/O
D22 — External memory data line 22.
P2.23/D23
10[5]
I/O
P2.23 — General purpose digital input/output pin.
I/O
D23 — External memory data line 23.
P2.24/D24
11[5]
I/O
P2.24 — General purpose digital input/output pin.
I/O
D24 — External memory data line 24.
P2.25/D25
12[5]
I/O
P2.25 — General purpose digital input/output pin.
I/O
D25 — External memory data line 25.
P2.26/D26/
BOOT0
13[5]
I/O
P2.26 — General purpose digital input/output pin.
I/O
D26 — External memory data line 26.
I
BOOT0 — While RESET is low, together with BOOT1 controls booting and
internal operation. Internal pull-up ensures high state if pin is left
unconnected.
I/O
P2.27 — General purpose digital input/output pin.
I/O
D27 — External memory data line 27.
I
BOOT1 — While RESET is low, together with BOOT0 controls booting and
internal operation. Internal pull-up ensures high state if pin is left
unconnected.
P2.27/D27/
BOOT1
16[5]
BOOT1:0 = 00 selects 8-bit memory on CS0 for boot.
BOOT1:0 = 01 selects 16-bit memory on CS0 for boot.
BOOT1:0 = 10 selects 32-bit memory on CS0 for boot.
BOOT1:0 = 11 selects internal flash memory.
P2.28/D28
17[5]
P2.29/D29
18[5]
P2.30/D30/
AIN4
19[2]
P2.31/D31/
AIN5
P3.0 to P3.31
20[2]
I/O
P2.28 — General purpose digital input/output pin.
I/O
D28 — External memory data line 28.
I/O
P2.29 — General purpose digital input/output pin.
I/O
D29 — External memory data line 29.
I/O
P2.30 — General purpose digital input/output pin.
I/O
D30 — External memory data line 30.
I
AIN4 — ADC, input 4. This analog input is always connected to its pin.
I/O
P2.31 — General purpose digital input/output pin.
I/O
D31 — External memory data line 31.
I
AIN5 — ADC, input 5. This analog input is always connected to its pin.
I/O
Port 3 — Port 3 is a 32-bit bidirectional I/O port with individual direction
controls for each bit. The operation of port 3 pins depends upon the pin
function selected via the Pin Connect Block.
LPC2290_3
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P3.0/A0
89[5]
I/O
P3.0 — General purpose digital input/output pin.
O
A0 — External memory address line 0.
P3.1/A1
88[5]
I/O
P3.1 — General purpose digital input/output pin.
O
A1 — External memory address line 1.
P3.2/A2
87[5]
I/O
P3.2 — General purpose digital input/output pin.
O
A2 — External memory address line 2.
P3.3/A3
81[5]
I/O
P3.3 — General purpose digital input/output pin.
O
A3 — External memory address line 3.
P3.4/A4
80[5]
I/O
P3.4 — General purpose digital input/output pin.
O
A4 — External memory address line 4.
P3.5/A5
74[5]
I/O
P3.5 — General purpose digital input/output pin.
O
A5 — External memory address line 5.
P3.6/A6
73[5]
I/O
P3.6 — General purpose digital input/output pin.
O
A6 — External memory address line 6.
P3.7/A7
72[5]
I/O
P3.7 — General purpose digital input/output pin.
O
A7 — External memory address line 7.
P3.8/A8
71[5]
I/O
P3.8 — General purpose digital input/output pin.
O
A8 — External memory address line 8.
P3.9/A9
66[5]
I/O
P3.9 — General purpose digital input/output pin.
O
A9 — External memory address line 9.
P3.10/A10
65[5]
I/O
P3.10 — General purpose digital input/output pin.
O
A10 — External memory address line 10.
P3.11/A11
64[5]
I/O
P3.11 — General purpose digital input/output pin.
O
A11 — External memory address line 11.
P3.12/A12
63[5]
I/O
P3.12 — General purpose digital input/output pin.
O
A12 — External memory address line 12.
P3.13/A13
62[5]
I/O
P3.13 — General purpose digital input/output pin.
O
A13 — External memory address line 13.
P3.14/A14
56[5]
I/O
P3.14 — General purpose digital input/output pin.
O
A14 — External memory address line 14.
P3.15/A15
55[5]
I/O
P3.15 — General purpose digital input/output pin.
O
A15 — External memory address line 15.
P3.16/A16
53[5]
I/O
P3.16 — General purpose digital input/output pin.
O
A16 — External memory address line 16.
P3.17/A17
48[5]
I/O
P3.17 — General purpose digital input/output pin.
O
A17 — External memory address line 17.
P3.18/A18
47[5]
I/O
P3.18 — General purpose digital input/output pin.
O
A18 — External memory address line 18.
P3.19/A19
46[5]
I/O
P3.19 — General purpose digital input/output pin.
O
A19 — External memory address line 19.
LPC2290_3
Product data sheet
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Rev. 03 — 16 November 2006
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P3.20/A20
45[5]
I/O
P3.20 — General purpose digital input/output pin.
O
A20 — External memory address line 20.
P3.21/A21
44[5]
I/O
P3.21 — General purpose digital input/output pin.
O
A21 — External memory address line 21.
P3.22/A22
41[5]
I/O
P3.22 — General purpose digital input/output pin.
O
A22 — External memory address line 22.
P3.23/A23/
XCLK
40[5]
I/O
P3.23 — General purpose digital input/output pin.
I/O
A23 — External memory address line 23.
O
XCLK — Clock output.
I/O
P3.24 — General purpose digital input/output pin.
O
CS3 — LOW-active Chip Select 3 signal.
P3.24/CS3
36[5]
(Bank 3 addresses range 0x8300 0000 to 0x83FF FFFF)
P3.25/CS2
35[5]
I/O
P3.25 — General purpose digital input/output pin.
O
CS2 — LOW-active Chip Select 2 signal.
(Bank 2 addresses range 0x8200 0000 to 0x82FF FFFF)
P3.26/CS1
30[5]
I/O
P3.26 — General purpose digital input/output pin.
O
CS1 — LOW-active Chip Select 1 signal.
(Bank 1 addresses range 0x8100 0000 to 0x81FF FFFF)
P3.27/WE
29[5]
P3.28/BLS3/
AIN7
28[2]
P3.29/BLS2/
AIN6
27[4]
P3.30/BLS1
97[4]
P3.31/BLS0
96[4]
I/O
P3.27 — General purpose digital input/output pin.
O
WE — LOW-active Write enable signal.
I/O
P3.28 — General purpose digital input/output pin.
O
BLS3 — LOW-active Byte Lane Select signal (Bank 3).
I
AIN7 — ADC, input 7. This analog input is always connected to its pin.
I/O
P3.29 — General purpose digital input/output pin.
O
BLS2 — LOW-active Byte Lane Select signal (Bank 2).
I
AIN6 — ADC, input 6. This analog input is always connected to its pin.
I/O
P3.30 — General purpose digital input/output pin.
O
BLS1 — LOW-active Byte Lane Select signal (Bank 1).
I/O
P3.31 — General purpose digital input/output pin.
O
BLS0 — LOW-active Byte Lane Select signal (Bank 0).
TD1
22[5]
O
TD1: CAN1 transmitter output.
RESET
135[6]
I
External Reset input: A LOW on this pin resets the device, causing I/O ports
and peripherals to take on their default states, and processor execution to
begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
142[7]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
141[7]
O
Output from the oscillator amplifier.
VSS
3, 9, 26, 38, I
54, 67, 79,
93, 103, 107,
111, 128
Ground: 0 V reference.
VSSA
139
Analog ground: 0 V reference. This should nominally be the same voltage
as VSS, but should be isolated to minimize noise and error.
I
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
VSSA(PLL)
138
I
PLL analog ground: 0 V reference. This should nominally be the same
voltage as VSS, but should be isolated to minimize noise and error.
VDD(1V8)
37, 110
I
1.8 V core power supply: This is the power supply voltage for internal
circuitry.
VDDA(1V8)
143
I
Analog 1.8 V core power supply: This is the power supply voltage for
internal circuitry. This should be nominally the same voltage as VDD(1V8) but
should be isolated to minimize noise and error.
VDD(3V3)
2, 31, 39, 51, I
57, 77, 94,
104, 112, 119
3.3 V pad power supply: This is the power supply voltage for the I/O ports.
VDDA(3V3)
14
Analog 3.3 V pad power supply: This should be nominally the same voltage
as VDD(3V3) but should be isolated to minimize noise and error.
I
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[3]
Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality.
[4]
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured
for a digital input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input,
digital section of the pad is disabled.
[5]
5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value ranges from 60 kΩ to 300 kΩ.
[6]
5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
[7]
Pad provides special analog functionality.
LPC2290_3
Product data sheet
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on RISC
principles, and the instruction set and related decode mechanism are much simpler than
those of microprogrammed CISC. This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip SRAM
On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed
as 8-bit, 16-bit, and 32-bit. The LPC2290 provides 16 kB of SRAM and the LPC2290/01
provides 64 kB of SRAM.
6.3 Memory map
The LPC2290 memory maps incorporate several distinct regions, as shown in Figure 3.
In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either
on-chip bootloader, external memory BANK0 or on-chip static RAM. This is described in
Section 6.18 “System control”.
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
3.75 GB
VPB PERIPHERALS
0xF000 0000
0xEFFF FFFF
0xE000 0000
0xDFFF FFFF
3.5 GB
RESERVED ADDRESS SPACE
3.0 GB
0x8400 0000
0x83FF FFFF
EXTERNAL MEMORY BANK3
EXTERNAL MEMORY BANK2
EXTERNAL MEMORY BANK1
EXTERNAL MEMORY BANK0
2.0 GB
BOOT BLOCK (RE-MAPPED FROM
ON-CHIP ROM MEMORY
RESERVED ADDRESS SPACE
0x8300 0000
0x82FF FFFF
0x8200 0000
0x81FF FFFF
0x8100 0000
0x80FF FFFF
0x8000 0000
0x7FFF FFFF
0x7FFF E000
0x7FFF DFFF
0x4001 0000
0x4000 FFFF
64 KBYTE ON-CHIP STATIC RAM (/01 ONLY)
0x4000 4000
0x4000 3FFF
16 KBYTE ON-CHIP STATIC RAM
0x4000 0000
0x3FFF FFFF
1.0 GB
RESERVED ADDRESS SPACE
0x0000 0000
0.0 GB
002aaa798
Fig 3. LPC2290 and LPC2290/01 memory map
6.4 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and
categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and
non-vectored IRQ as defined by programmable settings. The programmable assignment
scheme means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine can simply start dealing with that device. But if more than one
request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC
that identifies which FIQ source(s) is (are) requesting an interrupt.
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16/32-bit ARM microcontroller with external memory interface
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are requesting, the
VIC provides the address of the highest-priority requesting IRQs service routine,
otherwise it provides the address of a default routine that is shared by all the non-vectored
IRQs. The default routine can read another VIC register to see what IRQs are active.
6.4.1 Interrupt sources
Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has
one interrupt line connected to the VIC, but may have several internal interrupt flags.
Individual interrupt flags may also represent more than one interrupt source.
Table 4.
Interrupt sources
Block
Flag(s)
VIC channel #
WDT
Watchdog Interrupt (WDINT)
0
-
Reserved for software interrupts only
1
ARM Core
EmbeddedICE, DbgCommRx
2
ARM Core
EmbeddedICE, DbgCommTx
3
Timer 0
Match 0 to 3 (MR0, MR1, MR2, MR3)
4
Capture 0 to 3 (CR0, CR1, CR2, CR3)
Timer 1
Match 0 to 3 (MR0, MR1, MR2, MR3)
5
Capture 0 to 3 (CR0, CR1, CR2, CR3)
UART0
RX Line Status (RLS)
6
Transmit Holding Register Empty (THRE)
RX Data Available (RDA)
Character Time-out Indicator (CTI)
Auto-Baud Time-Out (ABTO) (available in LPC2290/01 only)
End of Auto-Baud (ABEO)
UART1
RX Line Status (RLS)
7
Transmit Holding Register empty (THRE)
RX Data Available (RDA)
Character Time-out Indicator (CTI)
Modem Status Interrupt (MSI)
Auto-Baud Time-Out (ABTO) (available in LPC2290/01 only)
End of Auto-Baud (ABEO)
PWM0
Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6)
8
I2C-bus
SI (state change)
9
SPI0
SPIF, MODF
10
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16/32-bit ARM microcontroller with external memory interface
Table 4.
Interrupt sources …continued
Block
Flag(s)
VIC channel #
SPI1/SSP
Source: SPI1 SPI Interrupt Flag (SPIF), Mode Fault (MODF)
11
Source: SSP (available in LPC2290/01 only)
TX FIFO at least half empty (TXRIS)
RX FIFO at least half full (RXRIS)
Receive Timeout condition (RTRIS)
Receive Overrun (RORRIS)
PLL
PLL Lock (PLOCK)
12
RTC
RTCCIF (Counter Increment), RTCALF (Alarm)
13
System Control
External Interrupt 0 (EINT0)
14
External Interrupt 1 (EINT1)
15
External Interrupt 2 (EINT2)
16
External Interrupt 3 (EINT3)
17
A/D
ADC
18
CAN
1 ORed CAN Acceptance Filter
19
CAN1 (TX int, RX int)
20, 21
CAN2 (TX int, RX int)
22, 23
6.5 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
6.6 External memory controller
The external Static Memory Controller is a module which provides an interface between
the system bus and external (off-chip) memory devices. It provides support for up to four
independently configurable memory banks (16 MB each with byte lane enable control)
simultaneously. Each memory bank is capable of supporting SRAM, ROM, flash EPROM,
burst ROM memory, or some external I/O devices.
Each memory bank may be 8-bit, 16-bit, or 32-bit wide.
6.7 General purpose parallel I/O and Fast I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
6.7.1 Features
• Direction control of individual bits.
• Separate control of output set and clear.
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16/32-bit ARM microcontroller with external memory interface
• All I/O default to inputs after reset.
6.7.2 Fast I/O features available in LPC2290/01 only
•
•
•
•
Fast I/O registers are located on the ARM local bus for the fastest possible I/O timing.
All GPIO registers are byte addressable.
Entire port value can be written in one instruction.
Mask registers allow single instruction to set or clear any number of bits in one port.
6.8 10-bit ADC
The LPC2290 each contain a single 10-bit successive approximation ADC with eight
multiplexed channels.
6.8.1 Features
•
•
•
•
Measurement range of 0 V to 3.3 V.
Capable of performing more than 400000 10-bit samples per second.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or Timer Match signal.
6.8.2 ADC features available in LPC2290/01 only
• Every analog input has a dedicated result register to reduce interrupt overhead.
• Every analog input can generate an interrupt once the conversion is completed.
6.9 CAN controllers and acceptance filter
The LPC2290 contains two CAN controllers. The CAN is a serial communications protocol
which efficiently supports distributed real-time control with a very high level of security. Its
domain of application ranges from high-speed networks to low cost multiplex wiring.
6.9.1 Features
•
•
•
•
•
Data rates up to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0B, ISO 11898-1.
Global Acceptance Filter recognizes 11-bit and 29-bit RX identifiers for all CAN buses.
Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard identifiers.
• Full CAN messages can generate interrupts.
6.10 UARTs
The LPC2290 contains two UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface.
6.10.1 Features
• 16 B Receive and Transmit FIFOs.
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16/32-bit ARM microcontroller with external memory interface
•
•
•
•
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in baud rate generator.
Standard modem interface signals included on UART1.
6.10.2 UART features available in LPC2290/01 only
• The transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs and hardware (CTS/RTS) flow control on UART1 only.
• Fractional baud rate generator enables standard baud rates such as 115200 to be
achieved with any crystal frequency above 2 MHz.
• Auto-bauding.
• Auto-CTS/RTS flow-control fully implemented in hardware.
6.11 I2C-bus serial I/O controller
The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line
(SCL), and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be
controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2290 supports bit rate up to 400 kbit/s (Fast I2C-bus).
6.11.1 Features
•
•
•
•
•
•
Compliant with standard I2C-bus interface.
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus may be used for test and diagnostic purposes.
6.12 SPI serial I/O controller
The LPC2290 contains two SPIs. The SPI is a full duplex serial interface, designed to be
able to handle multiple masters and slaves connected to a given bus. Only a single master
and a single slave can communicate on the interface during a given data transfer. During a
data transfer the master always sends a byte of data to the slave, and the slave always
sends a byte of data to the master.
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16/32-bit ARM microcontroller with external memory interface
6.12.1 Features
•
•
•
•
Compliant with SPI specification.
Synchronous, serial, full duplex, communication.
Combined SPI master and slave.
Maximum data bit rate of one eighth of the input clock rate.
6.13 SSP serial I/O controller (available in LPC2290/01 only)
The LPC2290/01 contains one Serial Synchronous Port controller (SSP). The SSP
controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact
with multiple masters and slaves on the bus. However, only a single master and a single
slave can communicate on the bus during a given data transfer. The SSP supports full
duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the
slave and from the slave to the master. Often only one of these data flows carries
meaningful data.
The SSP and SPI1 share the same pins on LPC2290/01. After a reset, SPI1 is enabled
and SSP is disabled.
6.13.1 Features
• Synchronous Serial Communication.
• 8-frame FIFOs for both transmit and receive.
• Compatible with Motorola SPI, 4-wire TI SSI and National Semiconductor Microwire
buses.
• Master or slave operation.
• Four bits to 16 bits per SPI frame.
6.14 General purpose timers
The TIMER0 and TIMER1 are designed to count cycles of the peripheral clock (PCLK)
and optionally generate interrupts or perform other actions at specified timer values,
based on four match registers. It also includes four capture inputs to trap the timer value
when an input signal transitions, optionally generating an interrupt. Multiple pins can be
selected to perform a single capture or match function, providing an application with ‘or’
and ‘and’, as well as ‘broadcast’ functions among them.
6.14.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit prescaler.
• Four 32-bit capture channels per timer that can take a snapshot of the timer value
when an input signal transitions. A capture event may also optionally generate an
interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
• Four external outputs per timer corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.14.2 Timer features available in LPC2290/01 only
• Timers can count cycles of the externally supplied clock providing external event
counting functionality
6.15 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.15.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect/incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal pre-scaler.
Selectable time period from (Tcy(PCLK) × 256 × 4) to (Tcy(PCLK) × 232 × 4) in multiples of
Tcy(PCLK) × 4.
6.16 Real-time clock
The Real-Time Clock (RTC) is designed to provide a set of counters to measure time
when normal or idle operating mode is selected. The RTC has been designed to use little
power, making it suitable for battery powered systems where the CPU is not running
continuously (Idle mode).
6.16.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
• Programmable Reference Clock Divider allows adjustment of the RTC to match
various crystal frequencies.
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
6.17 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2290. The Timer is designed to count
cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other
actions when specified timer values occur, based on seven match registers. The PWM
function is also based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires three
non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the MR0 match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
6.17.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit prescaler.
6.18 System control
6.18.1 Crystal oscillator
The oscillator supports crystals in the range of 1 MHz to 30 MHz. The oscillator output
frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for
purposes of rate equations, etc. fosc and CCLK are the same value unless the PLL is
running and connected. Refer to Section 6.18.2 “PLL” for additional information.
6.18.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle.The PLL is turned off and bypassed
following a chip reset and may be enabled by software. The program must configure and
activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The
PLL settling time is 100 µs.
6.18.3 Reset and wake-up timer
Reset has two sources on the LPC2290: the RESET pin and watchdog reset. The RESET
pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by
any source starts the Wake-up Timer (see Wake-up Timer description below), causing the
internal chip reset to remain asserted until the external reset is de-asserted, the oscillator
is running, a fixed number of clocks have passed, and the on-chip flash controller has
completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined values.
The Wake-up Timer ensures that the oscillator and other analog functions required for
chip operation are fully functional before the processor is allowed to execute instructions.
This is important at power-on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the Wake-up Timer.
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16/32-bit ARM microcontroller with external memory interface
The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power-on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.18.4 External interrupt inputs
The LPC2290 include up to nine edge or level sensitive External Interrupt Inputs as
selectable pin functions. When the pins are combined, external events can be processed
as four independent interrupt signals. The External Interrupt Inputs can optionally be used
to wake up the processor from Power-down mode.
6.18.5 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
6.18.6 Power control
The LPC2290 support two reduced power modes: Idle mode and Power-down mode. In
Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings.
6.18.7 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB bus so that they can operate at
the speed chosen for the ARM processor. In order to achieve this, the APB bus may be
slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB bus must work
properly at power-up (and its timing cannot be altered if it does not work since the APB
divider control registers reside on the APB bus), the default condition at reset is for the
APB bus to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider
is to allow power savings when an application does not require any peripherals to run at
the full processor rate. Because the APB divider is connected to the PLL output, the PLL
remains active (if it was running) during Idle mode.
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6.19 Emulation and debugging
The LPC2290 support emulation and debugging via a JTAG serial port. A trace port
allows tracing program execution. Debugging and trace functions are multiplexed only with
GPIOs on Port 1. This means that all communication, timer and interface peripherals
residing on Port 0 are available during the development and debugging phase as they are
when the application is run in the embedded system itself.
6.19.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote
debug protocol commands to the JTAG data needed to access the ARM core.
The ARM core has a Debug Communication Channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
entering the debug state. The debug communication channel is accessed as a
coprocessor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
6.19.2 Embedded trace
Since the LPC2290 has significant amounts of on-chip memory, it is not possible to
determine how the processor core is operating simply by observing the external pins. The
Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply
embedded processor cores. It outputs information about processor execution to the trace
port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.19.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC (Debug
Communications Channel), which is present in the EmbeddedICE logic. The LPC2290
contain a specific configuration of RealMonitor software programmed into the on-chip
flash memory.
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(1V8)
supply voltage (1.8 V)
internal rail
−0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
external rail
−0.5
+3.6
V
VDDA(3V3)
analog supply voltage (3.3 V)
−0.5
+4.6
V
VIA
analog input voltage
input voltage
VI
supply current
IDD
ground current
ISS
−0.5
+5.1
V
5 V tolerant I/O pins
[2][3]
−0.5
+6.0
V
other I/O pins
[2][4]
−0.5
VDD(3V3) + 0.5
V
per supply pin
[5]
-
100
mA
per ground pin
[5]
-
100
mA
[6]
−65
+150
°C
-
1.5
W
−2000
+2000
V
Tstg
storage temperature
Ptot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device power
consumption
Vesd
electrostatic discharge voltage
human body model; all
pins
[7]
[1]
The following applies to Table 5:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Only valid when the VDD(3V3) supply voltage is present.
[4]
Not to exceed 4.6 V.
[5]
The peak current is limited to 25 times the corresponding maximum current.
[6]
Dependent on package type.
[7]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
LPC2290_3
Product data sheet
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
8. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(1V8)
supply voltage (1.8 V)
internal rail
1.65
1.8
1.95
V
VDD(3V3)
supply voltage (3.3 V)
external rail
VDDA(3V3) analog supply voltage
(3.3 V)
3.0
3.3
3.6
V
2.5
3.3
3.6
V
Standard port pins, RESET, RTCK
IIL
LOW-level input current
VI = 0 V; no pull-up
-
-
3
µA
IIH
HIGH-level input current
VI = VDD(3V3); no pull-down
-
-
3
µA
IOZ
OFF-state output current
VO = 0 V, VO = VDD(3V3);
no pull-up/down
-
-
3
µA
Ilatch
I/O latch-up current
−(0.5VDD(3V3)) < VI <
(1.5VDD(3V3)); Tj < 125 °C
100
-
-
mA
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VDD(3V3)
V
[2][3][4]
output active
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Vhys
hysteresis voltage
-
0.4
-
V
VOH
-
V
HIGH-level output voltage IOH = −4 mA
[5]
VDD(3V3) − 0.4 -
IOL = −4 mA
[5]
VOL
LOW-level output voltage
-
-
0.4
V
IOH
HIGH-level output current VOH = VDD(3V3) − 0.4 V
[5]
−4
-
-
mA
IOL
LOW-level output current
VOL = 0.4 V
[5]
4
-
-
mA
-
-
−45
mA
IOHS
HIGH-level short-circuit
output current
VOH = 0 V
[6]
IOLS
LOW-level short-circuit
output current
VOL = VDD(3V3)
[6]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[7]
10
50
150
µA
VI = 0 V
[8]
−15
−50
−85
µA
VDD(3V3) < VI < 5 V
[7]
0
0
0
µA
-
50
-
mA
Power-down mode supply VDD(1V8) = 1.8 V,
current
Tamb = 25 °C,
-
10
-
µA
VDD(1V8) = 1.8 V,
Tamb = 85 °C
-
110
500
µA
VDD(1V8) = 1.8 V,
Tamb = 125 °C
-
300
1000
µA
Ipu
IDD(act)
pull-up current
active mode supply
current
VDD(1V8) = 1.8 V,
CCLK = 60 MHz,
Tamb = 25 °C, code
while(1){}
executed from flash, no
active peripherals
IDD(pd)
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified.
Symbol
I2C-bus
Parameter
Conditions
Min
Typ[1]
Max
Unit
V
pins
VIH
HIGH-level input voltage
0.7VDD(3V3)
-
-
VIL
LOW-level input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.5VDD(3V3) -
V
-
-
0.4
V
[5]
VOL
LOW-level output voltage
IOLS = 3 mA
ILI
input leakage current
VI = VDD(3V3); to VSS
-
2
4
µA
VI = 5 V
-
10
22
µA
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
-
1.8
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
-
1.8
V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (+25 °C), nominal supply voltages.
[2]
Including voltage on outputs in 3-state mode.
[3]
VDD(3V3) supply voltages must be present.
[4]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[5]
Accounts for 100 mV voltage drop in all supply lines.
[6]
Only allowed for a short time period.
[7]
Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[8]
Applies to P1[25:16].
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
Table 7.
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +125 °C unless otherwise specified. ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
Cia
ED
differential linearity
error
EL(adj)
EO
EG
ET
Conditions
Min
Typ
Max
Unit
analog input voltage
0
-
VDDA
V
analog input
capacitance
-
-
1
pF
-
-
±1
LSB
[1][2][3]
integral non-linearity
[1][4]
-
-
±2
LSB
offset error
[1][5]
-
-
±3
LSB
gain error
[1][6]
-
-
±0.5
%
absolute error
[1][7]
-
-
±4
LSB
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 4.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 4.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 4.
[7]
The absolute voltage error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the
non-calibrated ADC and the ideal transfer curve. See Figure 4.
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LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
gain
error
EG
offset
error
EO
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
1 LSB =
offset
error
EO
VDDA − VSSA
1024
002aaa668
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 4. ADC characteristics
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
9. Dynamic characteristics
Table 8.
Dynamic characteristics
Tamb = −40 °C to +125 °C; VDD(1V8), VDD(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
oscillator frequency
supplied by an external
oscillator (signal generator)
1
-
50
MHz
external clock frequency
supplied by an external
crystal oscillator
1
-
30
MHz
external clock frequency if
on-chip PLL is used
10
-
25
MHz
external clock frequency if
on-chip bootloader is used
for initial code download
10
-
25
MHz
External clock
fosc
Tcy(clk)
clock cycle time
20
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0.2 and P0.3)
tr
rise time
-
10
-
ns
tf
fall time
-
10
-
ns
-
ns
I2C-bus pins (P0.2 and P0.3)
fall time
tf
VIH to VIL
[2]
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2290_3
Product data sheet
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LPC2290
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16/32-bit ARM microcontroller with external memory interface
Table 9.
External memory interface dynamic characteristics
CL = 25 pF, Tamb = 40 °C
Symbol
Parameter
Conditions
Min
Typ Max
Unit
Common to read and write cycles
tCHAV
XCLK HIGH to address valid
time
-
-
10
ns
tCHCSL
XCLK HIGH to CS LOW time
-
-
10
ns
tCHCSH
XCLK HIGH to CS HIGH
time
-
-
10
ns
tCHANV
XCLK HIGH to address
invalid time
-
-
10
ns
Read cycle parameters
tCSLAV
CS LOW to address valid
time
[1]
−5
-
+10
ns
tOELAV
OE LOW to address valid
time
[1]
−5
-
+10
ns
tCSLOEL
CS LOW to OE LOW time
−5
-
+5
ns
(Tcy(CCLK) × (2 + WST1)) +
(−20)
-
-
ns
tam
memory access time
[2][3]
tam(ibr)
memory access time (initial
burst-ROM)
[2][3]
(Tcy(CCLK) × (2 + WST1)) +
(−20)
-
-
ns
tam(sbr)
memory access time
(subsequent burst-ROM)
[2][4]
Tcy(CCLK) + (−20)
-
-
ns
th(D)
data hold time
0
-
-
ns
tCSHOEH
CS HIGH to OE HIGH time
−5
-
+5
ns
tOEHANV
OE HIGH to address invalid
time
−5
-
+5
ns
tCHOEL
XCLK HIGH to OE LOW time
−5
-
+5
ns
tCHOEH
XCLK HIGH to OE HIGH
time
−5
-
+5
ns
Tcy(CCLK) − 10
-
-
ns
[5]
Write cycle parameters
[1]
tAVCSL
address valid to CS LOW
time
tCSLDV
CS LOW to data valid time
−5
-
+5
ns
tCSLWEL
CS LOW to WE LOW time
−5
-
+5
ns
tCSLBLSL
CS LOW to BLS LOW time
−5
-
+5
ns
tWELDV
WE LOW to data valid time
−5
-
+5
ns
tCSLDV
CS LOW to data valid time
−5
-
+5
ns
Tcy(CCLK) × (1 + WST2) − 5
-
Tcy(CCLK) × (1 +
WST2) + 5
ns
tWELWEH
WE LOW to WE HIGH time
[2]
tBLSLBLSH
BLS LOW to BLS HIGH time
[2]
Tcy(CCLK) × (1 + WST2) − 5
-
Tcy(CCLK) ×
(1 + WST2) + 5
ns
tWEHANV
WE HIGH to address invalid
time
[2]
Tcy(CCLK) − 5
-
Tcy(CCLK) + 5
ns
tWEHDNV
WE HIGH to data invalid time
[2]
(2 × Tcy(CCLK)) − 5
-
(2 × Tcy(CCLK)) + 5 ns
BLS HIGH to address invalid
time
[2]
Tcy(CCLK) − 5
-
Tcy(CCLK) + 5
tBLSHANV
LPC2290_3
Product data sheet
ns
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
32 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
Table 9.
External memory interface dynamic characteristics …continued
CL = 25 pF, Tamb = 40 °C
Symbol
Parameter
Conditions
[2]
Min
Typ Max
Unit
(2 × Tcy(CCLK)) − 5
-
(2 × Tcy(CCLK)) + 5 ns
tBLSHDNV
BLS HIGH to data invalid
time
tCHDV
XCLK HIGH to data valid
time
-
-
10
ns
tCHWEL
XCLK HIGH to WE LOW
time
-
-
10
ns
tCHBLSL
XCLK HIGH to BLS LOW
time
-
-
10
ns
tCHWEH
XCLK HIGH to WE HIGH
time
-
-
10
ns
tCHBLSH
XCLK HIGH to BLS HIGH
time
-
-
10
ns
tCHDNV
XCLK HIGH to data invalid
time
-
-
10
ns
[1]
Except on initial access, in which case the address is set up Tcy(CCLK) earlier.
[2]
Tcy(CCLK) = 1⁄CCLK.
[3]
Latest of address valid, CS LOW, OE LOW to data valid.
[4]
Address valid to data valid.
[5]
Earliest of CS HIGH, OE HIGH, address change to data invalid.
Table 10.
Standard read access specifications
Access cycle
Max frequency
WST setting
Memory access time requirement
WST ≥ 0; round up to
integer
standard read
2 + WST 1
f MAX ≤ -------------------------------t RAM + 20 ns
t RAM + 20 ns
WST 1 ≥ -------------------------------- – 2
t cy ( CCLK )
t RAM ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns
standard write
1 + WST 2
f MAX ≤ ---------------------------------t WRITE + 5 ns
t WRITE – t CYC + 5
WST 2 ≥ -------------------------------------------t cy ( CCLK )
t WRITE ≤ t cy ( CCLK ) × ( 1 + WST 2 ) – 5 ns
burst read - initial
2 + WST 1
f MAX ≤ -------------------------------t INIT + 20 ns
t INIT + 20 ns
WST 1 ≥ -------------------------------- – 2
t cy ( CCLK )
t INIT ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns
burst read - subsequent 3×
1
f MAX ≤ --------------------------------t ROM + 20 ns
N/A
t ROM ≤ t cy ( CCLK ) – 20 ns
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
33 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
9.1 Timing
XCLK
tCSLAV
tCSHOEH
CS
addr
tam
th(D)
data
tCSLOEL
tOELAV
tOEHANV
OE
tCHOEL
tCHOEH
002aaa749
Fig 5. External memory read access
XCLK
tCSLDV
CS
tAVCSL
tCSLWEL
tWELWEH
tBLSLBLSH
BLS/WE
tWEHANV
tCSLBLSL
tWELDV
tBLSHANV
addr
tCSLDV
tWEHDNV
tBLSHDNV
data
OE
002aaa750
Fig 6. External memory write access
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
34 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
VDD − 0.5 V
0.45 V
0.2VDD + 0.9 V
0.2VDD − 0.1 V
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 7. External clock timing
9.2 LPC2290 power consumption measurements
002aab452
60
IDD current
(mA)
(1)
(2)
40
20
0
0
10
20
30
40
50
60
frequency (MHz)
Test conditions: code executed from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK⁄4.
(1) 1.8 V core at 25 °C (typical)
(2) 1.65 V core at 25 °C (typical)
Fig 8. LPC2290 IDD(act) measured at different frequencies (CCLK) and temperatures
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
35 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
002aab453
15
IDD current
(mA)
10
(1)
(2)
5
0
0
10
20
30
40
50
60
frequency (MHz)
Test conditions: Idle mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register;
PCLK = CCLK⁄4.
(1) 1.8 V core at 25 °C (typical)
(2) 1.65 V core at 25 °C (typical)
Fig 9. LPC2290 IDD idle measured at different frequencies (CCLK) and temperatures
002aab454
500
IDD current
(µA)
(1)
(2)
400
(3)
300
200
100
0
−100
−50
0
50
100
150
temp (°C)
Test conditions: Power-down mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP
register.
(1) 1.95 V core
(2) 1.8 V core
(3) 1.65 V core
Fig 10. LPC2290 IDD(pd) measured at different temperatures
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
36 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
10. Package outline
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
c
y
X
A
73
72
108
109
ZE
e
E HE
A A2
(A 3)
A1
θ
wM
Lp
bp
L
pin 1 index
detail X
37
144
1
36
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
20.1
19.9
0.5
HD
HE
22.15 22.15
21.85 21.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D(1) Z E(1)
1.4
1.1
1.4
1.1
θ
o
7
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT486-1
136E23
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-03-14
03-02-20
Fig 11. Package outline SOT486-1 (LQFP144)
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
37 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
11. Abbreviations
Table 11.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AMBA
Advanced Microcontroller Bus Architecture
APB
AMBA Peripheral Bus
CAN
Controller Area Network
CISC
Complex Instruction Set Computer
CPU
Central Processing Unit
FIFO
First In, First Out
GPIO
General Purpose Input/Output
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RAM
Random Access Memory
RISC
Reduced Instruction Set Computer
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
38 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2290_3
20061116
Product data sheet
-
LPC2290-02
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
New features specific to the LPC2290/01 have been added throughout.
LPC2290-02
20041223
Product data
-
LPC2290-01
LPC2290-01
20040209
Preliminary data
-
-
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
39 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
LPC2290_3
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 03 — 16 November 2006
40 of 41
LPC2290
NXP Semiconductors
16/32-bit ARM microcontroller with external memory interface
15. Contents
1
2
2.1
2.2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.4.1
6.5
6.6
6.7
6.7.1
6.7.2
6.8
6.8.1
6.8.2
6.9
6.9.1
6.10
6.10.1
6.10.2
6.11
6.11.1
6.12
6.12.1
6.13
6.13.1
6.14
6.14.1
6.14.2
6.15
6.15.1
6.16
6.16.1
6.17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Enhancements introduced with LPC2290/01
device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key features common for LPC2290 and
LPC2290/01 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . 14
Architectural overview. . . . . . . . . . . . . . . . . . . 14
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 14
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 17
External memory controller. . . . . . . . . . . . . . . 17
General purpose parallel I/O and Fast I/O . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Fast I/O features available in LPC2290/01
only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ADC features available in LPC2290/01 only . . 18
CAN controllers and acceptance filter . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
UART features available in LPC2290/01 only . 19
I2C-bus serial I/O controller . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SSP serial I/O controller (available in
LPC2290/01 only) . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
General purpose timers . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Timer features available in LPC2290/01 only . 21
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Pulse width modulator . . . . . . . . . . . . . . . . . . 22
6.17.1
6.18
6.18.1
6.18.2
6.18.3
6.18.4
6.18.5
6.18.6
6.18.7
6.19
6.19.1
6.19.2
6.19.3
7
8
9
9.1
9.2
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System control . . . . . . . . . . . . . . . . . . . . . . . .
Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . .
PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset and wake-up timer . . . . . . . . . . . . . . . .
External interrupt inputs . . . . . . . . . . . . . . . . .
Memory mapping control . . . . . . . . . . . . . . . .
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Emulation and debugging. . . . . . . . . . . . . . . .
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
Embedded trace. . . . . . . . . . . . . . . . . . . . . . .
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPC2290 power consumption measurements
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
23
23
23
23
24
24
24
24
25
25
25
25
26
27
31
34
35
37
38
39
40
40
40
40
40
40
41
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 November 2006
Document identifier: LPC2290_3