Security & Chip Card ICs SLE 66C166PE 8/16-Bit Security Controller with enhanced instruction set for large memories in 0.22 µm CMOS Technology 96-Kbytes ROM, 4352 bytes RAM, 16-Kbytes EEPROM Dual Key Triple DES Preliminary Short Product Information 02.04 SLE 66C166PE Short Product Information Ref.: SPI_SLE 66C166PE_0204.doc This document contains preliminary information on a new product under development. Details are subject to change without notice. Revision History: Current Version 02.04 Previous Releases: 03.03 Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail: [email protected] Edition 2004 Published by Infineon Technologies AG, CC Applications Group St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 2002 All Rights Reserved. Attention please! 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Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. SLE 66C166PE 8/16-Bit Security Controller with enhanced instruction set for large memories in 0.22µm CMOS Technology 96-Kbyte ROM, 4352 Bytes RAM, 16-Kbyte EEPROM, Dual Key Triple DES Accelerator Features • • • New New • • Instruction set opcode compatible with standard SAB 8051 processor New New New • • • • • • • • • • • • New • Downward compatibility to existing SLE 66CxxxP products for existing masks without using the new features • • • • Typically saves up to 90% code space and increases execution speed up to 80%. Dedicated, non-standard architecture with execution time 6 times faster than standard SAB 8051 processor at same external clock. (Up to 18 times faster using internal frequency PLL x 3 compared to external clock). • • 96 Kbytes User ROM for application programs 16 Kbytes MicroSlim-EEPROM for increased memory requirements in mobile applications 4 Kbytes XRAM, 256 bytes internal RAM • • • Enhanced Memory Management and Protection Unit (MMU) with application and user defined segments Dual Key Triple DES (DDES) New CRC Module New • • • • Code executions during E²-programming for faster personalization • EEPROM programming voltage generated on chip • • • • Preliminary - Short Product Information Increased internal clock frequency for maximum performance Internal frequency is automatically adjusted to guarantee a given limited power consumption Two 16-bit Autoreload Timer Power saving sleep mode Ext. Clock freq. 1 up to 7.5 MHz UART for handling serial interface in accordance with ISO/IEC 7816 part 3 supporting transmission protocols T=1 and T=0 Supply voltage range:1.8 V, 3.0 V, 5.0 V Support of current consumption limits by GSM / UICC applications < 10 mA @ 5.5 V < 6 mA @ 3.3 V < 4 mA @ 1.98 V Operating Temperature range: -25 to +85°C Storing temperature range: –40° to +125°C ESD protection larger than 6 kV (HBM) MicroSlim-EEPROM CC EAL5+ certification according to BSI-PP-0002 planned 16-bit Interrupt Module Adjustable internal frequency according to available power or required performance • Additional enhanced instructions for direct physical memory access of >64kByte True Random Number Generator with Firmware test function Internal Clock with up to 33 MHz: Programmable internal frequency (PLL x1, x2, x3, x4 and free running mode(s)). • Addressable memory up to 16 Mbyte • • New 8/16-bit microcomputer in 0.22 µm CMOS technology 3/8 Typical Erase + Write time ≤ 2.9 ms Enhanced ECC module controlled by OS Reading and programming byte by byte Platform prepared for flash-like erasing of E²-segments up to 2 kB Flexible page mode for 1 to 64 bytes write/erase operation 32 bytes security area (OTP) Fast personalization mode ≤ 1.0 ms Minimum of 500.000 write/erase cycles @ 25°C per page. Maximum of 16.500.000 write/erase cycles per sector Typical data retention of 10 years @ 25°C 02.04 SLE 66C166PE Memory Management and Protection Unit New • • • • • • • New Addressable memory of up to 16 Mbyte Anti Snooping • • Separates OS (system mode) and application (user mode) System routines called by interrupts • • OS can restrict access to peripherals in application mode Variable application orientated segments defined and controlled by OS • • • New • • • • • • Active Shield with automatic and user controlled attack detection Enhanced multi-application support by descriptors for system / application mode. Targeted Certifications • • • • Enhanced sensor concept: • • • • • • Hardware countermeasures controlled by True Random Number Generator CC EAL5+ VISA level 3 MULTOS CAST Low and high voltage sensors Support Frequency sensors and filters • Light Sensor HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Softmasking) Glitch Sensors • Temperature Sensor Supported Standards Life Test Function for Sensors (UMSLC) • • • • Bus confusion Security reset detection Current control oscillator (ICO) Application notes ISO/IEC 7816 EMV 2000 GSM 11.11, 11.12, 11.18 ETSI TS 102 221 Document References Sparkling SFR encryption for DDES and ACE, CRC module and RNG 32 bytes security PROM, hardware protected for batch-, wafer-, die-individual security data. Unique chip identification number for each chip • • • Additional memory for customer-defined security FabKey on request • MED – memory encryption/decryption device for XRAM, ROM and EEPROM • Security optimized layout and layout scrambling Development Tools Overview Fast IRAM erase • Enhanced Error correction unit (ECU) • • • Testmode • Non standard dedicated Smart Card CPU – Core • Memory Security • Effective HW-countermeasures against SEMA/DEMA, SPA/DPA, DFA and Timing-Attacks Code execution from XRAM possible Security Features • Automatic randomization smoothing of power profile Irreversible Lock - Out of test-mode • Preliminary - Short Product Information 4/8 Confidential Data Book SLE 66CxxxPE Qualification report Chip delivery specification for wafer with chip-layout (die size, orientation,...) Module specification package, etc. containing description of Qualification report module Short Product Information Software Development Kit SDK CC Short Product Information Card Emulator CE66PE Short Product Information ROM Monitor RM66PE Short Product Information Emulator ET66PE Hitex or ET66PE KSC Short Product Information Smart Mask Package 02.04 SLE 66C166PE Performance DDES- Accelerator (typical values, based on internal test results) Operation Data Block Length Encryption Time for an 8-Byte Block incl. Data Transfer New 5 MHz 15 MHz 33 MHz* 56-bit Single DES Encryption 64 bit 23 µs 8 µs 3.5 µs 112-bit Triple DES Encryption 64 bit 35 µs 12 µs 5.3 µs * preliminary values Ordering Information Type SLE 66C166PE C SLE 66C166PE M5 Package 1 Die (sawn, unsawn) M5.1 Voltage Temperature Range Range 1.8 V; 3.0 V; 5.0 V – 25°C to + 70°C or or 3.0 V; 5.0 V – 25°C to + 85°C Frequency Range (int. clock frequency Frequency Range (ext. clock frequency) 1 MHz - 5 MHz Up to 33 MHz or 1 MHz - 7.5 MHz For ordering information please refer to the databook and contact your sales representative. Production sites for SLE 66C166PE: • 1 Dresden (Germany), UMC (Taiwan), Altis (France). available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging Preliminary - Short Product Information 5/8 02.04 SLE 66C166PE Pin Configuration VCC GND CLK RST SLE 66C166PE I/O Figure 1: Pin Configuration Pin Definitions and Functions Symbol Function VCC Operating voltage RST Reset input CLK Processor clock input GND Ground I/O Bi-directional data port Preliminary - Short Product Information 6/8 02.04 SLE 66C166PE General Description The SLE66C166PE is a member of the improved 66PE-series of Infineon Technologies. This high performance security controller is manufactured in advanced 0.22 µm CMOS technology. It is downward compatible to existing 66P controller derivatives. The well known ECO2000 8/16 bit CPU provides the high efficiency of the SAB 8051 instruction set extended by additional powerful instructions together with enhanced performance, memory sizes and security features compared to existing 66P derivatives. Performance: The internal clock frequency can be adjusted to a level up to 33 MHz either as a multiple of 1,2,3,4 to the external frequency or independent of the clock rate of the terminal with the help of the internal clock. It is adjustable according to either available power requirements or required performance: • New Increased internal clock frequency for maximum performance, e.g. for high performance with max. frequency in payment applications. • Automatically adjusted frequency for a max. given power consumption, e.g. by GSM or UMTS requirements. Memory: The SLE66C166PE offers 96 Kbytes of User-ROM, 256 byte internal RAM, 4096 byte XRAM and 16 Kbytes MicroSlim-EEPROM, to fulfill the increased requirements of GSM and UMTS applications. The large ROM size allows to place applications in the ROM-mask and to keep the E²PROM free for customer data. In addition it saves mask development costs, as one mask may be used for different customer projects. 16kByte of EEPROM thus allows to include include SIM Application Toolkit, Wireless Application Protocol (WAP), WML-Browser and JavaCard API implementations into the NVM. The enhanced Memory Management and Protection Unit allows a secure separation of the operating system and different applications. It allows to separate the memories in application orientated segments, which can be controlled by the OS. Furthermore, the MMU makes a secure downloading of applications possible even after personalization of a card. These new features suit the requirements of the next generation of multi application operating systems. Voltage Clock Reset ROM 96 Kbyte XRAM 4 Kbyte 16-Bit CPU with MMU & ECO 2000 Instruction Set EEPROM 16 Kbyte DES Accelerator Address-/Data Bus Sleep Mode Logic Sensors/Filters Interrupt Voltage Regulator two 16-bit Timer CRC Random Number Generator UART Clock generated Figure 2: Block Diagram SLE 66C166PE The new platform is designed to address up to 16Mbyte. However this feature is only available upon request and will clearly require a change in the existing tool environment. In addition, new instructions have been implemented in the design for an efficient direct access of physical memory >64KByte up to 16 MByte. Preliminary - Short Product Information 7/8 02.04 SLE 66C166PE Security features: Since the very beginning, security is an integrated part of Infineons product development, as proved by various certificates (ITSEC, CC, Proton, VISA, ZKA, Mondex). The so called “integral security concept” for the 66P series ensures: • • • A secret storage of any confidential code, data and keys Protection against side channel attacks such as: Simple Power Analysis (SPA) , Differential Power Analysis (DPA), Protection against Differential Fault Analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible HW or SW attacks Peripherals: The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-CRC). To minimize the overall power consumption, the chip card controller IC offers a sleep mode. The UART supports the halfduplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3. All relevant transmission parameters can be adjusted by software, as e.g. the clock division factor, direct/inverse convention and the number of stop bits. Additionally, the I/O port can be driven by communication routines realized in software. The HW-DES module supports symmetric crypto algorithms according to the Data Encryption Standard in the Electronic Code Book Mode. The random number generator (RNG) is able to supply the CPU with true random numbers on all conditions. The advanced sensor concept includes various sensors for any kind of attacks scenarios and even more important a “Life Test ” for sensors. As an important feature, the chip provides an on-chip security, which fulfills the strong security requirements of a Common Criteria evaluation at an EAL5+ level. In conclusion, the SLE 66C166PE fulfills all the requirements of today's chip card applications, and is especially designed for Java based SDA payment applications, security access and identification. In addition it offers a powerful platform for multi application cards based on Multos or Java and supports the migration to enhanced GSM (incl. WAP), GPRS and UMTS value added services. The SLE66C166PE integrates outstanding memory sizes, additional peripherals in combination with enhanced performance and optimized power consumption on a minimized die size. Preliminary - Short Product Information 8/8 02.04