PHILIPS DAC1008D750HN

DAC1008D750
Dual 10-bit DAC; up to 750 Msps; 2×, 4× or 8× interpolating
with JESD204A interface
Rev. 01 — 4 October 2010
Objective data sheet
1. General description
The DAC1008D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter
(DAC) with selectable 2×, 4× or 8× interpolating filters optimized for multi-carrier WCDMA
transmitters.
Because of its digital on-chip modulation, the DAC1008D750 allows the complex pattern
provided through lane 0, lane 1, lane 2 and lane 3, to be converted up from baseband to
IF. The mixing frequency is adjusted via a Serial Peripheral Interface (SPI) with a 32-bit
Numerically Controlled Oscillator (NCO) and the phase is controlled by a 16-bit register.
The DAC1008D750 also includes a 2×, 4× or 8× clock multiplier which provides the
appropriate internal clocks and an internal regulation to adjust the output full-scale
current.
The input data format is serial according to JESD204A specification. This new interface
has numerous advantages over the traditional parallel one: easy PCB layout, lower
radiated noise, lower pin count, self-synchronous link, skew compensation. The maximum
number of lanes of the DAC1008D750 is 4 and its maximum serial data rate is
3.125 Gbps.
The Multiple Device Synchronization (MDS) guarantees a maximum skew of one output
clock period between several DAC devices. MDS incorporates modes: Master/slave and
All slave mode.
2. Features and benefits
„ Dual 10-bit resolution
„ 750 Msps maximum update rate
„ Selectable 2×, 4× or 8× interpolation
filters
„ Input data rate up to 312.5 Msps
„ Very low-noise cap-free integrated PLL
„ 32-bit programmable NCO frequency
„ Four JESD204A serial input lanes
„ 1.8 V and 3.3 V power supplies
„ LVDS compatible clock inputs
„ IMD3: 76 dBc; fs = 737.28 Msps;
fo = 140 MHz
„ ACPR: 64 dBc; two carriers WCDMA;
fs = 737.28 Msps; fo = 153.6 MHz
„ Typical 1.26 W power dissipation at 4×
interpolation, PLL off and 740 Msps
„ Power-down mode and Sleep modes
„ Differential scalable output current from
1.6 mA to 22 mA
„ On-chip 1.25 V reference
„ External analog offset control
(10-bit auxiliary DACs)
„ Internal digital offset control
„ Inverse (sin x) / x function
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
„ Two’s complement or binary offset data „ Fully compatible SPI port
format
„ LMF = 421 or LMF = 211 support
„ Industrial temperature range from
−40 °C to +85 °C
„ Differential CML receiver with
„ Integrated PLL can be bypassed
embedded termination
„ Synchronization of multiple DAC outputs „ Embedded complex modulator
3. Applications
„
„
„
„
„
„
„
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point-to-point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
4. Ordering information
Table 1.
Ordering information
Type number
DAC1008D750HN
DAC1008D750_1
Objective data sheet
Package
Name
Description
HVQFN64
plastic thermal enhanced very thin quad flat package; no leads; SOT804-3
64 terminals; body 9 × 9 × 0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
Version
© NXP B.V. 2010. All rights reserved.
2 of 99
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SDO
SDIO
SCS_N
SCLK
NCO
32-bit frequency setting
16-bit phase adjustment
SPI CONTROL REGISTERS
cos
SYNC_OUTP
VIN_P1
L1
VIN_N1
VIN_P2
L2
VIN_N2
VIN_P3
VIN_N3
LANE
PROC
LANE
PROC
LANE
PROC
AUX.
DAC
AUXAP
AUXAN
sin
FIR 2
2×
FIR 3
2×
SINGLE
SIDE
BAND
MODULATOR
DAC1008D750HN
FIR 1
2×
FIR 2
2×
IOUTAP
X
Sin X
+
Σ
OFFSET
CONTROL
I DAC
IOUTAN
REF.
BANDGAP
AND
BIASING
VIRES
GAPOUT
FIR 3
X
Sin X
2×
+
Σ
IOUTBP
Q DAC
IOUTBN
10-BIT
GAIN
CONTROL
MULTI-DAC
SYNCHRONIZATION
3 of 99
© NXP B.V. 2010. All rights reserved.
CLKINP
Fig 1.
Block diagram
CLKINN
RESET_N
MDS_P
MDS_N
10-BIT
OFFSET
CONTROL
AUX.
DAC
AUXBP
AUXBN
001aam756
DAC1008D750
CLOCK GENERATOR UNIT
2×, 4× or 8× interpolating with JESD204A
L3
2×
FRAME ASSEMBLY
L0
VIN_N0
FIR 1
LANE
PROC
INTER LANE ALIGNMENT
Rev. 01 — 4 October 2010
All information provided in this document is subject to legal disclaimers.
VIN_P0
10-BIT
OFFSET
CONTROL
10-BIT
GAIN
CONTROL
DIGITAL LAYER
PROCESSING
JESD204A
SYNC_OUTN
NXP Semiconductors
DAC1008D750_1
Objective data sheet
5. Block diagram
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
6. Pinning information
49 VDDD(1V8)
50 SYNC_OUTN
51 SYNC_OUTP
52 VIN_N0
53 VIN_P0
54 VDDD(1V8)
55 VIN_P1
56 VIN-N1
57 VIN_N2
58 VIN_P2
59 VDDD(1V8)
60 VIN_P3
61 VIN_N3
62 n.c.
terminal 1
index area
63 n.c.
64 JTAG
6.1 Pinning
SDO
1
48 n.c.
SDIO
2
47 VDDD(1V8)
SCLK
3
46 MDS_N
VDDD(1V8)
4
45 MDS_P
SCS_N
5
44 VDDA(1V8)
RESET_N
6
43 AGND
n.c.
7
42 CLKINN
VIRES
8
GAPOUT
9
41 CLKINP
DAC1008D750HN
40 AGND
VDDA(1V8) 10
39 VDDA(1V8)
VDDA(1V8) 11
38 VDDA(1V8)
AGND 12
37 AGND
AUXBN 13
36 AUXAN
AUXBP 14
35 AUXAP
VDDA(3V3) 15
34 VDDA(3V3)
Fig 2.
VDDA(1V8) 32
AGND 31
VDDA(1V8) 30
Transparent top view
VDDA(1V8) 29
AGND 28
IOUTAN 27
IOUTAP 26
AGND 25
AGND 24
IOUTBP 23
IOUTBN 22
AGND 21
VDDA(1V8) 20
VDDA(1V8) 19
AGND 18
33 AGND
VDDA(1V8) 17
AGND 16
001aam757
Pin configuration
6.2 Pin description
DAC1008D750_1
Objective data sheet
Table 2.
Pin description
Symbol
Pin
Type[1]
Description
SDO
1
O
SPI data output
SDIO
2
I/O
SPI data input/output
SCLK
3
I
SPI clock
VDDD(1V8)
4
P
digital supply voltage 1.8 V
SCS_N
5
I
SPI chip select (active LOW)
RESET_N
6
I
general reset (active LOW)
n.c.
7
-
not connected
VIRES
8
I/O
DAC biasing resistor
GAPOUT
9
I/O
bandgap input/output voltage
VDDA(1V8)
10
P
analog supply voltage 1.8 V
VDDA(1V8)
11
P
analog supply voltage 1.8 V
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
4 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
DAC1008D750_1
Objective data sheet
Table 2.
Pin description …continued
Symbol
Pin
Type[1]
Description
AGND
12
G
analog ground
AUXBN
13
O
complementary auxiliary DAC B output
AUXBP
14
O
auxiliary DAC B output
VDDA(3V3)
15
P
analog supply voltage 3.3 V
AGND
16
G
analog ground
VDDA(1V8)
17
P
analog supply voltage 1.8 V
AGND
18
G
analog ground
VDDA(1V8)
19
P
analog supply voltage 1.8 V
VDDA(1V8)
20
P
analog supply voltage 1.8 V
AGND
21
G
analog ground
IOUTBN
22
O
complementary DAC B output current
IOUTBP
23
O
DAC B output current
AGND
24
G
analog ground
AGND
25
G
analog ground
IOUTAP
26
O
DAC A output current
IOUTAN
27
O
complementary DAC A output current
AGND
28
G
analog ground
VDDA(1V8)
29
P
analog supply voltage 1.8 V
VDDA(1V8)
30
P
analog supply voltage 1.8 V
AGND
31
G
analog ground
VDDA(1V8)
32
P
analog supply voltage 1.8 V
AGND
33
G
analog ground
VDDA(3V3)
34
P
analog supply voltage 3.3 V
AUXAP
35
O
auxiliary DAC A output current
AUXAN
36
O
complementary auxiliary DAC A output current
AGND
37
G
analog ground
VDDA(1V8)
38
P
analog supply voltage 1.8 V
VDDA(1V8)
39
P
analog supply voltage 1.8 V
AGND
40
G
analog ground
CLKINP
41
I
clock input
CLKINN
42
I
complementary clock input
AGND
43
G
analog ground
VDDA(1V8)
44
P
analog supply voltage 1.8 V
MDS_P
45
I/O
multi-device synchronization
MDS_N
46
I/O
complementary multi-device synchronization
VDDD(1V8)
47
P
digital supply voltage 1.8 V
n.c.
48
-
not connected
VDDD(1V8)
49
P
digital supply voltage 1.8 V
SYNC_OUTN
50
O
synchronization request to transmitter, complementary
output
SYNC_OUTP
51
O
synchronization request to transmitter
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
5 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 2.
Pin description …continued
Symbol
Pin
Type[1]
Description
VIN_N0
52
I
serial interface lane 0 negative input
VIN_P0
53
I
serial interface lane 0 positive input
VDDD(1V8)
54
P
digital supply voltage 1.8 V
VIN_P1
55
I
serial interface lane 1 positive input
VIN_N1
56
I
serial interface lane 1 negative input
VIN_N2
57
I
serial interface lane 2 negative input
VIN_P2
58
I
serial interface lane 2 positive input
VDDD(1V8)
59
P
digital supply voltage 1.8 V
VIN_P3
60
I
serial interface lane 3 positive input
VIN_N3
61
I
serial interface lane 3 negative input
n.c.
62
-
not connected
n.c.
63
-
not connected
JTAG
64
I
JTAG test mode select (must be grounded)
GND
H[2]
G
ground
[1]
P: power supply; G: ground; I: input; O: output.
[2]
H = heatsink (exposed die pad to be soldered to GND. A minimum of 81 thermal vias are required)
7. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Min
Max
Unit
analog supply voltage (3.3 V)
[1]
−0.5
+4.6
V
analog supply voltage (1.8 V)
[2]
−0.5
+2.5
V
VDDD
digital supply voltage
[2]
−0.5
+2.5
V
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
−40
+125
°C
VDDA(3V3)
VDDA(1V8)
Parameter
Conditions
[1]
The supply voltage VDDA(3V3) may have any value between −0.5 V and +4.6 V provided that the supply voltage differences ΔVCC are
respected.
[2]
The supply voltages VDDA(1V8) and VDDD may have any value between −0.5 V and +2.5 V provided that the supply voltage differences
ΔVCC are respected.
8. Thermal characteristics
Table 4.
Symbol
Rth(j-a)
Rth(j-c)
[1]
DAC1008D750_1
Objective data sheet
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction to ambient
[1]
18.7
K/W
thermal resistance from junction to case
[1]
6.7
K/W
Complies with JEDEC test board, in free air.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
6 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
9. Characteristics
Table 5.
Characteristics
VDDA(1V8) = VDDD = 1.7 V to 1.9 V; VDDA(3V3) = 3.0 V to 3.6 V; AGND and GND are shorted together; Tamb = −40 °C to +85 °C;
typical values measured at VDDA(1V8) = VDDD = 1.8 V; VDDA(3V3) = 3.3 V; Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA; maximum
sample rate; PLL off unless otherwise specified.
Test[1]
Min
Typ
Max
Unit
analog supply voltage
(3.3 V)
I
3.0
3.3
3.6
V
VDDD(1V8)
digital supply voltage
(1.8 V)
I
1.7
1.8
1.9
V
VDDA(1V8)
analog supply voltage
(1.8 V)
I
1.7
1.8
1.9
V
IDDA(3V3)
analog supply current
(3.3 V)
fo = 19 MHz; fs = 740 Msps;
4× interpolation; NCO on
I
-
43
-
mA
IDDD(1V8)
digital supply current,
(1.8 V)
fo = 19 MHz; fs = 740 Msps;
4× interpolation; NCO on
I
-
361
-
mA
IDDA(1V8)
analog supply current, fo = 19 MHz; fs = 740 Msps;
(1.8 V)
4× interpolation; NCO on
I
-
421
-
mA
ΔIDDD
digital supply current
difference
I
-
54
-
mA
Ptot
total power dissipation fs = 740 Msps;
4× interpolation; NCO off;
DAC Q off
C
-
0.80
-
W
fs = 740 Msps;
4× interpolation; NCO off
C
-
1.26
-
W
fs = 740 Msps;
4× interpolation; NCO on
C
-
1.50
-
W
fs = 625 Msps;
2× interpolation; NCO off
C
-
1.29
-
W
fs = 625 Msps;
2× interpolation; NCO on
C
-
1.46
-
W
complete device;
Power-down mode
I
-
0.04
-
W
DAC A and DAC B;
Power-down mode
I
-
0.60
-
W
DAC A and DAC B;
Sleep mode
I
-
0.80
-
W
Symbol
Parameter
VDDA(3V3)
Conditions
x/sin x function on;
fs = 740 Msps
Power-down mode;
fo = 19 MHz; fs = 640 Msps;
4× interpolation; NCO on
Timing specifications
td(startup)
start-up delay time
from full Power-down mode
-
20
-
ms
td(restart)
restart delay time
from Sleep mode
-
300
-
ns
-
11
-
μs
825
-
1575
mV
tlock
lock time
Clock inputs (CLKINN,
Vi
Objective data sheet
maximum input rate
CLKINP)[3]
input voltage
DAC1008D750_1
[2]
range: CLK+ or CLK−
|Vgpd| < 50 mV[4]
C
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
7 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 5.
Characteristics …continued
VDDA(1V8) = VDDD = 1.7 V to 1.9 V; VDDA(3V3) = 3.0 V to 3.6 V; AGND and GND are shorted together; Tamb = −40 °C to +85 °C;
typical values measured at VDDA(1V8) = VDDD = 1.8 V; VDDA(3V3) = 3.3 V; Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA; maximum
sample rate; PLL off unless otherwise specified.
Parameter
Conditions
Test[1]
Min
Typ
Max
Unit
Vidth
input differential
threshold voltage
|Vgpd| < 50
C
−100
-
+100
mV
Ri
input resistance
D
-
10
-
MΩ
CI
input capacitance
D
-
0.5
-
pF
Symbol
mV[4]
Digital inputs (SDO, SDIO, SCLK, SCS_N, RESET_N)
VIL
LOW-level input
voltage
C
GND
-
0.54
V
VIH
HIGH-level input
voltage
C
1.26
-
VDDD
V
IIL
LOW-level input
current
VIL = 0.54 V
I
-
1
-
μA
IIH
HIGH-level input
current
VIH = 1.26 V
I
-
1
-
μA
Digital inputs (Vin_p/Vin_n)[5]
VI(cm)
common-mode input
voltage
D
0.68
0.78
1.40
V
VI(dif)(p-p)
peak-to-peak
differential input
voltage
D
175
-
1000
mV
Ztt
Vtt source impedance
D
-
0.7
-
Ω
ΔZi
differential input
impedance
D
-
100
-
Ω
Digital outputs (SYNC_OUTN/SYNC_OUTP)[6]
Vo(cm)
common-mode output
voltage
I
0.79
1.17
1.46
V
Vo(dif)(p-p)
peak-to-peak
differential output
voltage
I
0.12
0.48
0.96
V
D
-
600
-
mV
Digital inputs/outputs (MDS_N/MDS_P)
Vo(dif)(p-p)
peak-to-peak
differential output
voltage
Co(L)
Output load
capacitance
between pins GND and
MDS_N or MDS_P
D
-
-
10
pF
CI
Input capacitance
between pins GND and
MDS_N or MDS_P
D
-
0.3
-
pF
D
-
1.6
-
mA
-
20
-
mA
D
1.8
-
VDDA(3V3) V
D
-
250
-
Analog outputs (IOUTAP, IOUTAN, IOUTBP, IOUTBN)
IO(fs)
full-scale output
current
register value = 00h
(see Table 14 and Table 15)
register = default value
(see Table 14 and Table 15)
VO
output voltage
Ro
output resistance
DAC1008D750_1
Objective data sheet
compliance range
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
kΩ
© NXP B.V. 2010. All rights reserved.
8 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 5.
Characteristics …continued
VDDA(1V8) = VDDD = 1.7 V to 1.9 V; VDDA(3V3) = 3.0 V to 3.6 V; AGND and GND are shorted together; Tamb = −40 °C to +85 °C;
typical values measured at VDDA(1V8) = VDDD = 1.8 V; VDDA(3V3) = 3.3 V; Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA; maximum
sample rate; PLL off unless otherwise specified.
Symbol
Parameter
Conditions
Test[1]
Min
Typ
Max
Unit
Co
output capacitance
D
-
3
-
pF
ΔEO
offset error variation
D
-
6
-
ppm/°C
ΔEG
gain error variation
D
-
18
-
ppm/°C
C
<tbd>
1.25
<tbd>
V
C
-
40
-
μA
C
-
117
-
ppm/°C
Reference voltage output (GAPOUT)
VO(ref)
reference output
voltage
IO(ref)
reference output
current
ΔVO(ref)
reference output
voltage variation
external voltage 1.2 V
Analog auxiliary outputs (AUXAP, AUXAN, AUXBP and AUXBN)
IO(aux)
auxiliary output current differential outputs
I
-
2.2
-
mA
VO(aux)
auxiliary output
voltage
compliance range
D
0
-
2
V
NDAC(aux)mono
auxiliary DAC
monotonicity
guaranteed
D
-
10
-
bits
2× interpolation
D
-
-
312.5
Msps
4× interpolation
D
-
-
187.5
Msps
8× interpolation
D
-
-
93.75
Msps
serial input
D
0.5
-
3.125
Gbps
D
-
-
750
Msps
up to 0.5 LSB
D
-
20
-
ns
register value = 00000000h
(see Table 22 to Table 25)
D
-
0
-
MHz
register value = FFFFFFFFh
(see Table 22 to Table 25)
D
-
750
-
MHz
D
-
0.175
-
MHz
reg value = 00000000h
(see Table 22 to Table 25)
D
-
0
-
MHz
reg value = F8000000h
(see Table 22 to Table 25)
D
-
726.4
-
MHz
D
-
23.4
-
MHz
Input timing (Vin_p/Vin_n)
fdata
fbit
data rate
bit rate
Output timing (IOUTAP, IOUTAN, IOUTBP, IOUTBN)
fs
sampling rate
ts
settling time
NCO frequency range; fs = 750 Msps
fNCO
fstep
NCO frequency
step frequency
Low power NCO frequency range; fs = 750 Msps
fNCO
fstep
NCO frequency
step frequency
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
9 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 5.
Characteristics …continued
VDDA(1V8) = VDDD = 1.7 V to 1.9 V; VDDA(3V3) = 3.0 V to 3.6 V; AGND and GND are shorted together; Tamb = −40 °C to +85 °C;
typical values measured at VDDA(1V8) = VDDD = 1.8 V; VDDA(3V3) = 3.3 V; Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA; maximum
sample rate; PLL off unless otherwise specified.
Symbol
Parameter
Test[1]
Min
Typ
Max
Unit
C
-
76
-
dBc
C
-
74
-
dBc
I
-
74
-
dBc
I
-
80
-
dBc
fs = 737.28 Msps;
4× interpolation;
fo = 153.6 MHz at −1 dBFS;
BW = 20 Mhz
C
-
84
-
dBc
fo1 = 95 MHz; fo2 = 97 MHz;
fs = 737.28 Msps;
4× interpolation
C
[7]
-
79
fo1 = 153.1 MHz;
fo2 = 154.1 MHz;
fs = 737.28 Msps;
4× interpolation
I
[7]
-
76
-
dBc
fo1 = 137 MHz;
fo2 = 143 MHz;
fs = 737.28 Msps;
4× interpolation
C
[7]
-
76
-
dBc
Conditions
Dynamic performances
SFDR
spurious-free dynamic fdata = 92.16 Msps;
fs = 737.28 Msps; 8×;
range
BW = fdata / 2; PLL on
fo = 4 MHz at −1 dBFS
fdata = 184.32 Msps;
fs = 737.28 Msps; 4×;
BW = fdata / 2
fo = 19 MHz at −1 dBFS
fdata = 312.5 Msps;
fs = 625 Msps; 2×;
BW = fdata / 2
fo = 19 MHz at −1 dBFS
SFDRRBW
IMD3
restricted bandwidth
fs = 737.28 Msps;
spurious-free dynamic 4× interpolation;
range
fo = 153.6 MHz at −1 dBFS;
BW = 100 MHz
third-order
intermodulation
distortion
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Table 5.
Characteristics …continued
VDDA(1V8) = VDDD = 1.7 V to 1.9 V; VDDA(3V3) = 3.0 V to 3.6 V; AGND and GND are shorted together; Tamb = −40 °C to +85 °C;
typical values measured at VDDA(1V8) = VDDD = 1.8 V; VDDA(3V3) = 3.3 V; Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA; maximum
sample rate; PLL off unless otherwise specified.
Test[1]
Min
Typ
Max
Unit
1 carrier; BW = 5 MHz
C
-
67
-
dBc
2 carriers; BW = 10 MHz
C
-
64
-
dBc
4 carriers; BW = 20 MHz
C
-
60
-
dBc
1 carrier; BW = 5 MHz
C
-
67
-
dBc
2 carriers; BW = 10 MHz
C
-
64
-
dBc
4 carriers; BW = 20 MHz
C
-
59
-
dBc
fs = 737.28 Msps;
4× interpolation;
fo = 153.6 MHz at 0 dBFS
I
-
−145
-
dBm/Hz
Symbol
Parameter
Conditions
ACPR
adjacent channel
power ratio
NCO on; 4× interpolation;
fs = 737.28 Msps; fo = 96
MHz
NCO on; 4× interpolation;
fs = 737.28 Msps; fo = 153.6
MHz
NSD
noise spectral density
[1]
D = guaranteed by design; C = guaranteed by characterization; I = 100 % industrially tested.
[2]
Delay between the deassertion of bits FORCE_RESET_FCLK and FORCE_RESET_DCLK and the deassertion of the sync signal. It
reflects the delay required by DAC1008D750 to lock to a JESD204A stream. It supposes that the TX is already transmitting
K28.5 characters in error-free conditions.
[3]
CLKINP/CLKINN inputs are at differential LVDS levels. An external termination resistor with a value of between 80 Ω and 120 Ω (see
Figure 16) should be connected across the pins.
[4]
|Vgpd| represents the ground potential difference voltage. This is the voltage that results from current flowing through the finite resistance
and the inductance between the receiver and the driver circuit ground voltage.
[5]
Vin_p and Vin_n inputs are differential CML inputs. They are terminated internally to Vtt via 50 Ω (see Figure 4).
[6]
SYNC_OUTP/SYNC_OUTN outputs are differential LVDS outputs. They must be terminated by a resistor with a value of between 80 Ω
and 120 Ω.
[7]
IMD3 rejection with −6 dBFS/tone.
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10. Application information
10.1 General description
The DAC1008D750 is a dual 10-bit DAC operating up to 750 Msps. With a maximum input
data rate of up to 312.5 Msps and a maximum output sampling rate of 750 Msps, the
DAC1008D750 allows more flexibility for wide bandwidth and multi-carrier systems.
Combined with its quadrature modulator and 32-bit NCO, the DAC1008D750 simplifies
the frequency selection of the system. This is also possible because of the 2×, 4× or 8×
interpolation filters which remove undesired images.
DAC1008D750 supports the following JESD204A key features:
•
•
•
•
•
•
•
10-bit/8-bit decoding
Code group synchronization
inter-lane alignment
1 + x14 + x15 scrambling polynomial
Character replacement
TX/RX synchronization management via SYNC signals
Multiple Converter Device Alignment-Multiple Lanes (MCDA-ML) device
DAC1008D750 can be interfaced with any logic device that features high-speed SERDES
functionality. This macro is now widely available in FPGA from different vendors.
Standalone SERDES ICs can also be used.
To enhance the intrinsic board layout simplification of the JESD204A standard, NXP
includes polarity swapping for each of the lanes and additionally offers lane swapping.
Each physical lane can be configured logically as lane0, lane1, lane2 or lane3.
This device is MCDA-ML compliant, offering inter-lane alignment between several
devices. Samples alignment between devices is maintained up to output level because of
an NXP proprietary mechanism. One device is configured as the master and all the others
are configured as slaves. These will automatically align their output samples to the master
ones. Therefore, a system with several DAC1008D750s can produce data with a
guaranteed alignment of less than 1 DAC output clock period.
Each DAC generates two complementary current outputs on pins IOUTAP/IOUTAN and
IOUTBP/IOUTBN. This provides a full-scale output current of up to 20 mA. An internal
reference is available for the reference current which is externally adjustable using pin
VIRES.
The DAC1008D750 must be configured before operating. Therefore, it features an SPI
slave interface to access internal registers. Some of these registers also provide
information about the JESD204A interface status.
The DAC1008D750 requires supplies of both 3.3 V and 1.8 V. The 1.8 V supply has
separate digital and analog power supply pins. The clock input is LVDS compliant.
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10.2 JESD204A receiver
CLOCK
ALIGN
10b
SYNC
AND
WORD
ALIGN
10b
K-DETECT 8b
10b/8b
DESCRAMBLER
8b
frame
clock
8b
8b
8b
8b
FA
(Frame Assembly)
DES
ILA
(Inter-lane Alignment)
10b
lane#
internal
configuration
interface
RX CONTROLLER
SYNC_OUT
10b
10b
005aaa157
The descrambler can be enabled/disabled
Fig 3.
JESD204A receiver
The JEDEC204A defines the following parameters:
L is the number of lanes per link
M is the number of converters per device
F is the number of bytes per frame clock period
The DAC1008D750 supports both LMF = 421 and LMF = 211. The current setting is
configurable via the SPI registers interface.
The complete Digital Layer Processing (DLP) adds a variable delay on each lane path.
This is mainly because of the inter-lane alignment.
Table 6.
Digital Layer Processing Latency
Symbol Parameter
td
DAC1008D750_1
Objective data sheet
delay time
Conditions
Test[1]
Min
Typ
Max
Unit
digital layer processing
delay
D
13
-
28
cycle[2]
[1]
D = guaranteed by design.
[2]
Frame clock cycle.
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10.2.1 Lane input
Each lane is CML compliant. It is terminated to a common voltage with an integrated 50 Ω
resistor.
Vin_p
50 Ω
50 Ω
Vin_n
Ztt
Vtt
001aak166
Fig 4.
Lane input termination
The common-mode voltage is programmable by the SET_VCM_VOLTAGE register as
shown in Table 76 on page 56.
DC coupling is only possible if both the DAC and the transmitter have the same
common-mode voltage. If this is not the case AC coupling is required.
VDD1
50 Ω
50 Ω
50 Ω
50 Ω
50 Ω
Zdiff = 100 Ω
50 Ω
50 Ω
50 Ω
Zdiff = 100 Ω
data in +
data in +
data in −
data in −
001aak163
001aak162
Fig 5.
VDD2
DC coupling
Fig 6.
AC coupling
The deserializer performs the incoming data clock recovery and also the serial to parallel
conversion. Therefore, each lane includes its own PLL that must first lock.
The clock alignment module transfers the data from the regenerated clock to the frame
clock domain. The frequency of both clocks is the same but the phase relationship
between the clocks is unknown.
10.2.2 Sync and word align
As stated in JESD204A, the transmitter and the receiver first have to synchronize. This is
achieved through SYNC_OUT signals and a sync pattern (K28.5 symbol). The receiver
(i.e. DAC1008D750) first drives its SYNC_OUT outputs. The sync pattern is continuously
sent until the receiver deasserts the SYNC_OUT signal.
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The lane processing makes use of the sync patterns to synchronize the datastream,
determine the initial running disparity and extract the 10-bit word from the incoming
datastream (word-alignment).
The SYNC_OUT signal is also used during normal operation by the DAC1008D750 to
request a link reinitialization. This occurs when the 10b/8b module loses synchronization.
The SYNC_OUT signal conforms to LVDS signaling. Its common-mode voltage and its
single-ended peak amplitude can be programmed using SET_SYNC_LEVEL bits in the
SET_SYNC registers (see Table 78 on page 56).
SYNC_OUT is synchronous with the frame clock.
tFS_R(max)
tFS_R(min)
SYNC_OUT
CLK
001aak165
tFS_R(min) and tFS_R(max) are defined in the JEDEC standard No. 204A.
Fig 7.
Table 7.
SYNC_OUT timing
SYNC_OUT timing
Symbol Parameter
td
[1]
delay time
Conditions
Test[1]
Min
Typ
Max
Unit
frame clock to sync
C
<tbd>
-
<tbd>
ns
C = guaranteed by characterization.
10.2.3 Comma detection and word align
This stage monitors the datastream for code characters (Comma detection), decodes the
words to bytes (octets) and performs optional character replacement as part of frame/lane
alignment monitoring and correction. This module provides the required control signals to
the RX controller and ILA.
This module decodes the 10-bit words into 8-bit words (octets). The decoding table is
specified in the IEEE 802.3-2005 specification. During decoding, the disparity is
calculated according to the disparity rules mentioned in the same specification
IEEE 802.3-2005. When the disparity counter is more than +2 or less than −2, an error will
be generated.
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The following comma symbols are detected during data transmission irrespective of the
running disparity:
/K/ = K28.5
/F/ = K28.7
/A/ = K28.3
/R/ = K28.0
/Q/ = K28.4
A flag is sent to the control interface to reflect detected commas in registers.
The following flags are also triggered according to the following definitions:
• VALID: a code group that is found in the column of the 10b/8b decoding tables
according to the current running disparity.
• DISPARITY ERROR: The received code group exists in the 10b/8b decoding table,
but is not found in the proper column according to the current running disparity.
• NOT-IN-TABLE (NIT) ERROR: The received code group is not found in the 10b/8b
decoding table for either disparity.
• INVALID: a code group that either shows a disparity error or that does not exist in the
10b/8b decoding table.
DAC1008D750 supports character replacement whatever the state of the descrambler.
When scrambling is not active, the received K28.3 /A/ or K28.7 /F/ will be replaced by the
previous sample. When scrambling is active, the corresponding data octet D28.3 (0xC) or
D28.7 (0xFC) will be used.
10.2.4 Descrambler
The descrambler is a 16-bit parallel self-synchronous descrambler based on the
polynomial 1 + x14 + x15. This processing can be turned off.
10.2.5 Inter-lane alignment
This feature removes strict PCB design skew compensation between the lanes.
10.2.5.1
Single device operation
This module handles the alignment of the four data streams. Because of inter-lane skew
and each PLL per lane concept, these alignment characters may be received at different
times by the receivers. After the synchronization period, the lock signal will be HIGH. This
enables the receipt of K28.3 /A/ characters.
The ILA_CNTRL register’s SEL_ILA[1:0] bits select which K28.3 /A/ symbol triggers the
initial lane alignment:“00” = 1st /A/ symbol, “01” = 2nd /A/ symbol, “10” = 3rd /A/ symbol,
“11” = 4th /A/ symbol; Table 87 on page 62. When all receivers have received their first
selected /A/, they start propagating the received data to the frame assembly module at the
same point in time.
This module can compensate up to ±7 frame clock period misalignments between the
lanes.
When initial lane alignment is not supported, the manual alignment mode can be used.
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After the initial ILA sequence, the lane alignment monitoring starts. When a K28.3 /A/
symbol is received among the user data:
• its position is compared to the value of the alignment monitor counter
• if two successive K28.3 /A/ symbols have been received at a wrong position, a
realignment takes place
• if the buffers are empty or overflow, this is indicated by the registers
ILA_BUF_ERR_LN0 to ILA_BUF_ERR_LN3
10.2.5.2
Multi-device operation
DAC1008D750 implements a multi-device inter-lane alignment that guarantees a skew of
less than one output period between them.
Two modes are available: master/slave and all slave. Both make use of the MDS_P and
MDS_N pins.
mds_A_out
ref_A
MDS_A
COMP
mds_A
I
LANES
DIG
BUFFER
Q
SYNC~
CLK
MGMT
DAC
CK
Fig 8.
001aal073
Multi-Device Synchronization (MDS) implementation
Each DAC device of the system generates its own reference (ref_A in Figure 8).
If configured as a slave, an early-late comparator compares the internal reference with the
external reference provided by the MDS pins. The comparator controls an internal buffer
that is used to delay the samples.
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10.2.5.3
Master/slave mode
The external reference is provided by one of the DACs (the master DAC), which has to be
configured to do this. The others are set to slave mode.
mds_out
ref_A
COMP
mds_in
I
DIG
MASTER
DAC 0
BUFFER
Q
CLK
MGMT
SYNC_0
DAC
mds_out
ref_A
COMP
mds_in
I
DIG
SLAVE
DAC 1
BUFFER
Q
CLK
MGMT
TX
SYNC_1
DAC
mds_out
ref_A
COMP
mds_in
I
DIG
SLAVE
DAC 2
BUFFER
Q
CLK
MGMT
SYNC_2
DAC
CLOCK
DISTRIBUTION
REF_CLOCK
001aal070
Fig 9.
DAC1008D750_1
Objective data sheet
Master-slave mode
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The MDS signal generated by the master DAC must reach all slaves within one DAC
output clock period. This induces PCB layout constraints for the MDS signal and also for
the clock distribution. Because trace lengths differ, the clock edges will reach each of the
DACs at different times.
TDAC
ref clock
PH01
master clock
PH02
slave 1 clock
PH03
slave 2 clock
001aal072
Fig 10. Clock skew case 1: Master is the farthest
The worst case clock skew is given by δt1 = PH01 − PH03, where PH0x represents the
sum of the trace delay and the clock skew at the output of the clock generator.
The maximum allowable trace delay for the MDS signal is given by Δt = TDAC − δt1.
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TDAC
ref clock
PH01
master clock
PH02
slave 1 clock
PH03
slave 2 clock
001aal071
Fig 11. Clock skew case 2: Master is closest
The worst case clock skew is given by δt2 = PH03 − PH01.
The minimum allowable trace delay for the MDS signal is given by Δt = δt2.
In real applications, the master DAC can be anywhere and both conditions must be
satisfied: δt2 < Δtmds < TDAC − δt1.
Example:
•
•
•
•
clock generator skew = ± 80 ps
FR4 substrate ⇒ 15 cm/ns delay
clock trace length difference = 3 cm and 4 cm
Output sampling rate = 750 Msps
⇒ 200 ps + 80 ps < Δtmds < 1333 ps − (266 ps + 80 ps)
⇒ 280 ps < Δtmds < 987 ps
⇒ 4.2 cm < Lmds < 14.8 cm
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10.2.5.4
All slave mode
The external reference is provided by the JESD204A transmitter. All DACs are configured
in slave mode.
mds_out
ref_A
JESD204A
TX
COMP
mds_in
I
DIG
SLAVE
DAC 0
BUFFER
Q
CLK
MGMT
SYNC_0
DAC
mds_out
ref_A
COMP
mds_in
I
DIG
SLAVE
DAC 1
BUFFER
Q
/A/
INSERTION
CLK
MGMT
SYNC_1
DAC
mds_out
ref_A
COMP
mds_in
I
DIG
SLAVE
DAC 2
BUFFER
Q
CLK
MGMT
SYNC_2
dT
DAC
MDS
CLOCK
DISTRIBUTION
REF_CLOCK
001aal069
Fig 12. All slave mode
The MDS signal is now driven from the transmitter. It is generated at the end of the
inter-lane alignment phase (see the JESD204A standard for details).
The transmitter must also compensate for the DAC latency. Although the DAC has an
internal samples delay line, it cannot handle large delays.
In this mode, PCB layout is also important. The following delay equation applies:
δt < Δtmds < TDAC − δt, where δt is the clock skew considered close to DAC pins.
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10.2.6 Frame assembly
DAC1008D750 supports only /F/ = 1, which means that every frame clock period carries
one byte per lane. Frame assembly combines the octet of lane_0 with the two MSB bits of
lane_1 and reassembles the original 10-bit sample. The same is done for lane_2 and
lane_3. Tail bits are dropped.
The frame assembler also handles previously triggered errors.
If scrambling is enabled:
If a nit_err (not-in-table error) or kout_unexp (unexpected control character) occurs in
lane_0 and/or lane_1, the previous 10-bit sample is repeated twice for I (lane_0,
lane_1). The same is done for Q (lane_2, lane_3).
If scrambling is disabled:
If a nit_err (not-in-table error) or kout_unexp (unexpected control character) occurs in
lane_0 and/or lane_1, the previous 10-bit sample will be repeated once for I (lane_0,
lane_1). The same is done for Q (lane_2, lane_3).
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CHARACTER CLOCK
312.5 MHz
/F
encoded
octet
b5
b4
b3
b2
b1
b0
D09
b7
S6
D08
b6
S5
b5
b4
b6
b5
b4
b3
b2
b1
b0
D03
S0
D02
lane 0
D09
b9
scrambled
octet
b8
S7
D01
b7
S6
D00
b6
S5
b5
b4
b6
b5
b4
b3
b2
b1
b0
S4
S3
ON/OFF
D08
byte 1
D07
D06
D05
T
D04
T
D02
T
S2
b2
S1
T
b1
S0
T
lane 1
F = 1 byte
D01
D00
M = 2 converters
b9
scrambled
octet
b8
S7
D09
b7
S6
D08
D08
b6
S5
D07
D07
D06
D06
D05
D05
D04
D04
b5
b4
S4
S3
ON/OFF
byte 2
D09
b3
S2
b2
S1
D03
D03
b1
S0
D02
D02
b0
DAC0
D03
T
b3
10b/8b
b7
DESERIALIZER
b8
D04
b1
encoded
octet
b9
D05
S1
b0
/10
D06
b2
10b/8b
b7
DESERIALIZER
b8
D07
S2
encoded
octet
b9
S3
byte 0
b3
b0
/10
S4
ON/OFF
DESCRAMBLER
b6
S7
DESCRAMBLER
b7
b8
DESCRAMBLER
b8
b9
scrambled
octet
10b/8b
b9
DESERIALIZER
/10
FRAME CLOCK
312.5 MHz
FRAME ASSEMBLY
SERIAL CLOCK
3.125 GHz
DAC1
D01
lane 2
D00
encoded
octet
b7
b6
b5
b4
b3
b2
b1
b0
scrambled
octet
b8
S7
D01
b7
S6
D00
b6
S5
b5
b4
S4
S3
ON/OFF
DESCRAMBLER
b8
b9
10b/8b
b9
DESERIALIZER
/10
byte 3
T
T
T
b3
S2
b2
S1
T
b1
S0
T
b0
lane 3
T
005aaa153
Fig 13. Frame assembly
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10.3 Serial Peripheral Interface (SPI)
10.3.1 Protocol description
The DAC1008D750 serial interface is a synchronous serial communication port allowing
easy interfacing with many industry microprocessors. It provides access to the registers
that define the operating modes of the chip in both Write mode and Read mode.
This interface can be configured as a 3-wire type (SDIO as bidirectional pin) or a 4-wire
type (SDIO and SDO as unidirectional pin, input and output port respectively). In both
configurations, SCLK acts as the serial clock and SCS_N acts as the serial chip select
bar.
Each read/write operation is sequenced by the SCS_N signal and enabled by a LOW
assertion to drive the chip with two bytes to five bytes, depending on the content of the
instruction byte (see Table 9).
RESET_N
SCS_N
SCLK
SDIO
R/W
N1
N0
A4
A3
A2
A1
A0
SDO
(optional)
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
001aaj812
R/W indicates the mode access, (see Table 8).
Fig 14. SPI protocol
Table 8.
R/W
Read or Write mode access description
Description
0
Write mode operation
1
Read mode operation
In Table 9 below, N1 and N0 indicate the number of bytes transferred after the instruction
byte.
Table 9.
Number of bytes to be transferred
N1
N0
Number of bytes transferred
0
0
1
0
1
2
1
0
3
1
1
4
A[4:0] indicates which register is being addressed. In the case of a multiple transfer, this
address points to the first registerto be accessed. The address is then internally
decreased after each following data phase.
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10.3.2 SPI timing description
The SPI interface can operate at a frequency of up to 15 MHz. The SPI timing is shown in
Figure 15.
tw(RESET_N)
RESET_N
50 %
th(SCS_N)
tsu(SCS_N)
SCS_N
50 %
tw(SCLK)
SCLK
SDIO
50 %
50 %
th(SDIO)
tsu(SDIO)
001aaj813
Fig 15. SPI timing diagram
The SPI timing characteristics are given in Table 10.
Table 10.
DAC1008D750_1
Objective data sheet
SPI timing characteristics
Symbol
Parameter
Min
Typ
Max
Unit
fSCLK
SCLK frequency
-
-
15
MHz
tw(SCLK)
SCLK pulse width
30
-
-
ns
tsu(SCS_N)
SCS_N set-up time
20
-
-
ns
th(SCS_N)
SCS_N hold time
20
-
-
ns
tsu(SDIO)
SDIO set-up time
10
-
-
ns
th(SDIO)
SDIO hold time
5
-
-
ns
tw(RESET_N)
RESET_N pulse width
30
-
-
ns
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10.4 Clock input
The DAC1008D750 has one differential clock input, CLKINN/CLKINP.
CLKINP
LVDS
LVDS
Zdiff = 100 Ω
100 Ω
CLKINN
001aah021
Fig 16. LVDS clock configuration
VDDA(1V8)
1.1 kΩ
100 nF
CLKINP
55 Ω
CML
Zdiff = 100 Ω
LVDS
100 Ω
55 Ω
100 nF
CLKINN
2.2 kΩ
AGND
100 nF
001aah020
Fig 17. Interfacing CML to LVDS
The DAC1008D750 can operate with a clock frequency up to 312.5 MHz or up to
750 MHz if the internal PLL is bypassed. The clock input can be LVDS (see Figure 16) but
it can also be interfaced with CML (see Figure 17).
During the reset phase (RESET_N asserted), the clock must be stable and running. This
ensures a proper reset of the complete device.
The device has no embedded power-on-reset feature. Driving the RESET_N pin to set the
device to its default state is mandatory.
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10.5 FIR filters
The three interpolation FIR filters have a stop band attenuation of at least 80 dBc and a
pass band ripple of less than 0,0005 dB.
Table 11.
Interpolation filter coefficients
First interpolation filter
DAC1008D750_1
Objective data sheet
Second interpolation filter
Third interpolation filter
Lower
Upper
Value
Lower
Upper
Value
Lower
Upper
Value
H(1)
H(55)
−4
H(1)
H(23)
−2
H(1)
H(15)
−39
H(2)
H(54)
0
H(2)
H(22)
0
H(2)
H(14)
0
H(3)
H(53)
13
H(3)
H(21)
17
H(3)
H(13)
273
H(4)
H(52)
0
H(4)
H(20)
0
H(4)
H(12)
0
H(5)
H(51)
−34
H(5)
H(19)
−75
H(5)
H(11)
−1102
H(6)
H(50)
0
H(6)
H(18)
0
H(6)
H(10)
0
H(7)
H(49)
72
H(7)
H(17)
238
H(7)
H(9)
4964
H(8)
H(48)
0
H(8)
H(16)
0
H(8)
-
8192
H(9)
H(47)
−138
H(9)
H(15)
−660
-
-
-
H(10)
H(46)
0
H(10)
H(14)
0
-
-
-
H(11)
H(45)
245
H(11)
H(13)
2530
-
-
-
H(12)
H(44)
0
H(12)
-
4096
-
-
-
H(13)
H(43)
−408
-
-
-
-
-
-
H(14)
H(42)
0
-
-
-
-
-
-
H(15)
H(41)
650
-
-
-
-
-
-
H(16)
H(40)
0
-
-
-
-
-
-
H(17)
H(39)
−1003
-
-
-
-
-
-
H(18)
H(38)
0
-
-
-
-
-
-
H(19)
H(37)
1521
-
-
-
-
-
-
H(20)
H(36)
0
-
-
-
-
-
-
H(21)
H(35)
−2315
-
-
-
-
-
-
H(22)
H(34)
0
-
-
-
-
-
-
H(23)
H(33)
3671
-
-
-
-
-
-
H(24)
H(32)
0
-
-
-
-
-
-
H(25)
H(31)
−6642
-
-
-
-
-
-
H(26)
H(30)
0
-
-
-
-
-
-
H(27)
H(29)
20756
-
-
-
-
-
-
H(28)
-
32768
-
-
-
-
-
-
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10.6 Quadrature modulator and Numerically Controlled Oscillator (NCO)
The quadrature modulator allows the 10-bit I and Q data to be mixed with the carrier
signal generated by the NCO.
The frequency of the NCO is programmed over 32 bits and the sign of the sine component
can be inverted in order to operate positive or negative, lower or upper single sideband
up-conversion.
10.6.1 NCO in 32-bit
When using the NCO, the frequency can be set by the four registers FREQNCO_LSB,
FREQNCO_LISB, FREQNCO_UISB and FREQNCO_MSB over 32 bits.
The frequency for the NCO in 32-bit is calculated as follows:
M×f
f NCO = --------------s
32
2
(1)
where M is the decimal representation of FREQ_NCO[31:0].
The phase of the NCO can be set from 0° to 360° by both registers PHINCO_LSB and
PHINCO_MSB over 16 bits.
The default setting is fNCO = 96 MHz when fs = 640 Msps and the default phase is 0°.
10.6.2 Low-power NCO
When using the low-power NCO, the frequency can be set by the five MSBs of register
FREQNCO_MSB.
The frequency for the low-power NCO is calculated as follows:
M×f
f NCO = --------------s
5
2
(2)
where M is the decimal representation of FREQ_NCO[31:27].
The phase of the low-power NCO can be set by the five MSBs of the register
PHINCO_MSB.
10.6.3 Minus_3dB
During normal use, a full-scale pattern will also be full-scale at the output of the DAC.
Nevertheless, when the I and Q data are simultaneously close to full-scale, some clipping
can occur and the minus_3dB function can be used to reduce the gain in the modulator by
3 dB. This is to keep a full-scale range at the output of the DAC without added interferers.
10.7 x / (sin x)
The roll-off effect of the DAC causes a selectable FIR filter to be inserted to compensate
for the (sin x) / x effect. This filter introduces a DC loss of 3.4 dB. The coefficients are
represented in Table 12.
DAC1008D750_1
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Table 12.
Inversion filter coefficients
First interpolation filter
Lower
Upper
Value
H(1)
H(9)
2
H(2)
H(8)
−4
H(3)
H(7)
10
H(4)
H(6)
−35
H(5)
-
401
10.8 DAC transfer function
The full-scale output current for each DAC is the sum of the two complementary current
outputs:
(3)
I O ( fs ) = I IOUTP + I IOUTN
The output current depends on the digital input data:
DATA
I IOUTP = I O ( fs ) × ⎛ ----------------⎞
⎝ 1023 ⎠
(4)
1023 – DATA
I IOUTN = I O ( fs ) × ⎛ ----------------------------------⎞
⎝
⎠
1023
(5)
The setting applied to register COMMON bit DF (register 00h[2]; see Table 18 “Page 0
register allocation map”) defines whether the DAC1008D750 operates with a binary input
or a two’s complement input.
Table 13 shows the output current as a function of the input data, when IO(fs) = 20 mA.
Table 13.
Data
0
DAC1008D750_1
Objective data sheet
DAC transfer function
I9/Q9 to I0/Q0
Binary
Two’s complement
00 0000 0000
10 0000 0000
IOUTP
IOUTN
0 mA
20 mA
...
...
...
...
...
2048
10 0000 0000
00 0000 0000
10 mA
10 mA
...
...
...
...
...
4095
11 1111 1111
01 1111 1111
20 mA
0 mA
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10.9 Full-scale current
10.9.1 Regulation
The DAC1008D750 reference circuitry integrates an internal bandgap reference voltage
which delivers a 1.25 V reference to the GAPOUT pin. It is recommended to decouple pin
GAPOUT using a 100 nF capacitor.
The reference current is generated via an external resistor of 909 Ω (1 %) connected to
pin VIRES. A control amplifier sets the appropriate full-scale current (IO(fs)) for both DACs
(see Figure 18).
REF.
BANDGAP
100 nF
AGND
909 Ω
(1 %)
AGND
GAPOUT
VIRES
DAC
CURRENT
SOURCES
ARRAY
001aaj816
Fig 18. Internal reference configuration
This configuration is optimum for temperature drift compensation because the bandgap
reference voltage can be matched to the voltage across the feedback resistor.
10.9.1.1
External regulation
The DAC current can also be set by applying an external reference voltage to the
non-inverting input pin GAPOUT and disabling the internal bandgap reference voltage
with bit GAP_PD (register 00h[0]; see Table 19 “COMMON register (address 00h) bit
description”).
10.9.2 Full-scale current adjustment
The default full-scale current (IO(fs)) is 20 mA but further adjustments can be made by the
user to both DACs independently using the serial interface from 1.6 mA to 22 mA, ± 10 %.
The settings applied to DAC_A_GAIN_COARSE[3:0] (register 0Ah; see Table 29
“DAC_A_CFG_2 register (address 0Ah) bit description” and register 0Bh; see Table 30
“DAC_A_CFG_3 register (address 0Bh) bit description”) and DAC_B_GAIN COARSE[3:0]
(register 0Dh; see Table 32 “DAC_B_CFG_2 register (address 0Dh) bit description” and
register 0Eh; see Table 33 “DAC_B_CFG_3 register (address 0Eh) bit description”) define
the coarse variation of the full-scale current (see Table 14).
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Table 14. IO(fs) coarse adjustment
Default settings are shown highlighted.
DAC_GAIN_COARSE[3:0]
IO(fs) (mA)
Decimal
Binary
0
0000
1.6
1
0001
3.0
2
0010
4.4
3
0011
5.8
4
0100
7.2
5
0101
8.6
6
0110
10.0
7
0111
11.4
8
1000
12.8
9
1001
14.2
10
1010
15.6
11
1011
17.0
12
1100
18.5
13
1101
20.0
14
1110
21.0
15
1111
22.0
The settings applied to DAC_A_GAIN_FINE[5:0] (register 0Ah; see Table 29
“DAC_A_CFG_2 register (address 0Ah) bit description”) and to DAC_B_GAIN_FINE[5:0]
(register 0Dh; see Table 32 “DAC_B_CFG_2 register (address 0Dh) bit description”)
define the fine variation of the full-scale current (see Table 15).
Table 15. IO(fs) fine adjustment
Default settings are shown highlighted.
DAC_GAIN_FINE[5:0]
Delta IO(fs)
Decimal
Two’s complement
−32
10 0000
−10 %
...
...
...
0
00 0000
0
...
...
...
31
01 1111
+10 %
The coding of the fine gain adjustment is two’s complement.
10.10 Digital offset correction
When the DAC1008D750 analog output is DC connected to the next stage, the digital
offset correction can be used to adjust the common-mode level at the output of the DAC.
It adds an offset at the end of the digital part, just before the DAC.
The settings applied to DAC_A_OFFSET[11:0] (register 09h; see Table 28
“DAC_A_CFG_1 register (address 09h) bit description” and register 0Bh; see Table 30
“DAC_A_CFG_3 register (address 0Bh) bit description”) and to “DAC_B_OFFSET[11:0]”
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(register 0Ch; see Table 31 “DAC_B_CFG_1 register (address 0Ch) bit description” and
register 0Eh; see Table 33 “DAC_B_CFG_3 register (address 0Eh) bit description”) define
the range of variation of the digital offset (see Table 16).
Table 16. Digital offset adjustment
Default settings are shown highlighted.
DAC_OFFSET[11:0]
Offset applied
Decimal
Two’s complement
−2048
1000 0000 0000
−4096
−2047
1000 0000 0001
−4094
...
...
...
−1
1111 1111 1111
−2
0
0000 0000 0000
0
+1
0000 0000 0001
+2
...
...
...
2046
0111 1111 1110
+4092
2047
0111 1111 1111
+4094
10.11 Analog output
The DAC1008D750 has two output channels each of which produces two complementary
current outputs. These allow the even-order harmonics and noise to be reduced. The pins
are IOUTAP/IOUTAN and IOUTBP/IOUTBN respectively and need to be connected via a
load resistor RL to the 3.3 V analog power supply (VDDA(3V3)).
The equivalent analog output circuit of one DAC is shown in Figure 19. This circuit
consists of a parallel combination of NMOS current sources and their associated switches
for each segment.
VDDA(3V3)
RL
RL
IOUTAP/IOUTBP
IOUTAN/IOUTBN
AGND
AGND
001aah019
Fig 19. Equivalent analog output circuit (one DAC)
The cascode source configuration increases the output impedance of the source, thus
improving the dynamic performance of the DAC by introducing less distortion.
The device can provide an output level (Vo(p-p)) of up to 2 V, depending on the application,
the following stages and the targeted performances.
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10.12 Auxiliary DACs
The DAC1008D750 integrates two auxiliary DACs that can be used to compensate for
any offset between the DAC and the next stage in the transmission path.
Both auxiliary DACs have a 10-bit resolution and are current sources (referenced to
ground).
(6)
I O ( AUX ) = I AUXP + I AUXN
The output current depends on the auxiliary DAC data:
AUX [ 9:0 ]
AUXP = I O ( AUX ) × ⎛ -------------------------⎞
⎝ 1023 ⎠
(7)
(1023 – A UX [ 9:0 ] )
AUXN = I O ( AUX ) × ⎛ ----------------------------------------------⎞
⎝
⎠
1023
(8)
Table 17 shows the output current as a function of the auxiliary DAC data.
Table 17. Auxiliary DAC transfer function
Default settings are shown highlighted.
DAC1008D750_1
Objective data sheet
Data
AUX[9:0] (binary)
IAUXP
IAUXN
0
00 0000 0000
0 mA
2.2 mA
...
...
...
...
512
10 0000 0000
1.1 mA
1.1 mA
...
...
...
...
1023
11 1111 1111
2.2 mA
0 mA
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10.13 Output configuration
10.13.1 Basic output configuration
The use of a differentially-coupled transformer output provides optimum distortion
performance (see Figure 20). In addition, it helps to match the impedance and provides
electrical isolation.
VDDA(3V3)
50 Ω
0 mA to 20 mA
2:1
IOUTnP
50 Ω
0 mA to 20 mA
IOUTnN
50 Ω
VDDA(3V3)
IOUTnP/IOUTnN; Vo(cm) = 2.8 V; Vo(dif)(p-p) = 1 V
001aaj817
Fig 20. 1 Vo(p-p) differential output with transformer
The DAC1008D750 can operate at a Vo(p-p) of 2 V differential outputs. In this
configuration, it is recommended to connect the center tap of the transformer to a 62 Ω
resistor connected to the 3.3 V analog power supply in order to adjust the DC
common-mode to approximately 2.7 V (see Figure 21).
VDDA(3V3)
VDDA(3V3)
100 Ω
62 Ω
0 mA to 20 mA
4:1
IOUTnP
50 Ω
0 mA to 20 mA
IOUTnN
100 Ω
VDDA(3V3)
IOUTnP/IOUTnN; Vo(cm) = 2.7 V; Vo(dif)(p-p) = 2 V
001aaj818
Fig 21. 2 Vo(p-p) differential output with transformer
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10.13.2 DC interface to an Analog Quadrature Modulator (AQM)
When the system operation requires to keep the DC component of the spectrum, the
DAC1008D750 must use a DC interface to connect to an AQM. In this case, the offset
compensation for LO cancellation can be made with the use of the digital offset control in
the DAC.
Figure 22 is an example of a connection to an AQM with a common-mode input level
(Vi(cm)) of 1.7 V.
AQM (Vi(cm) = 1.7 V)
VDDA(3V3)
51.1 Ω
(1)
51.1 Ω
(2)
442 Ω
IOUTnP
BBP
442 Ω
BBN
IOUTnN
0 mA to 20 mA
768 Ω
768 Ω
(1) IOUTnP/IOUTnN; V
o(cm) = 2.67 V; Vo(dif)(p-p) = 1.98 V
(2) BBP/BBN; V
i(cm) = 1.7 V; Vi(dif)(p-p) = 1.26 V
001aaj541
Fig 22. Example of a DC interface to an AQM with a Vi(cm) of 1.7 V
Figure 23 is an example of a connection to an AQM with a common-mode input level
(Vi(cm)) of 3.3 V.
VDDA(3V3)
(1)
54.9 Ω
AQM (Vi(cm) = 3.3 V)
5V
54.9 Ω
750 Ω
(2)
750 Ω
237 Ω
IOUTnP
BBP
237 Ω
IOUTnN
BBN
1.27 kΩ
1.27 kΩ
(1) IOUTnP/IOUTnN; V
o(cm) = 2.75 V; Vo(dif)(p-p) = 1.97 V
(2) BBP/BBN; V
i(cm) = 3.3 V; Vi(dif)(p-p) = 1.5 V
001aaj542
Fig 23. Example of a DC interface to an AQM with a Vi(cm) of 3.3 V
The auxiliary DACs can be used to control the offset in a precise range or with precise
steps.
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Figure 24 is an example of a DC interface connected to an AQM with a common-mode
input level (Vi(cm)) of 1.7 V when using auxiliary DACs.
VDDA(3V3)
51.1 Ω
(1)
AQM (Vi(cm) = 1.7 V)
51.1 Ω
(2)
442 Ω
IOUTnP
BBP
442 Ω
IOUTnN
BBN
0 mA to 20 mA
698 Ω
698 Ω
51.1 Ω
51.1 Ω
AUXnP
AUXnN
1.1 mA (typ.)
(1) IOUTnP/IOUTnN; V
o(cm) = 2.67 V; Vo(dif)(p-p) = 1.94 V
(2) BBP/BBN; V
i(cm) = 1.7 V; Vi(dif)(p-p) = 1.23 V; offset correction up to 36 mV
001aaj543
Fig 24. Example of a DC interface to an AQM with a Vi(cm) of 1.7 V when using auxiliary
DACs
Figure 25 is an example of a DC interface connected to an to an AQM with a
common-mode input level (Vi(cm)) of 3.3 V when using auxiliary DACs.
3.3 V
54.9 Ω
(1)
AQM (Vi(cm) = 3.3 V)
5V
54.9 Ω
750 Ω
750 Ω
(2)
237 Ω
IOUTnP
BBP
237 Ω
IOUTnN
BBN
634 Ω
634 Ω
442 Ω
442 Ω
AUXnP
AUXnN
(1) IOUTnP/IOUTnN; V
o(cm) = 2.75 V; Vo(dif)(p-p) = 1.96 V
(2) BBP/BBN; V
i(cm) = 3.3 V; Vi(dif)(p-p) = 1.5 V; offset correction up to 36 mV
001aaj544
Fig 25. Example of a DC interface to an AQM with a Vi(cm) of 3.3 V when using auxiliary
DACs
The constraints to adjusting the interface are the output compliance range of the DAC and
the auxiliary DACs, the input common-mode level of the AQM, and the range of offset
correction.
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10.13.3 AC interface to an Analog Quadrature Modulator (AQM)
When the AQM common-mode voltage is close to ground, the DAC1008D750 must be
AC-coupled and the auxiliary DACs are needed for offset correction.
Figure 26 is an example of a connection to an AQM with a common-mode input level
(Vi(cm)) of 0.5 V when using auxiliary DACs.
VDDA(3V3)
66.5 Ω
(1)
AQM (Vi(cm) = 0.5 V)
5V
66.5 Ω
2 kΩ
(2)
2 kΩ
10 nF
IOUTnP
BBP
10 nF
IOUTnN
BBN
0 mA to 20 mA
174 Ω
174 Ω
34 Ω
34 Ω
AUXnP
AUXnN
1.1 mA (typ.)
(1) IOUTnP/IOUTnN; V
o(cm) = 2.65 V; Vo(dif)(p-p) = 1.96 V
(2) BBP/BBN; V
i(cm) = 0.5 V; Vi(dif)(p-p) = 1.96 V; offset correction up to 70 mV
001aaj589
Fig 26. Example of a DC interface to an AQM with a Vi(cm) of 0.5 V when using auxiliary
DACs
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10.13.4 Phase correction
The Analog Quadrature Modulator which follows the DACs may have a phase imbalance
which will result in undesired sidebands. By adjusting the phase between the I and Q
channels, the spur can be reduced.
Without compensation the I and Q have a phase difference of Π / 2 (90°). The registers
PHASECORR_CNTRL0 and PHASECORR_CNTRL1 located in register page 0 allow a
phase variation from 75,7° to 104,3°. The two registers define a signed value that ranges
from −512 to +511. The resulting phase compensation (in radians) is given by the
equation: PHASE_CORR[9:0] / 2048.
10.14 Power and grounding
The power supplies should be decoupled with the following ground pins to optimize the
decoupling:
• VDDA(1V8): pin 38 with pin 37; pin 44 with pin 43; pin 11 with pin 12; pin 17 with pin 18;
pin 32 with pin 31
10.15 Configuration interface
10.15.1 Register description
DAC1008D750 implements indirect addressing using a page access method. The
page-address is located at address 0x1F and is by default 0x00, which selects page 0 as
default page. For example, to access registers which configure the JESDRX, one must
first activate page 4 by writing 0x04 to the page-address 0x1F.
The DAC1008D750 contains six different pages.
The device has no embedded power-on-reset feature. Driving the RESET_N pin to set the
device to its default state is mandatory.
10.15.2 Detailed descriptions of registers
The register information has been provided in page form accompanied by a detailed
description for each bit in the tables following the register allocation map of each page.
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
38 of 99
Table 18.
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
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10.15.2.1 Page 0 allocation map description
Page 0 register allocation map
Address Register name
R/W Bit definition
Default
b7
b6
b5
b4 b3
b2
-
-
DF
b1
b0
PD_ALL
Bin
Rev. 01 — 4 October 2010
00h COMMON
R/W
SPI_3W
SPI_RST
-
1
01h TXCFG
R/W
NCO_EN
NCO_LP_SEL
INV_SINE_EN
2
02h PLLCFG
R/W
PLL_PD
-
-
3
03h FREQNCO_LSB
R/W
FREQ_NCO[7:0]
01100110 66h
4
04h FREQNCO_LISB
R/W
FREQ_NCO[15:8]
01100110 66h
5
05h FREQNCO_UISB
R/W
FREQ_NCO[23:16]
01100110 66h
6
06h FREQNCO_MSB
R/W
FREQ_NCO[31:24]
00100110 26h
7
07h PHINCO_LSB
R/W
PH_NCO[7:0]
00000000 00h
8
08h PHINCO_MSB
R/W
PH_NCO[15:8]
00000000 00h
9
09h DAC_A_CFG_1
R/W
DAC_A_PD
10 0Ah DAC_A_CFG_2
R/W
11 0Bh DAC_A_CFG_3
R/W
12 0Ch DAC_B_CFG_1
PLL_DIV[1:0]
DAC_A_SLEEP
INT_FIR[1:0]
PLL_PHASE[1:0]
PLL_POL
10000100 84h
00000001 01h
00000000 00h
DAC_A_OFFSET[5:0]
00000000 00h
DAC_A_GAIN_COARSE[1:0]
DAC_A_GAIN_FINE[5:0]
01000000 40h
DAC_A_GAIN_COARSE[3:2]
DAC_A_OFFSET[11:6]
11000000 C0h
R/W
DAC_B_PD
DAC_B_OFFSET[5:0]
00000000 00h
13 0Dh DAC_B_CFG_2
R/W
DAC_B_GAIN_COARSE[1:0]
DAC_B_GAIN_FINE[5:0]
01000000 40h
14 0Eh DAC_B_CFG_3
R/W
DAC_B_GAIN_COARSE[3:2]
15 0Fh DAC_CFG
R/W
-
-
-
-
-
17 11h DAC_CURRENT_0 R/W
-
-
-
-
DAC_B_SLEEP
DAC_B_OFFSET[11:6]
18 12h DAC_CURRENT_1 R/W
-
11000000 C0h
MINUS_
3DB
NOISE_
SHAPER
00000000 00h
DAC_DIG_BIAS[2:0]
-
00000110 06h
DAC_MST_BIAS[2:0]
-
00000110 06h
DAC_DRV_BIAS[2:0]
-
DAC_SLV_BIAS[2:0]
-
01100110 66h
20 14h DAC_CURRENT_3 R/W
DAC_CK_BIAS[2:0]
-
DAC_CAS_BIAS[2:0]
-
01100110 66h
-
-
39 of 99
© NXP B.V. 2010. All rights reserved.
21 15h DAC_SEL_PH_
FINE
R/W
-
22 16h PHASECORR_
CNTRL0
R/W
23 17h PHASECORR_
CNTRL1
R/W PHASE_CORR_
ENABLE
-
-
SEL_PH_FINE[1:0]
PHASE_CORR[7:0]
-
-
26 1Ah DAC_A_AUX_MSB R/W
27 1Bh DAC_A_AUX_LSB R/W
-
-
-
00000000 00h
-
PHASE_CORR[9:8]
AUX_A[9:2]
AUX_A_PD
-
-
-
00000010 02h
00000000 00h
10000000 80h
-
-
AUX_A[1:0]
00000000 00h
DAC1008D750
-
19 13h DAC_CURRENT_2 R/W
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
0
MODE[2:0]
PD_GAP
Hex
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xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Page 0 register allocation map …continued
Address Register name
R/W Bit definition
b7
Default
b6
b5
b4 b3
28 1Ch DAC_B_AUX_MSB R/W
29 1Dh DAC_B_AUX_LSB R/W
31 1Fh PAGE_ADDRESS
R/W
NXP Semiconductors
DAC1008D750_1
Objective data sheet
Table 18.
b2
b1
b0
AUX_B[9:2]
Bin
Hex
10000000 80h
AUX_B_PD
-
-
-
-
-
-
-
-
-
-
AUX_B[1:0]
PAGE[2:0]
00000000 00h
00000000 00h
Rev. 01 — 4 October 2010
DAC1008D750
40 of 99
© NXP B.V. 2010. All rights reserved.
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.2
Page 0 bit definition detailed description
Please refer to Table 18 for a register overview for page 0. In the following tables, all the
values emphasized in bold are the default values.
Table 19. COMMON register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
SPI_3W
R/W
6
SPI_RST
Value
serial interface bus type
0
4 wire SPI
1
3 wire SPI
R/W
serial interface reset
0
1
2
1
0
DF
PD_ALL
GAP_PD
Description
R/W
no reset
performs a reset on all registers except 0x00
data format
0
signed (two’s compliment) format
1
unsigned format
R/W
power-down
0
no action
1
all circuits (digital and analog) are switched off
R/W
internal bandgap power-down
0
no action
1
internal bandgap references are switched off
Table 20. TXCFG register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
NCO_EN
R/W
6
5
4 to 2
NCO_LP_SEL
INV_SINE_EN
MODE[2:0]
DAC1008D750_1
Objective data sheet
Value
Description
NCO
0
disabled (the NCO phase is reset to 0)
1
enabled
R/W
low-power NCO
0
NCO may use all 32 bits
1
NCO frequency and phase given by the five
MSBs of the registers 06h and 08h respectively
R/W
x / (sin x) function
0
disabled
1
enabled
R/W
modulation
000
dual DAC: no modulation
001
positive upper single sideband up-conversion
010
positive lower single sideband up-conversion
011
negative upper single sideband up-conversion
100
negative lower single sideband up-conversion
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
41 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 20. TXCFG register (address 01h) bit description …continued
Default settings are shown highlighted.
Bit
Symbol
Access
1 to 0
INT_FIR[1:0]
R/W
Value
Description
interpolation
00
no interpolation
01
2×
10
4×
11
8×
Table 21. PLLCFG register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
PLL_PD
R/W
Value
Description
PLL
0
1
switched on
switched off
6
-
R/W
0
undefined
5
-
R/W
0
must be written with ’0’
4 to 3
PLL_DIV[1:0]
R/W
2 to 1
0
Table 22.
PLL_PHASE[1:0]
PLL_POL
PLL divider factor
00
2
01
4
10
8
R/W
PLL phase shift of fs
00
0°
01
120°
10
240°
11
undefined
clock edge of DAC (fs)
R/W
0
normal
1
inverted
FREQNCO_LSB register (address 03h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
FREQ_NCO[7:0]
R/W
66h
lower 8 bits for the NCO frequency setting
Table 23.
FREQNCO_LISB register (address 04h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
FREQ_NCO[15:8]
R/W
66h
lower intermediate 8 bits for the NCO frequency
setting
Table 24.
FREQNCO_UISB register (address 05h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
FREQ_NCO[23:16]
R/W
66h
upper intermediate 8 bits for the NCO frequency
setting
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
42 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 25.
FREQNCO_MSB register (address 06h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
FREQ_NCO[31:24]
R/W
26h
most significant 8 bits for the NCO frequency setting
Table 26.
PHINCO_LSB register (address 07h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
PH_NCO[7:0]
R/W
00h
lower 8 bits for the NCO phase setting
Table 27.
PHINCO_MSB register (address 08h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
PH_NCO[15:8]
R/W
00h
most significant 8 bits for the NCO phase setting
Table 28. DAC_A_CFG_1 register (address 09h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
DAC_A_PD
R/W
6
5 to 0
Table 29.
DAC_A_SLEEP
DAC_A_OFFSET[5:0]
Value
0
on
1
off
R/W
R/W
Description
DAC A power
DAC A Sleep mode
0
disabled
1
enabled
00h
lower 6 bits for the DAC A offset
DAC_A_CFG_2 register (address 0Ah) bit description
Bit
Symbol
Access
Value
Description
7 to 6
DAC_A_GAIN_COARSE[1:0]
R/W
1h
least significant 2 bits for the DAC A gain setting for
coarse adjustment
5 to 0
DAC_A_GAIN_FINE[5:0]
R/W
00h
the 6 bits for the DAC A gain setting for fine
adjustment
Table 30.
DAC_A_CFG_3 register (address 0Bh) bit description
Bit
Symbol
Access
Value
Description
7 to 6
DAC_A_GAIN_COARSE[3:2]
R/W
3h
most significant 2 bits for the DAC A gain setting for
coarse adjustment
5 to 0
DAC_A_OFFSET[11:6]
R/W
00h
most significant 6 bits for the DAC A offset
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
43 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 31. DAC_B_CFG_1 register (address 0Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
DAC_B_PD
R/W
6
5 to 0
Table 32.
DAC_B_SLEEP
DAC_B_OFFSET[5:0]
Value
DAC B power
0
on
1
off
R/W
R/W
Description
DAC B Sleep mode
0
disabled
1
enabled
00h
lower 6 bits for the DAC B offset
DAC_B_CFG_2 register (address 0Dh) bit description
Bit
Symbol
Access
Value
Description
7 to 6
DAC_B_GAIN_COARSE[1:0]
R/W
1h
least significant 2 bits for the DAC B gain setting for
coarse adjustment
5 to 0
DAC_B_GAIN_FINE[5:0]
R/W
00h
the 6 bits for the DAC B gain setting for fine
adjustment
Table 33.
DAC_B_CFG_3 register (address 0Eh) bit description
Bit
Symbol
Access
Value
Description
7 to 6
DAC_B_GAIN_COARSE[3:2]
R/W
3h
most significant 2 bits for the DAC B gain setting for
coarse adjustment
5 to 0
DAC_B_OFFSET[11:6]
R/W
00h
most significant 6 bits for the DAC B offset
Table 34. DAC_CFG register (address 0Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
1
MINUS_3DB
R/W
0
NOISE_SHAPER
Value
Description
NCO gain
0
unity
1
−3 dB
R/W
noise shaper
0
disabled
1
enabled
Table 35. DAC_CURRENT_0 register (address 11h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 1
DAC_DIG_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
Table 36. DAC_CURRENT_1 register (address 12h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 1
DAC_MST_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
DAC1008D750_1
Objective data sheet
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© NXP B.V. 2010. All rights reserved.
44 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 37. DAC_CURRENT_2 register (address 13h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 5
DAC_DRV_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
3 to 1
DAC_SLV_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
Table 38. DAC_CURRENT_3 register (address 14h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 5
DAC_CK_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
3 to 1
DAC_CAS_BIAS[2:0]
R/W
3h
bias current control (see Table 47)
Table 39. DAC_SEL_PH_FINE register (address 15h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
1 to 0
SEL_PH_FINE[1:0]
R/W
2h
fine DAC phase selection
Table 40. PHASECORR_CNTRL0 register (address 16h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
PHASE_CORR[7:0]
R/W
00h
LSB phase correction factor
Table 41. PHASECORR_CNTRL1 register (address 17h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
PHASE_CORR_ENABLE
R/W
Value
Description
phase correction
0
disabled
1
1 to 0
Table 42.
PHASE_CORR[9:8]
R/W
0h
enabled
MSB phase correction factor
DAC_A_AUX_MSB register (address 1Ah) bit description
Bit
Symbol
Access
Value
Description
7 to 0
AUX_A[9:2]
R/W
80h
most significant 8 bits for auxiliary DAC A
Table 43. DAC_A_AUX_LSB register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
AUX_A_PD
R/W
1 to 0
Table 44.
AUX_A[1:0]
R/W
Value
Description
auxiliary DAC A power
0
on
1
off
0h
lower 2 bits for auxiliary DAC A
DAC_B_AUX_MSB register (address 1Ch) bit description
Bit
Symbol
Access
Value
Description
7 to 0
AUX_B[9:2]
R/W
80h
most significant 8 bits for auxiliary DAC B
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
45 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 45. DAC_B_AUX_LSB register (address 1Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
AUX_B_PD
R/W
1 to 0
AUX_B[1:0]
R/W
Value
Description
auxiliary DAC B power
0
on
1
off
0h
lower 2 bits for auxiliary DAC B
Table 46. DAC_B_AUX_LSB register (address 1Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page address
Table 47. Bias current control table
Default settings are shown highlighted.
DAC1008D750_1
Objective data sheet
BIAS[2:0]
Deviation from nominal current
000
−30 %
001
...
010
...
011
0%
100
...
101
...
110
...
111
+30 %
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
46 of 99
Table 48.
Page 1 register allocation map
Address Register name
Default[1]
R/W Bit definition
b7
R/W
b6
b5
b2
b1
b0
Bin
Hex
Rev. 01 — 4 October 2010
01h MDS_WIN_PERIOD_A R/W
MDS_WIN_PERIOD_A[7:0]
10000000 80h
2
02h MDS_WIN_PERIOD_B R/W
MDS_WIN_PERIOD_B[7:0]
01000000 40h
3
03h MDS_MISCCNTRL0
4
04h MDS_MAN_ADJUSTD R/W
LY
5
05h MDS_AUTO_CYCLES R/W
6
06h MDS_MISCCNTRL1
R/W
8
08h MDS_ADJDELAY
R
-
9
09h MDS_STATUS0
R
EARLY
LATE
EQUAL
MDS_LOCK
EARLY_
ERROR
LATE_
ERROR
EQUAL_
FOUND
MDS_
ACTIVE
uuuuuuuu uuh
10 0Ah MDS_STATUS1
R
-
-
-
-
JD_ODD
MDS_
PRERUN
MDS_
LOCKOUT
MDS_
LOCK
uuuuuuuu uuh
31 1Fh PAGE_ADDRESS
R/W
-
-
-
-
-
u = undefined at power-up or after reset.
-
-
MDS_NCO
MDS_EVAL_
ENA
MDS_
MAN
MDS_SEL_
LN23
MDS_32T_
ENA
MDS_
PRERUN_
ENA
MDS_
MASTER
MDS_
ENA
MDS_PULSEWIDTH[2:0]
MDS_MAN_ADJUSTDLY[6:0]
MDS_
SR_
LOCK
MDS_
RELOCK
00010000 10h
01000000 40h
MDS_AUTO_CYCLES[7:0]
MDS_SR_ MDS_SR_
CKEN LOCKOUT
00000100 04h
10000000 80h
MDS_LOCK_DELAY[3:0]
00001111 0Fh
MDS_ADJDELAY[6:0]
uuuuuuuu uuh
PAGE[2:0]
00000000 00h
DAC1008D750
47 of 99
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2×, 4× or 8× interpolating with JESD204A
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1
-
MDS_
RUN
b3
00h MDS_MAIN
R/W
MDS_EQCHECK[1:0]
b4
0
[1]
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.3 Page 1 allocation map description
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.4
Page 1 bit definition detailed description
Please refer to Table 48 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 49. MDS_MAIN register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7 to 6
MDS_EQCHECK[1:0]
R/W
5
4
3
2
1
MDS_RUN
MDS_NCO
MDS_SEL_LN23
MDS_32T_ENA
MDS_MASTER
Value
lock mode
00
lock when (early = 1 and late = 1)
01
lock when (early = 1 and late = 1 and equal = 1)
10
lock when equal = 1
11
force_lock (equal-check = 1)
R/W
evaluation restart
0
no action
1
transition from 0 to 1 restarts evaluation_counter
R/W
NCO synchronization
0
no action
1
NCO synchronization enabled
R/W
synchronization reference
0
use lane 1 enable as reference for
synchronization
1
use lane 2/lane 3 enable as reference for
synchronization
R/W
maximum delay
0
maximum coarse delay is 16T_dclk
1
maximum coarse delay is 32T_dclk
R/W
MDS mode
0
1
0
MDS_ENA
Description
R/W
slave mode
master mode
MDS function
0
disable MDS function
1
enable MDS function
Table 50. MDS_WIN_PERIOD_A register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
MDS_WIN_PERIOD_A[7:0]
R/W
80h
determines MDS window LOW-time
Table 51. MDS_WIN_PERIOD_B register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
MDS_WIN_PERIOD_B[7:0]
R/W
40h
determines MDS window HIGH-time
DAC1008D750_1
Objective data sheet
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© NXP B.V. 2010. All rights reserved.
48 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 52. MDS_MISCCNTRL0 register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
4
MDS_EVAL_ENA
R/W
3
2 to 0
MDS_PRERUN_ENA
MDS_PULSEWIDTH[2:0]
Value
Description
MDS evaluation
0
disabled
1
enabled
R/W
automatic MDS start-up
0
no mds_win/mds_ref generation in advance
1
mds_win/mds_ref run-in before MDS evaluation
R/W
width of MDS (in output clk-periods)
000
1T
001
2T
010 to
111
(MDS_pulsewidth −1) × 4T
Table 53. MDS_MAN_ADJUSTDLY register (address 04h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
MDS_MAN
R/W
Value
Description
adjustment delay mode
0
auto-control adjustment delays
1
6 to 0
MDS_MAN_ADJUSTDLY[6:0]
R/W
manual control adjustment delays
adjustment delay value
40h
if MDS_MAN = 0 then initial value adjustment
delay
-
if MDS_MAN = 1 then controls adjustment delay
Table 54. MDS_AUTO_CYCLES register (address 05h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
MDS_AUTO_CYCLES[7:0]
R/W
80h
number of evaluation cycles applied for MDS
Table 55. MDS_MISCCNTRL1 register (address 06h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
MDS_SR_CKEN
R/W
6
5
MDS_SR_LOCKOUT
MDS_SR_LOCK
DAC1008D750_1
Objective data sheet
Value
Description
lock mode
0
free-running mds_cken
1
MDS_cken forced LOW
R/W
lockout detector soft reset
0
mds_lockout in use
1
MDS_lockout forced LOW
R/W
lock detector soft reset
0
MDS_lock in use
1
MDS_lock forced LOW
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
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49 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 55. MDS_MISCCNTRL1 register (address 06h) bit description …continued
Default settings are shown highlighted.
Bit
Symbol
Access
4
MDS_RELOCK
R/W
Value
relock mode
0
1
3 to 0
MDS_LOCK_DELAY[3:0]
R/W
Description
Fh
no action
relock when lockout occurs
number of succeeding 'equal'-detections until lock
Table 56. MDS_ADJDELAY register (address 08h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
6 to 0
MDS_ADJDELAY[6:0]
R
-
actual value adjustment delay
Table 57. MDS_STATUS0 register (address 09h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
EARLY
R
6
5
4
LATE
EQUAL
MDS_LOCK
Value
0
false
1
true
R
late signal (sampled) from early-late detector
0
false
1
true
R
equal signal (sampled) from early-late detector
0
false
1
true
R
result equal check
0
1
3
2
1
0
EARLY_ERROR
LATE_ERROR
EQUAL_FOUND
MDS_ACTIVE
DAC1008D750_1
Objective data sheet
Description
early signal (sampled) from early-late detector
R
false
true
adjustment delay maximum value stops the search
0
false
1
true
R
adjustment delay minimum value stops the search
0
false
1
true
R
evaluation logic has detected equal condition
0
false
1
true
R
evaluation logic active
0
false
1
true
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
50 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 58. MDS_STATUS1 register (address 0Ah) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
3
JD_ODD
R
2
1
MDS_PRERUN
MDS_LOCKOUT
Value
MDS start mode
0
MDS start aligned to cdi-even sample
1
MDS start aligned to cdi-odd sample (only for ^2)
R
MDS pre-run phase active flag
0
false
1
true
R
MDS lockout detected flag
0
1
0
MDS_LOCK
Description
R
false
true
MDS lock flag
0
false
1
true
Table 59. PAGE_ADDRESS register (address 1Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page address
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
51 of 99
Table 60.
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.5 Page 2 allocation map description
Page 2 register allocation map
Address Register name
R/W Bit definition
b7
Default
b6
b5
b4
b3
b2
b1
b0
Bin
Hex
Rev. 01 — 4 October 2010
00h MAINCONTROL
R/W
-
-
FULL_RE_ SYNC_INIT_
INIT
LEVEL
0
0
3
03h JCLK_CNTRL
R/W
SR_CDI
-
CDI_MODE[1:0]
-
FCLK_POL
4
04h RST_EXT_FCLK
R/W
RST_EXT_FCLK_TIME[7:0]
00111111 3Fh
5
05h RST_EXT_DCLK
R/W
RST_EXT_DCLK_TIME[7:0]
00100000 20h
6
06h DCSMU_PREDIVCNT R/W
DCSMU_PREDIVIDER[7:0]
00011110 1Eh
7
07h PLL_CHARGETIME
R/W
PLL_CHARGE_TIME[7:0]
00110010 32h
8
08h PLL_RUN_IN_TIME
R/W
PLL_RUNIN_TIME[7:0]
00110010 32h
9
09h CA_RUN_IN_TIME
R/W
CA_RUNIN_TIME[7:0]
00000100 04h
22 16h SET_VCM_VOLTAGE R/W
-
23 17h SET_SYNC
R/W
-
27 1Bh TYPE_ID
R
28 1Ch DAC_VERSION
R
29 1Dh DIG_VERSION
R
DAC
-
-
FRONTEND[1:0]
30 1Eh JRX_ANA_VERSION R
31 1Fh PAGE_ADDRESS
R/W
-
-
SET_SYNC_VCOM[2:0]
-
-
FORCE_ FORCE_ 00000011 03h
RESET_ RESET_
DCLK
FCLK
FCLK_SEL[1:0]
SET_VCM[3:0]
-
DUAL
00000010 02h
SET_SYNC_LEVEL[2:0]
DSP
00000000 00h
BIT_RES[1:0]
01000011 43h
11011111 DFh
DAC_VERSION_ID[7:0]
00000001 01h
DIG_VERSION_ID[7:0]
00000010 02h
JRX_ANA_VERSION_ID[7:0]
00000010 02h
-
-
PAGE[2:0]
00000000 00h
DAC1008D750
52 of 99
© NXP B.V. 2010. All rights reserved.
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
0
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.6
Page 2 bit definition detailed description
Please refer to Table 60 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 61. MAINCONTROL register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
5
FULL_RE_INIT
R/W
4
SYNC_INIT_LEVEL
Value
Description
initialization
0
quick reinitialization
1
full reinitialization
R/W
synchronization
0
1
synchronization starts with '0'
synchronization starts with '1'
3
-
R/W
must be written with ’0’
2
-
R/W
must be written with ’0’
1
FORCE_RESET_DCLK
R/W
reset_dclk
0
FORCE_RESET_FCLK
0
release reset_dclk
1
force reset_dclk
R/W
reset_fclk
0
release reset_fclk
1
force reset_fclk
Table 62. JCLK_CNTRL register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
SR_CDI
R/W
5 to 4
2
1 to 0
CDI_MODE[1:0]
FCLK_POL
FCLK_SEL[1:0]
DAC1008D750_1
Objective data sheet
Value
Description
cdi reset
0
no action
1
soft reset cdi
R/W
cdi mode
00
cdi_mode 0 (^2 modes)
01
cdi_mode 1 (^4 modes)
10
cdi_mode 2 (^8 modes)
11
reserved
fclk polarity
R/W
0
no action
1
invert polarity
fclk clock source
R/W
00
dclk × 2
01
dclk
10
dclk_div2; running
11
dclk_div2; reset dclk_div2 divider
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
53 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 63. RST_EXT_FCLK register (address 04h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
RST_EXT_FCLK_TIME[7:0]
R/W
3Fh
specifies extension time reset_fclk in fclk periods
Table 64. RST_EXT_DCLK register (address 05h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
RST_EXT_DCLK_TIME[7:0]
R/W
20h
specifies extension time reset_dclk (in dclk-periods)
Table 65. DCSMU_PREDIVCNT register (address 06h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
DCSMU_PREDIVIDER[7:0]
R/W
1Eh
value used by dcsmu predivider (at fclk)
Table 66. PLL_CHARGETIME register (address 07h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
PLL_CHARGE_TIME[7:0]
R/W
32h
PLL charge time
(at fclk/DCSMU_PREDIVIDER[7:0])
Table 67. PLL_RUN_IN_TIME register (address 08h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
PLL_RUNIN_TIME[7:0]
R/W
32h
PLL run in time (at fclk/DCSMU_PREDIVIDER[7:0])
Table 68. CA_RUN_IN_TIME register (address 09h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
CA_RUNIN_TIME[7:0]
R/W
04h
clock alignment run in time
(at fclk/DCSMU_PREDIVIDER[7:0])
Table 69. SET_VCM_VOLTAGE register (address 16h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 0
SET_VCM[3:0]
R/W
02h
set lane common-mode voltage (see Table 76)
Table 70. SET_SYNC register (address 17h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
6 to 4
SET_SYNC_VCOM[2:0]
R/W
4h
set synchronization transmitter common-mode level
(see Table 77)
2 to 0
SET_SYNC_LEVEL[2:0]
R/W
3h
set synchronization transmitter output level swing
(see Table 78)
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
54 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 71. TYPE_ID register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
DAC
R
6 to 5
4
3 to 2
1 to 0
FRONTEND [1:0]
DUAL
DSP
BIT_RES[1:0]
Value
Description
part type
0
ADC
1
DAC
R
input format
00
CMOS
01
LVDS
10
JESD204A
11
reserved
R
converter structure
0
single
1
dual
R
digital processing
00
none
01
upsampling filters
10
single sideband modulator
11
upsampling filters + single sideband
modulator
R
resolution
00
16 bits
01
14 bits
10
12 bits
11
10 bits
Table 72. DAC_VERSION register (address 1Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
DAC_VERSION_ID[7:0]
R
01h
dual DAC core version
Table 73. DIG_VERSION register (address 1Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
DIG_VERSION_ID[7:0]
R
02h
digital version
Table 74. JRX_ANA_VERSION register (address 1Eh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
JRX_ANA_VERSION_ID[7:0]
R
02h
analog deserializer version
Table 75. PAGE_ADDRESS register (address 1Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page address
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
55 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 76.
Lane common-mode voltage adjustment
Register 16h: SET_VCM_VOLTAGE
Decimal
SET_VCM_VOLTAGE
Vcom (V)
15
1111
1.40
14
1110
1.36
13
1101
1.31
12
1100
1.26
11
1011
1.21
10
1010
1.16
9
1001
1.12
8
1000
1.07
7
0111
1.02
6
0110
0.97
5
0101
0.92
4
0100
0.87
3
0011
0.82
2
0010
0.78
1
0001
0.73
0
0000
0.68
Table 77.
SYNC common-mode voltage adjustment
Register 17h: SET_SYNC
Decimal
SET_SYNC_VCOM[2:0]
Vcom (V)
7
111
1.46
6
110
1.36
5
101
1.27
4
100
1.17
3
011
1.07
2
010
0.98
1
001
0.88
0
000
0.79
Table 78.
SYNC swing voltage adjustment
Register 17h: SET_SYNC
DAC1008D750_1
Objective data sheet
Decimal
SET_SYNC_LEVEL[2:0]
Single-ended output voltage (V)
7
111
0.48
6
110
0.42
5
101
0.36
4
100
0.30
3
011
0.24
2
010
0.18
1
001
0.12
0
000
0.06
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
56 of 99
Table 79.
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.7 Page 4 allocation map description
Page 4 register allocation map
Address Register name
R/W Bit definition
b7
Default
b6
b4
b3
b2
b1
b0
Bin
Hex
Rev. 01 — 4 October 2010
R/W
1
01h SR_DLP_1
R/W SR_CNTRL SR_CNTRL SR_CNTRL_ SR_CNTRL_ SR_DEC_
_LN3
_LN2
LN1
LN0
LN3
2
02h FORCE_LOCK
R/W
3
03h MAN_LOCK_
LN_1_0
R/W
MAN_LOCK_LN1[3:0]
MAN_LOCK_LN0[3:0]
00000000 00h
4
04h MAN_LOCK_2_0 R/W
MAN_LOCK_LN3[3:0]
MAN_LOCK_LN2[3:0]
00000000 00h
5
05h CA_CNTRL
R/W
6
06h SCR-CNTRL
R/W MAN_SCR MAN_SCR_ MAN_SCR_ MAN_SCR_
_LN3
LN2
LN1
LN0
7
07h ILA_CNTRL
R/W
SEL_421_
211
8
08h FORCE_ALIGN
R/W
-
9
09h MAN_ALIGN_
LN_0_1
R/W
MAN_ALIGN_LN1[3:0]
MAN_ALIGN_LN0[3:0]
00000000 00h
10 0Ah MAN_ALIGN_
LN_2_3
R/W
MAN_ALIGN_LN3[3:0]
MAN_ALIGN_LN2[3:0]
00000000 00h
11
0Bh FA_ERR_
HANDLING
R/W
12 0Ch SYNCOUT_
MODE
R/W
13 0Dh LANE_
POLARITY
R/W
14 0Eh LANE_SELECT
R/W
16 10h SOFT_RESET_
SCRAMBLER
R/W
SR_SWA_
LN2
SR_SWA_
LN1
FORCE_
FORCE_
FORCE_
LOCK_LN3 LOCK_LN2 LOCK_LN1
SR_SWA_ SR_CA_LN3 SR_CA_LN2 SR_CA_LN1 SR_CA_LN0 00000000 00h
LN0
FORCE_
LOCK_LN0
SR_DEC_
LN2
SR_DEC_
LN1
-
-
-
SR_DEC_ 00000000 00h
LN0
SR_ILA
00000000 00h
WORD_
WORD_
WORD_
WORD_ SELECT_RF SELECT_RF SELECT_RF SELECT_RF 00000000 00h
SWAP_LN3 SWAP_LN2 SWAP_LN1 SWAP_LN0 _F10_LN3
_F10_LN2 _F10_LN1
_F10_LN0
SEL_ILA[1:0]
-
SEL_KOUT_UNEXP_
LN23[1:0]
-
-
-
LANE_SEL_LN3[1:0]
-
-
FORCE_
SCR_LN2
SEL_LOCK[2:0]
-
SEL_KOUT_UNEXP_
LN10[1:0]
SEL_RE_INIT[2:0]
FORCE_
SCR_LN3
-
-
-
LANE_SEL_LN2[1:0]
-
-
FORCE_ 00000000 00h
SCR_LN0
SUP_LANE_
SYN
EN_SCR
10000011 83h
DYN_ALIGN
_ENA
FORCE_
ALIGN
00000000 00h
SEL_NIT_ERR_LN23[1:0] SEL_NIT_ERR_LN10[1:0] 00000000 00h
SYNC_POL
-
FORCE_
SCR_LN1
SEL_SYNC[3:0]
POL_LN3
POL_LN2
LANE_SEL_LN1[1:0]
SR_SCR_
LN3
SR_SCR_
LN2
INIT_VALUE_S15_S8_LN0[7:0]
POL_LN1
00000000 00h
POL_LN0
LANE_SEL_LN0[1:0]
SR_SCR_
LN1
00000000 00h
11100100 E4h
SR_SCR_ 00000000 00h
LN0
00000000 00h
DAC1008D750
57 of 99
© NXP B.V. 2010. All rights reserved.
00h SR_DLP_0
2×, 4× or 8× interpolating with JESD204A
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0
17 11h INIT_SCR_S15T8 R/W
_LN0
SR_SWA_
LN3
b5
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Page 4 register allocation map …continued
Address Register name
R/W Bit definition
b7
Default
b6
b5
b4
-
b3
b2
b1
b0
INIT_VALUE_S7_S1_LN0[6:0]
Bin
Hex
Rev. 01 — 4 October 2010
R/W
00000000 00h
19 13h INIT_SCR_
S15T8_LN1
R/W
20 14h INIT_SCR_
S7T1_LN1
R/W
21 15h INIT_SCR_
S15T8_LN2
R/W
22 16h INIT_SCR_
S7T1_LN2
R/W
23 17h INIT_SCR_
S15T8_LN3
R/W
24 18h INIT_SCR_
S7T1_LN3
R/W
25 19h INIT_ILA_
BUFPTR_LN01
R/W
INIT_ILA_BUFPTR_LN1[3:0]
INIT_ILA_BUFPTR_LN0[3:0]
10001000 88h
26 1Ah INIT_ILA_
BUFPTR_LN23
R/W
INIT_ILA_BUFPTR_LN3[3:0]
INIT_ILA_BUFPTR_LN2[3:0]
10001000 88h
27 1Bh ERROR_
HANDLING
R/W
-
28 1Ch REINIT_CNTRL
R/W
REINIT_
ILA_LN3
INIT_VALUE_S15_S8_LN1[7:0]
-
00000000 00h
INIT_VALUE_S7_S1_LN1[6:0]
00000000 00h
INIT_VALUE_S15_S8_LN2[7:0]
-
00000000 00h
INIT_VALUE_S7_S1_LN2[6:0]
00000000 00h
INIT_VALUE_S15_S8_LN3[7:0]
-
-
00000000 00h
INIT_VALUE_S7_S1_LN3[6:0]
NAD_ERR_ KUX_CORR NAD_CORR
CORR
CORR_MODE[1:0]
00000000 00h
IMPL_ALT
IGNORE_ 00000000 00h
ERR
REINIT_ILA REINIT_ILA_ REINIT_ILA_ RESYNC_O RESYNC_O RESYNC_O RESYNC_O 00000000 00h
_LN2
LN1
LN0
_L_LN3
_L_LN2
_L_LN1
_L_LN0
-
-
-
-
PAGE[2:0]
00000000 00h
DAC1008D750
58 of 99
© NXP B.V. 2010. All rights reserved.
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
18 12h INIT_SCR_
S7T1_LN0
31 1Fh PAGE_ADDRESS R/W
NXP Semiconductors
DAC1008D750_1
Objective data sheet
Table 79.
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.8
Page 4 bit definition detailed description
Please refer to Table 79 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 80. SR_DLP_0 register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
SR_SWA_LN3
R/W
0
soft reset sync_word_alignment lane 3
6
SR_SWA_LN2
R/W
0
soft reset sync_word_alignment lane 2
5
SR_SWA_LN1
R/W
0
soft reset sync_word_alignment lane 1
4
SR_SWA_LN0
R/W
0
soft reset sync_word_alignment lane 0
3
SR_CA_LN3
R/W
0
soft reset clock_alignment lane 3
2
SR_CA_LN2
R/W
0
soft reset clock_alignment lane 2
1
SR_CA_LN1
R/W
0
soft reset clock_alignment lane 1
0
SR_CA_LN0
R/W
0
soft reset clock_alignment lane 0
Table 81. SR_DLP_1 register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
SR_CNTRL_LN3
R/W
0
soft reset controller lane 3
6
SR_CNTRL_LN2
R/W
0
soft reset controller lane 2
5
SR_CNTRL_LN1
R/W
0
soft reset controller lane 1
4
SR_CNTRL_LN0
R/W
0
soft reset controller lane 0
3
SR_DEC_LN3
R/W
0
soft reset decoder_10b8b lane 3
2
SR_DEC_LN2
R/W
0
soft reset decoder_10b8b lane 2
1
SR_DEC_LN1
R/W
0
soft reset decoder_10b8b lane 1
0
SR_DEC_LN0
R/W
0
soft reset decoder_10b8b lane 0
Table 82. FORCE_LOCK register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
FORCE_LOCK_LN3
R/W
6
5
4
FORCE_LOCK_LN2
FORCE_LOCK_LN1
FORCE_LOCK_LN0
DAC1008D750_1
Objective data sheet
Value
Description
lane 3 lock mode
0
automatic lock sync_word_alignment lane 3
1
manual lock sync_word_alignment lane 3
R/W
lane 2 lock mode
0
automatic lock sync_word_alignment lane 2
1
manual lock sync_word_alignment lane 2
R/W
lane 1 lock mode
0
automatic lock sync_word_alignment lane 1
1
manual lock sync_word_alignment lane 1
R/W
lane 0 lock mode
0
automatic lock sync_word_alignment lane 0
1
manual lock sync_word_alignment lane 0
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
59 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 82. FORCE_LOCK register (address 02h) bit description …continued
Default settings are shown highlighted.
Bit
Symbol
Access
0
SR_ILA
R/W
Value
Description
soft reset inter-lane alignment
0
no action
1
reset
Table 83. MAN_LOCK_LN_1_0 register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
MAN_LOCK_LN1[3:0]
R/W
0h
manual lock setting synchronization word alignment
lane 1
3 to 0
MAN_LOCK_LN0[3:0]
R/W
0h
manual lock setting synchronization word alignment
lane 0
Table 84. MAN_LOCK_2_0 register (address 04h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
MAN_LOCK_LN3[3:0]
R/W
0h
manual lock setting synchronization word alignment
lane 3
3 to 0
MAN_LOCK_LN2[3:0]
R/W
0h
manual lock setting synchronization word alignment
lane 2
Table 85.
CA_CNTRL register (address 05h) bit description
Bit
Symbol
Access
7
WORD_SWAP_LN3
R/W
6
5
4
WORD_SWAP_LN2
WORD_SWAP_LN1
WORD_SWAP_LN0
Value
0
dout_ca_ln3[7:0] = din_ca_ln3[7:0]
1
dout_ca_ln3[7:0] = din_ca_ln3[0:7]
R/W
lane 2 bit swapping
0
dout_ca_ln2[7:0] = din_ca_ln2[7:0]
1
dout_ca_ln2[7:0] = din_ca_ln2[0:7]
R/W
lane 1 bit swapping
0
dout_ca_ln1[7:0] = din_ca_ln1[7:0]
1
dout_ca_ln1[7:0] = din_ca_ln1[0:7]
R/W
lane 0 bit swapping
0
1
3
2
SELECT_RF_F10_LN3
SELECT_RF_F10_LN2
DAC1008D750_1
Objective data sheet
Description
lane 3 bit swapping
R/W
dout_ca_ln0[7:0] = din_ca_ln0[7:0]
dout_ca_ln0[7:0] = din_ca_ln0[0:7]
lane 3 sampling mode
0
din_ca_ln3 sampled at falling edge f10_ln3
1
din_ca_ln3 sampled at rising edge f10_ln3
R/W
lane 2 sampling mode
0
din_ca_ln2 sampled at falling edge f10_ln2
1
din_ca_ln2 sampled at rising edge f10_ln2
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
60 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 85.
CA_CNTRL register (address 05h) bit description …continued
Bit
Symbol
Access
1
SELECT_RF_F10_LN1
R/W
0
Table 86.
SELECT_RF_F10_LN0
Symbol
Access
MAN_SCR_LN3
R/W
4
0
din_ca_ln1 sampled at falling edge f10_ln1
1
din_ca_ln1 sampled at rising edge f10_ln1
lane 0 sampling mode
0
din_ca_ln0 sampled at falling edge f10_ln0
1
din_ca_ln0 sampled at rising edge f10_ln0
SCR_CNTRL register (address 06h) bit description
Bit
5
MAN_SCR_LN2
MAN_SCR_LN1
MAN_SCR_LN0
Value
0
scrambling lane 3 off (when force_scr_ln3 = 1)
1
scrambling lane 3 on (when force_scr_ln3 = 1)
R/W
lane 2 manual scrambling
0
scrambling lane 2 off (when force_scr_ln2 = 1)
1
scrambling lane 2 on (when force_scr_ln2 = 1)
R/W
lane 1 manual scrambling
0
scrambling lane 1 off (when force_scr_ln1 = 1)
1
scrambling lane 1 on (when force_scr_ln1 = 1)
R/W
lane 0 manual scrambling
1
FORCE_SCR_LN3
R/W
1
FORCE_SCR_LN2
R/W
1
FORCE_SCR_LN1
R/W
1
FORCE_SCR_LN0
DAC1008D750_1
Objective data sheet
scrambling lane 3 depends on lock_ln3 and
en_scr
scrambling lane 3 depends on man_scr_ln3
scrambling lane 2 depends on lock_ln2 and
en_scr
scrambling lane 2 depends on man_scr_ln2
lane 1 scrambling mode
0
0
scrambling lane 0 on (when force_scr_ln0 = 1)
lane 2 scrambling mode
0
1
scrambling lane 0 off (when force_scr_ln0 = 1)
lane 3 scrambling mode
0
2
Description
lane 3 manual scrambling
0
3
Description
lane 1 sampling mode
R/W
7
6
Value
R/W
scrambling lane 1 depends on lock_ln1 and
en_scr
scrambling lane 1 depends on man_scr_ln1
lane 0 scrambling mode
0
scrambling lane 0 depends on lock_ln0 and
en_scr
1
scrambling lane 0 depends on man_scr_ln0
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
61 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 87.
ILA_CNTRL register (address 07h) bit description
Bit
Symbol
Access
7
SEL_421_211
R/W
6 to 5
4 to 2
SEL_ILA[1:0]
SEL_LOCK[2:0]
Value
inter-lane alignment mode
0
inter-lane alignment based on lane 3 : lane 2
and/or lane 1 : lane 0
1
inter-lane alignment based on ln3 : ln0
R/W
inter-lane alignment trigger mode
00
inter-lane alignment is done after receiving
1 /A/-symbol
01
inter-lane alignment is done after receiving
2 /A/-symbols
10
inter-lane alignment is done after receiving
3 /A/-symbols
11
inter-lane alignment is done after receiving
4 /A/-symbols
R/W
inter-lane alignment start mode
000
inter-lane alignment may start only if all (4 or 2)
lanes are locked
001
inter-lane alignment may start if one of the (4 or 2)
lanes are locked
010
inter-lane alignment may start if lane 0 is locked
011
inter-lane alignment may start if lane 1 is locked
100
inter-lane alignment may start if lane 2 is locked
101
1
0
Table 88.
SUP_LANE_SYN
EN_SCR
R/W
0
inter-lane alignment synchronization disabled
1
inter-lane alignment synchronization enabled
data descrambling
0
disabled
1
enabled
FORCE_ALIGN register (address 08h) bit description
Bit
Symbol
Access
DYN_ALIGN_ENA
R/W
Table 89.
inter-lane alignment may start if lane 3 is locked
inter-lane alignment enable
R/W
1
0
Description
FORCE_ALIGN
Value
Description
dynamic re-alignment mode
0
no dynamic re-alignment
1
dynamic re-alignment (and monitoring) enabled
R/W
lane alignment mode
0
automatic lane alignment based on
/A/ symbols
1
manual lane alignment based on man_align_lnx
MAN_ALIGN_LN_0_1 register (address 09h) bit description
Bit
Symbol
Access
Value
Description
7 to 4
MAN_ALIGN_LN1[3:0]
R/W
0h
indicates alignment data-delay for lane 1 [1..15]
3 to 0
MAN_ALIGN_LN0[3:0]
R/W
0h
indicates alignment data-delay for lane 0 [1..15]
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
62 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 90.
MAN_ALIGN_LN_2_3 register (address 0Ah) bit description
Bit
Symbol
Access
Value
Description
7 to 4
MAN_ALIGN_LN3[3:0]
R/W
0h
indicates alignment data-delay for lane 3 [1..15]
3 to 0
MAN_ALIGN_LN2[3:0]
R/W
0h
indicates alignment data-delay for lane 2 [1..15]
Table 91. FA_ERR_HANDLING register (address 0Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7 to 6
SEL_KOUT_ UNEXP_LN23[1:0]
R/W
5 to 4
3 to 2
1 to 0
SEL_KOUT_ UNEXP_LN10[1:0]
SEL_NIT_ERR_ LN23[1:0]
SEL_NIT_ERR_ LN10[1:0]
DAC1008D750_1
Objective data sheet
Value
Description
lane 2/lane 3 unexpected /K/ error handling
00
unexpected /K/ in lane 2 or lane 3
error_handling
01
unexpected /K/ in lane 2 and lane 3 error_handling
10
unexpected /K/ in lane 2 error_handling
11
unexpected /K/ in lane 3 error_handling
R/W
lane 0/lane 1 unexpected /K/ error handling
00
unexpected /K/ in lane 0 or lane 1
error_handling
01
unexpected /K/ in lane 0 and lane 1 error_handling
10
unexpected /K/ in lane 0 error_handling
11
unexpected /K/ in lane 1 error_handling
R/W
lane 2/lane 3 nit-error handling
00
nit-errors in lane 2 or lane 3 error_handling
01
not-in-table errors lane 2 and lane 3
error_handling
10
not-in-table errors in lane 2 error_handling
11
not-in-table errors in lane 3 error_handling
R/W
lane 0/lane 1 nit-error handling
00
nit-errors in lane 0 or lane 1 error_handling
01
not-in-table errors lane 0 and lane 1
error_handling
10
not-in-table errors in lane 0 error_handling
11
not-in-table errors in lane 1 error_handling
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
63 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 92. SYNCOUT_MODE register (address 0Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7 to 5
SEL_RE_INIT[2:0]
R/W
Value
Description
reinitialization mode
000
i_re_init when 1 of the lane_rst's is active
001
i_re_init when rst_ln0 or rst_ln1 is active
010
i_re_init when rst_ln2 or rst_ln3 is active
011
i_re_init when rst_ln0 is active
100
i_re_init when rst_ln1 is active
101
i_re_init when rst_ln2 is active
110
i_re_init when rst_ln3 is active
111
4
3 to 0
Table 93.
SYNC_POL
SEL_SYNC[3:0]
R/W
0
sync_out is active when LOW
1
sync_out is active when HIGH
R/W
synchronization mode
0000
sync when one of the four lane_syncs is active
0001
sync when all four lane_syncs are active
0010
sync when sync_ln0 or sync_ln1 is active
0011
sync when both sync_ln0 and sync_ln1 are active
0100
sync when sync_ln2 or sync_ln3 is active
0101
sync when both sync_ln2 and sync_ln3 are active
0110
sync when sync_ln0 is active
0111
sync when sync_ln1 is active
1000
sync when sync_ln2 is active
1001
sync when sync_ln3 is active
1010
sync remains fixed '1'
other
sync remains fixed '0'
LANE_POLARITY register (address 0Dh) bit description
Bit
Symbol
Access
3
POL_LN3
R/W
2
POL_LN2
Value
0
no action
1
invert all data bits of lane 3
R/W
lane 2 data polarity
1
0
POL_LN1
POL_LN0
DAC1008D750_1
Objective data sheet
Description
lane 3 data polarity
0
1
i_re_init remains '0'
synchronization polarity
R/W
no action
invert all data bits of lane 2
lane 1 data polarity
0
no action
1
invert all data bits of lane 1]
R/W
lane 0 data polarity
0
no action
1
invert all data bits of lane 0
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
64 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 94. LANE_SELECT register (address 0Eh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7 to 6
LANE_SEL_LN3[1:0]
R/W
Value
lane 3 data mapping
00
ila_in_ln3 = lane_ln0 (dout and controls)
01
ila_in_ln3 = lane_ln1 (dout and controls)
10
ila_in_ln3 = lane_ln2 (dout and controls)
11
5 to 4
3 to 2
LANE_SEL_LN2[1:0]
R/W
LANE_SEL_LN1[1:0]
00
ila_in_ln2 = lane_ln0 (dout and controls)
01
ila_in_ln2 = lane_ln1 (dout and controls)
10
ila_in_ln2 = lane_ln2 (dout and controls)
11
ila_in_ln2 = lane_ln3 (dout and controls)
R/W
Table 95.
LANE_SEL_LN0[1:0]
lane 1 data mapping
ila_in_ln1 = lane_ln1 (dout and controls)
10
ila_in_ln1 = lane_ln2 (dout and controls)
11
ila_in_ln1 = lane_ln3 (dout and controls
lane 0 data mapping
00
ila_in_ln0 = lane_ln0 (dout and controls)
01
ila_in_ln0 = lane_ln1 (dout and controls)
10
ila_in_ln0 = lane_ln2 (dout and controls)
11
ila_in_ln0 = lane_ln3 (dout and controls)
SOFT_RESET_SCRAMBLER register (address 10h) bit description
Symbol
Access
3
SR_SCR_LN3
R/W
Value
1
0
Table 96.
SR_SCR_LN2
R/W
SR_SCR_LN1
no action
soft_reset scrambler of lane 3
lane 2 scrambler reset
0
no action
1
soft_reset scrambler of lane 2
R/W
SR_SCR_LN0
Description
lane 3 scrambler reset
0
1
ila_in_ln1 = lane_ln0 (dout and controls)
01
R/W
Bit
2
ila_in_ln3 = lane_ln3 (dout and controls)
lane 2 data mapping
00
1 to 0
Description
lane 1 scrambler reset
0
no action
1
soft_reset scrambler of lane 1
R/W
lane 0 scrambler reset
0
no action
1
soft_reset scrambler of lane 0
INIT_SCR_S15T8_LN0 register (address 11h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
INIT_VALUE_S15_S8_LN0[7:0]
R/W
00h
initialization value for lane 0 descrambler bits
s15 : s8
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
65 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 97.
INIT_SCR_S7T1_LN0 (address 12h) bit description
Bit
Symbol
Access
Value
Description
6 to 0
INIT_VALUE_S7_S1_LN0[6:0]
R/W
00h
initialization value for lane 0 descrambler bits s7 : s1
Table 98.
INIT_SCR_S15T8_LN1 register (address 13h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
INIT_VALUE_S15_S8_LN1[7:0]
R/W
00h
initialization value for lane 1 descrambler bits
s15 : s8
Table 99.
INIT_SCR_S7T1_LN1 register (address 14h) bit description
Bit
Symbol
Access
Value
Description
6 to 0
INIT_VALUE_S7_S1_LN1[6:0]
R/W
00h
initialization value for lane 1 descrambler bits s7 : s1
Table 100. INIT_SCR_S15T8_LN2 register (address 15h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
INIT_VALUE_S15_S8_LN2[7:0]
R/W
00h
initialization value for lane 2 descrambler bits
s15 : s8
Table 101. INIT_SCR_S7T1_LN2 register (address 16h) bit description
Bit
Symbol
Access
Value
Description
6 to 0
INIT_VALUE_S7_S1_LN2[6:0]
R/W
00h
initialization value for lane 2 descrambler bits s7 : s1
Table 102. INIT_SCR_S15T8_LN3 register (address 17h) bit description
Bit
Symbol
Access
Value
Description
7 to 0
INIT_VALUE_S15_S8_LN3[7:0]
R/W
00h
initialization value for lane 3 descrambler bits
s15 : s8
Table 103. INIT_SCR_S7T1_LN3 register (address 18h) bit description
Bit
Symbol
Access
Value
Description
6 to 0
INIT_VALUE_S7_S1_LN3[6:0]
R/W
00h
initialization value for lane 3 descrambler bits s7 : s1
Table 104. INIT_ILA_BUFPTR_LN01 register (address 19h) bit description
Bit
Symbol
Access
Value
Description
7 to 4
INIT_ILA_BUFPTR_LN1[3:0]
R/W
8h
initialization value for lane 1 ILA buffer pointer
3 to 0
INIT_ILA_BUFPTR_LN0[3:0]
R/W
8h
initialization value for lane 0 ILA buffer pointer
Table 105. INIT_ILA_BUFPTR_LN23 register (address 1Ah) bit description
Bit
Symbol
Access
Value
Description
7 to 4
INIT_ILA_BUFPTR_LN3[3:0]
R/W
8h
initialization value for lane 3 ILA buffer pointer
3 to 0
INIT_ILA_BUFPTR_LN2[3:0]
R/W
8h
initialization value for lane 2 ILA buffer pointer
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
66 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 106. ERROR_HANDLING register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
6
NAD_ERR_CORR
R/W
5
4
3 to 2
1
0
KUX_CORR
NAD_CORR
CORR_MODE[1:0]
IMPL_ALT
IGNORE_ERR
Value
Description
frame assembler (fa)
0
not-in-table errors passed to fa
1
nad (nit and disparity) errors passed to fa
R/W
K-character error mode
0
unexpected K-character errors ignored (at fa)
1
unexpected K-character errors concealment (at
fa)
R/W
nad error mode
0
nad-errors ignored (at fa)
1
nad-errors concealment (at fa)
R/W
conceal mode
00
conceal 1 period at fa
01
conceal 2 periods at fa
10
conceal 3 periods at fa
11
conceal 4 periods at fa
R/W
disparity error detection configuration
0
default disparity error detection (table mode)
1
alternative disparity error detection (cnt mode)
R/W
general error mode
0
no action
1
ignore disparity/nit-errors at lane-controller
Table 107. REINIT_CNTRL register (address 1Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
7
REINIT_ILA_LN3
R/W
6
5
4
REINIT_ILA_LN2
REINIT_ILA_LN1
REINIT_ILA_LN0
DAC1008D750_1
Objective data sheet
Value
Description
lane 3, ila-buffer out-of-range check
0
no action
1
lane 3 ila-buffer out-of-range_error will activate
reinitialization
R/W
lane 2, ila-buffer out-of-range check
0
no action
1
lane 2 ila-buffer out-of-range_error will activate
reinitialization
R/W
lane 1, ila-buffer out-of-range check
0
no action
1
lane 1 ila-buffer out-of-range_error will activate
reinitialization
R/W
lane 0, ila-buffer out-of-range check
0
no action
1
lane 0 ila-buffer out-of-range_error will activate
reinitialization
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
67 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 107. REINIT_CNTRL register (address 1Ch) bit description …continued
Default settings are shown highlighted.
Bit
Symbol
Access
3
RESYNC_O_L_LN3
R/W
2
1
0
RESYNC_O_L_LN2
RESYNC_O_L_LN1
RESYNC_O_L_LN0
Value
Description
lane 3, resync over link
0
no action
1
lane 3 lane controller checks for
K28.5 /K/ symbols
R/W
lane 2, resync over link
0
no action
1
lane 2 lane controller checks for
K28.5 /K/ symbols
R/W
lane 1, resync over link
0
no action
1
lane 1 lane controller checks for
K28.5 /K/ symbols
R/W
lane 0, resync over link
0
no action
1
lane 0 controller checks for K28.5 /K/ symbols
Table 108. PAGE_ADDRESS register (address 1Fh) bit description
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page_address
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
68 of 99
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.9 Page 5 allocation map description
Table 109. Page 5 register allocation map
Address Register name
Default[1]
R/W Bit definition
b7
b6
b5
b4
b3
b2
b1
b0
Bin
Hex
Rev. 01 — 4 October 2010
00h ILA_MON_1_0
R
ILA_MON_LN1[3:0]
ILA_MON_LN0[3:0
uuuuuuuu uuh
1
01h ILA_MON_3_2
R
ILA_MON_LN3[3:0]
ILA_MON_LN2[3:0]
uuuuuuuu uuh
2
02h ILA_BUF_ERR
R
3
03h CA_MON
R
4
04h DEC_FLAGS
R
5
05h KOUT_FLAG
R
-
-
6
06h K28_LN0_FLAG R
-
7
07h K28_LN1_FLAG R
-
8
08h K28_LN2_FLAG R
9
-
-
CA_MON_LN3[1:0]
-
-
ILA_BUF_
ERR_LN3
CA_MON_LN2[1:0]
CA_MON_LN1[1:0]
ILA_BUF_
ERR_LN1
ILA_BUF_
ERR_LN0
CA_MON_LN0[1:0]
uuuuuuuu uuh
uuuuuuuu uuh
DEC_NIT_
ERR_LN0
DEC_DISP_ DEC_DISP_ DEC_DISP_ DEC_DISP_ uuuuuuuu uuh
ERR_LN3
ERR_LN2
ERR_LN1
ERR_LN0
-
-
DEC_KOUT_ DEC_KOUT_ DEC_KOUT_ DEC_KOUT_ uuuuuuuu uuh
LN3
LN2
LN1
LN0
-
-
K28_7_LN0
K28_5_LN0
K28_4_LN0
K28_3_LN0
K28_0_LN0 uuuuuuuu uuh
-
-
K28_7_LN1
K28_5_LN1
K28_4_LN1
K28_3_LN1
K28_0_LN1 uuuuuuuu uuh
-
-
-
K28_7_LN2
K28_5_LN2
K28_4_LN2
K28_3_LN2
K28_0_LN2 uuuuuuuu uuh
09h K28_LN3_FLAG R
-
-
-
K28_7_LN3
K28_5_LN3
K28_4_LN3
K28_3_LN3
K28_0_LN3 uuuuuuuu uuh
10 0Ah KOUT_
R
UNEXPECTED_
FLAG
-
-
-
-
11
DEC_NIT DEC_NIT DEC_NIT_
_ERR_
_ERR_
ERR_LN1
LN3
LN2
ILA_BUF_
ERR_LN2
DEC_KOUT_ DEC_KOUT_ DEC_KOUT_ DEC_KOUT_ uuuuuuuu uuh
UNEXP_LN3 UNEXP_LN2 UNEXP_LN1 UNEXP_LN0
0Bh LOCK_CNT_
MON_LN01
R
LOCK_CNT_MON_LN1[3:0]
LOCK_CNT_MON_LN0[3:0]
uuuuuuuu uuh
12 0Ch LOCK_CNT_
MON_LN23
R
LOCK_CNT_MON_LN3[3:0]
LOCK_CNT_MON_LN2[3:0]
uuuuuuuu uuh
13 0Dh CS_STATE_LNX R
69 of 99
© NXP B.V. 2010. All rights reserved.
15 0Fh INTR_MISC_
ENA
R/W
16 10h FLAG_CNT_LSB R
_LN0
RST_
BUF_
ERR_
FLAGS
-
CS_STATE_LN2[1:0]
-
-
CS_STATE_LN1[1:0]
-
-
CS_STATE_LN0[1:0]
-
-
uuuuuuuu uuh
00000000 00h
INTR_
INTR_ INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ 00000000 00h
ENA_ ENA_CS_ CS_INIT_
CS_INIT_
BUF_ERR_ BUF_ERR_ BUF_ERR_ BUF_ERR_
CS_
INIT_LN2
LN1
LN0
LN3
LN2
LN1
LN0
INIT_LN3
FLAG_CNT_LN0[7:0]
uuuuuuuu uuh
DAC1008D750
14 0Eh RST_BUF_ERR_ R/W
FLAGS
CS_STATE_LN3[1:0]
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
0
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Address Register name
17 11h FLAG_CNT_
MSB_LN0
Default[1]
R/W Bit definition
b7
b6
b5
b4
b3
b2
b1
b0
Bin
Hex
Rev. 01 — 4 October 2010
FLAG_CNT_LN0[15:8]
uuuuuuuu uuh
18 12h FLAG_CNT_LSB R
_LN1
FLAG_CNT_LN1[7:0]
uuuuuuuu uuh
19 13h FLAG_CNT_
MSB_LN1
R
FLAG_CNT_LN1[15:8]
uuuuuuuu uuh
20 14h FLAG_CNT_LSB R
_LN2
FLAG_CNT_LN2[7:0]
uuuuuuuu uuh
21 15h FLAG_CNT_
MSB_LN2
R
FLAG_CNT_LN2[15:8]
uuuuuuuu uuh
22 16h FLAG_CNT_LSB R
_LN3
FLAG_CNT_LN3[7:0]
uuuuuuuu uuh
23 17h FLAG_CNT_
MSB_LN3
R
FLAG_CNT_LN3[15:8]
uuuuuuuu uuh
24 18h BER_LEVEL_
LSB
R/W
BER_LEVEL[7:0]
00000000 00h
25 19h BER_LEVEL_
MSB
R/W
BER_LEVEL[15:8]
00000000 00h
26 1Ah INTR_ENA
R/W
INTR_
ENA_
NIT
27 1Bh CNTRL_
R/W
FLAGCNT_LN01
RST_
CFC_
LN1
INTR_
ENA_
DISP
70 of 99
© NXP B.V. 2010. All rights reserved.
29 1Dh MON_FLAGS_
RESET
R/W
RST_NIT
_ERRFLAGS
RST_
DISP_
ERR_
FLAGS
30 1Eh DBG_CNTRL
R/W
BER_
MODE
INTR_
CLEAR
31 1Fh PAGE_
ADDRESS
R/W
-
-
u = undefined at power-up or after reset.
SEL_CFC_LN1[2:0]
RST_CFC_
LN0
SEL_CFC_LN0[2:0]
01010101 55h
SEL_CFC_LN3[2:0]
RST_CFC_
LN2
SEL_CFC_LN2[2:0]
01010101 55h
RST_KOUT RST_KOUT RST_K28_
RST_K28_
RST_K28_
RST_K28_ 00000000 00h
_FLAGS
_UNEXPEC LN3_FLAGS LN2_FLAGS LN1_FLAGS LN0_FLAGS
TED_FLAGS
INTR_MODE[2:0]
-
-
-
PAGE[2:0]
-
00000000 00h
00000000 00h
DAC1008D750
28 1Ch CNTRL_
R/W
RST_
FLAGCNT_LN23
CFC_LN3
INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ INTR_ENA_ 00000000 00h
KOUT
KOUT_
K28_7
K28_5
K28_3
MISC
UNEXP
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
R
[1]
NXP Semiconductors
DAC1008D750_1
Objective data sheet
Table 109. Page 5 register allocation map …continued
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.10
Page 5 bit definition detailed description
Please refer to Table 109 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 110. ILA_MON_1_0 register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
ILA_MON_LN1[3:0]
R
-
ila_buf_ln1 pointer
3 to 0
ILA_MON_LN0[3:0]
R
-
ila_buf_ln0 pointer
Table 111. ILA_MON_3_2 register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
ILA_MON_LN3[3:0]
R
-
ila_buf_ln3 pointer
3 to 0
ILA_MON_LN2[3:0]
R
-
ila_buf_ln2 pointer
Table 112. ILA_BUF_ERR register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
3
ILA_BUF_ERR_LN3
R
2
1
0
ILA_BUF_ERR_LN2
ILA_BUF_ERR_LN1
ILA_BUF_ERR_LN0
Value
Description
lane 3 ila buffer error
0
ila_buf_ln3 pointer is in range
1
ila_buf_ln3 pointer is out of range
R
lane 2 ila buffer error
0
ila_buf_ln2 pointer is in range
1
ila_buf_ln2 pointer is out of range
R
lane 1 ila buffer error
0
ila_buf_ln1 pointer is in range
1
ila_buf_ln1 pointer is out of range
R
lane 0 ila buffer error
0
ila_buf_ln0 pointer is in range
1
ila_buf_ln0 pointer is out of range
Table 113. CA_MON register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
CA_MON_LN3[1:0]
R
-
clock alignment phase monitor lane 3
5 to 4
CA_MON_LN2[1:0]
R
-
clock alignment phase monitor lane 2
3 to 2
CA_MON_LN1[1:0]
R
-
clock alignment phase monitor lane 1
1 to 0
CA_MON_LN0[1:0]
R
-
clock alignment phase monitor lane 0
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
71 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 114. DEC_FLAGS register (address 04h) bit description
Bit
Symbol
Access
Value
Description
7
DEC_NIT_ERR_LN3
R
-
not-in-table error flag lane 3
6
DEC_NIT_ERR_LN2
R
-
not-in-table error flag lane 2
5
DEC_NIT_ERR_LN1
R
-
not-in-table error flag lane 1
4
DEC_NIT_ERR_LN0
R
-
not-in-table error flag lane 0
3
DEC_DISP_ERR_LN3
R
-
disparity error flag lane 3
2
DEC_DISP_ERR_LN2
R
-
disparity error flag lane 2
1
DEC_DISP_ERR_LN1
R
-
disparity error flag lane 1
0
DEC_DISP_ERR_LN0
R
-
disparity error flag lane 0
Table 115. KOUT_FLAG register (address 05h) bit description
Bit
Symbol
Access
Value
Description
3
DEC_KOUT_LN3
R
-
/K/ symbols found in lane 3
2
DEC_KOUT_LN2
R
-
/K/ symbols found in lane 2
1
DEC_KOUT_LN1
R
-
/K/ symbols found in lane 1
0
DEC_KOUT_LN0
R
-
/K/ symbols found in lane 0
Table 116. K28_LN0_FLAG register (address 06h) bit description
Bit
Symbol
Access
Value
Description
4
K28_7_LN0
R
-
K28_7 /F/ symbols found in lane 0
3
K28_5_LN0
R
-
K28_5 /K/ symbols found in lane 0
2
K28_4_LN0
R
-
K28_4 /Q/ symbols found in lane 0
1
K28_3_LN0
R
-
K28_3 /A/ symbols found in lane 0
0
K28_0_LN0
R
-
K28_0 /R/ symbols found in lane 0
Table 117. K28_LN1_FLAG register (address 07h) bit description
Bit
Symbol
Access
Value
Description
4
K28_7_LN1
R
-
K28_7 /F/ symbols found in lane 1
3
K28_5_LN1
R
-
K28_5 /K/ symbols found in lane 1
2
K28_4_LN1
R
-
K28_4 /Q/ symbols found in lane 1
1
K28_3_LN1
R
-
K28_3 /A/ symbols found in lane 1
0
K28_0_LN1
R
-
K28_0 /R/ symbols found in lane 1
Table 118. K28_LN2_FLAG register (address 08h) bit description
Bit
Symbol
Access
Value
Description
4
K28_7_LN2
R
-
K28_7 /F/ symbols found in lane 2
3
K28_5_LN2
R
-
K28_5 /K/ symbols found in lane 2
2
K28_4_LN2
R
-
K28_4 /Q/ symbols found in lane 2
1
K28_3_LN2
R
-
K28_3 /A/ symbols found in lane 2
0
K28_0_LN2
R
-
K28_0 /R/ symbols found in lane 2
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
72 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 119. K28_LN3_FLAG register (address 09h) bit description
Bit
Symbol
Access
Value
Description
4
K28_7_LN3
R
-
K28_7 /F/ symbols found in lane 3
3
K28_5_LN3
R
-
K28_5 /K/ symbols found in lane 3
2
K28_4_LN3
R
-
K28_4 /Q/ symbols found in lane 3
1
K28_3_LN3
R
-
K28_3 /A/ symbols found in lane 3
0
K28_0_LN3
R
-
K28_0 /R/ symbols found in lane 3
Table 120. KOUT_UNEXPECTED_FLAG register (address 0Ah) bit description
Bit
Symbol
Access
Value
Description
3
DEC_KOUT_UNEXP_LN3
R
-
unexpected /K/ symbols found in lane 3
2
DEC_KOUT_UNEXP_LN2
R
-
unexpected /K/ symbols found in lane 2
1
DEC_KOUT_UNEXP_LN1
R
-
unexpected /K/ symbols found in lane 1
0
DEC_KOUT_UNEXP_LN0
R
-
unexpected /K/ symbols found in lane 0
Table 121. LOCK_CNT_MON_LN01 register (address 0Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
LOCK_CNT_MON_LN1[3:0]
R
-
lock_state monitor synchronization word alignment
lane 1
3 to 0
LOCK_CNT_MON_LN0[3:0]
R
-
lock_state monitor synchronization word alignment
lane 0
Table 122. LOCK_CNT_MON_LN23 register (address 0Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 4
LOCK_CNT_MON_LN3[3:0]
R
-
lock_state monitor synchronization word alignment
lane 3
3 to 0
LOCK_CNT_MON_LN2[3:0]
R
-
lock_state monitor synchronization word alignment
lane 2
Table 123. CS_STATE_LNX register (address 0Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
CS_STATE_LN3[1:0]
R
-
monitor cs_state fsm lane 3
5 to 4
CS_STATE_LN2[1:0]
R
-
monitor cs_state fsm lane 2
3 to 2
CS_STATE_LN1[1:0]
R
-
monitor cs_state fsm lane 1
1 to 0
CS_STATE_LN0[1:0]
R
-
monitor cs_state fsm lane 0
Table 124. RST_BUF_ERR_FLAGS register (address 0Eh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
RST_BUF_ERR_FLAGS
R/W
0
reset ILA_BUF_ERR_LNn flags
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
73 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 125. INTR_MISC_ENA register (address 0Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
INTR_ENA_CS_INIT_LN3
R/W
0
intr_misc in case cs_state_ln3 = cs_init
6
INTR_ENA_CS_INIT_LN2
R/W
0
intr_misc in case cs_state_ln2 = cs_init
5
INTR_ENA_CS_INIT_LN1
R/W
0
intr_misc in case cs_state_ln1 = cs_init
4
INTR_ENA_CS_INIT_LN0
R/W
0
intr_misc in case cs_state_ln0 = cs_init
3
INTR_ENA_BUF_ERR_LN3
R/W
0
generate interrupt if ILA_BUF_ERR_LN3 = 1
2
INTR_ENA_BUF_ERR_LN2
R/W
0
generate interrupt if ILA_BUF_ERR_LN2 = 1
1
INTR_ENA_BUF_ERR_LN1
R/W
0
generate interrupt if ILA_BUF_ERR_LN1 = 1
0
INTR_ENA_BUF_ERR_LN0
R/W
0
generate interrupt if ILA_BUF_ERR_LN0 = 1
Table 126. FLAG_CNT_LSB_LN0 register (address 10h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN0[7:0]
R
-
LSBs of flag_counter lane 0
Table 127. FLAG_CNT_MSB_LN0 register (address 11h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN0[15:8]
R
-
MSBs of flag_counter lane 0
Table 128. FLAG_CNT_LSB_LN1 register (address 12h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN1[7:0]
R
-
LSBs of flag_counter lane 1
Table 129. FLAG_CNT_MSB_LN1 register (address 13h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN1[15:8]
R
-
MSBs of flag_counter lane 1
Table 130. FLAG_CNT_LSB_LN2 register (address 14h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN2[7:0]
R
-
LSBs of flag_counter lane 2
Table 131. FLAG_CNT_MSB_LN2 register (address 15h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN2[15:8]
R
-
MSBs of flag_counter lane 2
Table 132. FLAG_CNT_LSB_LN3 register (address 16h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN3[7:0]
R
-
LSBs of flag_counter lane 3
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
74 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 133. FLAG_CNT_MSB_LN3 register (address 17h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
FLAG_CNT_LN3[15:8]
R
-
MSBs of flag_counter lane 3
Table 134. BER_LEVEL_LSB register (address 18h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
BER_LEVEL[7:0]
R/W
00h
LSBs level used for simple (DC) BER-measurement
Table 135. BER_LEVEL_MSB register (address 19h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
BER_LEVEL[15:8]
R/W
00h
MSBs level used for simple (DC)
BER-measurement
Table 136. INTR_ENA register (address 1Ah) bit description
Bit
Symbol
Access
7
INTR_ENA_NIT
R/W
6
5
4
3
INTR_ENA_DISP
INTR_ENA_KOUT
INTR_ENA_KOUT_UNEXP
INTR_ENA_K28_7
Value
not-in-table interrupt
0
no action
1
nit-error in ln<x> affects i_ln<x>
R/W
disparity-error interrupt
0
no action
1
disparity-error in ln<x> affects i_ln<x>
R/W
K-character interrupt
0
no action
1
detection k-control character in ln<x> affects
i_ln<x>
R/W
unexpected K-character interrupt
0
no action
1
detection unexpected K-character in ln<x> affects
i_ln<x>
R/W
K28_7 interrupt
0
1
2
1
0
INTR_ENA_K28_5
INTR_ENA_K28_3
INTR_ENA_MISC
DAC1008D750_1
Objective data sheet
Description
R/W
no action
detection K28_7 in ln<x> affects i_ln<x>
K28_5 interrupt
0
no action
1
detection K28_5 in ln<x> affects i_ln<x>
R/W
K28_3 interrupt
0
no action
1
detection K28_3 in ln<x> affects i_ln<x>
R/W
miscellaneous interrupt
0
no action
1
detection depends on intr_misc_ena
(see Table 125)
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
75 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 137. CNTRL_FLAGCNT_LN01 register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
RST_CFC_LN1
R/W
0
reset FLAG_CNT_LN1
6 to 4
SEL_CFC_LN1[2:0]
R/W
5h
select FLAG_CNT_LN1 source (see Table 142)
3
RST_CFC_LN0
R/W
0
reset FLAG_CNT_LN0
2 to 0
SEL_CFC_LN0[2:0]
R/W
5h
select FLAG_CNT_LN0 source (see Table 142)
Table 138. CNTRL_FLAGCNT_LN23 register (address 1Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
RST_CFC_LN3
R/W
0
reset FLAG_CNT_LN3
6 to 4
SEL_CFC_LN3[2:0]
R/W
5h
select FLAG_CNT_LN3 source (see Table 142)
3
RST_CFC_LN2
R/W
0
reset FLAG_CNT_LN2
2 to 0
SEL_CFC_LN2[2:0]
R/W
5h
select FLAG_CNT_LN2 source (see Table 142)
Table 139. MON_FLAGS_RESET register (address 1Dh) bit description
Bit
Symbol
Access
Value
Description
7
RST_NIT_ERR-FLAGS
R/W
0
reset nit-error monitor flags
6
RST_DISP_ERR_FLAGS
R/W
0
reset disparity monitor flags
5
RST_KOUT_FLAGS
R/W
0
reset K symbols monitor flags
4
RST_KOUT_UNEXPECTED_FLAGS R/W
0
reset unexpected K symbols monitor flags
3
RST_K28_LN3_FLAGS
R/W
0
reset K28_x monitor flags for lane 3
2
RST_K28_LN2_FLAGS
R/W
0
reset K28_x monitor flags for lane 2
1
RST_K28_LN1_FLAGS
R/W
0
reset K28_x monitor flags for lane 1
0
RST_K28_LN0_FLAGS
R/W
0
reset K28_x monitor flags for lane 0
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
76 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 140. DBG_CNTRL register (address 1Eh) bit description
Bit
Symbol
Access
7
BER_MODE
R/W
6
INTR_CLEAR
Value
simple BER-measurement
0
no action
1
simple BER-measurement enabled
R/W
interrupts clear
0
1
5 to 3
INTR_MODE[2:0]
Description
R/W
no action
clear interrupts (to '1')
interrupt settings
000
global interrupt depends on lane 0
001
global interrupt depends on lane 1
010
global interrupt depends on lane 2
011
global interrupt depends on lane 3
100
global interrupt depends on lane 0 or lane 1
101
global interrupt depends on lane 2 or lane 3
110
global interrupt depends on lane 0 or lane 1 or
lane 2 or lane 3
111
no interrupt
Table 141. PAGE_ADDRESS register (address 1Fh) bit description
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page_address
Table 142. Counter source
Default settings are shown highlighted.
DAC1008D750_1
Objective data sheet
SEL_CFC_LNn[2:0]
Source
000
not-in-table error
001
disparity error
010
K symbol found
011
unexpected K symbol found
100
K28_7 (/F/) symbol found
101
K28_5 (/K/) symbol found
110
K28_3 (/A/) symbol found
111
K28_0 (/R/) symbol found
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
77 of 99
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.11 Page 6 allocation map description
Table 143. Page 6 register allocation map
Address
Register name
Default[1]
R/W Bit definition
b7
b6
b5
b4
b3
b2
b1
LN0_DID[7:0]
b0
Bin
Hex
Rev. 01 — 4 October 2010
00h
LN0_CFG_0
R
1
01h
LN0_CFG_1
R
2
02h
LN0_CFG_2
R
-
-
-
LN0_LID[4:0]
uuuuuuuu 0xuu
3
03h
LN0_CFG_3
R
LN0_SCR
-
-
LN0_L[4:0]
uuuuuuuu 0xuu
4
04h
LN0_CFG_4
R
5
05h
LN0_CFG_5
R
6
06h
LN0_CFG_6
R
7
07h
LN0_CFG_7
8
08h
9
09h
-
-
-
-
uuuuuuuu 0xuu
LN0_BID[3:0]
LN0_F[7:0]
-
-
-
R
LN0_CS[1:0]
LN0_CFG_8
R
-
LN0_CFG_9
R
uuuuuuuu 0xuu
uuuuuuuu 0xuu
LN0_K[4:0]
uuuuuuuu 0xuu
-
LN0_N[4:0]
uuuuuuuu 0xuu
-
-
LN0_N’[4:0]
uuuuuuuu 0xuu
-
-
-
LN0_S[4:0]
uuuuuuuu 0xuu
LN0_HD
-
-
LN0_CF[4:0]
uuuuuuuu 0xuu
LN0_M[7:0]
uuuuuuuu 0xuu
LN0_CFG_10
R
11 0Bh
LN0_CFG_11
R
LN0_RES1[7:0]
uuuuuuuu 0xuu
12 0Ch
LN0_CFG_12
R
LN0_RES2[7:0]
uuuuuuuu 0xuu
13 0Dh
LN0_CFG_13
R
LN0_FCHK[7:0]
uuuuuuuu 0xuu
16 10h
LN1_CFG_0
R
17 11h
LN1_CFG_1
R
-
-
-
18 12h
LN1_CFG_2
R
-
-
-
LN1_LID[4:0]
uuuuuuuu 0xuu
19 13h
LN1_CFG_3
R
LN1_SCR
-
-
LN1_L[4:0]
uuuuuuuu 0xuu
20 14h
LN1_CFG_4
R
21 15h
LN1_CFG_5
R
-
-
-
LN1_K[4:0]
uuuuuuuu 0xuu
22 16h
LN1_CFG_6
R
23 17h
LN1_CFG_7
R
LN1_CS[1:0]
-
LN1_N[4:0]
24 18h
LN1_CFG_8
R
-
-
-
LN1_N’[4:0]
uuuuuuuu 0xuu
25 19h
LN1_CFG_9
R
-
-
-
LN1_S[4:0]
uuuuuuuu 0xuu
26 1Ah
LN1_CFG_10
R
LN1_HD
-
-
LN1_CF[4:0]
uuuuuuuu 0xuu
27 1Bh
LN1_CFG_11
R
LN1_DID[7:0]
-
uuuuuuuu 0xuu
LN1_BID[3:0]
LN1_F[7:0]
uuuuuuuu 0xuu
LN1_M[7:0]
LN1_RES1[7:0]
uuuuuuuu 0xuu
uuuuuuuu 0xuu
uuuuuuuu 0xuu
uuuuuuuu 0xuu
DAC1008D750
78 of 99
© NXP B.V. 2010. All rights reserved.
10 0Ah
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
0
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Address
Register name
28 1Ch
LN1_CFG_12
R
29 1Dh
LN1_CFG_13
R
31 1Fh
PAGE_ADDRESS R/W
[1]
Default[1]
R/W Bit definition
b7
b6
b5
b4
b3
b2
b1
LN1_RES2[7:0]
-
-
-
-
b0
Bin
Hex
uuuuuuuu 0xuu
LN1_FCHK[7:0]
-
NXP Semiconductors
DAC1008D750_1
Objective data sheet
Table 143. Page 6 register allocation map …continued
uuuuuuuu 0xuu
PAGE[2:0]
00000000 00h
u = undefined at power-up or after reset.
Rev. 01 — 4 October 2010
DAC1008D750
79 of 99
© NXP B.V. 2010. All rights reserved.
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.12
Page 6 bit definition detailed description
Please refer to Table 143 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 144. LN0_CFG_0 register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_DID[7:0]
R
-
lane 0 device ID
Table 145. LN0_CFG_1 register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 0
LN0_BID[3:0]
R
-
lane 0 bank ID
Table 146. LN0_CFG_2 register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN0_LID[4:0]
R
-
lane 0 lane ID
Table 147. LN0_CFG_3 register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN0_SCR
R
-
scrambling on
4 to 0
LN0_L[4:0]
R
-
number of lanes minus 1
Table 148. LN0_CFG_4 register (address 04h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_F[7:0]
R
-
number of octets per frame minus 1
Table 149. LN0_CFG_5 register (address 05h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN0_K[4:0]
R
-
number of frames per multi-frame minus 1
Table 150. LN0_CFG_6 register (address 06h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_M[7:0]
R
-
number of converters per device minus 1
Table 151. LN0_CFG_7 register (address 07h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
LN0_CS[1:0]
R
-
number of control bits
4 to 0
LN0_N[4:0]
R
-
converter resolution minus 1
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
80 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 152. LN0_CFG_8 register (address 08h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN0_N’[4:0]
R
-
number of bits per sample minus 1
Table 153. LN0_CFG_9 register (address 09h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN0_S[4:0]
R
-
number of samples per converter per frame cycle
minus 1
Table 154. LN0_CFG_10 register (address 0Ah) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN0_HD
R
-
high density
4 to 0
LN0_CF[4:0]
R
-
number of control words per frame cycle
Table 155. LN0_CFG_11 register (address 0Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_RES1[7:0]
R
-
lane 0 reserved field
Table 156. LN0_CFG_12 register (address 0Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_RES2[7:0]
R
-
lane 0 reserved field
Table 157. LN0_CFG_13 register (address 0Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN0_FCHK[7:0]
R
-
lane 0 checksum
Table 158. LN1_CFG_0 register (address 10h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_DID[7:0]
R
-
lane 1 device ID
Table 159. LN1_CFG_1 register (address 11h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 0
LN1_BID[3:0]
R
-
lane 1 bank ID
Table 160. LN1_CFG_2 register (address 12h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN1_LID[4:0]
R
-
lane 1 lane ID
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
81 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 161. LN1_CFG_3 register (address 13h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN1_SCR
R
-
scrambling on
4 to 0
LN1_L[4:0]
R
-
number of lanes minus 1
Table 162. LN1_CFG_4 register (address 14h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_F[7:0]
R
-
number of octets per frame minus 1
Table 163. LN1_CFG_5 register (address 15h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN1_K[4:0]
R
-
number of frames per multiframe minus 1
Table 164. LN1_CFG_6 register (address 16h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_M[7:0]
R
-
number of converters per device minus 1
Table 165. LN1_CFG_7 register (address 17h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
LN1_CS[1:0]
R
-
number of control bits
4 to 0
LN1_N[4:0]
R
-
converter resolution minus 1
Table 166. LN1_CFG_8 register (address 18h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN1_N’[4:0]
R
-
number of bits per sample minus 1
Table 167. LN1_CFG_9 register (address 19h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN1_S[4:0]
R
-
number of samples per converter per frame cycle
minus 1
Table 168. LN1_CFG_10 register (address 1Ah) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
LN1_HD
R
-
high density
4 to 0
LN1_CF[4:0]
R
-
number of control words per frame cycle
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
82 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 169. LN1_CFG_11 register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_RES1[7:0]
R
-
lane 1 reserved field
Table 170. LN1_CFG_12 register (address 1Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_RES2[7:0]
R
-
lane 1 reserved field
Table 171. LN1_CFG_13 register (address 1Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN1_FCHK[7:0]
R
-
lane 1 checksum
Table 172. PAGE_ADDRESS register (address 1Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page_address
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
83 of 99
NXP Semiconductors
DAC1008D750_1
Objective data sheet
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.15.2.13 Page 7 allocation map description
Table 173. Page 7 register allocation map
Address
Register name
Default[1]
R/W Bit definition
b7
0
00h
LN2_CFG_0
R
1
01h
LN2_CFG_1
R
b6
b5
b4
b3
b2
b1
LN2_DID[7:0]
-
-
-
-
b0
Bin
Hex
uuuuuuuu 0xuu
LN2_BID[3:0]
uuuuuuuu 0xuu
Rev. 01 — 4 October 2010
02h
LN2_CFG_2
R
-
-
-
LN2_LID[4:0]
uuuuuuuu 0xuu
3
03h
LN2_CFG_3
R
LN2_SCR
-
-
LN2_L[4:0]
uuuuuuuu 0xuu
4
04h
LN2_CFG_4
R
5
05h
LN2_CFG_5
R
6
06h
LN2_CFG_6
R
7
07h
LN2_CFG_7
R
LN2_CS[1:0]
8
08h
LN2_CFG_8
R
-
9
09h
LN2_CFG_9
R
LN2_F[7:0]
-
-
-
uuuuuuuu 0xuu
LN2_K[4:0]
uuuuuuuu 0xuu
-
LN2_N[4:0]
uuuuuuuu 0xuu
-
-
LN2_N’[4:0]
uuuuuuuu 0xuu
-
-
-
LN2_S[4:0]
uuuuuuuu 0xuu
LN2_HD
-
-
LN2_M[7:0]
uuuuuuuu 0xuu
10 0Ah
LN2_CFG_10
R
11 0Bh
LN2_CFG_11
R
LN2_RES1[7:0]
uuuuuuuu 0xuu
12 0Ch
LN2_CFG_12
R
LN2_RES2[7:0]
uuuuuuuu 0xuu
13 0Dh
LN2_CFG_13
R
LN2_FCHK[7:0]
uuuuuuuu 0xuu
16 10h
LN3_CFG_0
R
17 11h
LN3_CFG_1
R
-
-
-
18 12h
LN3_CFG_2
R
-
-
-
LN3_LID[4:0]
uuuuuuuu 0xuu
19 13h
LN3_CFG_3
R
LN3_SCR
-
-
LN3_L[4:0]
uuuuuuuu 0xuu
-
-
-
LN3_CFG_4
R
21 15h
LN3_CFG_5
R
22 16h
LN3_CFG_6
R
23 17h
LN3_CFG_7
R
LN3_DID[7:0]
-
uuuuuuuu 0xuu
LN3_BID[3:0]
LN3_F[7:0]
uuuuuuuu 0xuu
uuuuuuuu 0xuu
LN3_K[4:0]
LN3_M[7:0]
LN3_CS[1:0]
uuuuuuuu 0xuu
uuuuuuuu 0xuu
uuuuuuuu 0xuu
-
LN3_N[4:0]
uuuuuuuu 0xuu
84 of 99
© NXP B.V. 2010. All rights reserved.
24 18h
LN3_CFG_8
R
-
-
-
LN3_N’[4:0]
uuuuuuuu 0xuu
25 19h
LN3_CFG_9
R
-
-
-
LN3_S[4:0]
uuuuuuuu 0xuu
26 1Ah
LN3_CFG_10
R
LN3_HD
-
-
LN3_CF[4:0]
uuuuuuuu 0xuu
27 1Bh
LN3_CFG_11
R
LN3_RES1[7:0]
uuuuuuuu 0xuu
DAC1008D750
20 14h
LN2_CF[4:0]
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
2
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Address
Register name
28 1Ch
LN3_CFG_12
R
29 1Dh
LN3_CFG_13
R
31 1Fh
PAGE_ADDRESS R/W
[1]
Default[1]
R/W Bit definition
b7
b6
b5
b4
b3
b2
b1
LN3_RES2[7:0]
-
-
-
-
b0
Bin
Hex
uuuuuuuu 0xuu
LN3_FCHK[7:0]
-
NXP Semiconductors
DAC1008D750_1
Objective data sheet
Table 173. Page 7 register allocation map …continued
uuuuuuuu 0xuu
PAGE[2:0]
00000000 00h
u = undefined at power-up or after reset.
Rev. 01 — 4 October 2010
DAC1008D750
85 of 99
© NXP B.V. 2010. All rights reserved.
2×, 4× or 8× interpolating with JESD204A
All information provided in this document is subject to legal disclaimers.
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
10.15.2.14
Page 7 bit definition detailed description
Please refer to Table 173 for a register overview and their default values. In the following
tables, all the values emphasized in bold are the default values.
Table 174. LN2_CFG_0 register (address 00h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_DID[7:0]
R
-
lane 2 device ID
Table 175. LN2_CFG_1 register (address 01h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 0
LN2_BID[3:0]
R
-
lane 2 bank ID
Table 176. LN2_CFG_2 register (address 02h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN2_LID[4:0]
R
-
lane 2 lane ID
Table 177. LN2_CFG_3 register (address 03h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN2_SCR
R
-
scrambling on
4 to 0
LN2_L[4:0]
R
-
number of lanes minus 1
Table 178. LN2_CFG_4 register (address 04h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_F[7:0]
R
-
number of octets per frame minus 1
Table 179. LN2_CFG_5 register (address 05h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN2_K[4:0]
R
-
number of frames per multiframe minus 1
Table 180. LN2_CFG_6 register (address 06h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_M[7:0]
R
-
number of converters per device minus 1
Table 181. LN2_CFG_7 register (address 07h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
LN2_CS[1:0]
R
-
number of control bits
4 to 0
LN2_N[4:0]
R
-
converter resolution minus 1
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
86 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 182. LN2_CFG_8 register (address 08h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN2_N'[4:0]
R
-
number of bits per sample minus 1
Table 183. LN2_CFG_9 register (address 09h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN2_S[4:0]
R
-
number of samples per converter per frame cycle
minus 1
Table 184. LN2_CFG_10 register (address 0Ah) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN2_HD
R
-
high density
4 to 0
LN2_CF[4:0]
R
-
number of control words per frame cycle
Table 185. LN2_CFG_11 register (address 0Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_RES1[7:0]
R
-
lane 2 reserved field
Table 186. LN2_CFG_12 register (address 0Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_RES2[7:0]
R
-
lane 2 reserved field
Table 187. LN2_CFG_13 register (address 0Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN2_FCHK[7:0]
R
-
lane 2 checksum
Table 188. LN3_CFG_0 register (address 10h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_DID[7:0]
R
-
lane 3 device ID
Table 189. LN3_CFG_1 register (address 11h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
3 to 0
LN3_BID[3:0]
R
-
lane 3 bank ID
Table 190. LN3_CFG_2 register (address 12h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN3_LID[4:0]
R
-
lane 3 lane ID
DAC1008D750_1
Objective data sheet
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Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
87 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 191. LN3_CFG_3 register (address 13h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN3_SCR
R
-
scrambling on
4 to 0
LN3_L[4:0]
R
-
number of lanes minus 1
Table 192. LN3_CFG_4 register (address 14h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_F[7:0]
R
-
number of octets per frame minus 1
Table 193. LN3_CFG_5 register (address 15h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN3_K[4:0]
R
-
number of frames per multiframe minus 1
Table 194. LN3_CFG_6 register (address 16h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_M[7:0]
R
-
number of converters per device minus 1
Table 195. LN3_CFG_7 register (address 17h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 6
LN3_CS[1:0]
R
-
number of control bits
4 to 0
LN3_N[4:0]
R
-
converter resolution minus 1
Table 196. LN3_CFG_8 register (address 18h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN3_N'[4:0]
R
-
number of bits per sample minus 1
Table 197. LN3_CFG_9 register (address 19h) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
4 to 0
LN3_S[4:0]
R
-
number of samples per converter per frame cycle
minus 1
Table 198. LN3_CFG_10 register (address 1Ah) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7
LN3_HD
R
-
high density
4 to 0
LN3_CF[4:0]
R
-
number of control words per frame cycle
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
88 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 199. LN3_CFG_11 register (address 1Bh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_RES1[7:0]
R
-
lane 3 reserved field
Table 200. LN3_CFG_12 register (address 1Ch) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_RES2[7:0]
R
-
lane 3 reserved field
Table 201. LN3_CFG_13 register (address 1Dh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
7 to 0
LN3_FCHK[7:0]
R
-
lane 3 checksum
Table 202. PAGE_ADDRESS register (address 1Fh) bit description
Default settings are shown highlighted.
Bit
Symbol
Access
Value
Description
2 to 0
PAGE[2:0]
R/W
0h
page_address
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
89 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
11. Package outline
HVQFN64: plastic thermal enhanced very thin quad flat package; no leads;
64 terminals; body 9 x 9 x 0.85 mm
A
B
D
SOT804-3
terminal 1
index area
E
A1
A
c
detail X
e1
1/2 e
e
L
17
32
C
C A B
C
v
w
b
y1 C
y
33
16
e
e2
Eh
1/2 e
1
terminal 1
index area
48
64
49
X
Dh
0
2.5
scale
Dimensions
Unit
mm
5 mm
A
A1
b
max 1.00 0.05 0.30
nom 0.85 0.02 0.21
min 0.80 0.00 0.18
c
D(1)
Dh
E(1)
Eh
0.2
9.1
9.0
8.9
7.25
7.10
6.95
9.1
9.0
8.9
7.25
7.10
6.95
e
e1
0.5
7.5
e2
L
v
7.5
0.5
0.4
0.3
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT804-3
---
---
---
sot804-3_po
European
projection
Issue date
09-02-24
10-08-06
Fig 27. Package outline SOT804 (HVQFN64)
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
90 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
12. Abbreviations
Table 203. Abbreviations
DAC1008D750_1
Objective data sheet
Acronym
Description
AQM
Analog Quadrature Modulator
BER
Bit Error Rate
BW
BandWidth
BWA
Broadband Wireless Access
CDMA
Code Division Multiple Access
CML
Current Mode Logic
CMOS
Complementary Metal Oxide Semiconductor
DAC
Digital-to-Analog Converter
DCSMU
Device Configuration Management and Start-up Unit
DES
DESerializer
EDGE
Enhanced Data rates for GSM Evolution
FIR
Finite Impulse Response
FPGA
Field Programmable Gate Array
GSM
Global System for Mobile communications
IF
Intermediate Frequency
ILA
Inter-Lane Alignment
IMD3
third order InterMoDulation product
LMDS
Local Multipoint Distribution Service
LSB
Least Significant Bit
LTE
Long Term Evolution
LVDS
Low-Voltage Differential Signaling
MDS
Multipoint Distribution Service
MMDS
Multichannel Multipoint Distribution Service
MSB
Most Significant Bit
NCO
Numerically Controlled Oscillator
NMOS
Negative Metal-Oxide Semiconductor
PLL
Phase-Locked Loop
SERDES
SERializer/DESerializer
SFDR
Spurious Free Dynamic Range
SPI
Serial Peripheral Interface
TD-SCDMA
Time Division-Synchronous Code Division Multiple Access
WCDMA
Wideband Code Division Multiple Access
WiMax
Worldwide interoperability for Microwave Access
WLL
Wireless Local Loop
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
91 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
13. Revision history
Table 204. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
DAC1008D750 v.1
20101004
Objective data sheet
-
-
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
92 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
93 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
94 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
16. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .6
Thermal characteristics . . . . . . . . . . . . . . . . . . .6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .7
Digital Layer Processing Latency . . . . . . . . . . .13
SYNC_OUT timing . . . . . . . . . . . . . . . . . . . . . .15
Read or Write mode access description . . . . .24
Number of bytes to be transferred . . . . . . . . . .24
SPI timing characteristics . . . . . . . . . . . . . . . .25
Interpolation filter coefficients . . . . . . . . . . . . .27
Inversion filter coefficients . . . . . . . . . . . . . . . .29
DAC transfer function . . . . . . . . . . . . . . . . . . .29
IO(fs) coarse adjustment . . . . . . . . . . . . . . . . . .31
IO(fs) fine adjustment . . . . . . . . . . . . . . . . . . . .31
Digital offset adjustment . . . . . . . . . . . . . . . . .32
Auxiliary DAC transfer function . . . . . . . . . . . .33
Page 0 register allocation map . . . . . . . . . . . .39
COMMON register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
TXCFG register (address 01h) bit description .41
PLLCFG register (address 02h) bit description 42
FREQNCO_LSB register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
FREQNCO_LISB register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
FREQNCO_UISB register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
FREQNCO_MSB register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
PHINCO_LSB register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
PHINCO_MSB register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
DAC_A_CFG_1 register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
DAC_A_CFG_2 register (address 0Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
DAC_A_CFG_3 register (address 0Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
DAC_B_CFG_1 register (address 0Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
DAC_B_CFG_2 register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
DAC_B_CFG_3 register (address 0Eh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
DAC_CFG register (address 0Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Table 35. DAC_CURRENT_0 register (address 11h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 36. DAC_CURRENT_1 register (address 12h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 37. DAC_CURRENT_2 register (address 13h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 38. DAC_CURRENT_3 register (address 14h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 39. DAC_SEL_PH_FINE register (address 15h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 40. PHASECORR_CNTRL0 register (address 16h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 41. PHASECORR_CNTRL1 register (address 17h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 42. DAC_A_AUX_MSB register (address 1Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 43. DAC_A_AUX_LSB register (address 1Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 44. DAC_B_AUX_MSB register (address 1Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 45. DAC_B_AUX_LSB register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 46. DAC_B_AUX_LSB register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 47. Bias current control table . . . . . . . . . . . . . . . . . 46
Table 48. Page 1 register allocation map . . . . . . . . . . . . 47
Table 49. MDS_MAIN register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 50. MDS_WIN_PERIOD_A register (address 01h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 51. MDS_WIN_PERIOD_B register (address 02h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 52. MDS_MISCCNTRL0 register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 53. MDS_MAN_ADJUSTDLY register (address 04h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 54. MDS_AUTO_CYCLES register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 55. MDS_MISCCNTRL1 register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 56. MDS_ADJDELAY register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 57. MDS_STATUS0 register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 58. MDS_STATUS1 register (address 0Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 59. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
continued >>
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
95 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 60. Page 2 register allocation map . . . . . . . . . . . .52
Table 61. MAINCONTROL register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Table 62. JCLK_CNTRL register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Table 63. RST_EXT_FCLK register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 64. RST_EXT_DCLK register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 65. DCSMU_PREDIVCNT register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 66. PLL_CHARGETIME register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 67. PLL_RUN_IN_TIME register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 68. CA_RUN_IN_TIME register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 69. SET_VCM_VOLTAGE register (address 16h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 70. SET_SYNC register (address 17h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Table 71. TYPE_ID register (address 1Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 72. DAC_VERSION register (address 1Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 73. DIG_VERSION register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 74. JRX_ANA_VERSION register (address 1Eh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 75. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 76. Lane common-mode voltage adjustment . . . . .56
Table 77. SYNC common-mode voltage adjustment . . . .56
Table 78. SYNC swing voltage adjustment . . . . . . . . . . .56
Table 79. Page 4 register allocation map . . . . . . . . . . . .57
Table 80. SR_DLP_0 register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Table 81. SR_DLP_1 register (address 01h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Table 82. FORCE_LOCK register (address 02h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Table 83. MAN_LOCK_LN_1_0 register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Table 84. MAN_LOCK_2_0 register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Table 85. CA_CNTRL register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Table 86. SCR_CNTRL register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Table 87. ILA_CNTRL register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Table 88. FORCE_ALIGN register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 89. MAN_ALIGN_LN_0_1 register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 90. MAN_ALIGN_LN_2_3 register (address 0Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 91. FA_ERR_HANDLING register (address 0Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 92. SYNCOUT_MODE register (address 0Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 93. LANE_POLARITY register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 94. LANE_SELECT register (address 0Eh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 95. SOFT_RESET_SCRAMBLER register (address
10h) bit description . . . . . . . . . . . . . . . . . . . . . 65
Table 96. INIT_SCR_S15T8_LN0 register (address 11h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 97. INIT_SCR_S7T1_LN0 (address 12h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 98. INIT_SCR_S15T8_LN1 register (address 13h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 99. INIT_SCR_S7T1_LN1 register (address 14h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 100. INIT_SCR_S15T8_LN2 register (address 15h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 101. INIT_SCR_S7T1_LN2 register (address 16h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 102. INIT_SCR_S15T8_LN3 register (address 17h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 103. INIT_SCR_S7T1_LN3 register (address 18h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 104. INIT_ILA_BUFPTR_LN01 register (address 19h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 105. INIT_ILA_BUFPTR_LN23 register (address 1Ah)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 106. ERROR_HANDLING register (address 1Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 107. REINIT_CNTRL register (address 1Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 108. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 109. Page 5 register allocation map . . . . . . . . . . . . 69
Table 110. ILA_MON_1_0 register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 111. ILA_MON_3_2 register (address 01h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 112. ILA_BUF_ERR register (address 02h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 113. CA_MON register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
continued >>
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
96 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 114. DEC_FLAGS register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 115. KOUT_FLAG register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 116. K28_LN0_FLAG register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 117. K28_LN1_FLAG register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 118. K28_LN2_FLAG register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table 119. K28_LN3_FLAG register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 120. KOUT_UNEXPECTED_FLAG register (address
0Ah) bit description . . . . . . . . . . . . . . . . . . . . .73
Table 121. LOCK_CNT_MON_LN01 register (address 0Bh)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 122. LOCK_CNT_MON_LN23 register (address 0Ch)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 123. CS_STATE_LNX register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 124. RST_BUF_ERR_FLAGS register (address 0Eh)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 125. INTR_MISC_ENA register (address 0Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 126. FLAG_CNT_LSB_LN0 register (address 10h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 127. FLAG_CNT_MSB_LN0 register (address 11h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 128. FLAG_CNT_LSB_LN1 register (address 12h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 129. FLAG_CNT_MSB_LN1 register (address 13h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 130. FLAG_CNT_LSB_LN2 register (address 14h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 131. FLAG_CNT_MSB_LN2 register (address 15h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 132. FLAG_CNT_LSB_LN3 register (address 16h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Table 133. FLAG_CNT_MSB_LN3 register (address 17h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Table 134. BER_LEVEL_LSB register (address 18h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Table 135. BER_LEVEL_MSB register (address 19h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Table 136. INTR_ENA register (address 1Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Table 137. CNTRL_FLAGCNT_LN01 register (address 1Bh)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .76
Table 138. CNTRL_FLAGCNT_LN23 register (address 1Ch)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .76
Table 139. MON_FLAGS_RESET register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Table 140. DBG_CNTRL register (address 1Eh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 141. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 142. Counter source . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 143. Page 6 register allocation map . . . . . . . . . . . . 78
Table 144. LN0_CFG_0 register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 145. LN0_CFG_1 register (address 01h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 146. LN0_CFG_2 register (address 02h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 147. LN0_CFG_3 register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 148. LN0_CFG_4 register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 149. LN0_CFG_5 register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 150. LN0_CFG_6 register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 151. LN0_CFG_7 register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 152. LN0_CFG_8 register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 153. LN0_CFG_9 register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 154. LN0_CFG_10 register (address 0Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 155. LN0_CFG_11 register (address 0Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 156. LN0_CFG_12 register (address 0Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 157. LN0_CFG_13 register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 158. LN1_CFG_0 register (address 10h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 159. LN1_CFG_1 register (address 11h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 160. LN1_CFG_2 register (address 12h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 161. LN1_CFG_3 register (address 13h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 162. LN1_CFG_4 register (address 14h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 163. LN1_CFG_5 register (address 15h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 164. LN1_CFG_6 register (address 16h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 165. LN1_CFG_7 register (address 17h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
continued >>
DAC1008D750_1
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
97 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
Table 166. LN1_CFG_8 register (address 18h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Table 167. LN1_CFG_9 register (address 19h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Table 168. LN1_CFG_10 register (address 1Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Table 169. LN1_CFG_11 register (address 1Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Table 170. LN1_CFG_12 register (address 1Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Table 171. LN1_CFG_13 register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Table 172. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Table 173. Page 7 register allocation map . . . . . . . . . . . .84
Table 174. LN2_CFG_0 register (address 00h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 175. LN2_CFG_1 register (address 01h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 176. LN2_CFG_2 register (address 02h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 177. LN2_CFG_3 register (address 03h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 178. LN2_CFG_4 register (address 04h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 179. LN2_CFG_5 register (address 05h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 180. LN2_CFG_6 register (address 06h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 181. LN2_CFG_7 register (address 07h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Table 182. LN2_CFG_8 register (address 08h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 183. LN2_CFG_9 register (address 09h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 184. LN2_CFG_10 register (address 0Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 185. LN2_CFG_11 register (address 0Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 186. LN2_CFG_12 register (address 0Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 187. LN2_CFG_13 register (address 0Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 188. LN3_CFG_0 register (address 10h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 189. LN3_CFG_1 register (address 11h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 190. LN3_CFG_2 register (address 12h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table 191. LN3_CFG_3 register (address 13h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table 192. LN3_CFG_4 register (address 14h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table 193. LN3_CFG_5 register (address 15h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table 194. LN3_CFG_6 register (address 16h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table 195. LN3_CFG_7 register (address 17h) bit
DAC1008D750_1
Objective data sheet
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 196. LN3_CFG_8 register (address 18h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 197. LN3_CFG_9 register (address 19h) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 198. LN3_CFG_10 register (address 1Ah) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 199. LN3_CFG_11 register (address 1Bh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 200. LN3_CFG_12 register (address 1Ch) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 201. LN3_CFG_13 register (address 1Dh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 202. PAGE_ADDRESS register (address 1Fh) bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 203. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 204. Revision history . . . . . . . . . . . . . . . . . . . . . . . 92
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 4 October 2010
© NXP B.V. 2010. All rights reserved.
98 of 99
DAC1008D750
NXP Semiconductors
2×, 4× or 8× interpolating with JESD204A
17. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10
Application information. . . . . . . . . . . . . . . . . . 12
10.1
General description . . . . . . . . . . . . . . . . . . . . 12
10.2
JESD204A receiver . . . . . . . . . . . . . . . . . . . . 13
10.2.1
Lane input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
10.2.2
Sync and word align . . . . . . . . . . . . . . . . . . . . 14
10.2.3
Comma detection and word align . . . . . . . . . . 15
10.2.4
Descrambler . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10.2.5
Inter-lane alignment . . . . . . . . . . . . . . . . . . . . 16
10.2.5.1 Single device operation . . . . . . . . . . . . . . . . . 16
10.2.5.2 Multi-device operation . . . . . . . . . . . . . . . . . . 17
10.2.5.3 Master/slave mode . . . . . . . . . . . . . . . . . . . . . 18
10.2.5.4 All slave mode . . . . . . . . . . . . . . . . . . . . . . . . 21
10.2.6
Frame assembly . . . . . . . . . . . . . . . . . . . . . . . 22
10.3
Serial Peripheral Interface (SPI) . . . . . . . . . . . 24
10.3.1
Protocol description . . . . . . . . . . . . . . . . . . . . 24
10.3.2
SPI timing description . . . . . . . . . . . . . . . . . . . 25
10.4
Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.5
FIR filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.6
Quadrature modulator and Numerically
Controlled Oscillator (NCO) . . . . . . . . . . . . . . 28
10.6.1
NCO in 32-bit . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.6.2
Low-power NCO . . . . . . . . . . . . . . . . . . . . . . . 28
10.6.3
Minus_3dB . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.7
x / (sin x) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.8
DAC transfer function . . . . . . . . . . . . . . . . . . . 29
10.9
Full-scale current . . . . . . . . . . . . . . . . . . . . . . 30
10.9.1
Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.9.1.1 External regulation . . . . . . . . . . . . . . . . . . . . . 30
10.9.2
Full-scale current adjustment . . . . . . . . . . . . . 30
10.10
Digital offset correction . . . . . . . . . . . . . . . . . . 31
10.11
Analog output . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.12
Auxiliary DACs . . . . . . . . . . . . . . . . . . . . . . . . 33
10.13
Output configuration . . . . . . . . . . . . . . . . . . . . 34
10.13.1 Basic output configuration . . . . . . . . . . . . . . . 34
10.13.2
DC interface to an Analog Quadrature
Modulator (AQM) . . . . . . . . . . . . . . . . . . . . . .
10.13.3 AC interface to an Analog Quadrature
Modulator (AQM) . . . . . . . . . . . . . . . . . . . . . .
10.13.4 Phase correction . . . . . . . . . . . . . . . . . . . . . .
10.14
Power and grounding. . . . . . . . . . . . . . . . . . .
10.15
Configuration interface. . . . . . . . . . . . . . . . . .
10.15.1 Register description . . . . . . . . . . . . . . . . . . . .
10.15.2 Detailed descriptions of registers . . . . . . . . . .
10.15.2.1 Page 0 allocation map description . . . . . . . . .
10.15.2.2 Page 0 bit definition detailed description . . . .
10.15.2.3 Page 1 allocation map description . . . . . . . . .
10.15.2.4 Page 1 bit definition detailed description . . . .
10.15.2.5 Page 2 allocation map description . . . . . . . . .
10.15.2.6 Page 2 bit definition detailed description . . . .
10.15.2.7 Page 4 allocation map description . . . . . . . . .
10.15.2.8 Page 4 bit definition detailed description . . . .
10.15.2.9 Page 5 allocation map description . . . . . . . . .
10.15.2.10 Page 5 bit definition detailed description . . .
10.15.2.11 Page 6 allocation map description . . . . . . . .
10.15.2.12 Page 6 bit definition detailed description . . .
10.15.2.13 Page 7 allocation map description . . . . . . . .
10.15.2.14 Page 7 bit definition detailed description . . .
11
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
13
Revision history . . . . . . . . . . . . . . . . . . . . . . .
14
Legal information . . . . . . . . . . . . . . . . . . . . . .
14.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
14.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
15
Contact information . . . . . . . . . . . . . . . . . . . .
16
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
37
38
38
38
38
38
39
41
47
48
52
53
57
59
69
71
78
80
84
86
90
91
92
93
93
93
93
94
94
95
99
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 October 2010
Document identifier: DAC1008D750_1