INTEGRATED CIRCUITS DATA SHEET 74LVC1GX04 X-tal driver Product specification 2003 Aug 13 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 FEATURES DESCRIPTION • Wide supply voltage range from 1.65 to 5.5 V The 74LVC1GX04 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. • 5 V tolerant input and a 5 V overvoltage tolerant powered down output. • High noise immunity Inputs can be driven from either 3.3 or 5 V devices. This feature allows the use of this device as translator in a mixed 3.3 and 5 V environment. • Complies with JEDEC standard: – JESD8-7 (1.65 to 1.95 V) This device is fully specified for partial power-down applications using Ioff at output Y. The Ioff circuitry disables the output Y, preventing the damaging backflow current through the device when it is powered down. – JESD8-5 (2.3 to 2.7 V) – JESD8B/JESD36 (2.7 to 3.6 V). • ±24 mA output drive (VCC = 3.0 V) • CMOS low power consumption The 74LVC1GX04 combines the functions of the 74LVC1GU04 and 74LVC1G04 to provide a device optimized for use in crystal oscillator applications. • Latch-up performance exceeds 250 mA • Direct interface with TTL levels The integration of the two devices into the 74LVC1GX04 produces the benefits of a compact footprint, lower power dissipation and stable operation over a wide range of frequency and temperature. • SOT363 and SOT457 package • ESD protection: – HBM EIA/JESD22-A114-A exceeds 2000 V – MM EIA/JESD22-A115-A exceeds 200 V. • Specified from −40 to +85 °C and −40 to +125 °C. 2003 Aug 13 2 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER propagation delay input X1 to output X2 propagation delay input X1 to output Y CONDITIONS TYPICAL UNIT VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ 2.1 ns VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 1.7 ns VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.5 ns VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.1 ns VCC = 5.0 V; CL = 50 pF; RL = 500 Ω 1.6 ns VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ 4.4 ns VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.9 ns VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 3.0 ns VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.8 ns VCC = 5.0 V; CL = 50 pF; RL = 500 Ω 2.3 ns CI input capacitance 5 pF CPD power dissipation capacitance per buffer output enabled; notes 1 and 2 35 pF Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; ∑(CL × VCC2 × fo) = sum of outputs. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUT OUTPUT X1 X2 Y H L H L H L Note 1. H = HIGH voltage level; L = LOW voltage level. 2003 Aug 13 3 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL 74LVC1GX04GW −40 to +125 °C 6 TSSOP6 74LVC1GX04GV −40 to +125 °C 6 TSSOP6 CODE MARKING plastic SOT363 VX plastic SOT457 VX4 PINNING PIN SYMBOL DESCRIPTION 1 n.c. not connected 2 GND ground (0 V) 3 X1 data input 4 X2 data output 5 VCC supply voltage 6 Y data output handbook, halfpage handbook, halfpage n.c. 1 GND 2 X1 6 Y X04 3 Y 4 3 X2 MNB097 X1 X2 MNB098 Fig.1 Pin configuration. 2003 Aug 13 6 5 VCC Fig.2 Logic symbol. 4 4 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER VCC supply voltage VI input voltage VO output voltage Tamb operating ambient temperature tr, tf input rise and fall times CONDITIONS note 1 MIN. MAX. UNIT 1.65 5.5 V 0 5.5 V active mode 0 VCC V Power-down mode; VCC = 0 V 0 5.5 V −40 +125 °C VCC = 1.65 to 2.7 V 0 20 ns/V VCC = 2.7 to 5.5 V 0 10 ns/V note 2 Notes 1. For use of a regular crystal oscillator, the recommended minimum VCC should be 2.0 V. 2. Only for output Y. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage CONDITIONS MIN. MAX. UNIT −0.5 +6.5 V IIK input diode current VI < 0 − −50 mA VI input voltage note 1 −0.5 +6.5 V IOK output diode current VO > VCC or VO < 0 − ±50 mA VO output voltage active mode; notes 1 and 2 −0.5 Power-down mode; notes 1 and 2 −0.5 IO output source or sink current ICC, IGND VCC or GND current Tstg storage temperature PD power dissipation VO = 0 to VCC Tamb = −40 to +125 °C VCC + 0.5 V +6.5 V − ±50 mA − ±100 mA −65 +150 °C − 300 mW Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. 2003 Aug 13 5 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. VCCΩ (V) OTHER TYP. MAX. UNIT Tamb = −40 to +85 °C; note 1 VIH HIGH-level input voltage 1.65 to 5.5 0.75 × VCC − − V VIL LOW-level input voltage 1.65 to 5.5 − − 0.25 × VCC V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA 1.65 to 5.5 − − 0.1 V IO = 4 mA 1.65 − − 0.45 V IO = 8 mA 2.3 − − 0.3 V IO = 12 mA 2.7 − − 0.4 V IO = 24 mA 3.0 − − 0.55 V IO = 32 mA 4.5 − − 0.55 V IO = −100 µA 1.65 to 5.5 VCC − 0.1 − − V IO = −4 mA 1.65 1.2 − − V IO = −8 mA 2.3 1.9 − − V IO = −12 mA 2.7 2.2 − − V IO = −24 mA 3.0 2.3 − − V IO = −32 mA 4.5 3.8 − − V VOH HIGH-level output voltage VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND 5.5 − ±0.1 ±5 µA Ioff power OFF leakage current VI or VO = 5.5 V; note 2 0 − ±0.1 ±10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − 0.1 10 µA 2003 Aug 13 6 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 TEST CONDITIONS SYMBOL PARAMETER MIN. VCCΩ (V) OTHER TYP. MAX. UNIT Tamb = −40 to +125 °C VIH HIGH-level input voltage 1.65 to 5.5 0.8 × VCC − − V VIL LOW-level input voltage 1.65 to 5.5 − − 0.2 × VCC V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA 1.65 to 5.5 − − 0.1 V IO = 4 mA 1.65 − − 0.70 V IO = 8 mA 2.3 − − 0.45 V IO = 12 mA 2.7 − − 0.60 V IO = 24 mA 3.0 − − 0.80 V IO = 32 mA 4.5 − − 0.80 V IO = −100 µA 1.65 to 5.5 VCC − 0.1 − − V IO = −4 mA 1.65 0.95 − − V IO = −8 mA 2.3 1.7 − − V IO = −12 mA 2.7 1.9 − − V IO = −24 mA 3.0 2.0 − − V VOH HIGH-level output voltage VI = VIH or VIL IO = −32 mA 4.5 3.4 − − V ILI input leakage current VI = 5.5 V or GND 5.5 − − ±20 µA Ioff power OFF leakage current VI or VO = 5.5 V; note 2 0 − − ±20 µA ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 40 µA Notes 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 2. VO only for output Y. 2003 Aug 13 7 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 AC CHARACTERISTICS GND = 0 V. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS MIN. TYP. MAX. UNIT VCC (V) Tamb = −40 to +85 °C; note 1 tPHL/tPLH propagation delay input X1 see Figs 3 and 5 to output X2 propagation delay input X1 X2 no external load; to output Y see Figs 4 and 5 1.65 to 1.95 0.5 2.1 5.0 ns 2.3 to 2.7 0.3 1.7 4.0 ns 2.7 0.3 2.5 4.5 ns 3.0 to 3.6 0.3 2.1 3.7 ns 4.5 to 5.5 0.3 1.6 3.0 ns 1.65 to 1.95 1.0 4.4 10.0 ns 2.3 to 2.7 0.5 2.9 6.0 ns 2.7 0.5 3.0 6.0 ns 3.0 to 3.6 0.5 2.8 5.5 ns 4.5 to 5.5 0.5 2.3 4.5 ns 1.65 to 1.95 0.5 − 6.5 ns 2.3 to 2.7 0.3 − 5.0 ns 2.7 0.3 − 5.6 ns 3.0 to 3.6 0.3 − 4.5 ns 4.5 to 5.5 0.3 − 3.8 ns 1.65 to 1.95 1.0 − 12.5 ns 2.3 to 2.7 0.5 − 7.5 ns 2.7 0.5 − 7.5 ns 3.0 to 3.6 0.5 − 6.9 ns 4.5 to 5.5 0.5 − 5.6 ns Tamb = −40 to +125 °C tPHL/tPLH propagation delay input X1 see Figs 3 and 5 to output X2 propagation delay input X1 X2 no external load; to output Y see Figs 4 and 5 Note 1. All typical values are measured at Tamb = 25 °C. 2003 Aug 13 8 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 AC WAVEFORMS handbook, halfpage VI VM X1 input GND tPHL tPLH VOH VM X2 output VOL MNB099 INPUT VCC VM tr = tf VI 1.65 to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns 4.5 to 5.5 V 0.5 × VCC VCC ≤ 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.3 The input X1 to output X2 propagation delay. handbook, halfpage VI VM X1 input GND tPHL tPLH VOH VM Y output VOL MNB100 INPUT VCC VM VI tr = tf 1.65 to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns 4.5 to 5.5 V 0.5 × VCC VCC ≤ 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.4 The input X1 to output Y propagation delay. 2003 Aug 13 9 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 VEXT handbook, full pagewidth VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL MNA616 VCC RL VEXT VI CL 1.65 to 1.95 V VCC 30 pF 1 kΩ open 2.3 to 2.7 V VCC 30 pF 500 Ω open tPLH/tPHL 2.7 V 2.7 V 50 pF 500 Ω open 3.0 to 3.6 V 2.7 V 50 pF 500 Ω open 4.5 to 5.5 V VCC 50 pF 500 Ω open Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.5 Load circuitry for switching times. MNB101 160 handbook, halfpage handbook, halfpage gfs (mA/V) Rbias = 560 kΩ 120 VCC 0.47 µF Vi input output 100 µF 80 A Io 40 MNA638 0 g fs 0 ∆I = --------o∆V i 1 fi = 1 kHz. VO is constant. Tamb = 25 °C. Fig.6 Fig.7 Test set-up for measuring forward transconductance. 2003 Aug 13 10 2 3 4 5 6 VCC (V) Typical forward transconductance as a function of supply voltage. Philips Semiconductors Product specification X-tal driver 74LVC1GX04 APPLICATION INFORMATION Crystal controlled oscillator circuits are widely used in clock pulse generators because of their excellent frequency stability and wide operating frequency range. The use of the 74LVC1GX04 provides the additional advantages of low power dissipation, stable operation over a wide range of frequency and temperature and a very small footprint. This application information describes crystal characteristics, design and testing of crystal oscillator circuits based on the 74LVC1GX04. handbook, halfpage C1 L1 C0 R1 MNB102 Fig.8 Equivalent circuit of a crystal. Crystal Characteristics Figure 8 is the equivalent circuit of a quartz crystal. Figure 9 also shows that with a specified load capacitance (CL), the load resonance frequency (fL) is the same for a circuit with either a series (b) or parallel (c) capacitance. CL is specified by crystal manufacturers and is used in determining the value of the external components of the oscillator. The reactive and resistive component of the impedance of the crystal alone and the crystal with a series and a parallel capacitance is shown in Figure 9. handbook, full pagewidth C1 + resistance (a) R1 L1 C0 0 fr R1 fa f ∞ reactance − + C1 resistance RL (b) L1 C0 0 fL fa R1 CL f ∞ reactance − + Rp C1 resistance (c) CL C0 L1 0 fr R1 (a) resonance. (b) anti-resonance. (c) load resonance. fL fa f reactance − MNB104 Fig.9 Reactance and resistance characteristics of a crystal. 2003 Aug 13 ∞ 11 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 Design Testing Figure 10 shows the recommended way to connect a crystal to the 74LVC1GX04. This circuit is basically a Pierce oscillator circuit in which the crystal is operating at its fundamental frequency and is tuned by the parallel load capacitance of C1 and C2. C1 and C2 are in series with the crystal. They should be approximately equal. R1 is the drive-limiting resistor and is set to approximately the same value as the reactance of C1 at the crystal frequency (R1 = XC1). This will result in an input to the crystal of 50% of the rail-to-rail output of X2. This keeps the drive level into the crystal within drive specifications (the designer should verify this). Overdriving the crystal can cause damage. After the calculations are performed for a particular crystal, the oscillator circuit should be tested. The following simple checks will verify the prototype design of a crystal controlled oscillator circuit. Perform them after laying out the board: • Test the oscillator over worst-case conditions (lowest supply voltage, worst-case crystal and highest operating temperature). Adding series and parallel resistors can simulate a worse case crystal. • Insure that the circuit does not oscillate without the crystal. • Check the frequency stability over a supply range greater than that which is likely to occur during normal operation. The resistor Rf provides negative feedback and sets a bias point of the inverter near mid-supply, operating the 74LVC1GU04 in the high gain linear region. The value of Rf is not critical, typically it is set at 1 MΩ. • Check that the start up time is within system requirements. As the 74LVC1GX04 isolates the system loading, once the design is optimized, the single layout may work in multiple applications for any given crystal. To calculate the values of C1 and C2, the designer can use C1 × C2 the formula: C L = ------------------- + Cs C1 + C2 CL is the load capacitance as specified by the crystal manufacturer, Cs is the stray capacitance of the circuit (for the LVC1GX04 this is equal to an input capacitance of 5 pf). handbook, halfpage 74LVC1GU04 74LVC1G04 portion portion X1 X2 Y system load Rf Csys C2 Xtal Rsys C1 MNB103 Fig.10 Crystal oscillator configuration. 2003 Aug 13 12 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 PACKAGE OUTLINES Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 v M A 4 5 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 2003 Aug 13 REFERENCES IEC JEDEC EIAJ SC-88 13 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 Plastic surface mounted package; 6 leads SOT457 D E B y A HE 6 5 X v M A 4 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION SOT457 2003 Aug 13 REFERENCES IEC JEDEC EIAJ SC-74 14 EUROPEAN PROJECTION ISSUE DATE 97-02-28 01-05-04 Philips Semiconductors Product specification X-tal driver 74LVC1GX04 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Aug 13 15 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/01/pp16 Date of release: 2003 Aug 13 Document order number: 9397 750 11772