INTEGRATED CIRCUITS CBT16213 24-bit bus exchange switch with 12-bit output enables Objective specification 2001 Jan 19 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 FEATURES DESCRIPTION • 5 Ω switch connection between two ports • TTL compatible control input levels • Package options include plastic shrink small outline (SSOP) and The CBT16213 provides 24 bits of high-speed TTL-compatible bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The CBT16213 operates as 24-bit bus switch or a 12-bit bus exchanger, which provides data exchanging between the four signal ports via the data-select (S0–S2) terminals. thin shrink small outline (TSSOP) The CBT16213 is characterized for operation from –40 to +85 °C. QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25 °C; GND = 0 V PARAMETER TYPICAL UNIT tPLH tPHL Propagation delay An to Yn CL = 50 pF; VCC = 5 V 0.25 ns CIN Input capacitance VI = 0 V or VCC 4.5 pF COUT Output capacitance Outputs disabled; VO = 0 V or VCC 11.5 pF ICCZ Total supply current Outputs disabled; VCC = 5.5 V 3 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 56-Pin Plastic SSOP Type III –40 to +85 °C CBT16213DL CBT16213DL SOT371-1 56-Pin Plastic TSSOP Type II –40 to +85 °C CBT16213DGG CBT16213DGG SOT364-1 FUNCTION TABLE S2 S1 L L L L L H L H S0 LOGIC SYMBOL A1 A2 FUNCTION L Z Z Disconnect H B1 Z A1 = B1 L B2 Z A1 = B2 H H Z B1 A2 = B1 L L Z B2 A2 = B2 H L H A2 & B2 A1 & B2 A1 = A2 = B2 H H L B1 B2 A1 = B1, A2 = B2 H H H B2 B1 A1 = B2, A2 = B1 1A1 2 1A2 H = High voltage level L = Low voltage level Z = High impedance “off ” state 1 of 12 Channels 3 54 1B1 53 1B2 FLOW CONTROL S0 S1 S2 1 56 55 SA00512 2001 Jan 19 2 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 PIN CONFIGURATION PIN DESCRIPTION SYMBOL NAME AND FUNCTION 1, 56, 55 S0, S1, S2 Data select 2, 4, 6, 9, 11, 13, 15, 18, 21, 23, 25, 27 1A1–12A1 A1 channel 3, 5, 7, 10, 12, 14, 16, 20, 22, 24, 26, 28 1A2–12A2 A2 channel 54, 52, 50, 47, 45, 43, 41, 39, 36, 34, 32, 30 1B1, 12B1 B1 channel 53, 51, 48, 46, 44, 42, 40, 37, 35, 33, 31, 29 1B2, 12B2 B2 channel S0 1 56 S1 1A1 2 55 S2 1A2 3 54 1B1 2A1 4 53 1B2 2A2 5 52 2B1 3A1 6 51 2B2 3A2 7 50 3B1 GND 8 49 GND 4A1 9 48 3B2 8, 19, 38, 49 GND Ground (0 V) 4A2 10 47 4B1 17 VCC Positive supply voltage 5A1 11 46 4B2 5A2 12 45 5B1 6A1 13 44 5B2 6A2 14 43 6B1 7A1 15 42 6B2 7A2 16 41 7B1 VCC 17 40 7B2 8A1 18 39 8B1 GND 19 38 GND 8A2 20 37 8B2 9A1 21 36 9B1 9A2 22 35 9B2 10A1 23 34 10B1 10A2 24 33 10B2 11A1 25 32 11B1 11A2 26 31 11B2 12A1 27 30 12B1 12A2 28 29 12B2 SA00511 2001 Jan 19 PIN NUMBER 3 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC IIK VI CONDITIONS RATING UNIT –0.5 to +7.0 V –50 mA –0.5 to +7.0 V output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to +150 °C DC supply voltage DC input diode current DC input VI < 0 voltage3 voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL PARAMETER UNIT Min Max VCC DC supply voltage 4.0 5.5 V VIH High-level input voltage 2.0 — V VIL Low-level Input voltage — 0.8 V –40 +85 °C Tamb 2001 Jan 19 Operating free-air temperature range 4 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL VIK II ICC ∆ICC CI CIO(OFF) O(O ) PARAMETER Tamb = –40 °C to +85 °C TEST CONDITIONS UNIT Min Typ1 Max VCC = 4.5 V; II = –18 mA — — –1.2 VCC = 0 V; VI = 5.5 V — — 10 VCC = 5.5 V; VI = GND or 5.5 V — — ±1 Quiescent supply current2 VCC = 5.5 V; IO = 0 V, VI = VCC or GND — — 3 µA Additional supply current per input pin2 VCC = 5.5 V, one input at 2.7 V, other inputs at VCC or GND — — 2.5 mA Control pins VI= 3 V or 0 V — 4.5 — pF — 11.5 — pF — 11.5 — pF VCC = 4.0 V; V1 = 2.4 V; II = 15 mA — 14 21 VCC = 4.5 V; V1 = 0 V; II = 64 mA — 5 7 VCC = 4.5 V; V1 = 0 V; II = 30 mA — 5 7 VCC = 4.5 V; V1 = 2.4 V; II = 15 mA — 8 15 VCC = 4.0 V; V1 = 2.4 V; II = 15 mA — 22 33 VCC = 4.5 V; V1 = 0 V; II = 64 mA — 10 14 VCC = 4.5 V; V1 = 0 V; II = 30 mA — 10 14 VCC = 4.5 V; V1 = 2.4 V; II = 15 mA — 16 22 Input clamp voltage Input leakage current Power-off leakage current, B port Power-off leakage current, A port A to B or B to A ron3 A1 to A2 V µA S0 S1 VO = 3 V or 0 V; S0, S1, or S2 = VCC Ω NOTES: 1. All typical values are at VCC = 5 V, Tamb = 25 °C 2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. AC CHARACTERISTICS GND = 0 V; tR; CL = 50 pF SYMBOL PARAMETER tpd Propagation delay1 ten Output enable time to High and Low level tdis Output disable time from High and Low level FROM (INPUT) TO (OUTPUT) VCC = +5.0 V ± 0.5 V VCC = 4.0 V Min Max Min Max UNIT A or B B or A — 0.25 — 0.25 ns A1 A2 — 0.5 — 0.5 ns S A or B 3.2 11.1 — 12.4 ns S0 A2 and B2 4 10.9 — 13.3 ns S A or B 2.3 11.9 — 12.4 ns S0 A2 and B2 5.7 12 — 12.8 ns NOTES: 1. This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance). 2001 Jan 19 5 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 AC WAVEFORMS TEST CIRCUIT AND WAVEFORMS VM = 1.5 V, VIN = GND to 3.0 V 7V 3V 1.5 V 1.5 V 500 Ω From Output Under Test S1 Open GND INPUT 500 Ω CL = 50 pF 0V tPHL tPLH Load Circuit VOH 1.5 V 1.5 V OUTPUT VOL SA00028 Waveform 1. Input (An) to Output (Yn) Propagation Delays TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. 3V Output Control (Low-level enabling 1.5 V SA00012 1.5 V 0V tPLZ tPZL 3.5 V Output Waveform 1 S1 at 7 V (see Note) 1.5 V VOL tPHZ tPZH Output Waveform 2 S1 at Open (see Note) VOL + 0.3 V VOH VOH – 0.3 V 1.5 V 0V Note: Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. SA00029 Waveform 2. 3-State Output Enable and Disable Times 2001 Jan 19 6 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm 2001 Jan 19 7 SOT371-1 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm 2001 Jan 19 8 SOT364-1 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 NOTES 2001 Jan 19 9 Philips Semiconductors Objective specification 24-bit bus exchange switch with 12-bit output enables CBT16213 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 01–01 Document order number: 2001 Jan 19 10