IP4365CX11 Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4 Rev. 01 — 26 March 2010 Product data sheet 1. Product profile 1.1 General description The IP4365CX11 is a fully integrated smart card interface device according ISO/IEC 7816-3 for the Subscriber Identity Module (SIM) card interface and according ISO/IEC 7816-12 for the Universal Subscriber Identity Module (USIM) Universal Serial Bus (USB) interface. It is designed to provide ElectroMagnetic Interference (EMI) filtering and ElectroStatic Discharge (ESD) protection for the conventional digital interface and also for the USB interface. The 3-channel EMI filter is identical to the filter available as ESD protection and EMI filter IP4366CX8 (which does not contain the additional USB full speed ESD protection). It also provides RC low-pass filtering of undesired Radio Frequency (RF) signals in the 800 MHz to 3 000 MHz frequency band. The IP4365CX11 is designed to provide protection to downstream components from ESD voltages as high as ±15 kV contact discharge and > ±15 kV air discharge according the IEC 61000-4-2 model, far exceeding standard level 4. The device is fabricated using monolithic silicon technology and integrate three resistors and several high-level ESD-protection diodes in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4365CX11 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) 3-channel SIM card interface integrated RC filter array Integrated 100 Ω/100 Ω/47 Ω series channel resistors 2-channel USB full speed compliant ESD protection for USIM 1-channel ESD protection for card supply 10 pF channel capacitance EMI filter compatible with IP4366CX8 Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air discharge, far exceeding IEC 61000-4-2 level 4 WLCSP with 0.4 mm pitch 1.3 Applications USIM, SIM and similar smart card interfaces in e.g. cellular and Personal Communication System (PCS) mobile handsets and wireless modems IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 2. Pinning information 2.1 Pinning 3 2 1 bump A1 index area A B C D 008aaa218 transparent top view, solder balls facing down Fig 1. Pin configuration 2.2 Pin description Table 1. Pinning Pin Description A1 internal pin RST or I/O channel A2 ground A3 external pin RST or I/O channel B1 internal pin CLK channel B2 not connected (missing ball) B3 external pin CLK channel C1 internal pin I/O or RST channel C2 ground C3 external pin I/O or RST channel D1 external ESD protection (USB data or supply) D2 external ESD protection (USB data or supply) D3 external ESD protection (USB data or supply) 3. Ordering information Table 2. Ordering information Type number IP4365CX11/P IP4365CX11_1 Product data sheet Package Name Description Version WLCSP11 wafer level chip-size package; 11 bumps (3 × 4 - B2) IP4365CX11/P All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 2 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 4. Functional diagram IEC61000-4-2 level 1 protection pins IEC61000-4-2 level 4 protection pins R1 A1 100 Ω A3 R2 B1 47 Ω B3 R3 C1 100 Ω C3 D1 D2 D3 A2, C2 008aaa216 Fig 2. Schematic diagram 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VI input voltage VESD electrostatic discharge voltage Min Max Unit −0.5 +5.5 V pins A3, B3, C3, D1, D2 and D3 to ground (A2, C2) contact discharge [1] −15 +15 kV air discharge [1] −15 +15 kV contact discharge −8 +8 kV air discharge −15 +15 kV contact discharge −2 +2 kV air discharge −2 +2 kV IEC 61000-4-2 level 4; pins A3, B3, C3, D1, D2 and D3 to ground (A2, C2) IEC 61000-4-2 level 1; pins A1, B1 and C1 to ground (A2, C2) Pch channel power dissipation continuous power; Tamb = 70 °C - 60 mW Ptot total power dissipation continuous power; Tamb = 70 °C - 180 mW Tstg storage temperature −55 +150 °C - 260 °C −35 +85 °C Treflow(peak) peak reflow temperature Tamb [1] IP4365CX11_1 Product data sheet 10 s maximum ambient temperature Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 3 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 6. Characteristics Table 4. Electrical characteristics Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 75 100 125 Ω 35.2 47.0 58.8 Ω 8 10 12 pF Rs(ch) channel series resistance R1 and R3 Cch channel capacitance channel A1 to A3, channel B1 to B3, channel C1 to C3, pins D1, D2 and D3; Vbias(DC) = 0 V; f = 1 MHz VBR breakdown voltage Itest = 1 mA 6 - 10 V ILR reverse leakage current VI = 3 V - - 50 nA R2 [1] [1] Guaranteed by design. 7. Application information 7.1 Application diagram A typical application diagram showing IP4365CX11 in a SIM card interface using the standard digital and the USB full speed interface is depicted in Figure 3. The 2 kV ESD compliant pins (A1, B1 and C1) are connected to the baseband interface side while the six 15 kV ESD compliant pins (pins A3, B3, C3, D1, D2 and D3) are connected to the USIM card. Pins D1, D2 and D3 are identical and can be used as required. Also the channel A1 to A3 and the channel C1 to C3 can be exchanged in case this is required for an easier routing. VSIM D3 RST CLK I/O USB A1 R1 A3 100 Ω B1 R2 B3 47 Ω C1 R3 C3 100 Ω VCC GND RST SPU CLK I/O AUX1 AUX2 D1 D+ D2 D− SIM/smart card baseband A2, C2 008aaa217 Fig 3. Typical application diagram IP4365CX11_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 4 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 7.2 Insertion loss The IP4365CX11 is mainly designed as an EMI/RFI filter for SIM card interfaces. The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the IP4365CX11 is shown in Figure 4. The insertion loss in a 50 Ω NWA system for all three resistor equipped channels of IP4365CX11 is depicted in Figure 5. The insertion loss is measured with a test Printed-Circuit Board (PCB) utilizing laser drilled micro-via holes that connect the PCB ground plane to the ground pins. IN OUT DUT 50 Ω 50 Ω TEST BOARD Vgen 001aai755 Fig 4. Frequency response measurement configuration 008aaa214 0 s21 (dB) (1) −10 −20 (2) −30 (3) −40 10−1 1 10 102 103 104 f (MHz) (1) Channel B1 to B3. (2) Channel C1 to C3. (3) Channel A1 to A3. Fig 5. IP4365CX11_1 Product data sheet Measured insertion loss magnitudes All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 5 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 7.3 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4365CX11 is shown in Figure 6. Six typical examples of crosstalk measurement results of IP4365CX11 are depicted in Figure 7. Unused channels are terminated with 50 Ω to ground. IN_1 50 Ω OUT_2 DUT IN_2 50 Ω OUT_1 TEST BOARD 50 Ω 50 Ω Vgen 001aai756 Fig 6. Crosstalk measurement configuration 008aaa215 0 αct (dB) −20 (1) (2) (3) −40 −60 −80 −100 1 10 102 103 104 f (MHz) (1) Pin B1 to pin C3. (2) Pin B1 to pin A3. (3) Pin A1 to pin B3. Fig 7. IP4365CX11_1 Product data sheet Measured crosstalk between different channels All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 6 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 8. Package outline WLCSP11: wafer level chip-size package; 11 bumps (3 x 4 - B2) bump A1 index area D A2 E A A1 detail X e1 b e D e C e2 B A 3 2 X 1 European projection wlcsp11_3x4-b2_po Fig 8. Table 5. Package outline IP4365CX11 (WLCSP11) Dimensions for Figure 8 Symbol Min Typ Max Unit A 0.57 0.61 0.65 mm A1 0.18 0.20 0.22 mm A2 0.39 0.41 0.43 mm b 0.21 0.26 0.31 mm D 1.11 1.16 1.21 mm E 1.51 1.56 1.61 mm e - 0.4 - mm e1 - 0.8 - mm e2 - 1.2 - mm IP4365CX11_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 7 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 9. Design and assembly recommendations 9.1 PCB design guidelines For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 6 for the recommended PCB design parameters. Table 6. Recommended PCB design parameters Parameter Value or specification PCB pad diameter 200 μm Micro-via diameter 100 μm (0.004 inch) Solder mask aperture diameter 370 μm Copper thickness 20 μm to 40 μm Copper finish AuNi PCB material FR4 9.2 PCB assembly guidelines for Pb-free soldering Table 7. Assembly recommendations Parameter Value or specification Solder screen aperture diameter 330 μm Solder screen thickness 100 μm (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) Solder / flux ratio 50 / 50 Solder reflow profile see Figure 9 T (°C) Treflow(peak) 250 230 cooling rate 217 pre-heat t1 t2 t3 t4 t (s) t5 001aai943 The device is capable of withstanding at least three reflows of this profile. Fig 9. IP4365CX11_1 Product data sheet Pb-free solder reflow profile All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 8 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection Table 8. Characteristics Symbol Parameter Treflow(peak) peak reflow temperature t1 time 1 t2 time 2 t3 Conditions Min Typ Max Unit 230 - 260 °C soak time 60 - 180 s time during T ≥ 250 °C - - 30 s time 3 time during T ≥ 230 °C 10 - 50 s t4 time 4 time during T > 217 °C 30 - 150 s t5 time 5 dT/dt rate of change of temperature - - 540 s cooling rate - - −6 °C/s pre-heat 2.5 - 4.0 °C/s 10. Abbreviations Table 9. Abbreviations Acronym Description DUT Device Under Test EMI ElectroMagnetic Interference ESD ElectroStatic Discharge FR4 Flame Retard 4 IEC International Electrotechnical Commission ISO International Organization for Standardization NSMD Non-Solder Mask Defined NWA NetWork Analyzer PCB Printed-Circuit Board PCS Personal Communication System RF Radio Frequency RFI Radio Frequency Interference RoHS Restriction of Hazardous Substances SIM Subscriber Identity Module USB Universal Serial Bus USIM Universal Subscriber Identity Module WLCSP Wafer-Level Chip-Scale Package 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4365CX11_1 20100326 Product data sheet - - IP4365CX11_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 9 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the IP4365CX11_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 10 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4365CX11_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 26 March 2010 © NXP B.V. 2010. All rights reserved. 11 of 12 IP4365CX11 NXP Semiconductors Integrated SIM card passive filter array and USB ESD protection 14. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 7.1 7.2 7.3 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Application diagram . . . . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Design and assembly recommendations . . . . 8 PCB design guidelines . . . . . . . . . . . . . . . . . . . 8 PCB assembly guidelines for Pb-free soldering 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 March 2010 Document identifier: IP4365CX11_1