BAP65-02 Silicon PIN diode Rev. 5 — 28 September 2010 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small SMD plastic package. 1.2 Features and benefits High voltage, current controlled RF resistor for RF switches Low diode capacitance Low diode forward resistance (low loss) Very low series inductance 1.3 Applications RF attenuators and switches Bandswitch for TV tuners Series diode for mobile communication transmit/receive switch 2. Pinning information Table 1. Pinning Pin Description 1 cathode 2 anode Simplified outline 1 Graphic symbol 2 sym006 3. Ordering information Table 2. Ordering information Type number BAP65-02 Package Name Description Version - plastic surface-mounted package; 2 leads SOD523 4. Marking Table 3. Marking codes Type number Marking code BAP65-02 K6 BAP65-02 NXP Semiconductors Silicon PIN diode 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR continuous reverse voltage IF continuous forward current Ptot total power dissipation Tstg Conditions Min Max Unit - 30 V - 100 mA - 715 mW storage temperature 65 +150 C Tj junction temperature 65 +150 C Tamb ambient temperature 40 +85 C Ts 90 C 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth j-s thermal resistance from junction to soldering point Conditions Typ Unit 85 K/W 7. Characteristics Table 6. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 50 mA - 0.9 1.1 V IR reverse leakage current VR = 20 V - - 20 nA Cd diode capacitance VR = 0 V; f = 1 MHz - 0.65 - pF VR = 1 V; f = 1 MHz - 0.55 0.9 pF VR = 3 V; f = 1 MHz - 0.5 0.8 pF VR = 20 V; f = 1 MHz - 0.375 - pF rD diode forward resistance - 1 - IF = 5 mA; f = 100 MHz [1] - 0.65 0.95 IF = 10 mA; f = 100 MHz [1] - 0.56 0.9 - 0.35 - IF = 1 mA; f = 100 MHz IF = 100 mA; f = 100 MHz s212 s212 s212 isolation insertion loss insertion loss BAP65-02 Product data sheet VR = 0; f = 900 MHz - 10 - dB VR = 0; f = 1800 MHz - 5.8 - dB VR = 0; f = 2450 MHz - 4.4 - dB IF = 1 mA; f = 900 MHz - 0.11 - dB IF = 1 mA; f = 1800 MHz - 0.13 - dB IF = 1 mA; f = 2450 MHz - 0.16 - dB IF = 5 mA; f = 900 MHz - 0.08 - dB IF = 5 mA; f = 1800 MHz - 0.11 - dB IF = 5 mA; f = 2450 MHz - 0.13 - dB All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 2 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode Table 6. Characteristics …continued Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit s212 insertion loss IF = 10 mA; f = 900 MHz - 0.07 - dB IF = 10 mA; f = 1800 MHz - 0.1 - dB s212 insertion loss IF = 10 mA; f = 2450 MHz - 0.13 - dB IF = 100 mA; f = 900 MHz - 0.07 - dB IF = 100 mA; f = 1800 MHz - 0.1 - dB IF = 100 mA; f = 2450 MHz - 0.128 - dB L charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 ; measured at IR = 3 mA - 0.17 - s LS series inductance IF = 100 mA; f = 100 MHz - 0.6 - nH [1] Guaranteed on AQL basis: inspection level S4, AQL 1.0. BAP65-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 3 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode mld499 10 mld500 1000 Cd (fF) rD (Ω) 800 600 1 400 200 10−1 10−1 1 10 IF (mA) 0 102 0 12 20 16 f = 1 MHz; Tj = 25 C Forward resistance as a function of forward current; typical values Fig 2. mld501 0 2 s21 (dB) 8 VR (V) f = 100 MHz; Tj = 25 C Fig 1. 4 Diode capacitance as a function of reverse voltage; typical values mld502 0 s21 2 (dB) (5) −0.1 −10 (1) −0.2 (2) (3) (4) −20 −0.3 −30 −0.4 −0.5 0 1000 2000 f (MHz) 3000 −40 0 1000 2000 f (MHz) 3000 Diode zero biased and inserted in series with a 50 stripline circuit. Tamb = 25 C. (1) IF = 0.5 mA (2) IF = 1 mA (3) IF = 5 mA (4) IF = 10 mA (5) IF = 100 mA Diode inserted in series with a 50 stripline circuit and biased via the analyzer Tee network. Tamb = 25 C. Fig 3. Insertion loss (s212) of the diode as a function of frequency; typical values BAP65-02 Product data sheet Fig 4. Isolation (s212) of the diode as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode 8. Package outline Plastic surface-mounted package; 2 leads SOD523 A c v M A HE A D 1 E 0 0.5 1 mm scale 2 DIMENSIONS (mm are the original dimensions) bp (1) UNIT A bp c D E HE v mm 0.65 0.58 0.34 0.26 0.17 0.11 1.25 1.15 0.85 0.75 1.65 1.55 0.1 Note 1. The marking bar indicates the cathode. OUTLINE VERSION REFERENCES IEC SOD523 Fig 5. JEDEC JEITA SC-79 EUROPEAN PROJECTION ISSUE DATE 02-12-13 06-03-16 Package outline SOD523 BAP65-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 5 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP65-02 v.5 20100928 Product data sheet - BAP65-02_N v.4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been updated. Table 4 “Limiting values”: added Tamb (ambient temperature). BAP65-02_N v.4 20080108 Product data sheet - BAP65-02 v.3 BAP65-02 v.3 (9397 750 08364) 20010511 Product specification - BAP65-02 v.2 BAP65-02 v.2 (9397 750 08237) 20010507 Product specification - BAP65-02 v.1 BAP65-02 v.1 (9397 750 07724) 20001220 Product specification - - BAP65-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from national authorities. BAP65-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 7 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAP65-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 8 of 9 BAP65-02 NXP Semiconductors Silicon PIN diode 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 1 2 2 2 5 6 7 7 7 7 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 September 2010 Document identifier: BAP65-02